SEMICONDUCTOR DEVICE HAVING MULTILAYER INTERCONNECTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Structure and method for improving high voltage breakdown reliability of a microelectronic device

Power distribution networks for a three-dimensional (3D) integrated circuit (IC) (3DIC)

Integrated circuit package with microstrip routing and an external ground plane

Fan-out semiconductor package including electromagnetic interference shielding layer

Method of forming semiconductor device having a dual material redistribution line

Package structure and method of forming package structure

Semiconductor device comprising a die seal including long via lines

BOARD FOR ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT PACKAGE, AND METHOD OF MANUFACTURING BOARD FOR ELECTRONIC COMPONENT PACKAGE

Forming self-aligned vias and air-gaps in semiconductor fabrication

Semiconductor structure of interconnect and fabrication method thereof

Selective deposition of WCN barrier/adhesion layer for interconnect

Asymmetric stair structure and method for fabricating the same

High-speed semiconductor device and method for forming the same

Densely stacked metal-insulator-metal capacitor and method of forming the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Semiconductor structure and method for manufacturing the same

Semiconductor device

Three-dimensional semiconductor memory device and method for manufacturing the same

Graphene wiring structure and semiconductor device using the same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

Reducing metallic interconnect resistivity through application of mechanical strain

SEMICONDUCTOR MEMORY DEVICE AND METHOD FOR MANUFACTURING SAME

Semiconductor device

Semiconductor device and method for manufacturing the same

STRUCTURE AND METHOD FOR CAPPING COBALT CONTACTS

Method of Surface Localized Pore Sealing of Porous Dielectric Material

Semiconductor integrated circuit device having reduced power consumption

Power rail for standard cell block

Metal interconnects for super (skip) via integration

Memory device having capped embedded wires

Semiconductor device, layout pattern and method for manufacturing an integrated circuit

Chip-size, double side connection package and method for manufacturing the same

Chamferless via structures

Semiconductor device package and method of manufacturing the same

Method and structure for dual sheet resistance trimmable thin film resistors

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor memory device

Three dimensional semiconductor device and method of forming the same

Three-dimensional memory device with short-free source select gate contact via structure and method of making the same

Integrated circuit and computer-implemented method of manufacturing the same

Semiconductor device and method of forming the same

Integrated circuit device and method of manufacturing the same

Integrated circuit device and method of manufacturing the same

Logic cell structure with interconnection design and configuration

Semiconductor device

Integrated circuit device

Assemblies having shield lines of an upper wiring layer electrically coupled with shield lines of a lower wiring layer

Interconnect structure having power rail structure and related method

Integrated circuit structure including via interconnect structure abutting lateral ends of metal lines and methods of forming same

Semiconductor device including a substrate contact plug and manufacturing method thereof

Semiconductor device and method for manufacturing same

Methods for forming conductive paths and vias

Thin film resistor methods of making contacts

Semiconductor device having inductor

Integrated transformers and integrated balanced to unbalanced transformers

SEMICONDUCTOR DEVICE

Electronic device and method for fabricating the same

Three-dimensional semiconductor device

Integrated circuit device

Wiring with external terminal

Memory and fabrication method thereof

Enhanced self-alignment of vias for a semiconductor device

Integrated circuits having parallel conductors and their formation

Computationally efficient nano-scale conductor resistance model

Independent gate FinFET with backside gate contact

Independent gate FinFET with backside gate contact

Methods of forming backside self-aligned vias and structures formed thereby

Body contact layouts for semiconductor structures

Semiconductor device containing multilayer titanium nitride diffusion barrier and method of making thereof

Method of bonding semiconductor substrates

Semiconductor device and method of manufacturing the same

Semiconductor device, semiconductor integrated circuit, and load driving device

METHOD OF FABRICATING SEMICONDUCTOR PACKAGE

Semiconductor structure and manufacturing method thereof

High performance middle of line interconnects

Self-aligned pattern formation for a semiconductor device

Technologies for inverting lithographic patterns and semiconductor devices including high aspect ratio structures

3D low flux, high-powered MMIC amplifiers

Antenna apparatus and method

Microstructure modulation for 3D bonded semiconductor structure with an embedded capacitor

Microstructure modulation for 3D bonded semiconductor containing an embedded resistor structure

Method and structure for semiconductor mid-end-of-line (MEOL) process

Microstructure modulation for metal wafer-wafer bonding

Nitride structure having gold-free contact and methods for forming such structures

BEOL vertical fuse formed over air gap

Fan-out semiconductor package

Mechanisms for forming metal-insulator-metal (MIM) capacitor structure

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Method for blocking a trench portion

Memory array and method of forming the same

Seal-ring structure for stacking integrated circuits

Methods of forming integrated circuit package with thermally conductive pillar

SEMICONDUCTOR APPARATUS AND METHOD FOR PREPARING THE SAME

SEMICONDUCTOR APPARATUS AND METHOD FOR PREPARING THE SAME

Seal ring for wafer level package

Method for fabricating contact electrical fuse

Substrate-less stackable package with wire-bond interconnect

Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates

Low resistance seed enhancement spacers for voidless interconnect structures

Low resistance seed enhancement spacers for voidless interconnect structures

Lithographacally defined vias for organic package substrate scaling

Dual liner silicide

Self aligned conductive lines with relaxed overlay

Method of forming a self-aligned contact using selective SiOdeposition

Semiconductor device having groove-shaped via-hole

Variable space mandrel cut for self aligned double patterning

Self-aligned quadruple patterning (SAQP) for routing layouts including multi-track jogs

Semiconductor device

Method of fabricating semiconductor device

Selective passivation and selective deposition

Integrated structures comprising channel material extending into source material

Package with solder regions aligned to recesses

Forming bonding structures by using template layer as templates

Semiconductor device and manufacturing method thereof

Series MIM structures

Three plate MIM capacitor via integrity verification

Three plate MIM capacitor via integrity verification

Devices with chamfer-less vias multi-patterning and methods for forming chamfer-less vias

RANDOM NUMBER GENERATING DEVICE AND RANDOM NUMBER GENERATING METHOD

Critical dimension shrink through selective metal growth on metal hardmask sidewalls

Fully integrated broadband interconnect

Contacts for highly scaled transistors

Semiconductor devices with non-overlapping slits in-between memory blocks

Protective layer for contact pads in fan-out interconnect structure and method of forming same

METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON

Sensor shielding for harsh media applications

Semiconductor device including an air gap between wirings and manufacturing method thereof

Circuit design having aligned power staples

Semiconductor devices including a capping layer

Enhancing integrated circuit density with active atomic reservoir

Electronic device and method for fabricating the same

Semiconductor device

Conformal low temperature hermetic dielectric diffusion barriers

Semiconductor devices and methods for forming semiconductor devices

Group III-V device structure

Discrete charge trapping elements for 3D NAND architecture

Vertical memory devices and methods of manufacturing the same

Semiconductor device including resistor structure

Drain-extended metal-oxide-semiconductor bipolar switch for electrical overstress protection

Thin 3D die with electromagnetic radiation blocking encapsulation

Hybrid dielectric scheme for varying liner thickness and manganese concentration

Cobalt based interconnects and methods of fabrication thereof

Raised via for terminal connections on different planes

Method and apparatus for forming self-aligned via with selectively deposited etching stop layer

Self-aligned via forming to conductive line and related wiring structure

Design-aware pattern density control in directed self-assembly graphoepitaxy process

Methods for isolating portions of a loop of pitch-multiplied material and related structures

Memory device including multiple gate-induced drain leakage current generator circuits

Memory device having programmable impedance elements with a common conductor formed below bit lines

Semiconductor memory device and structure

Semiconductor structure and manufacturing method thereof

Multiple driver pin integrated circuit structure

Methods of forming conductive structures including stair step or tiered structures having conductive portions

Increased contact alignment tolerance for direct bonding

Bottom-up selective dielectric cross-linking to prevent via landing shorts

Embedded metal-insulator-metal (MIM) decoupling capacitor in monolitic three-dimensional (3D) integrated circuit (IC) structure

Semiconductor device and semiconductor device fabrication method

Self-aligned isotropic etch of pre-formed vias and plugs for back end of line (BEOL) interconnects

Maskless air gap to prevent via punch through

Interconnect structure including airgaps and substractively etched metal lines

Semiconductor devices and methods of fabricating the same

Semiconductor device

Magnetic memory devices

Pixel structure, manufacturing method and display panel

Three-dimensional memory device with enhanced mechanical stability semiconductor pedestal and method of making thereof

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

Semiconductor device for avoiding short circuit between adjacent storage nodes and manufacturing method thereof

Semiconductor device including fuse structure

3D semiconductor device and structure

Cobalt contact and interconnect structures

Cobalt contact and interconnect structures

Method for forming fin field effect transistor (FinFET) device structure with interconnect structure

Via connection to a partially filled trench

Magnetically enhanced high density plasma-chemical vapor deposition plasma source for depositing diamond and diamond-like films

Semiconductor device and a method for fabricating the same

Nanowire-based vertical memory cell array having a metal layer interposed between a common back plate and the nanowires

MIM CAPACITOR WITH ENHANCED CAPACITANCE

Method of forming semiconductor memory device

Electronic device with integrated galvanic isolation, and manufacturing method of the same

Structure and method to reduce copper loss during metal cap formation

Semiconductor device structures including stair step structures, and related semiconductor devices

Semiconductor memory device and a manufacturing method thereof

Semiconductor device including a porous dielectric layer, and method of forming the semiconductor device

Circuits for and methods of implementing an inductor and a pattern ground shield in an integrated circuit

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

Solid state memory device, and manufacturing method thereof

Semiconductor packaging method, semiconductor package and stacked semiconductor packages

Alternative ground lines for inter-slot grounding

Multiple via structure for high performance standard cells

Semiconductor devices and contact plugs

Semiconductor device and method of manufacturing thereof

Methods of manufacturing integrated magnetic core inductors with vertical laminations

Semiconductor apparatus, system, and method of producing semiconductor apparatus

Vertical semiconductor devices

Semiconductor device and method of manufacturing semiconductor device

Controlled resistance integrated snubber for power switching device

Semiconductor arrangement with a sealing structure

Integrated circuit interconnect structure having metal oxide adhesive layer

Corrosion and/or etch protection layer for contacts and interconnect metallization integration

Interconnect structure and method of forming the same

Method of forming high density, high shorting margin, and low capacitance interconnects by alternating recessed trenches

Fan-out semiconductor package

Phase changing on-chip thermal heat sink

Test structure for testing via resistance and method

Middle of the line (MOL) contacts with two-dimensional self-alignment

Microelectronic assembly from processed substrate

Data processing device using neural network, electronic component, and electronic device

Semiconductor devices, methods of manufacture thereof, and capacitors

Semiconductor device and method for fabricating the same

ROM chip manufacturing structures having shared gate electrodes

Integrated circuit having vertical transistor and semiconductor device including the integrated circuit

Semiconductor device including overlay patterns

Integrated circuit structure with continuous metal crack stop

Conductive structure and method of forming the same

Interconnection structure and manufacturing method thereof

Air gap structure and method

Memory devices, semiconductor devices and related methods

Memory device and method of disposing conduction lines of the same

Method of forming interconnection structure

Semiconductor device with reduced via resistance

Barrier layers in trenches and vias

Interconnection lines having variable widths and partially self-aligned continuity cuts

Interconnection cells having variable width metal lines and fully-self aligned variable length continuity cuts

Apparatus and method for forming interconnection lines having variable pitch and variable widths

Via blocking layer

Interconnect structure and method of forming the same

Solar cell module and conductor

MONOLITHIC INTEGRATION TECHNIQUES FOR FABRICATING PHOTODETECTORS WITH TRANSISTORS ON SAME SUBSTRATE

Semiconductor device and method for manufacturing the same

Monolayer thin film capacitor and method for manufacturing the same

Integrated structures and methods of forming vertically-stacked memory cells

Semiconductor device

Integrated circuit for reducing ohmic drop in power rails

Semiconductor device and fabrication method of the same

SEMICONDUCTOR PACKAGE

Power module assembly with dual substrates and reduced inductance

Bond structures and the methods of forming the same

Semiconductor device

Power grid, IC and method for placing power grid

Method to form interconnect structure with tungsten fill

Semiconductor device and manufacturing method thereof

Through-silicon via with improved substrate contact for reduced through-silicon via (TSV) capacitance variability

Vertical semiconductor device

Replacement contacts

Methods of manufacturing semiconductor devices

Self-aligned middle of the line (MOL) contacts

Semiconductor device and manufacturing method thereof

Multi-metal fill with self-align patterning

Method for forming semiconductor device contact

Layout for semiconductor device including via pillar structure

Semiconductor device

3D NAND device with five-folded memory stack structure configuration

Redistribution layer structures for integrated circuit package

Integrated circuit having a high cell density

Fabrication method of semiconductor substrate

Semiconductor device including a bit line

Semiconductor package device and method of manufacturing the same

Semiconductor device comprising a die seal including long via lines

Integrated circuit product having a through-substrate-via (TSV) and a metallization layer that are formed after formation of a semiconductor device

Semiconductor device with a conductive liner

Memory device and method of forming thereof

Interconnection structure having air gap

Semiconductor device having composite structures and fabrication method thereof

Textile patterning for subtractively-patterned self-aligned interconnects, plugs, and vias

Semiconductor device, method of designing a layout of a semiconductor device, and method of manufacturing a semiconductor device

Integrated circuit package structure and testing method using the same

METHOD OF GROWING NANOSTRUCTURES

Semiconductor device and manufacturing method thereof

Three-dimensional memory device having passive devices at a buried source line level and method of making thereof

Semiconductor devices

Interconnect metal layout for integrated circuit

Static random access memory device

Semiconductor device structure and method for forming the same

Integrated circuit (IC) devices with varying diameter via layer

Semiconductor device including dummy via anchored to dummy metal layer

Self aligned interconnect structures

Interlevel conductor pre-fill utilizing selective barrier deposition

Power grid structures and method of forming the same

Semiconductor device and method of forming the same

Device-manufacturing scheme for increasing the density of metal patterns in inter-layer dielectrics

Airgap protection layer for via alignment

Semiconductor device and method of fabricating the same

Metallic blocking layer for reliable interconnects and contacts

Method of manufacturing an interconnect structure by forming metal layers in mask openings

Interconnect via with grown graphitic material

High thermal conductivity vias by additive processing

Integrated circuit nanoparticle thermal routing structure in interconnect region

Semiconductor device package thermal conduit

Thermal routing trench by additive processing

Integrated circuit nanoparticle thermal routing structure over interconnect region

Semiconductor structure, testing and fabricating methods thereof

Semiconductor manufacturing method and semiconductor manufacturing apparatus

Gate tie-down enablement with inner spacer

Self aligned via and method for fabricating the same

Method of forming superconductor structures

Use of noble metals in the formation of conductive connectors

Interconnect structure