207731 ⎘
Details of semiconductor or other solid state devices; Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body with adaptable interconnections
Semiconductor chip having bond pads
#902Semiconductor device with inclined through holes
#903Semiconductor chip and semiconductor device
#904Component with chip through-contacts
#905Semiconductor chip having bond pads
#906Semiconductor device
#907Semiconductor chip having bond pads and multi-chip package
#908Semiconductor device with reduced thickness of the semiconductor substrate
#909Signal routing on redistribution layer
#910Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#911Semiconductor device electronic component, circuit board, and electronic device
#912Method for manufacturing semiconductor device
#913Semiconductor device
#914Bonding pad on IC substrate and method for making the same
#915Semiconductor device and oscillator
#916Electronic board, method of manufacturing the same, and electronic device
#917Electronic board, method of manufacturing the same, and electronic device
#918Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
#919Wafer and single chip having circuit rearranged structure and method for fabricating the same
#920Methods of forming semiconductor devices and electrical interconnect structures in semiconductor devices and intermediate structures formed thereby
#921Redistribution layer with microstrips
#922Semiconductor chip with coil element over passivation layer
#923Microelectronic assemblies having compliant layers
#924Stacked chip package with redistribution lines
#925Integrated circuit with additional mini-pads connected by an under-bump metallization and method for production thereof
#926Intermediate semiconductor device structures
#927Method of making the semiconductor device, circuit board, and electronic instrument
#928Semiconductor device production method and semiconductor device
#929Manufacturing process of semiconductor device
#930Microelectronic assemblies having compliant layers
#931High density direct connect LOC assembly
#932Manufacturing managing method of semiconductor devices and a semiconductor substrate
#933Integrated circuit and methods of redistributing bondpad locations
#934Semiconductor device to be applied to various types of semiconductor package
#935Integrated circuit and methods of redistributing bondpad locations
#936Connection device with actuating element for changing a conductive state of a via
#937Wafer level chip scale package having a gap and method for manufacturing the same
#938Semiconductor package having an optical device and a method of making the same
#939CHIP STRUCTURE AND WAFER STRUCTURE
#940MULTI-CHIP BALL GRID ARRAY PACKAGE
#941Microelectronic assemblies having compliancy
#942Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus
#943System and method for reducing voltage drops in integrated circuits
#944Method of manufacturing semiconductor device and semiconductor device
#945Methods for patterning dielectric material, and methods for aligning semiconductor fabrication molds and semiconductor substrates
#946Semiconductor chip having solder bumps and dummy bumps
#947Structure and programming of laser fuse
#948Semiconductor package with a controlled impedance bus
#949Method for re-routing lithography-free microelectronic devices
#950Method of manufacturing semiconductor device and support structure for semiconductor substrate
#951Method and apparatus for circuit completion through the use of ball bonds or other connections during the formation of a semiconductor device
#952Integrated circuit chip having pass-through vias therein that extend between multiple integrated circuits on the chip
#953Methods for aligning semiconductor fabrication molds and semiconductor substrates
#954Configuration terminal for integrated devices and method for configuring an integrated device
#955High density direct connect loc assembly
#956Integrated circuit design for routing an electrical connection
#957Methods for designing and tuning one or more packaged integrated circuits
#958Manufacturing method of passivation layer on wafer and manufacturing method of bumps on wafer
#959Method for manufacturing wafer level chip scale package using redistribution substrate
#960Redistribution layer of wafer and the fabricating method thereof
#961Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
#962Top layers of metal for integrated circuits
#963Chip structure
#964Method for forming a redistribution layer in a wafer structure
#965Top layers of metal for high performance IC's
#966Semiconductor device and wire bonding chip size package therefor
#967Top layers of metal for high performance IC's
#968Methods for forming molds
#969Electrode structure of a semiconductor device and method of manufacturing the same
#970Board having alternating rows of processors and memories
#971Method for fabrication of semiconductor device
#972Methods of forming lead free solder bumps
#973Integrated circuit and methods of redistributing bondpad locations
#974Method for fabricating pad redistribution layer
#975Methods of fabricating integrated circuit chips for multi-chip packaging and wafers and chips formed thereby
#976Top layers of metal for high performance IC's
#977Stacked semiconductor device
#978Method for manufacturing a semiconductor device
#979Semiconductor device
#980Process for producing a chip arrangement provided with a molding compound
#981Semiconductor package including redistribution pattern and method of manufacturing the same
#982Structure and method of forming metal buffering layer
#983Top layers of metal for high performance IC's
#984Method of manufacturing semiconductor device and support structure for semiconductor substrate
#985Top layers of metal for high performance IC's
#986Programming semiconductor dies for pin map compatibility
#987Method of manufacturing semiconductor device
#988Integrated circuit packaging method and structure for redistributing configuration thereof
#989Over-passivation process of forming polymer layer over IC chip
#990Top layers of metal for high performance IC's
#991Misalignment-tolerant multiplexing/demultiplexing architectures
#992Switching device for reconfigurable interconnect and method for making the same
#993Stacked die BGA or LGA component assembly
#994Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus
#995Integrated circuit adapted for ECO and FIB debug
#996Low fabrication cost, high performance, high reliability chip scale package
#997Top layers of metal for high performance IC's
#998Top layers of metal for high performance IC's
#999Semiconductor device and manufacturing method for the same
#1000Low fabrication cost, high performance, high reliability chip scale package
#1001Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods
#1002Process for producing semiconductor device, semiconductor device, circuit board and electronic equipment
#1003Connector assembly
#1004Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#1005Method for fabrication of semiconductor device
#1006Semiconductor chip package and multichip package
#1007Wafer-level electronic modules with integral connector contacts
#1008Chip and wafer integration process using vertical connections
#1009Parallel design processes for integrated circuits
#1010Customized microelectronic device and method for making customized electrical interconnections
#1011Redistribution of substrate interconnects
#1012Semiconductor device
#1013Structure and programming of laser fuse
#1014Input/output structure and integrated circuit using the same
#1015Method for creating electrical pathways for semiconductor device structures using laser machining processes
#1016Method of manufacturing wafer level chip size package
#1017Method of fabricating a connection device
#1018BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same
#1019Super high density module with integrated wafer level packages
#1020Method for producing an electronic component, especially a memory chip
#1021Semiconductor device and method of manufacturing the same
#1022Method for producing a semiconductor package, with a rerouted electrode formed on a resin projection portion
#1023Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#1024Semiconductor device
#1025Semiconductor processing methods
#1026Process for manufacturing semiconductor device
#1027Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
#1028Multi-level redistribution layer traces for reducing current crowding in flipchip solder bumps
#1029Wafer-level chip scale package and method for fabricating and using the same
#1030Semiconductor device with improved design freedom of external terminal
#1031Power terminal sharing with noise isolation
#10323D stacked compute and memory with copper pillars
#10333D stacked ferroelectric compute and memory
#1034Steep-switch field effect transistor with integrated bi-stable resistive system
#1035Static random access memory device and forming method thereof