207783 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto Manufacturing methods
Semiconductor device having solderable and bondable electrical contact pads
#3002Contact pads for integrated circuit packages
#3003Semiconductor structure with composite barrier layer under redistribution layer and manufacturing method thereof
#3004Bond pad having ruthenium directly on passivation sidewall
#3005Metal pad offset for multi-layer metal layout
#3006Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system
#3007Metal bump joint structure
#3008Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same
#3009Conductive connections, structures with such connections, and methods of manufacture
#3010Semiconductor device
#3011Method of forming post-passivation interconnect structure
#3012SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#3013Chip packages and methods of manufacturing the same
#3014Method for processing a semiconductor workpiece and semiconductor workpiece
#3015Methods and apparatus of guard rings for wafer-level-packaging
#30163D chip-on-wafer-on-substrate structure with via last process
#3017Conductive connections, structures with such connections, and methods of manufacture
#3018Method of fabricating semiconductor package, semiconductor package formed thereby, and semiconductor device including the same
#3019Semiconductor package and method of manufacturing the same
#3020Metal cored solder decal structure and process
#3021Semiconductor chip having different conductive pad widths and method of making layout for same
#3022Chip-on-wafer package and method of forming same
#3023Molded insulator in package assembly
#3024Methods of fabrication and testing of three-dimensional stacked integrated circuit system-in-package
#3025Polymer layers embedded with metal pads for heat dissipation
#3026Structure and method of providing a re-distribution layer (RDL) and a through-silicon via (TSV)
#3027Method of forming chip with through silicon via electrode
#3028Tin plating solution, tin plating equipment, and method for fabricating semiconductor device using the tin plating solution
#3029Metal contact for semiconductor device
#3030Bowl-shaped solder structure
#3031Power management applications of interconnect substrates
#3032Optoelectronic component with integrated protection diode and method of producing same
#3033Stacked semiconductor structure and method
#3034Semiconductor device and method of manufacturing the same
#3035Semiconductor device
#3036Interconnection structure having a via structure and fabrication thereof
#3037Hybrid bonding systems and methods for semiconductor wafers
#3038Integrated circuit chip and fabrication method
#3039Metal contact for semiconductor device
#3040Solder pad for semiconductor device package
#3041Conductive pads and methods of formation thereof
#3042Through-silicon via with low-K dielectric liner
#3043Chromium/titanium/aluminum-based semiconductor device contact fabrication
#3044Bonding structure for stacked semiconductor devices
#3045Semiconductor device
#3046Wafer level device and method with cantilever pillar structure
#3047Manufacture of coated copper pillars
#3048Metal pillar bump packaging strctures and fabrication methods thereof
#3049Semiconductor chip with patterned underbump metallization and polymer film
#3050Interconnect etch with polymer layer edge protection
#3051METHOD FOR FABRICATING SEMICONDUCTOR DEVICES HAVING HIGH-PRECISION GAPS
#3052Semiconductor packages and methods of forming the same
#3053Semiconductor device and method of manufacturing the same
#3054SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME
#3055Chip package and method thereof
#3056Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#3057Novel 3D Integration Method using SOI Substrates and Structures Produced Thereby
#3058Methods of connecting a first electronic package to a second electronic package
#3059Semiconductor device
#3060WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
#3061Semiconductor device and manufacturing method thereof
#3062Substrate bonding with diffusion barrier structures
#3063Hermetically sealed wafer packages
#30643D packages and methods for forming the same
#3065Semiconductor device structure and manufacturing method
#3066Solder stud structure
#3067Semiconductor device structure and manufacturing method
#3068Bump structure and method for forming the same
#3069Methods and apparatus of packaging semiconductor devices
#3070SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#3071Semiconductor device utilizing redistribution layers to couple stacked die
#3072Semiconductor arrangement and formation thereof
#3073COF type semiconductor package and method of manufacturing the same
#3074EVALUATION ELEMENT AND WAFER
#3075Semiconductor device having fan-in and fan-out redistribution layers
#3076Integrated circuit package
#3077Package structure and manufacturing method
#3078Methods for controlling warpage in packaging
#3079Single mask package apparatus
#3080Semiconductor device and manufacturing method thereof
#3081Enhanced board level reliability for wafer level packages
#3082Mechanically anchored backside C4 pad
#3083Solder ball protection in packages
#3084Method of manufacturing a semiconductor device and semiconductor integrated circuit wafer
#3085Method of forming package assembly
#3086Seal ring structure with a metal pad
#3087Thin NiB or CoB capping layer for non-noble metallic bonding landing pads
#3088Backside integration of RF filters for RF front end modules and design structure
#3089Electrode provided with UBM structure having a barrier layer for reducing solder diffusion into the electrode and a method for producing the same
#3090Method for Flip-Chip Bonding Using Copper Pillars
#3091Packages with solder ball revealed through laser
#3092Packaging devices and methods of manufacture thereof
#3093Chip parts and method for manufacturing the same, circuit assembly having the chip parts and electronic device
#3094Wafer bonding process and structure
#3095Bottom package having routing paths connected to top package and method of manufacturing the same
#3096Method for manufacturing semiconductor devices having a metallisation layer
#3097Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus
#3098Semiconductor device and semiconductor device manufacturing method
#3099Sealing structure for a bonded wafer and method of forming the sealing structure
#3100Electronic devices utilizing contact pads with protrusions and methods for fabrication
#3101METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#3102Protection circuit including vertical gallium nitride schottky diode and PN junction diode
#3103Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips
#3104Bundled memory and manufacture method for a bundled memory with an external input/output bus
#3105Semiconductor device with post-passivation interconnect structure and method of forming the same
#3106Copper post structure for wafer level chip scale package
#3107Semiconductor packaging structure and manufacturing method for the same
#3108VIA UNDER THE INTERCONNECT STRUCTURES FOR SEMICONDUCTOR DEVICES
#3109Under bump metallization
#3110Semiconductor device
#3111Bonded processed semiconductor structures and carriers
#3112Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap
#3113Semiconductor device having semiconductor chip with large and small irregularities on upper and lower side surface portions thereof
#3114Thermal pads between stacked semiconductor dies and associated systems and methods
#3115Semiconductor device and manufacturing method thereof
#3116Microbump and sacrificial pad pattern
#3117Flip-chip hybridisation of two microelectronic components using a UV anneal
#3118Microelectronic unit and package with positional reversal
#3119Substrate structure and fabrication method thereof
#3120System and method for 3D integrated circuit stacking
#3121Bonding pad structure with dense via array
#3122Passive component structure and manufacturing method thereof
#3123Inductor for post passivation interconnect and a method of forming
#3124System and method for bonding package lid
#3125Methods for processing substrates
#3126Assembly bonding
#3127GaN transistor with improved bonding pad structure and method of fabricating the same
#3128Interconnect structure and method of forming same
#3129SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING SEMICONDUCTOR DEVICE, PRODUCING METHOD AND MOUNTING METHOD OF SOLDER-CONTAINING SEMICONDUCTOR DEVICE
#3130Semiconductor device
#3131Package having substrate with embedded metal trace overlapped by landing pad
#3132SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#3133Interposer for integrated circuit chip package
#3134Protrusion bump pads for bond-on-trace processing
#3135Semiconductor package
#3136Method of fabricating bump structure and bump structure
#3137Barrier structures between external electrical connectors
#3138Conductive Lines and Pads and Method of Manufacturing Thereof
#3139Method of fabricating a bond pad structure
#3140Bond pad having a trench and method for forming
#3141BOND PAD HAVING A TRENCH AND METHOD FOR FORMING
#3142Semiconductor integrated circuit device having protective split at peripheral area of bonding pad and method of manufacturing same
#3143Chip stack with electrically insulating walls
#3144EMICONDUCTOR DEVICE WITH DIE TOP POWER CONNECTIONS
#3145Method and apparatus for a conductive pillar structure
#3146Package on package bonding structure and method for forming the same
#3147SEMICONDUCTOR APPARATUS, MANUFACTURING METHOD THEREOF AND TESTING METHOD THEREOF
#3148DIE PACKAGE ARCHITECTURE WITH EMBEDDED DIE AND SIMPLIFIED REDISTRIBUTION LAYER
#3149Method of packaging a semiconductor device
#3150Process for forming package-on-package structures
#3151Semiconductor device and method of forming build-up interconnect structures over a temporary substrate
#3152Method of processing a semiconductor wafer
#3153Grid array connection device and method
#3154Die substrate assembly and method
#3155PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME
#3156Low z-height package assembly
#3157Self-aligned under bump metal
#3158Substrate comprising improved via pad placement in bump area
#3159Methods and apparatus for wafer level packaging
#3160PACKAGE ASSEMBLY AND METHOD FOR MANUFACTURING THE SAME
#3161Method for manufacturing semiconductor apparatus
#3162Conductive pad structure for hybrid bonding and methods of forming same
#3163BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibility
#3164REDISTRIBUTION LAYER ALLOY STRUCTURE AND MANUFACTURING METHOD THEREOF
#3165Bump structures for semiconductor package
#3166Methods for forming semiconductor devices with stepped bond pads
#3167Chip-on-substrate packaging on carrier
#3168Semiconductor apparatus and method for producing the same
#3169Semiconductor device and method of manufacturing the same
#3170Protective layer for contact pads in fan-out interconnect structure and method of forming same
#3171Semiconductor device
#3172Method and structure for wafer level packaging with large contact area
#3173Tunable composite interposer
#3174Device including two power semiconductor chips and manufacturing thereof
#3175Electronic component with sheet-like redistribution structure
#3176Semiconductor device and method for manufacturing the same
#3177Warpage reduction in structures with electrical circuitry
#3178Leadless semiconductor package with optical inspection feature
#3179Semiconductor device
#3180Semiconductor packaging and manufacturing method thereof
#3181Thin embedded packages, methods of fabricating the same, electronic systems including the same, and memory cards including the same
#3182Integrated circuit and fabricating method thereof
#3183Wafer-level die attach metallization
#3184Discrete semiconductor device package and manufacturing method
#3185Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods
#3186Through silicon via structure
#3187Semiconductor device and manufacturing method thereof
#3188Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods
#3189Mechanisms for forming post-passivation interconnect structure
#3190Semiconductor device and fabricating method thereof
#3191Semiconductor device and manufacturing method thereof
#3192Chip package and method for forming the same
#3193Fabrication methods of chip device packages
#3194Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
#3195PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#3196Staged via formation from both sides of chip
#3197Post passivation interconnect structures and methods for forming the same
#3198Semiconductor device and method of manufacturing semiconductor device
#3199Semiconductor packaging device including via-in pad (VIP) and manufacturing method thereof
#3200Semiconductor constructions having through-substrate interconnects
#3201Semiconductor packaging and manufacturing method thereof
#3202Method for singulating packaged integrated circuits and resulting structures
#3203Method of forming interconnection structure of package structure
#3204Die-to-die gap control for semiconductor structure and method
#3205Chip device packages and fabrication methods thereof
#3206Methods and apparatus of packaging semiconductor devices
#3207Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#3208Thermocompression for semiconductor chip assembly
#3209Semiconductor devices and methods of forming thereof
#3210Semiconductor device and method for producing the same
#3211Semiconductor device and method for manufacturing the same
#3212Alignment marks in substrate having through-substrate via (TSV)
#3213Microelectronic packages having layered interconnect structures and methods for the manufacture thereof
#3214Redistribution layer and method of forming a redistribution layer
#3215Semiconductor device for use in flip-chip bonding, which reduces lateral displacement
#3216Semiconductor structure
#3217Semiconductor Device and Method for Manufacturing Semiconductor Device
#3218Semiconductor chips having through silicon vias and related fabrication methods and semiconductor packages
#3219Structure to prevent solder extrusion
#3220Stress buffer structures in a mounting structure of a semiconductor device
#3221Quad flat no lead package and production method thereof
#3222Method for producing photosensitive infrared detectors
#3223Method of fabricating wafer-level chip package
#3224Method for processing a wafer and wafer structure
#3225Plug via formation with grid features in the passivation layer
#3226Contact pad structure, an electronic component, and a method for manufacturing a contact pad structure
#3227Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration
#3228Electronic component package and method for forming same
#3229Connection member, semiconductor device, and stacked structure
#3230Die edge side connection
#3231Liquid compositions and methods of fabricating a semiconductor device using the same
#3232Electrostatic discharge protection apparatus and process
#3233Electronic device with bimetallic interface element for wire bonding
#3234Semiconductor device having voids between top metal layers of metal interconnects
#3235Bump structures in semiconductor packages and methods of fabricating the same
#3236Method for removing electroplated metal facets and reusing a barrier layer without chemical mechanical polishing
#3237Die attachment apparatus and method utilizing activated forming gas
#3238Semiconductor device and fabrication method thereof and semiconductor structure
#3239Copper pillar bump and flip chip package using same
#3240Semiconductor device and method for manufacturing the same
#3241Semiconductor-on-insulator with back side strain topology
#3242Method of forming a memory device
#3243Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation
#3244Semiconductor device and manufacturing method of semiconductor device
#3245Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface
#3246Electronic device package and fabrication method thereof
#3247Apparatus and methods for reducing impact of high RF loss plating
#3248Devices having inhomogeneous silicide schottky barrier contacts
#3249Bottom-up plating of through-substrate vias
#3250INTEGRATED CIRCUIT INCLUDING WIRE STRUCTURE AND RELATED METHOD
#3251Electronic device packages having bumps and methods of manufacturing the same
#3252Interconnection structure with confinement layer
#3253Semiconductor device and method of forming pad layout for flipchip semiconductor die
#3254Semiconductor module and a method for fabrication thereof by extended embedding technologies
#3255Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure
#3256Stack of semiconductor structures and corresponding manufacturing method
#3257Inductor structure and manufacturing method thereof
#3258Fabrication method of packaging substrate
#3259Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
#3260Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer
#3261Crack stopping structure in wafer level packaging (WLP)
#3262SEMICONDUCTOR DEVICE
#3263Alignment structures and methods of forming same
#3264Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device
#3265Methods to fabricate a radio frequency integrated circuit
#3266Method for manufacturing a fan-out WLP with package
#3267Packaging methods and structures for semiconductor devices
#3268Chip package and fabrication method thereof
#3269Semiconductor device and method of making wafer level chip scale package
#3270Structures and methods for improving solder bump connections in semiconductor devices
#3271Bonding structure including metal nano particle
#3272Segmented bond pads and methods of fabrication thereof
#3273Pad configurations for an electronic package assembly
#3274Fine Pitch stud POP Structure and Method
#3275Vertical semiconductor MOSFET device with double substrate-side multiple electrode connections and encapsulation
#3276Apparatus & method for treating substrate
#3277Bump pad structure
#3278Semiconductor device and manufacturing method thereof
#3279Technique for wafer-level processing of QFN packages
#3280Conductive pads and methods of formation thereof
#3281Chip to package interface
#3282Semiconductor structures and methods of manufacture
#3283Multi-function and shielded 3D interconnects
#3284Mounting structure and mounting structure manufacturing method
#3285Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#3286Semiconductor device
#3287Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
#3288Semiconductor chip connecting semiconductor package
#3289Coreless package structure and method for manufacturing same
#3290Conductive structure and method for forming the same
#3291Method of forming package systems having interposers
#3292Bond pad stack for transistors
#3293Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same
#3294Method of forming molded panel embedded die structure
#3295Wire tail connector for a semiconductor device
#3296Chip package
#3297Semiconductor packages having through electrodes and methods for fabricating the same
#3298Method of forming a reliable microelectronic assembly
#3299Ball height control in bonding process
#3300Method for producing contact areas on a semiconductor substrate