207721 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
Through-substrate via formation with improved topography control
#1202Packaged semiconductor devices and packaging methods
#1203Manufacturing method of device embedded substrate and device embedded substrate manufactured by this method
#1204Shielded package assemblies with integrated capacitor
#1205Embedded multi-terminal capacitor
#1206Implementing inverted master-slave 3D semiconductor stack
#1207INTEGRATED CIRCUIT DEVICE HAVING SUPPORTS FOR USE IN A MULTI-DIMENSIONAL DIE STACK
#1208Accessing or interconnecting integrated circuits
#1209Chip support substrate, chip support method, three-dimensional integrated circuit, assembly device, and fabrication method of three-dimensional integrated circuit
#1210SEMICONDCUTOR CHIP AND SEMIONDUCOT MODULE
#1211Integrated device comprising via with side barrier layer traversing encapsulation layer
#1212Chip package including recess in side edge
#1213Nonvolatile memory devices and methods forming the same
#1214Integrated circuit device with radio frequency (RF) switches and controller
#1215Power line structure for semiconductor apparatus
#1216Semiconductor device including conductive layer with conductive plug
#1217Reduced-noise reference voltage platform for a voltage converter device
#1218Semiconductor device
#1219Thermal interface material on package
#1220Semiconductor device with combined power and ground ring structure
#1221ELECTRONIC COMPONENT PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#1222Polymer grafting for enhanced dielectric and interconnect material adhesion
#1223Method and device for an integrated trench capacitor
#1224Semiconductor device
#1225Stub minimization for multi-die wirebond assemblies with parallel windows
#1226Electric component module
#1227Semiconductor integrated circuit device having protective split at peripheral area of bonding pad and method of manufacturing same
#1228Trench multilevel contact to a 3D memory array and method of making thereof
#1229Apparatus, system, and method for wireless connection in integrated circuit packages
#1230Opening in a multilayer polymeric dielectric layer without delamination
#1231Semiconductor package having EMI shielding and method of fabricating the same
#1232Semiconductor device
#1233Semiconductor device
#1234Low profile semiconductor module with metal film support
#1235Stub minimization with terminal grids offset from center of package
#1236Semiconductor device for transmitting electrical signals between two circuits
#1237SEMICONDUCTOR DEVICE
#1238Thickened stress relief and power distribution layer
#1239Method of integrated circuit fabrication
#1240Systems and methods for integrated multi-layer magnetic films
#1241Semiconductor device and structure
#1242INVERSE NANOSTRUCTURE DIELECTRIC LAYERS
#1243Multiple depth vias in an integrated circuit
#1244Use of dielectric slots for reducing via resistance in dual damascene process
#1245Metal on elongated contacts
#1246DIELECTRIC LAYERS HAVING ORDERED ELONGATE PORES
#1247Semiconductor device having plural patterns extending in the same direction
#1248Stacked three dimensional semiconductor device with in-circuit antenna
#1249SEMICONDUCTOR DIE PACKAGE WITH INSULATED WIRES FOR ROUTING POWER SIGNALS
#1250Power semiconductor device to reduce voltage variation between terminals
#1251Semiconductor module and driver device
#1252Stacked bit line dual word line nonvolatile memory
#1253Semiconductor device and method of manufacturing the same
#1254SEMICONDUCTOR DEVICE
#1255Electronic apparatus, method of optimizing de-coupling capacitor and computer-readable recording medium
#1256Ball arrangement for integrated circuit package devices
#1257SUBSTRATE LOCAL INTERCONNECT INTEGRATION WITH FINFETS
#1258Small size and fully integrated power converter with magnetics on chip
#1259Semiconductor device and semiconductor package having a plurality of differential signal balls
#1260Semiconductor Device and Method of Forming WLCSP Using Wafer Sections Containing Multiple Die
#1261Decoupling arrangement
#1262Staged via formation from both sides of chip
#1263Semiconductor device and semiconductor package
#1264Semiconductor element housing package, semiconductor device, and mounting structure
#1265Devices and methods related to radio-frequency switches having reduced-resistance metal layout
#1266Partially depopulated interconnection arrays for packaged semiconductor devices and printed circuit boards
#1267SEMICONDUCTOR DEVICE
#1268Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#1269Component-embedded substrate
#1270Flip-chip, face-up and face-down centerbond memory wirebond assemblies
#1271Co-support for XFD packaging
#1272Protruding contact for integrated chip
#1273Chip on package structure and method
#1274Semiconductor device
#1275In-situ formation of silicon and tantalum containing barrier
#1276PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
#1277Semiconductor device and method of forming a shielding layer between stacked semiconductor die
#1278Method of manufacturing semiconductor device
#1279Semiconductor device and manufacturing method thereof
#1280Integrated circuit devices having through silicon via structures and methods of manufacturing the same
#1281Semiconductor device for battery power voltage control
#1282Integrated circuit chip comprising electronic device and electronic system
#1283Integrated circuit devices including a through-silicon via structure and methods of fabricating the same
#1284Non-conductive film and non-conductive paste including zinc particles, semiconductor package including the same, and method of manufacturing the semiconductor package
#1285Power device cassette with auxiliary emitter contact
#1286Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#1287Semiconductor memory apparatus for improving characteristics of power distribution network
#1288Semiconductor device with via bar
#1289Integrated circuit structure and a battery structure
#1290Semiconductor device having plural memory chip
#1291Electronic device, test board, and semiconductor device manufacturing method
#1292Composite module
#1293Semiconductor device having stacked chips
#1294Flip chip assembly process for ultra thin substrate and package on package assembly
#1295Semiconductor device
#1296Semiconductor device
#1297Switching element and a diode being connected to a power source and an inductive load
#1298Low package parasitic inductance using a thru-substrate interposer
#1299Semiconductor package
#1300Ball arrangement for integrated circuit package devices
#1301Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
#1302Semiconductor device with covering member that partially covers wiring substrate
#1303Semiconductor device and method of forming pad layout for flipchip semiconductor die
#1304Semiconductor package including multiple chips and separate groups of leads
#1305Integrated passive device (IPD) on substrate
#1306Method of manufacturing a tunable three dimensional inductor
#1307SEMICONDUCTOR DEVICE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, ELECTRONIC COMPONENT, CIRCUIT SUBSTRATE, AND ELECTRONIC APPARATUS
#1308Image forming apparatus, chip, and chip package to reduce cross-talk between signals
#1309Multi-die fine grain integrated voltage regulation
#1310Method of manufacturing a capacitor
#1311Semiconductor device
#1312Semiconductor device and method for fabricating the same
#1313Method for off-grid routing structures utilizing self aligned double patterning (SADP) technology
#1314Technique for wafer-level processing of QFN packages
#1315Display device
#1316Image forming apparatus and chip
#1317Capacitor in post-passivation structures and methods of forming the same
#1318Electronic device with at least one impedance-compensating inductor and related methods
#1319Integrated circuit package with a conductive grid formed in a packaging substrate
#1320IMAGE FORMING APPARATUS, CHIP, AND CHIP PACKAGE
#1321Semiconductor chip and stacked type semiconductor package having the same
#1322Three dimensional energy storage device, method of manufacturing same, and mobile electronic device containing same
#1323Semiconductor devices including stair step structures, and related methods
#1324Semiconductor device and a method of manufacturing the same
#1325Semiconductor device
#1326Semiconductor device
#1327Semiconductor device
#1328Local interconnects by metal-III-V alloy wiring in semi-insulating III-V substrates
#1329Parallel signal via structure
#1330Hybrid semiconductor package
#1331Semiconductor device, electronic apparatus, and method of manufacturing semiconductor device
#1332Method of fabricating packaging substrate having a passive element embedded therein
#1333Method and system for template assisted wafer bonding
#1334SEMICONDUCTOR MODULE
#1335Multilayer printed circuit board
#1336Device and method for reducing contact resistance of a metal
#1337Semiconductor package comprising stacked integrated circuit chips having connection terminals and through electrodes symmetrically arranged
#1338Microelectronic assembly including memory packages connected to circuit panel, the memory packages having stub minimization for wirebond assemblies without windows
#1339Semiconductor device including a plurality of semiconductor chips, and a cover member with first and second brims
#1340Standard cell having cell height being non-integral multiple of nominal minimum pitch
#1341SEMICONDUCTOR CHIP AND A SEMICONDUCTOR PACKAGE HAVING A PACKAGE ON PACKAGE (POP) STRUCTURE INCLUDING THE SEMICONDUCTOR CHIP
#1342Semiconductor device including a DC-DC converter
#1343Combining cut mask lithography and conventional lithography to achieve sub-threshold pattern features
#1344Cascoded semiconductor devices with gate bias circuit
#1345Display device and manufacturing method thereof
#1346Chip and manufacturing method thereof
#1347Semiconductor integrated circuit device
#1348Decoupling circuit and semiconductor integrated circuit
#1349Embedded die-down package-on-package device
#1350Mesh planes with alternating spaces for multi-layered ceramic packages
#1351Coupled vias for channel cross-talk reduction
#1352Apparatus for improved power distribution in an electrical component board
#1353Semiconductor package and printed circuit board
#1354Stacked chip system
#1355Structure and method for a low-K dielectric with pillar-type air-gaps
#1356Method for manufacturing a semiconductor chip with each contact pad having a pad cell associated therewith
#1357Packaging devices and methods for semiconductor devices
#1358Wiring substrate for a semiconductor device having differential signal paths
#1359DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor
#1360Semiconductor device and method of manufacturing thereof
#1361Insulating structure, a method of forming an insulating structure, and a chip scale isolator including such an insulating structure
#1362Suspended inductor microelectronic structures
#1363Printed circuit board
#1364Printed circuit board
#1365Semiconductor device, wireless device, and storage device
#1366Semiconductor device and manufacturing method of semiconductor device
#1367Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#1368Semiconductor device and method of forming topside and bottom-side interconnect structures around core die with TSV
#1369Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding
#1370Memory circuits and routing of conductive layers thereof
#1371Semiconductor device and manufacturing method thereof
#1372Semiconductor circuit with electrical connections having multiple signal or potential assignments
#1373Semiconductor package including multiple chips and separate groups of leads
#1374Method for off-grid routing structures utilizing self aligned double patterning (SADP) technology
#1375Semiconductor package
#1376Device including a semiconductor chip and wires
#1377Component-embedded resin substrate
#1378Semiconductor device with resin mold
#1379Semiconductor device
#1380High density package interconnects
#1381Semiconductor device and method of manufacturing the same
#1382Semiconductor integrated circuit device, electronic apparatus, and display apparatus
#1383Semiconductor device, semiconductor device design method, semiconductor device design apparatus, and program
#1384RFID chip module
#1385Integrated circuit system with distributed power supply comprising interposer and voltage regulator
#1386Semiconductor module having heat dissipating portion
#1387Wiring board and method of manufacturing wiring board
#1388Wiring board and design method for wiring board
#1389String selection structure of three-dimensional semiconductor device
#1390Capacitor in Post-Passivation structures and methods of forming the same
#1391In situ-built pin-grid arrays for coreless substrates, and methods of making same
#1392Surface modified TSV structure and methods thereof
#1393Stub minimization using duplicate sets of signal terminals having modulo-x symmetry in assemblies without wirebonds to package substrate
#1394Stub minimization using duplicate sets of terminals having modulo-x symmetry for wirebond assemblies without windows
#1395SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
#1396Low-profile chip package with modified heat spreader
#1397Methods of making an interposer structure with embedded capacitor structure
#1398Landside stiffening capacitors to enable ultrathin and other low-Z products
#1399Stacked semiconductor chips including test circuitry
#1400Tie bar resonance suppression
#1401Wiring board and method for manufacturing the same
#1402Capacitor structure for wideband resonance suppression in power delivery networks
#1403Highly secure and extensive scan testing of integrated circuits
#1404Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques
#1405Semiconductor package having unified semiconductor chips
#1406Low-noise flip-chip packages and flip chips thereof
#1407NON-SOLDER MASK DEFINED COPPER PAD AND EMBEDDED COPPER PAD TO REDUCE PACKAGING SYSTEM HEIGHT
#1408Semiconductor device and manufacturing method thereof
#1409Semiconductor power converter and method of manufacturing the same
#1410SEMICONDUCTOR PACKAGE
#1411Arrangement for energy conditioning
#1412Configuration sequence for programmable logic device
#1413Loss of signal detection for high-speed serial links
#1414Leakage-current abatement circuitry for memory arrays
#1415Stub minimization for assemblies without wirebonds to package substrate
#1416PACKAGE SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#1417Semiconductor device and method of manufacturing the same
#1418Semiconductor package with solder resist capped trace to prevent underfill delamination
#1419Wiring substrate
#1420Wiring substrate
#1421Overvoltage protection for multi-chip module and system-in-package
#1422Semiconductor device with discrete blocks
#1423Semiconductor device
#1424Dual row quad flat no-lead semiconductor package
#1425Double through silicon via structure
#1426Package substrate and electronic device
#1427Circuit board for peripheral circuits of high-capacity modules, and a high-capacity module including a peripheral circuit using the circuit board
#1428Space imaging overlay inspection method and array substrate
#1429Low-impedance power delivery for a packaged die
#1430MICROBUMP SEAL
#1431Incorporation of passives and fine pitch through via for package on package
#1432Device for reducing contact resistance of a metal
#1433Semiconductor device and method of manufacturing the same
#1434LIQUID CRYSTAL DISPLAY DEVICE AND METHOD OF MANUFACTURING A LIQUID CRYSTAL DISPLAY DEVICE
#1435Supply voltage or ground connections for integrated circuit device
#1436Systems and methods for mitigation of mechanical degradation in high performance electrical circuit packages
#1437Ball grid array (BGA) and printed circuit board (PCB) via pattern to reduce differential mode crosstalk between transmit and receive differential signal pairs
#1438Methods for receiving and transmitting voltage through the use of supply voltage or ground connections including bond pad interconnects for integrated circuit devices
#1439Reduced-noise reference voltage platform for a voltage converter device
#1440Semiconductor device capable of switching operation modes and operation mode setting method therefor
#1441Semiconductor device having silicon interposer on which semiconductor chip is mounted
#1442Semiconductor devices and methods of manufacturing the same
#1443Semiconductor device apparatus and assembly with opposite die orientations
#1444Adaptive workload based optimizations to mitigate current delivery limitations in integrated circuits
#1445Delta arrangement of hexagonal-close-packed signal pairs
#1446Integrated circuit packaging system with interposer and method of manufacture thereof
#1447Support method, recording medium storing design support program and semiconductor device
#1448Semiconductor device and a method of manufacturing the same
#1449Semiconductor module and method for manufacturing the same
#1450Temperature compensated oscillator with improved noise performance
#1451Capacitor for interposers and methods of manufacture thereof
#1452Semiconductor device including option pads for determining an operating structure thereof, and a system having the same
#1453Switch module
#1454SEMICONDUCTOR DEVICE HAVING ENHANCED SIGNAL INTEGRITY
#1455Integrated circuit apparatus, systems, and methods
#1456Physical design symmetry and integrated circuits enabling three dimentional (3D) yield optimization for wafer to wafer stacking
#1457Semiconductor device including wiring board with semiconductor chip
#1458ARRAY SUBSTRATE FOR LIQUID CRYSTAL PANEL, AND LIQUID CRYSTAL PANEL
#1459Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits
#1460Semiconductor package and methods of formation thereof
#1461Method for fabrication of a semiconductor device and structure
#1462Power converter
#1463Method of manufacturing interposer-based damping resistor
#1464Electronic device
#1465MULTI-CHIP SEMICONDUCTOR APPARATUS
#1466Embedded capacitor module
#1467Method for assigning terminal of semiconductor package, apparatus, and semiconductor package
#1468Component assembly
#1469Power converter
#1470Semiconductor integrated circuit chip and layout method for the same
#1471Semiconductor device, memory system and method of manufacturing the semiconductor device
#1472Semiconductor package with integrated electromagnetic shielding
#1473Semiconductor chip comprising a plurality of contact pads and a plurality of associated pad cells
#1474Complex Semiconductor Packages and Methods of Fabricating the Same
#1475Methods of improving bump allocation for semiconductor devices and semiconductor devices with improved bump allocation
#1476Multilayer printed wiring board
#1477SEMICONDUCTOR DEVICE INCLUDING VOLTAGE CONVERTER CIRCUIT, AND METHOD OF MAKING THE SEMICONDUCTOR DEVICE
#1478Electronic module packages and assemblies for electrical systems
#1479Integrated circuit packaging with ball grid array having differential pitch to enhance thermal performance
#1480Integrated passive devices
#1481ESD protection circuit cell
#1482Gate driver with digital ground
#1483Multilayer connection structure
#1484Techniques for wafer-level processing of QFN packages
#1485Semiconductor package
#1486Semiconductor package including stacked semiconductor chips and a redistribution layer
#1487Decoupling arrangement
#1488Semiconductor device
#1489Mesh planes with alternating spaces for multi-layered ceramic packages
#1490Device with an integrated circuit
#1491INTEGRATED CIRCUIT INCLUDING A DIFFERENTIAL POWER AMPLIFIER WITH A SINGLE ENDED OUTPUT AND AN INTEGRATED BALUN
#1492Method to align mask patterns
#1493SEMICONDUCTOR CHIP DEVICE WITH THERMAL INTERFACE MATERIAL FRAME
#1494Monolithic ceramic electronic component and method for manufacturing the same
#1495Power management applications of interconnect substrates
#1496Stub minimization with terminal grids offset from center of package
#1497Stub minimization for multi-die wirebond assemblies with parallel windows
#1498Stub minimization for assemblies without wirebonds to package substrate
#1499Package substrate
#1500Stub minimization for wirebond assemblies without windows