207721 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
3D semiconductor structure and device
#902Electronic part mounting heat-dissipating substrate
#903Robust low inductance power module package
#904Semiconductor package with elastic coupler and related methods
#905Electrostatic discharge protection apparatus and applications thereof
#906Cu column, Cu core column, solder joint, and through-silicon via
#907Cu pillar cylindrical preform for semiconductor connection
#9083D integrated circuit device
#909Dual-sided die packages
#910Current breaker
#911Area-efficient and robust electrostatic discharge circuit
#912Semiconductor device and manufacturing method thereof
#913Semiconductor device having electrode pads arranged between groups of external electrodes
#914Power amplifier modules with bonding pads and related systems, devices, and methods
#915Microelectronic package including microelectronic elements having stub minimization for wirebond assemblies without windows
#916Liquid jetting apparatus and wiring member
#917Semiconductor module and semiconductor driving device
#918Packages and methods of forming packages
#919Package substrate differential impedance optimization for 25 to 60 Gbps and beyond
#920Apparatus and method to balance the parasitic capacitances between metal tracks on an integrated circuit chip
#921Compact bypass and decoupling structure for millimeter-wave circuits
#9223D semiconductor device and structure
#923Circuit board for COF package
#924Apparatus and methods for electrical overstress protection
#925Power device cassette with auxiliary emitter contact
#926Semiconductor module
#927High-speed semiconductor modules
#928Semiconductor device
#929Cooling and power delivery for a wafer level computing board
#930Sensor unit for a vehicle, and method for producing a sensor unit for a vehicle
#931Semiconductor device and method
#932SEMICONDUCTOR MODULE AND SEMICONDUCTOR DEVICE
#933Gate driver on array short-circuit protection circuit and liquid crystal panel including the same
#934Integrated circuit package substrate
#935Package, electronic component, and electronic apparatus
#936Circuit boards and circuit board assemblies
#937Semiconductor device
#938MOSFET having dual-gate cells with an integrated channel diode
#939Power electronic switching device comprising a plurality of potential surfaces
#940Multi-die fine grain integrated voltage regulation
#941Distribution of electronic circuit power supply potentials
#942Apparatus and method to monitor die edge defects
#943Integrated circuit device
#944Power integrated module
#945SEMICONDUCTOR DEVICE WITH STACKED TERMINALS
#946Semiconductor device having repairable penetration electrode
#947Semiconductor device with discrete blocks
#948Coated bond wires for die packages and methods of manufacturing said coated bond wires
#949Shielded package assemblies with integrated capacitor
#950Power management application of interconnect substrates
#951Semiconductor integrated circuit device
#952Fan-out 3D IC integration structure without substrate and method of making the same
#953Semiconductor devices with bump allocation
#954SEMICONDUCTOR DEVICE
#955Semiconductor device with decreased overlapping area between redistribution lines and signal lines
#956Power conversion apparatus
#957Semiconductor chip including a plurality of pads
#958Semiconductor device layout having a power rail
#959Semiconductor package assemblies with system-on-chip (SOC) packages
#960Semiconductor devices with redistribution pads
#961Semiconductor package, semiconductor device using the same and manufacturing method thereof
#962Semiconductor memory devices including a memory cell array and stepped wiring portions, and manufacturing methods thereof
#963Electrostatic discharge protection element
#964Surface mount high-frequency circuit
#965Driving circuit and pin output order arranging method
#966Semiconductor device
#967High speed, high density, low power die interconnect system
#968Package programmable decoupling capacitor array
#969Semiconductor package with integrated semiconductor devices and passive component
#970Microelectronic package having stub minimization using symmetrically-positioned duplicate sets of terminals for wirebond assemblies without windows
#971LINE STRUCTURE FOR MATCHING SIGNAL LINES OF SEMICONDUCTOR DEVICE
#972Semiconductor chip, semiconductor package including the same, and method of fabricating the same
#973High density substrate routing in BBUL package
#974Conductive structure and manufacturing method thereof, array substrate, display device
#975Semiconductor package and method of forming the same
#976Capacitor in post-passivation structures and methods of forming the same
#977Display substrate, manufacturing method thereof and display device
#978Array substrate and display device
#979High speed, high density, low power die interconnect system
#980Semiconductor device and busbar
#981Display device
#982Methods of forming under device interconnect structures
#983Via pattern to reduce crosstalk between differential signal pairs
#984Semiconductor device and method of manufacture
#985Stacked semiconductor device assembly in computer system
#986Embedded die-down package-on-package device
#987Semiconductor device and electronic device
#988Power amplifier modules including tantalum nitride terminated through wafer via and related systems, devices, and methods
#989Power amplifier modules with harmonic termination circuit and related systems, devices, and methods
#990Die package with low electromagnetic interference interconnection
#991Power amplifier modules with power amplifier and transmission line and related systems, devices, and methods
#992FinFET power supply decoupling
#993Integrated circuit package substrate
#994Apparatus, system, and method for wireless connection in integrated circuit packages
#995Semiconductor device
#996Mixed impedance leads for die packages and method of making the same
#997Semiconductor integrated circuit device
#998Stacked bit line dual word line nonvolatile memory
#999Method of manufacturing wafer level packaging including through encapsulation vias
#1000Semiconductor device that transfers an electric signal with a set of inductors
#1001Interposer for a package-on-package structure
#1002Microelectronic package having a passive microelectronic device disposed within a package body
#1003Dual row quad flat no-lead semiconductor package
#1004Semiconductor device, display module, and electronic device
#1005Electronic component built-in substrate and electronic device
#1006Semiconductor device having stacked chips
#1007Power semiconductor module
#1008Semiconductor package and mounting structure thereof
#1009Sub-terahertz/terahertz interconnect
#1010Semiconductor device and manufacturing method of the same
#1011Semiconductor device and method of forming substrate including embedded component with symmetrical structure
#1012Semiconductor device including at least one element
#1013Display device including auxiliary lines and polarizing films, and manufacturing method thereof
#1014Integrated circuit including lateral insulated gate field effect transistor
#1015Semiconductor devices and methods of manufacturing the same
#1016SIGNAL RETURN PATH
#1017Semiconductor device packages including a controller element
#1018Semiconductor chip package assembly with improved heat dissipation performance
#1019SEMICONDUCTOR DEVICE
#1020Wiring substrate
#1021Body bias multiplexer for stress-free transmission of positive and negative supplies
#1022Laser module with simplified alignment
#1023Decoupling arrangement
#1024Display device
#1025Crosstalk polarity reversal and cancellation through substrate material
#1026Semiconductor packaging structure and semiconductor power device thereof
#1027Semiconductor device having electrode pads arranged between groups of external electrodes
#1028Semiconductor device having a floating option pad, and a method for manufacturing the same
#1029High density package interconnects
#1030Staged via formation from both sides of chip
#1031Semiconductor device including a redistribution layer
#1032High voltage ESD protection apparatus
#1033Microelectronic package having at least two microelectronic elements that are horizontally spaced apart from each other
#1034Modular electrostatic discharge (ESD) protection
#1035Stub minimization for assemblies without wirebonds to package substrate
#1036Switchable package capacitor for charge conservation and series resistance
#1037Systems and Methods for Main Distribution on an Integrated Circuit
#1038Flip chip package and manufacturing method thereof
#1039Memory metal scheme
#1040Method of manufacturing semiconductor device and semiconductor device
#1041Array substrate, method of producing the same, and display apparatus
#1042Array substrate and method for manufacturing the same, display device
#1043Semiconductor integrated circuit device
#1044Capacitor in post-passivation structures and methods of forming the same
#1045Partially depopulated interconnection arrays for packaged semiconductor devices and printed circuit boards
#1046Signal delivery in stacked device
#1047Planarity-tolerant reworkable interconnect with integrated testing
#1048Substrate comprising stacks of interconnects, interconnect on solder resist layer and interconnect on side portion of substrate
#1049Semiconductor device and manufacturing method thereof
#1050Semiconductor device
#1051Integrated device package comprising a magnetic core inductor with protective ring embedded in a package substrate
#1052Interconnect circuits at three dimensional (3-D) bonding interfaces of a processor array
#1053Metal layout for radio-frequency switches
#1054Distributed LC resonant tanks clock tree synthesis
#1055Chip package, package substrate and manufacturing method thereof
#1056Electronic component embedded printed circuit board and method of manufacturing the same
#1057Semiconductor stack for converter with snubber capacitors
#1058High speed, high density, low power die interconnect system
#1059Semiconductor packages including an interposer
#1060Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms
#1061Lead portion of semiconductor device
#1062Crosstalk reduction in electrical interconnects
#1063MOSFET having dual-gate cells with an integrated channel diode
#1064Semiconductor device having an inner power supply plate structure
#1065Power gating for three dimensional integrated circuits (3DIC)
#1066Power line structure for semiconductor apparatus
#1067Integrated circuit layout wiring for multi-core chips
#1068Microelectronic packaging without wirebonds to package substrate having terminals with signal assignments that mirror each other with respect to a central axis
#1069Electronic device having a lead with selectively modified electrical properties
#1070Thermal interface material layer and package-on-package device including the same
#1071METHODS OF FORMING PANEL EMBEDDED DIE STRUCTURES
#1072Substrate comprising embedded elongated capacitor
#1073Circuit device and method of manufacturing a circuit device for controlling a transmission of a vehicle
#1074Packaging devices and methods for semiconductor devices
#1075Reconfigurable power distribution system for three-dimensional integrated circuits
#1076Semiconductor devices, multi-die packages, and methods of manufacture thereof
#1077Low-impedance power delivery for a packaged die
#1078Semiconductor device having plural memory chip
#1079Interconnect circuits at three-dimensional (3-D) bonding interfaces of a processor array
#1080Semiconductor module
#1081Packaging substrate with block-type via and semiconductor packages having the same
#1082Voltage contrast characterization structures and methods for within chip process variation characterization
#1083Integrated device package comprising an electromagnetic (EM) passive device in an encapsulation layer, and an EM shield
#1084Output discharge techniques for load switches
#1085Semiconductor device including an embedded surface mount device and method of forming the same
#1086Semiconductor devices having through-electrodes
#1087Semiconductor packages including thermal blocks
#1088Multilayered semiconductor device
#1089Semiconductor chip and a semiconductor package having a package on package (POP) structure including the semiconductor chip
#1090Solid state contactor with improved interconnect structure
#1091SEMICONDUCTOR DEVICE
#1092Semiconductor device with discrete blocks
#1093Device and method for reducing contact resistance of a metal
#1094Stacked conductor structure and methods for manufacture of same
#1095Circuit substrate for semiconductor package with multiple circuit substrate units and semiconductor package therefor
#1096Leakage-current abatement circuitry for memory arrays
#1097Semiconductor device comprising plurality of conductive portions disposed within wells and a nanowire coupled to conductive portion
#1098Wafer level integration of passive devices
#1099Input/output termination for ripple prevention
#1100Stacked semiconductor device assembly
#1101Systems and methods for mechanical and electrical package substrate issue mitigation
#1102Multiple depth vias in an integrated circuit
#1103Method and device for an integrated trench capacitor
#1104Semiconductor device manufacturing method and semiconductor device
#1105Semiconductor package assemblies with system-on-chip (SOC) packages
#1106High density substrate routing in BBUL package
#1107Semiconductor package including an embedded surface mount device and method of forming the same
#1108Semiconductor device
#1109Electronic device for vehicle
#1110Package substrate and method for manufacturing package substrate
#1111Semiconductor package and method of forming the same
#1112Multilayer wiring board
#1113Power device cassette with auxiliary emitter contact
#1114Low-noise flip-chip packages and flip chips thereof
#1115Semiconductor structure and manufacturing method of the same
#1116Semiconductor device and method of testing semiconductor device
#1117System and method for metal matrix mounting scheme
#1118Thermal interface material on package
#1119Thermal interface material on package
#1120Apparatus and method to monitor die edge defects
#1121Thermal interface material on package
#1122Thermal interface material on package
#1123Synthesis of complex cells
#1124Semiconductor device and method of manufacturing the same
#1125Semiconductor device
#1126Ball grid array formed on printed circuit board
#1127TRACE STRUCTURE OF FINE-PITCH PATTERN
#1128Passive component integrated with semiconductor device in semiconductor package
#1129Semiconductor package with integrated semiconductor devices and passive component
#1130Chip capacitors
#1131Semiconductor device
#1132Semiconductor device
#1133Power management integrated circuit (PMIC) integration into a processor package
#1134Capacitor in post-passivation structures and methods of forming the same
#1135Semiconductor device, semiconductor device design method, semiconductor device design apparatus, and program
#1136Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
#1137PROCESS FOR PATTERNING MATERIALS IN THIN-FILM DEVICES
#1138Co-support for XFD packaging
#1139Semiconductor device
#1140Integrated circuit having electromagnetic shielding capability and manufacturing method thereof
#1141Device having multiple-layer pins in memory MUX1 layout
#1142Package structure and method of manufacturing the same
#1143Semiconductor device
#1144Semiconductor package
#1145Semiconductor device and structure
#1146Radiation hardened by design digital input/output circuits and related methods
#1147Shielded package assemblies with integrated capacitor
#1148MOSFET having dual-gate cells with an integrated channel diode
#1149Semiconductor device
#1150Power gating for three dimensional integrated circuits (3DIC)
#1151Semiconductor package with trace covered by solder resist
#1152SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#1153Integrated circuit with interface circuitry, and an interface cell for such interface circuitry
#1154Electronic module
#1155Embedded package substrate capacitor
#1156Semiconductor device
#1157Bonding pad arrangment design for multi-die semiconductor package structure
#1158Power amplifier modules with bifet and harmonic termination and related systems, devices, and methods
#1159Power amplifier modules including bipolar transistor with grading and related systems, devices, and methods
#1160Power amplifier modules including wire bond pad and related systems, devices, and methods
#1161THROUGH CRACK STOP VIA
#1162Semiconductor device
#1163Device packaging with substrates having embedded lines and metal defined pads
#1164Integrated circuit package substrate
#1165Wafer having pad structure
#1166Display device and manufacturing method thereof
#1167Profile of through via protrusion in 3DIC interconnect
#1168Power management applications of interconnect substrates
#1169Chip and circuit structure
#1170Semiconductor integrated circuit device
#1171Encapsulated molded package with embedded antenna for high data rate communication using a dielectric waveguide
#1172Liquid crystal display device and method of manufacturing a liquid crystal display device
#1173Semiconductor device having contact structures
#1174Switchable package capacitor for charge conservation and series resistance
#1175SWITCHING ELEMENT AND A DIODE BEING CONNECTED TO A POWER SOURCE AND AN INDUCTIVE LOAD
#1176Packages with metal line crack prevention design
#1177Method of forming a semiconductor substrate including a cooling channel
#1178Use of dielectric slots for reducing via resistance in dual damascene process
#1179Multilayered semiconductor device
#1180Semiconductor device with external connection bumps
#1181Semiconductor socket with direct selective metalization
#1182Semiconductor device and method for designing a semiconductor device
#1183Integrated circuit interconnect crack monitor circuit
#1184ESD protection circuit cell
#1185Integrated circuit, integrated circuit package and method of providing protection against an electrostatic discharge event
#1186Semiconductor device and method of manufacturing the same
#1187Semiconductor device and method of fabricating the same
#1188CHIP ON FILM PACKAGES INCLUDING PLURALITY OF OUTPUT PADS CONNECTED TO FILM WIRES
#1189Substrate with built-in capacitor and method for manufacturing substrate with built-in capacitor
#1190Semiconductor device
#1191Semiconductor device
#1192Via corner engineering in trench-first dual damascene process
#1193RFID chip module
#1194High-frequency circuit package and sensor module
#1195Embedded die flip-chip package assembly
#1196Electrical connectivity of die to a host substrate
#1197Semiconductor package with sidewall contacting bonding tape
#1198Method for fabricating integrated circuits including contacts for metal resistors
#1199Semiconductor integrated circuit
#1200Integrated circuit component shielding