207731 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
Efficient power management method in integrated circuit through a nanotube structure
#602Semiconductor device and method of providing a thermal dissipation path through RDL and conductive via
#603Semiconductor device
#604Semiconductor device and manufacturing method thereof
#605Method for producing substrate for mounting device and method for producing a semiconductor module
#606Method of forming electrical connections
#607Under land routing
#608SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#609Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof
#610Semiconductor device and a method of manufacturing the same
#611Semiconductor device, and method of fabricating semiconductor device
#612Surface depressions for die-to-die interconnects and associated systems
#613Through-silicon via structure and a process for forming the same
#614Intra-die routing using back side redistribution layer and associated method
#615Method of chip repair by stacking a plurality of bad dies
#616Semiconductor die having a redistribution layer
#617Hardwired switch of die stack and operating method of hardwired switch
#618Semiconductor device
#619Semiconductor structure
#620Massively parallel interconnect fabric for complex semiconductor devices
#621Wafer backside structures having copper pillars
#622Microelectronic packages fabricated at the wafer level and methods therefor
#623Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices
#624Metal programmable logic and multiple function pin interface
#625SEMICONDUCTOR DEVICE AND A METHOD OF INCREASING A RESISTANCE VALUE OF AN ELECTRIC FUSE
#626Stacked semiconductor package and method of manufacturing thereof
#627Electronic board, method of manufacturing the same, and electronic device
#628Three-dimensional semiconductor architecture
#629Semiconductor device
#630Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads
#631Stack type semiconductor package apparatus
#632Semiconductor package
#633Manufacturing method of semiconductor device
#634Semiconductor device
#635Electronic substrate, semiconductor device, and electronic device
#636Semiconductor device
#637Method of manufacturing semiconductor device
#638Semiconductor package and method for manufacturing the same for decreasing number of processes
#639Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same
#640Redistribution layer power grid
#641CAPACITOR STRUCTURE IN A SEMICONDUCTOR DEVICE
#642Semiconductor package and methods of manufacturing the same
#643SEMICONDUCTOR DEVICE
#644Face-to-face (F2F) hybrid structure for an integrated circuit
#645METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILM
#646Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices
#647Through substrate vias for back-side interconnections on very thin semiconductor wafers
#648Top layers of metal for high performance IC's
#649Semiconductor body and method for voltage regulation
#650Semiconductor package with passivation island for reducing stress on solder bumps
#651Semiconductor package, semiconductor module, and method for fabricating the semiconductor package
#652Semiconductor package with a metal post
#653On demand circuit function execution employing optical sensing
#654Zigzag pattern for TSV copper adhesion
#655Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same
#656Semiconductor package with a controlled impedance bus and method of forming same
#657Semiconductor device and method of forming a fan-in package-on-package structure using through silicon vias
#658Method of manufacturing a semiconductor device
#659Electronic device having a chip stack
#660SEMICONDUCTOR DEVICE
#661Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip
#662LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE
#663Bond pad structure and method for producing same
#664Back-end-of-line wiring structures with integrated passive elements and design structures for a radiofrequency integrated circuit
#665Packaging conductive structure and method for forming the same
#666RESCUE STRUCTURE AND METHOD FOR LASER WELDING
#667Semiconductor device and method of providing a thermal dissipation path through RDL and conductive via
#668Chip package and method for fabricating the same
#669Semiconductor device
#670Semiconductor package and method for packaging a semiconductor package
#671Circuit substrate having circuit wire formed of conductive polarization particles, method of manufacturing the circuit substrate and semiconductor package having the circuit wire
#672Surface depressions for die-to-die interconnects and associated systems and methods
#673Semiconductor package with joint reliability, entangled wires including insulating material
#674Top layers of metal for high performance IC's
#675Semiconductor chip package and multichip package
#676Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
#677METHOD OF FABRICATING SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR WAFER, AND METHOD OF SAWING THE SEMICONDUCTOR WAFER
#678WAFER LEVEL REDISTRIBUTION USING CIRCUIT PRINTING TECHNOLOGY
#679Semiconductor device and a method for manufacturing the same
#680Disabling electrical connections using pass-through 3D interconnects and associated systems and methods
#681RELIABILITY WCSP LAYOUTS
#682Configuration terminal for integrated devices and method for configuring an integrated device
#683System and method of forming a wafer scale package
#684Semiconductor device
#685Semiconductor package having side walls and method for manufacturing the same
#686RE-DISTRIBUTION CONDUCTIVE LINE STRUCTURE AND THE METHOD OF FORMING THE SAME
#687Solder structures including barrier layers with nickel and/or copper
#688Semiconductor device and a method of manufacturing the same
#689Manufacturing method of semiconductor apparatus and semiconductor apparatus
#690SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME
#691Programmable nanotube interconnect
#692SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME
#693Semiconductor device, circuit board, and electronic instrument
#694SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME
#695Semiconductor Device
#696Semiconductor chip having conductive member for reducing localized voltage drop
#697Method for Enhancing the Adhesion of a Passivation Layer on a Semiconductor Device
#698Semiconductor element, semiconductor device, and fabrication method thereof
#699Method of manufacturing semiconductor device having semiconductor formation regions of different planar sizes
#700Controller chip mounted on a memory chip with re-wiring lines
#701Top layers of metal for high performance IC's
#702Chip-stacked package structure with asymmetrical leadframe
#703Wafer level semiconductor package and method for manufacturing the same
#704Method of manufacturing semiconductor device and semiconductor device
#705Manufacturing method of redistribution circuit structure
#706Semiconductor device
#707Board adapted to mount an electronic device, semiconductor module and manufacturing method therefor, and portable device
#708Wafer-level chip scale package and method for fabricating and using the same
#709Semiconductor chip with coil element over passivation layer
#710Edit structure that allows the input of a logic gate to be changed by modifying any one of the metal or via masks used to form the metal interconnect structure
#711CHIP SCALE STACKED DIE PACKAGE
#712Semiconductor device
#713Semiconductor device having low dielectric insulating film and manufacturing method of the same
#714Semiconductor device having low dielectric insulating film and manufacturing method of the same
#715Semiconductor package with passivation island for reducing stress on solder bumps
#716Redistribution layer for wafer-level chip scale package and method therefor
#717INTERCONNECTION STRUCTURE
#718Stacked chip package with redistribution lines
#719Semiconductor device and method of manufacturing the same
#720Semiconductor device having wafer level chip scale packaging substrate decoupling
#721Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers
#722Top layers of metal for high performance IC's
#723Integrated circuit including parylene material layer
#724Semiconductor chip, method of fabricating the same and stacked package having the same
#725Method of fabricating a semiconductor device, and semiconductor device with a conductive member extending through a substrate and connected to a metal pattern bonded to the substrate
#726System and method for providing semiconductor device features using a protective layer
#727Under Bump Routing Layer Method and Apparatus
#728Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
#729Semiconductor package and method for manufacturing the same for decreasing number of processes
#730Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same
#731Method of fabricating a semiconductor die having a redistribution layer
#732Semiconductor die having a distribution layer
#733Semiconductor device and method for manufacturing the same
#734Semiconductor package and multi-chip semiconductor package using the same
#735Electronic device manufacturing method and electronic device
#736Semiconductor package having re-distribution lines for supplying power and a method for manufacturing the same
#737Semiconductor device, chip package and method of fabricating the same
#738Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same
#739Capacitor structure in a semiconductor device
#740Semiconductor device and method for manufacturing semiconductor device
#741Wafer level package
#742Highly reliable low cost structure for wafer-level ball grid array packaging
#743SEMICONDUCTOR DEVICE AND PRODUCTION METHOD OF THE SAME SEMICONDUCTOR DEVICE
#744Chip stack package and method of fabricating the same
#745Four-terminal programmable via-containing structure and method of fabricating same
#746Method to create a metal pattern using a damascene-like process
#747Top layers of metal for high performance IC's
#748Semiconductor device including redistribution line structure and method of fabricating the same
#749Method for fabricating a low cost integrated circuit (IC) package
#750Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof
#751Chip and wafer integration process using vertical connections
#752SEMICONDUCTOR PACKAGE HAVING WIRE REDISTRIBUTION LAYER AND METHOD OF FABRICATING THE SAME
#753Semiconductor die with mask programmable interface selection
#754Semiconductor module having deflecting conductive layer over a spacer structure
#755Signal routing on redistribution layer
#756Semiconductor device manufacturing method and semiconductor device
#757Semiconductor module, method of manufacturing semiconductor module, and mobile device
#758Circuit device, a method for manufacturing a circuit device, and a semiconductor module
#759Semiconductor device and manufacturing method thereof
#760Capacitance trimming circuit of semiconductor device having vertically stacked capacitor layers and operation method thereof
#761Semiconductor module, portable device and method for manufacturing semiconductor module
#762Packaging conductive structure for a semiconductor substrate having a metallic layer
#763Method of manufacturing semiconductor devices encapsulated in chip size packages
#764Programming of laser fuse
#765Semiconductor device with magnetic powder mixed therein and manufacturing method thereof
#766SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#767Semiconductor device capable of selecting wiring connection mode by controlling via formation
#768SEMICONDUCTOR DEVICE
#769Semiconductor chip structure, method of manufacturing the semiconductor chip structure, semiconductor chip package, and method of manufacturing the semiconductor chip package
#770Semiconductor device
#771Zigzag-stacked package structure
#772Redistribution circuit structure
#773Method of making a semiconductor device having multiple die redistribution layer
#774Semiconductor device having multiple die redistribution layer
#775Packing board for electronic device, packing board manufacturing method, semiconductor module, semiconductor module manufacturing method, and mobile device
#776Structure of super thin chip scale package and method of the same
#777SEMICONDUCTOR DICE HAVING BACK SIDE REDISTRIBUTION LAYER ACCESSED USING THROUGH-SILICON VIAS, METHODS
#778Top layers of metal for high performance IC's
#779Method of manufacturing wafer level chip size package
#780Top layers of metal for high performance IC's
#781Top layers of metal for high performance IC's
#782Semiconductor chip and production process therefor
#783Semiconductor device and manufacturing method therefor
#784Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package
#785Method of mounting semiconductor chip to circuit substrate using solder bumps and dummy bumps
#786Systems and methods to passivate on-die redistribution interconnects
#787Wafer level package configured to compensate size difference in different types of packages
#788Top layers of metal for integrated circuits
#789WAFER SCALE THIN FILM PACKAGE
#790Wafer level chip size packaged chip device with a double-layer lead structure and method of fabricating the same
#791Low fabrication cost, high performance, high reliability chip scale package
#792SEMICONDUCTOR PACKAGE AND METHODS OF MANUFACTURING THE SAME
#793Method for manufacturing a structure in a semiconductor device and a structure in a semiconductor device
#794Microelectronic packages fabricated at the wafer level and methods therefor
#795WAFER LEVEL PACKAGE STRUCTURE WITH BUILD UP LAYERS
#796Top layers of metal for high performance IC's
#797Top layers of metal for high performance IC's
#798Die arrangement and method for producing a die arrangement
#799Method of identifying and/or programming an integrated circuit
#800Systems and methods for supporting a subset of multiple interface types in a semiconductor device
#801Chip package and method for fabricating the same
#802Top layers of metal for high performance IC's
#803Top layers of metal for high performance IC's
#804Top layers of metal for high performance IC's
#805Top layers of metal for integrated circuits
#806Chip package and method for fabricating the same
#807Package structure with leadframe on offset chip-stacked structure
#808Semiconductor device and method of manufacturing same
#809Chip structure with redistribution traces
#810Multiple-dies semiconductor device with redistributed layer pads
#811Top layers of metal for high performance IC's
#812Top layers of metal for high performance IC's
#813Top layers of metal for high performance IC's
#814Top layers of metal for high performance IC's
#815Top layers of metal for high performance IC's
#816Top layers of metal for high performance IC's
#817Top layers of metal for high performance IC's
#818Top layers of metal for high performance IC's
#819Top layers of metal for high performance IC's
#820Top layers of metal for high performance IC's
#821Top layers of metal for high performance IC's
#822Top layers of metal for high performance IC's
#823Top layers of metal for high performance IC's
#824Top layers of metal for high performance IC's
#825Repair structure and active device array substrate
#826Top layers of metal for high performance IC's
#827Programming semiconductor dies for pin map compatibility
#828Top layers of metal for high performance IC's
#829Top layers of metal for high performance IC's
#830Top layers of metal for high performance IC's
#831Top layers of metal for high performance IC's
#832Top layers of metal for high performance IC's
#833Integrated circuit package system with post-passivation interconnection and integration
#834Assembly having stacked die mounted on substrate
#835Top layers of metal for high performance IC's
#836Top layers of metal for high performance IC's
#837Top layers of metal for high performance IC's
#838Top layers of metal for high performance IC's
#839On-chip inductor using redistribution layer and dual-layer passivation
#840Top layers of metal for high performance IC's
#841Top layers of metal for high performance IC's
#842Top layers of metal for high performance IC's
#843Top layers of metal for high performance IC's
#844Top layers of metal for high performance IC's
#845Top layers of metal for high performance IC's
#846Top layers of metal for high performance IC's
#847Top layers of metal for high performance IC's
#848Top layers of metal for high performance IC's
#849Top layers of metal for high performance IC's
#850Top layers of metal for high performance IC's
#851Top layers of metal for high performance IC's
#852Top layers of metal for high performance IC's
#853Top layers of metal for high performance IC's
#854Top layers of metal for high performance IC's
#855Top layers of metal for high performance IC's
#856Top layers of metal for high performance IC's
#857Top layers of metal for high performance IC's
#858Top layers of metal for high performance IC's
#859Semiconductor device having low dielectric insulating film and manufacturing method of the same
#860Top layers of metal for high performance IC's
#861Super high density module with integrated wafer level packages
#862Top layers of metal for high performance IC's
#863Top layers of metal for high performance IC's
#864Top layers of metal for high performance IC's
#865Top layers of metal for high performance IC's
#866Top layers of metal for high performance IC's
#867Top layers of metal for high performance IC's
#868Rescue structure and method for laser welding
#869INTEGRATED CIRCUIT PACKAGE SYSTEM WITH POST-PASSIVATION INTERCONNECTION AND INTEGRATION
#870High-performance semiconductor package
#871Integrated-circuit chip with offset external pads and method for fabricating such a chip
#872Method for fabricating a BGA device and BGA device
#873Semiconductor device having a fuse element
#874Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument
#875Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus
#876Semiconductor device and a method of increasing a resistance value of an electric fuse
#877Electronic substrate, semiconductor device, and electronic device
#878Method for manufacturing semiconductor device
#879Redistribution connecting structure of solder balls
#880Base semiconductor chip, semiconductor integrated circuit device, and semiconductor integrated circuit device manufacturing method
#881Methods of redistributing bondpad locations on an integrated circuit
#882Semiconductor package having an optical device and a method of making the same
#883Patterned gold bump structure for semiconductor chip
#884Electric fuse circuit providing margin read function
#885Method for forming a redistribution layer in a wafer structure
#886Wafer level chip scale package having a gap and method for manufacturing the same
#887Wafer level package having floated metal line and method thereof
#888WAFER LEVEL CHIP SCALE PACKAGE HAVING REROUTING LAYER AND METHOD OF MANUFACTURING THE SAME
#889Super high-density module with integrated wafer level packages
#890Compliant terminal mountings with vented spaces and methods
#891System to wirebond power signals to flip-chip core
#892Super high-density module with integrated wafer level packages
#893Compliant terminal mountings with vented spaces and methods
#894On demand circuit function execution employing optical sensing
#895Configurable power segmentation using a nanotube structure
#896Programmable nanotube interconnect
#897Semiconductor chip having bond pads
#898Semiconductor chip having bond pads
#899Wafer level chip scale packaging structure and method of fabricating the same
#900Wafer level package having redistribution interconnection layer and method of forming the same