207721 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
Stub minimization for wirebond assemblies without windows
#1502Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
#1503Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
#1504Stub minimization for wirebond assemblies without windows
#1505Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
#1506Stub minimization for assemblies without wirebonds to package substrate
#1507Integrated circuit package and a method for manufacturing an integrated circuit package
#1508Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
#1509Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
#1510Stub minimization for assemblies without wirebonds to package substrate
#1511Stub minimization using duplicate sets of signal terminals in assemblies without wirebonds to package substrate
#1512Electronic device having member which functions as ground conductor and radiator
#1513Printed wiring board
#1514Interposer package structure for wireless communication element, thermal enhancement, and EMI shielding
#1515Electronic device, wiring substrate, and method for manufacturing electronic device
#1516Systems and methods for lowering interconnect capacitance
#1517Semiconductor device
#1518Semiconductor integrated circuit device and method of manufacturing same
#1519Wiring substrate and semiconductor package
#1520De-pop on-device decoupling for BGA
#1521In-grid on-device decoupling for BGA
#1522Semiconductor package having support member
#1523Small size and fully integrated power converter with magnetics on chip
#1524Vertical power budgeting and shifting for three-dimensional integration
#1525Packaging identical chips in a stacked structure
#1526Component-incorporated wiring substrate and method of manufacturing the same
#1527UNIVERSAL PRINTED CIRCUIT BOARD AND MEMORY CARD INCLUDING THE SAME
#1528Method of manufacturing capacitor
#1529Lead assembly for a flip-chip power switch
#1530Signal delivery in stacked device
#1531Semiconductor device
#1532Manufacturing method for semiconductor device
#1533Wafer-level chip scale package
#1534Semiconductor element-embedded wiring substrate
#1535Flip-chip semiconductor device having anisotropic electrical interconnection and substrate utilized for the package
#1536Dual-function integrated circuit
#1537Electronic assembly including die on substrate with heat spreader having an open window on the die
#1538Ball grid array with improved single-ended and differential signal performance
#1539SEMICONDUCTOR PACKAGE INCLUDING AN EXTERNAL CIRCUIT ELEMENT
#1540Method of forming a package substrate
#1541MODULAR CHIP STACK AND PACKAGING TECHNOLOGY WITH VOLTAGE SEGMENTATION, REGULATION, INTEGRATED DECOUPLING CAPACITANCE, AND COOLING STRUCTURE AND PROCESS
#1542In situ-built pin-grid arrays for coreless substrates, and methods of making same
#1543System on a chip with interleaved sets of pads
#1544Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die
#1545Low-noise flip-chip packages and flip chips thereof
#1546In-situ formation of silicon and tantalum containing barrier
#1547Thin-film capacitor, multilayer wiring board and semiconductor device
#1548Flip chip assembly process for ultra thin substrate and package on package assembly
#1549PACKAGING STRUCTURE EMBEDDED WITH ELECTRONIC ELEMENTS AND METHOD OF FABRICATING THE SAME
#1550Multilayered board semiconductor device with BGA package
#1551Integrated circuit apparatus, systems, and methods
#1552Semiconductor device
#1553Wiring board and method for manufacturing the same
#1554Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
#1555Semiconductor device, semiconductor device design method, semiconductor design apparatus, and program
#1556Semiconductor device and manufacturing method of the same
#1557Flip-chip, face-up and face-down centerbond memory wirebond assemblies
#1558Semiconductor integrated circuit having a three-dimensional (3D) stack package structure
#1559Integrated circuit package with segregated Tx and Rx data channels
#1560Semiconductor package with embedded spiral inductor
#1561CIRCUIT BOARD
#1562Method and system for template assisted wafer bonding
#1563Semiconductor device and manufacturing method thereof
#1564SEMICONDUCTOR DEVICE
#1565Wiring board, semiconductor device, and method for manufacturing wiring board
#1566Wiring board, semiconductor device, and method for manufacturing wiring board
#1567Hybrid integrated circuit device and electronic device
#1568Semiconductor device and method of making semiconductor device
#1569Semiconductor device and method of forming pad layout for flipchip semiconductor die
#1570Semiconductor device having a pad-disposition restriction area
#1571Semiconductor integrated circuit device
#1572Electronic device for switching currents and method for producing the same
#1573Semiconductor device with resin mold
#1574Interconnections for fine pitch semiconductor devices and manufacturing method thereof
#1575Integrated circuit package with molded cavity
#1576Semiconductor package including multiple chips and separate groups of leads
#1577Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
#1578Wiring pattern having a stub wire
#1579Semiconductor apparatus having power through holes connected to power pattern
#1580Manufacturing method of semiconductor device
#1581Semiconductor device and manufacturing method therefor
#1582Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
#1583High bandwidth passive switching current sensor
#1584Semiconductor device
#1585Integrated structures of high performance active devices and passive devices
#1586Semiconductor device having a ring oscillator and MISFET for converting voltage fluctuation to frequency fluctuation
#1587Semiconductor device and wiring board
#1588Low noise flip-chip packages and flip chips thereof
#1589Semiconductor device and package wiring substrate with matrix pattern external terminals for transmitting a differential signal
#1590Enhanced ESD protection of integrated circuit in 3DIC package
#1591Method for making multilayer connection structure
#1592Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers
#1593Multilayer printed wiring board
#1594Method and apparatus for low inductive design pattern
#1595Techniques for attenuating resonance induced impedance in integrated circuits
#1596Continuously referencing signals over multiple layers in laminate packages
#1597IC package with embedded filters
#1598Semiconductor device and a method of manufacturing the same
#1599Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors
#1600Package substrate having a through hole and method of fabricating the same
#1601Device packaging with substrates having embedded lines and metal defined pads
#1602Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
#1603Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
#1604Method and system for template assisted wafer bonding
#1605Semiconductor device for battery power voltage control
#1606Resin multilayer substrate and method for manufacturing the resin multilayer substrate
#1607Semiconductor device including a DC-DC converter
#1608Semiconductor package
#1609Semiconductor device comprising stacked LSI having circuit blocks connected by power supply and signal line through vias
#1610Semiconductor device having plural memory chip
#1611Semiconductor device having semiconductor substrate electrode pads, and external electrodes
#1612Semiconductor chip and semiconductor device
#1613MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME
#1614Printed wiring board and method for manufacturing the same
#1615Semiconductor device having power supply-side and ground-side metal reinforcing members insulated from each other
#1616Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#1617Semiconductor device
#1618Semiconductor integrated circuit
#1619Integrated circuit system with distributed power supply comprising interposer and voltage regulator module
#1620Accessing or interconnecting integrated circuits
#1621Apparatus, system, and method for wireless connection in integrated circuit packages
#1622Hybrid integrated circuit device and electronic device
#1623Low-noise flip-chip packages and flip chips thereof
#1624Thermal power plane for integrated circuits
#1625APPARATUS FOR MONOLITHIC POWER GATING ON AN INTEGRATED CIRCUIT
#1626Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor
#1627Flip chip bump array with superior signal performance
#1628Semiconductor device substrate and semiconductor device
#1629Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor
#1630Pad structure having contact bars extending into substrate and wafer having the pad structure
#1631Method of manufacturing semiconductor device
#1632Flexible packaging for chip-on-chip and package-on-package technologies
#1633Nonvolatile memory devices and methods forming the same
#1634Electronic passive device
#1635Chip Capacitor Precursors
#1636Assembly method for converting the precursors to capacitors
#1637Integrated circuit package with reduced parasitic loop inductance
#1638Stacked semiconductor device assembly
#1639VLSI Package for High Performance Integrated Circuit
#1640Staged via formation from both sides of chip
#1641Package substrate, module and electric/electronic devices using the same
#1642SEMICONDUCTOR PACKAGE INCLUDING DECOUPLING SEMICONDUCTOR CAPACITOR
#1643SEMICONDUCTOR INTEGRATED CIRCUIT
#1644BALL GRID ARRAY PACKAGE
#1645Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor die
#1646Composite electronic circuit assembly
#1647Thermal enhancement for multi-layer semiconductor stacks
#1648Semiconductor device and method of manufacturing the same
#1649Packaging substrate having a passive element embedded therein and method of fabricating the same
#1650Power conversion apparatus and cooling structure therefor
#1651Electronic component and method for manufacturing the same
#1652SEMICONDUCTOR DEVICE
#1653Semiconductor device, electronic apparatus, and method of manufacturing semiconductor device
#1654CAPACITOR STRUCTURE WITH RAISED RESONANCE FREQUENCY
#1655Circuit Device
#1656Semiconductor chip layout
#1657Semiconductor integrated circuit chip and layout method for the same
#1658Arrangement for energy conditioning
#1659Ceramic electronic component and wiring board
#1660ELECTRONIC COMPONENT AND PRINTED WIRING BOARD
#1661Low noise high thermal conductivity mixed signal package
#1662DC-DC CONVERTER
#1663Semiconductor and a method of manufacturing the same
#1664Integrated structures of high performance active devices and passive devices
#1665Multi-chip package including chip address circuit
#1666Method of manufacturing printed wiring board
#1667Die connection monitoring system and method
#1668Ball grid array with improved single-ended and differential signal performance
#1669Semiconductor integrated circuit device
#1670Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer
#1671Corrugated die edge for stacked die semiconductor package
#1672Semiconductor storage device and manufacturing method thereof
#1673SEMICONDUCTOR PACKAGE HAVING DE-COUPLING CAPACITOR
#1674Display device
#1675Package substrate
#1676SEMICONDUCTOR APPARATUS
#1677Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitor
#1678Wiring board, method of manufacturing the same, and semiconductor device
#1679MULTILAYER PRINTED WIRING BOARD
#1680Method of manufacturing an inductor for a microelectronic device
#1681Integrated circuit apparatus, systems, and methods
#1682SEMICONDUCTOR DEVICE
#1683Semiconductor package with a conductive shielding member
#1684Reception circuit and signal reception method
#1685Integrated circuit package system with embedded die superstructure and method of manufacture thereof
#1686INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POSTS AND METHOD OF MANUFACTURE THEREOF
#1687PRINTED WIRING BOARD AND METHOD OF SUPPRESSING POWER SUPPLY NOISE THEREOF
#1688Semiconductor apparatus and power supply circuit
#1689Semiconductor device
#1690Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#1691High-dielectric sheet, a printed circuit board having the high-dielectric sheet and production methods thereof
#1692High speed, high density, low power die interconnect system
#1693High speed, high density, low power die interconnect system
#1694Semiconductor device capable of switching operation modes
#1695Chip package and method for forming the same
#1696SEMICONDUCTOR DEVICE
#1697Stacked bit line dual word line nonvolatile memory
#1698In system reflow of low temperature eutectic bond balls
#1699Voltage converter
#1700Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors
#1701SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
#1702Electronic circuit
#1703Multilayered board semiconductor device with BGA package
#1704Integrated circuit package for semiconductior devices with improved electric resistance and inductance
#1705Semiconductor device and multi-layered wiring substrate
#1706Semiconductor device capable of switching operation mode and operation mode setting method therefor
#1707Semiconductor device providing a first electrical conductor and a second electrical conductor in one through hole and method for manufacturing the same
#1708Reducing susceptibility to electrostatic discharge damage during die-to-die bonding for 3-D packaged integrated circuits
#1709Semiconductor device and electronic device
#1710Semiconductor device and a method of manufacturing the same
#1711Interconnect pattern for transceiver package
#1712SEMICONDUCTOR PACKAGE
#1713Semiconductor package
#1714Arrangement for energy conditioning
#1715Interconnect pattern for high performance interfaces
#1716Semiconductor device
#1717Composite module
#1718Semiconductor device
#1719SEMICONDUCTOR DEVICE
#1720LEAD PIN AND WIRING SUBSTRATE WITH LEAD PIN
#1721High-frequency circuit package and sensor module
#1722SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#1723System on chip power management through package configuration
#1724Semiconductor device
#1725Attaching passive components to a semiconductor package
#1726Integrated Circuit Module and Multichip Circuit Module Comprising an Integrated Circuit Module of This Type
#1727Semiconductor device including a DC-DC converter having a metal plate
#1728Contact equipment and circuit package
#1729High-frequency circuit package and sensor module
#1730Semiconductor memory device, semiconductor package and system having stack-structured semiconductor chips
#1731Semiconductor package and method for making the same
#1732Integrated circuit package with embedded components
#1733Display device and manufacturing method thereof
#1734Wiring board, manufacturing method of the wiring board, and semiconductor package
#1735Package substrate and semiconductor apparatus
#1736Printed wiring board and method of suppressing power supply noise thereof
#1737Universal IO unit, associated apparatus and method
#1738Spacer, and its manufacturing method
#1739Semiconductor device
#1740Hybrid integrated circuit device, and method for fabricating the same, and electronic device
#1741Electronic component package, base of electronic component package, and junction structure of electronic component package and circuit substrate
#1742POWER AND SIGNAL DISTRIBUTION OF INTEGRATED CIRCUITS
#1743Grounding system and apparatus
#1744Electronic passive device
#1745Semiconductor package and method for fabricating the same
#1746Pin-out designation method for package-board codesign
#1747CAPACITOR ELECTRODE, CAPACITOR STRUCTURE AND METHOD OF MAKING THE SAME
#1748Semiconductor integrated circuit
#1749Semiconductor device, semiconductor element, and substrate
#1750Semiconductor package substrate and semiconductor device having the same
#1751Semiconductor integrated circuit and multi-chip module
#1752Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
#1753Semiconductor die-based packaging interconnect
#1754Semiconductor Device and Method of Forming Pad Layout for Flipchip Semiconductor Die
#1755Semiconductor integrated circuit
#1756Interconnection of land section to wiring layers at center of external connection terminals in semiconductor device and manufacturing thereof
#1757Wiring board with built-in capacitor
#1758SEMICONDUCTOR DEVICE
#1759Method of wirebonding that utilizes a gas flow within a capillary from which a wire is played out
#1760Method for manufacturing interposer
#1761Semiconductor device, and power conversion device using semiconductor device
#1762Semiconductor device having a wafer level chip size package structure
#1763Three-dimensional silicon interposer for low voltage low power systems
#1764Semiconductor device
#1765Ball-grid-array package, electronic system and method of manufacture
#1766Systems and methods to laminate passives onto substrate
#1767Wiring board having piercing linear conductors and semiconductor device using the same
#1768Low noise high thermal conductivity mixed signal package
#1769Semiconductor package and method of manufacturing the same
#1770Semiconductor packages including heat slugs
#1771Semiconductor Device and Method of Forming Conductive TSV in Peripheral Region of Die Prior to Wafer Singulaton
#1772Providing in package power supplies for integrated circuits
#1773Systems and methods for lowering interconnect capacitance through adjustment of relative signal levels
#1774Semiconductor device
#1775METHOD OF DESIGNING SEMICONDUCTOR INTEGRATED CIRCUIT, DESIGNING APPARATUS, SEMICONDUCTOR INTEGRATED CIRCUIT SYSTEM, SEMICONDUCTOR INTEGRATED CIRCUIT MOUNTING SUBSTRATE, PACKAGE AND SEMICONDUCTOR INTEGRATED CIRCUIT
#1776SEMICONDUCTOR DEVICE
#1777CIRCUIT PACKAGE WITH INTEGRATED DIRECT-CURRENT (DC) BLOCKING CAPACITOR
#1778Semiconductor chip, film substrate, and related semiconductor chip package
#1779Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#1780Semiconductor package having non-uniform contact arrangement
#1781Fabrication method for circuit substrate having post-fed die side power supply connections
#1782Printed circuit board
#1783SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE
#1784Apparatus for stacking integrated circuits
#1785High Density MIM Capacitor Embedded in a Substrate
#1786Electrical property altering, planar member with solder element in IC chip package
#1787Multilayer printed wiring board
#1788EQUIPOTENTIAL PAD CONNECTION
#1789Semiconductor device with reduced cross talk
#1790MOTHERBOARD WITH MOUNTING HOLES
#1791Energy conditioning circuit arrangement for integrated circuit
#1792Ceramic capacitor and wiring board
#1793Method for manufacturing ceramic capacitor
#1794Semiconductor chip and semiconductor device, and method for manufacturing semiconductor device
#1795Semiconductor device
#1796Die down ball grid array packages and method for making same
#1797Structure and method for forming a capacitively coupled chip-to-chip signaling interface
#1798SEMICONDUCTOR DEVICE
#1799MULTILAYER PRINTED WIRING BOARD
#1800Display device and manufacturing method thereof