Three-dimensional memory device containing amorphous and crystalline blocking dielectric layers

Metal option structure of semiconductor device

SELECTIVE INTERCONNECTS IN BACK-END-OF-LINE METALLIZATION STACKS OF INTEGRATED CIRCUITRY

Barrier-free vertical interconnect structure

Methods of manufacturing semiconductor devices

Low resistance crosspoint architecture

Integrated system with power management integrated circuit having on-chip thin film inductors

Semiconductor memory

Apparatuses including band offset materials, and related systems

Microelectronic devices including stair step structures, and related electronic devices and methods

Method for preparing semiconductor device with air gap structure

Three-dimensional memory arrays with layer selector transistors

Methods of forming memory devices including stair step structures

Vertically integrated device stack including system on chip and power management integrated circuit

Integrated circuit (IC) device integral capacitor and anti-fuse

Fan-out semiconductor package

Method for providing a semiconductor device with silicon filled gaps

Socket design for a memory device

Semiconductor device and manufacturing method thereof

Semiconductor memory device and manufacturing method thereof

Vertical 3D stack NOR device

Semiconductor memory device including capacitor

Semiconductor memory devices

Semiconductor device including a field effect transistor

Logic drive based on multichip package using interconnection bridge

Semiconductor device with edge-protecting spacers over bonding pad

INTEGRATED WORD LINE CONTACT STRUCTURES IN THREE-DIMENSIONAL (3D) MEMORY ARRAY

Method of manufacturing a semiconductor structure

Interconnect structure and method of forming the same

Semiconductor structure and method for fabricating the same

Structures and methods for heat dissipation of semiconductor devices

Fully aligned top vias

HYBRID METALLIZATION AND DIELECTRIC INTERCONNECTS IN TOP VIA CONFIGURATION

SPACER-BASED CONDUCTOR CUT

Memory arrays and methods used in forming a memory array comprising strings of memory cells

Trench isolation for advanced integrated circuit structure fabrication

Semiconductor storage device

Field plate structure to enhance transistor breakdown voltage

Memory cells with vertically overlapping wordlines

Semiconductor device

Semiconductor memory device and manufacturing method of the semiconductor memory device

Three-dimensional memory device containing width-modulated connection strips and methods of forming the same

Hybrid bonding contact structure of three-dimensional memory device

Semiconductor device with diffusion barrier in the active contact

Semiconductor device

Semiconductor device and method of fabricating the same

Hybrid integrated circuit package and method

Semiconductor device with spacer over bonding pad

Microelectronic devices with polysilicon fill material between opposing staircase structures, and related devices, systems, and methods

Die interconnect substrate, an electrical device and a method for forming a die interconnect substrate

Semiconductor device, and associated method and system

Conductive rail structure for semiconductor devices

Wiring substrate and semiconductor device

Self-aligned contacts

Semiconductor device with spacers for self aligned vias

ISOLATION STRUCTURE FOR METAL INTERCONNECT

Semiconductor device and manufacturing method thereof

Fin field effect transistor (FinFET) device structure with protection layer and method for forming the same

Top via with hybrid metallization

Multi-wafer capping layer for metal arcing protection

Wet cleaning with tunable metal recess for via plugs

Planarization method of a capping insulating layer, a method of forming a semiconductor device using the same, and a semiconductor device formed thereby

Semiconductor device and method of manufacture using a contact etch stop layer (CESL) breakthrough process

Profile of deep trench isolation structure for isolation of high-voltage devices

Method of forming a semiconductor device

TFT array substrate

Variable die size memory device and methods of manufacturing the same

Semiconductor device having a stack of data lines with conductive structures on both sides thereof

Through array contact structure of three-dimensional memory device

Integrated circuit including at least one memory cell with an antifuse device

Thin film transistor based memory cells on both sides of a layer of logic devices

3D device and devices with bonding

Sidewall spacer to reduce bond pad necking and/or redistribution layer necking

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor device and method of manufacturing the same

Integrated assemblies

Semiconductor memory device and apparatus including the same

Interconnect structure and electronic apparatus including the same

Three-dimensional semiconductor device including a through-via structure having a via liner having protruding portions

Integrated circuit with circuit cells having lower intercell routing metal layers

Semiconductor device and method of fabricating the same

Methods for manufacturing a memory array having strings of memory cells comprising forming bridge material between memory blocks

Methods used in forming a memory array comprising strings of memory cells

Through-Substrate Vias with Improved Connections

Self-aligned top via formation at line ends

Integrated circuit device including air gaps and method of manufacturing the same

Backside deep isolation structures for semiconductor device arrays

Three-dimensional memory devices with backside isolation structures

Semiconductor arrangement

Semiconductor device, manufacturing method, imaging element, and electronic device

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device, image pickup device, and method for manufacturing semiconductor device

Vertical memory devices

Three-dimensional microelectronic package with embedded cooling channels

Semiconductor package structure and method of manufacturing the same

Power delivery network for CFET with buried power rails

Back end of the line metal structure and method

Middle-end-of-line strap for standard cell

Thermal routing trench by additive processing

Interconnect integration scheme with fully self-aligned vias

Double patterning interconnect integration scheme with SAV

Semiconductor structure with a laminated layer

Semiconductor device with multi-layer etch stop structure and method for forming the same

3D semiconductor device and structure

INTEGRATED CIRCUIT LAYOUT DIAGRAM SYSTEM

Semiconductor device for sensing impedance changes in a medium

Device and method for temperature monitoring of a semiconductor device

Sputtering a layer on a substrate using a high-energy density plasma magnetron

Magnetically enhanced high density plasma-chemical vapor deposition plasma source for depositing diamond and diamond-like films

Memory arrays and methods used in forming a memory array comprising strings of memory cells

Semiconductor device including vertical routing structure and method for manufacturing the same

Structure and method for isolation of bit-line drivers for a three-dimensional NAND

Interconnect fabricated with flowable copper

Chip package and method of fabricating the same

Via structure and methods thereof

Methods for forming microelectronic devices with self-aligned interconnects, and related devices and systems

Interconnects having a via-to-line spacer for preventing short circuit events between a conductive via and an adjacent line

MULTI-LAYER ONE TIME PROGRAMMABLE PERMANENT MEMORY AND PREPARATION METHOD THEREOF

Inspection structure and inspection method

Semiconductor device, layout design method for the same and method for fabricating the same

Semiconductor device

Three-dimensional memory devices and fabrication methods thereof

Multi-stack three-dimensional memory devices and methods for forming the same

Three-dimensional memory device with corrosion-resistant composite spacer

Memory device and method of manufacturing the same

Three-dimensional memory devices having through array contacts and methods for forming the same

3D integrated circuit device and structure with hybrid bonding

Semiconductor device and manufacturing method of the same

Semiconductor devices including a thick metal layer

Semiconductor fuse structure and method of manufacturing a semiconductor fuse structure

Semiconductor structure with fully aligned vias

Resonant LC tank package and method of manufacture

Magnetically enhanced low temperature-high density plasma-chemical vapor deposition plasma source for depositing diamond and diamond-like films

Semiconductor device having reduced capacitance between source and drain pads

Semiconductor devices including resistor structures

Magnetic random access memory device and formation method thereof

Semiconductor structure and method for manufacturing the same

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Vertical semiconductor devices

Metal gate contacts and methods of forming the same

Source/drain contact having a protruding segment

Semiconductor device and method of fabricating the same

Composite IC chips including a chiplet embedded within metallization layers of a host IC chip

Vias in composite IC chip structures

Bump structure to prevent metal redeposit and to prevent bond pad consumption and corrosion

Bottom barrier free interconnects without voids

Embedded dual-sided interconnect bridges for integrated-circuit packages

Integrated circuit structures having differentiated interconnect lines in a same dielectric layer

Via Rail Structure

Via structure having a metal hump for low interface resistance

Semiconductor memory device and manufacturing method thereof

Middle-of-line interconnect structure and manufacturing method

Semiconductor device and methods of forming the same

Contact features and methods of fabricating the same in semiconductor devices

THIN FILM BASED PASSIVE DEVICES AND METHODS OF FORMING THE SAME

Method and apparatus for forming self-aligned via with selectively deposited etching stop layer

MICROELECTRODE ARRAY AND METHODS OF FABRICATING SAME

Package structure and manufacturing method thereof

Semiconductor package

Integrated circuit package and method

Interconnect structure for fin-like field effect transistor

Encapsulated top via interconnects

Metallic interconnect structure

Self-aligned scheme for semiconductor device and method of forming the same

Enhanced intermetal dielectric adhesion

Staircase formation in three-dimensional memory device

Structure and method to fabricate fully aligned via with reduced contact resistance

Fully aligned top vias with replacement metal lines

Semiconductor structure with oxidized ruthenium

Semiconductor device having improved overlay shift tolerance

Three-dimensional memory device including contact-level bit-line-connection structures and methods of making the same

Charging prevention method and structure

Replacement gate structures for advanced integrated circuit structure fabrication

Contact over active gate structures with metal oxide-caped contacts to inhibit shorting

Memory device

Memory device with transistors above memory stacks and manufacturing method of the memory device

Three-dimensional memory device having multi-deck structure and methods for forming the same

Semiconductor storage device and method for producing semiconductor storage device

Semiconductor device and method for fabricating the same

Semiconductor device with multiple polarity groups

Semiconductor assemblies using edge stacking and methods of manufacturing the same

Method for protecting an integrated circuit, and corresponding device

BEOL alternative metal interconnects: integration and process

Integrated Assemblies Having Barrier Material Between Silicon-Containing Material and Another Material Reactive with Silicon

Semiconductor package and manufacturing method thereof

Semiconductor memory device

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR MEMORY DEVICE

Semiconductor device and method of manufacturing same

Method of manufacturing semiconductor device

Semiconductor device and method of fabricating the same

Self-aligned patterning with colored blocking and structures resulting therefrom

Package structure and method of fabricating the same

Semiconductor device and manufacturing method thereof

Package structure, package-on-package structure and method of fabricating the same

Three-dimensional memory device containing tubular blocking dielectric spacers

Integrated circuit structures having linerless self-forming barriers

Contact over active gate structures with metal oxide layers to inhibit shorting

Integrated circuit structure of capacitive device

Semiconductor device and method for manufacturing the same

Fully self-aligned via

Method for fabricating a semiconductor device including self-aligned top via formation at line ends

Self-aligned contacts for MOL

Semiconductor structure and fabrication method thereof

MULTIPLE LAYER COPPER SEEDING

Interconnect structures including self aligned vias

Methods of etching metals in semiconductor devices

Method for improving circuit layout for manufacturability

Integrated circuit and method of manufacturing the same

Multi-dimensional integrated circuits having semiconductors mounted on multi-dimensional planes and multi-dimensional memory structure

Isolation of circuit elements using front side deep trench etch

Semiconductor structure and manufacturing method for the same

Magnetic memory devices

Three-dimensional memory devices having through stair contacts and methods for forming the same

Semiconductor memory device

Semiconductor memory device

Three-dimensional semiconductor memory device with concave convex separation structures

Three-dimensional memory devices having through array contacts and methods for forming the same

Ferroelectric random access memory (FRAM) cell

Semiconductor device and method for fabricating the same

Semiconductor package structure

Backside contact for thermal displacement in a multi-wafer stacked integrated circuit

Semiconductor structure and manufacturing method thereof

Interconnect structure

Graphene-assisted low-resistance interconnect structures and methods of formation thereof

Package structure having conductive patterns with crystal grains copper columnar shape and method manufacturing the same

Graphene barrier layer

Semiconductor device and method of manufacture

Semiconductor device including back side power supply circuit

Interconnect structure and method for forming the same

Manufacturing method of memory device

Package substrate and method of fabricating the same and chip package structure

Semiconductor devices having vias on a scribe lane region

SEMICONDUCTOR MEMORY DEVICE

Placing top vias at line ends by selective growth of via mask from line cut dielectric

Assemblies comprising memory cells and select gates

Via contact patterning method to increase edge placement error margin

Self-aligned via structures with barrier layers

Barrier-free interconnect structure and manufacturing method thereof

Interconnect structure and method for forming the same

Advanced lithography and self-assembled devices

Ion through-substrate via

Semiconductor packages with shortened talking path

Selective recessing to form a fully aligned via

Semiconductor device with reduced contact resistance and methods of forming the same

Method and IC design with non-linear power rails

Bilayer barrier for interconnect and memory structures formed in the BEOL

Skip-via proximity interconnect

Selective patterning of vias with hardmasks

Contact resistance between via and conductive line

Integrated circuit, system for and method of forming an integrated circuit

SRAM having irregularly shaped metal lines

Semiconductor device

Memory device including multiple decks

Package structure with protective structure and method of fabricating the same

Semiconductor device

Electronic device and method for fabricating the same

Semiconductor device

Patterning approach for improved via landing profile

Module structure and method for manufacturing the module structure

Method of manufacturing chip packaging structure

Self aligned gratings for tight pitch interconnects and methods of fabrication

IC having trench-based metal-insulator-metal capacitor

Stacked capacitor

Semiconductor die contact structure and method

Interconnection structure of selective deposition process

Interconnect structure and method

Conductive feature structure including a blocking region

Cross-wafer RDLs in constructed wafers

Heterogeneous metal line compositions for advanced integrated circuit structure fabrication

Via resistance reduction

Semiconductor device

Vertical non-volatile memory devices and methods of programming the same

Semiconductor memory device and method for manufacturing semiconductor memory device

Semiconductor memory device and method of manufacturing the same

3D NAND memory device and method of forming the same

Etch method for opening a source line in flash memory

3D memory array having select lines

Cell manufacturing

Three-dimensional semiconductor memory device

Stacked die structure and method of fabricating the same

Package substrate with high-density interconnect layer having pillar and via connections for fan out scaling

Interconnect structure, semiconductor structure including interconnect structure and method for forming the same

Semiconductor packages

Molded embedded bridge including routing layers for enhanced EMIB applications

Package substrate and method of fabricating the same

Package structure including a first electronic device, a second electronic device and a plurality of dummy pillars

Semiconductor device comprising etch stop layer over dielectric layer and method of manufacture

Advanced metal connection with metal cut

STACKED STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Structure and formation method of chip package with fan-out feature

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Amorphous layers for reducing copper diffusion and method forming same

Patterning methods for semiconductor devices and structures resulting therefrom

Semiconductor device and method of manufacture

Transistor and display device

Back end of line nanowire power switch transistors

Solid-state imaging device, method for manufacturing the same, and electronic apparatus

Semiconductor devices

Vertical memory devices

Memory arrays and methods used in forming a memory array comprising strings of memory cells