Semiconductor device layer structure and method of fabrication

Semiconductor device having semiconductor chip and metal plate

Room temperature metal direct bonding

Method for manufacturing semiconductor device

Sub-field enhanced global alignment

Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods

Semiconductor device and method of manufacturing the same

SELF-ALIGNED METAL MASK ASSEMBLY FOR SELECTIVELY DEPOSITING THIN FILMS ON MICROELECTRONIC SUBSTRATES AND DEVICES, AND METHOD OF USE

Terminal structure and manufacturing method thereof, and electronic device and manufacturing method thereof

Die stacking with an annular via having a recessed socket

Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element

Semiconductor package substrate structure and manufacturing method thereof

Structures and methods for improving solder bump connections in semiconductor devices

PACKAGING SUBSTRATE HAVING EMBEDDED SEMICONDUCTOR CHIP

Semiconductor devices having stress relief layers and methods for fabricating the same

Semiconductor device and manufacturing method thereof

FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING METHOD THEREOF

Method for manufacturing electronic device

Method and apparatus for manufacturing semiconductor device

Process of forming an electronic device including a conductive stud over a bonding pad region

Method for manufacturing a semiconductor device

Method for insertion bonding and device thus obtained

Semiconductor package

SEMICONDUCTOR DEVICE

METALLURGY FOR COPPER PLATED WAFERS

Manufacturing method of semiconductor device and semiconductor device

Method of forming a semiconductor device including a stress buffer material formed above a low-k metallization system

Semiconductor device having under-filled die in a die stack

System with semiconductor components having encapsulated through wire interconnects (TWI)

Process for making contact with and housing integrated circuits

Bonding pad for preventing pad peeling

Package structure and method for reducing dielectric layer delamination

Chip scale surface mounted semiconductor device package and process of manufacture

Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same

Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages

Semiconductor Device and Method of Forming Conductive TSV in Peripheral Region of Die Prior to Wafer Singulaton

Semiconductor-on-insulator with back side connection

Post bump and method of forming the same

Packaged semiconductor chips

Semiconductor-on-insulator with back side support layer

Semiconductor-on-insulator with back side heat dissipation

Structures and methods to improve lead-free C4 interconnect reliability

SEMICONDUCTOR CHIP PACKAGE AND METHOD FOR MANUFACTURING THEREOF AND STACK PACKAGE USING THE SAME

METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT

Compound semiconductor device and connectors

Semiconductor device and fabrication method thereof

Formation of TSV backside interconnects by modifying carrier wafers

Manufacturing method of semiconductor device including Au bump on seed film

Methods for producing an ultrathin semiconductor circuit

Semiconductor chip, method of fabricating the same, and stack module and memory card including the same

Electrical property altering, planar member with solder element in IC chip package

Circuit Device and Method of Manufacturing Thereof

SEMICONDUCTOR DEVICE, CAMERA MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Metallic Bump Structure Without Under Bump Metallurgy And a Manufacturing Method Thereof

Standing chip scale package

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN EVEN COATING THICKNESS USING ELECTRO-LESS PLATING AND RELATED DEVICE

INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING

Semiconductor device and method for manufacturing the same

Warpage resistant semiconductor package and method for manufacturing the same

Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection

Semiconductor chip passivation structures and methods of making the same

Method of forming wire bonds in semiconductor devices

Substrate for flip chip bonding and method of fabricating the same

Metallic electrode forming method and semiconductor device having metallic electrode

INTERPOSER SUBSTRATE, LSI CHIP AND INFORMATION TERMINAL DEVICE USING THE INTERPOSER SUBSTRATE, MANUFACTURING METHOD OF INTERPOSER SUBSTRATE, AND MANUFACTURING METHOD OF LSI CHIP

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD THEREOF

Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support

Method of forming a bond pad

Semiconductor device

DEVICES CONTAINING SILVER COMPOSITIONS DEPOSITED BY MICRO-DEPOSITION DIRECT WRITING SILVER CONDUCTOR LINES

Electronic component and method of connecting with multi-profile bumps

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE

WAFER LEVEL LED PACKAGE STRUCTURE FOR INCREASING LIGHT-EMITTING EFFICIENCY AND HEAT-DISSIPATING EFFECT AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF INSPECTING AN ELECTRICAL CHARACTERISTIC OF A SEMICONDUCTOR DEVICE

Aluminum bond pads with enhanced wire bond stability

CONDUCTIVE BUMP STRUCTURE FOR SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Semiconductor device having surface protective films on bond pad

Semiconductor package and manufacturing method of the semiconductor package

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Circuit substrate and method for utilizing packaging of the circuit substrate

Semiconductor device

Structure and method of forming a pad structure having enhanced reliability

Bump pad structure

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Semiconductor bond pad patterns and method of formation

Piezoelectric device

Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the same

Germanium film optical device fabricated on a glass substrate

Method of making electronic device

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Semiconductor device and method for manufacturing the same

PACKAGE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE AND METHOD OF THE SAME

Semiconductor die packages using thin dies and metal substrates

METHOD FOR APPLYING ELECTRICAL CONTACTS ON SEMICONDUCTING SUBSTRATES, SEMICONDUCTING SUBSTRATE AND USE OF THE METHOD

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR DEVICE HAVING AT LEAST ONE BUMP WITHOUT OVERLAPPING SPECIFIC PAD OR DIRECTLY CONTACTING SPECIFIC PAD

Method of forming an inductor on a semiconductor wafer

Semiconductor chip pad structure and method for manufacturing the same

Semiconductor integrated circuit device and method of manufacturing same

Metal wiring structures for uniform current density in C4 balls

Active area bonding compatible high current structures

3D chip-stack with fuse-type through silicon via

PACKAGE WITH SEMICONDUCTOR DEVICE AND INTEGRATED CIRCUIT MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH PACKAGE

Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR DEVICE

Ball-limiting-metallurgy layers in solder ball structures

Stacked semiconductor package

Conductive through connection and forming method thereof

Unit pixel of image sensor having three-dimensional structure and method for manufacturing the same

Structures for improving current carrying capability of interconnects and methods of fabricating the same

Semiconductor device having elastic solder bump to prevent disconnection

Bonding of substrates including metal-dielectric patterns with metal raised above dielectric

Electronic board, method of manufacturing the same, and electronic device

Semiconductor device comprising a through electrode and a pad connected to the through electrode and having an exposed portion and method for fabricating the same

Semiconductor device, circuit substrate, electro-optic device and electronic appliance

Method of fabricating a semiconductor device

Method of manufacturing a semiconductor device by lamination

Chip-size-package semiconductor chip and manufacturing method

Integrated circuit chip using top post-passivation technology and bottom structure technology

Interconnect structure for a semiconductor device

Chip packages

Filp chip interconnection structure with bump on partial pad and method thereof

Semiconductor device

Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability

Chip stack package and method of fabricating the same

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and manufacturing method therefor

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

PROCESS FOR STRIPPING PHOTORESIST AND REMOVING DIELECTRIC LINER

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Via Using Zn or Zn Alloys and Its Making Method, 3D Chip Stack Packages Using Thereof

Semiconductor device and method of manufacturing the same

Structure and method for sealing cavity of micro-electro-mechanical device

Making a semiconductor device having conductive through organic vias

Method for manufacturing semiconductor apparatus

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Method for bonding wafers to produce stacked integrated circuits

Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die

Semiconductor constructions

Microelectronic assemblies having compliancy and methods therefor

Semiconductor device having a conductive bump

Flip chip semiconductor package and fabrication method thereof

Reducing stress between a substrate and a projecting electrode on the substrate

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

Method for fabricating semiconductor components using maskless back side alignment to conductive vias

Chips having rear contacts connected by through vias to front contacts

Semiconductor apparatus and method of manufacturing semiconductor apparatus

Semiconductor device

Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts

Stress barrier structures for semiconductor chips

EMBEDDED CAPACITOR DEVICE AND METHODS OF FABRICATION

METHOD OF PRODUCING SEMICONDUCTOR DEVICE

Manufacturing method of semiconductor device

Method of manufacturing ball grid array type semiconductor device

Electromigration-Resistant Flip-Chip Solder Joints

Metallization system of a semiconductor device including metal pillars having a reduced diameter at the bottom

Semiconductor device

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Through-silicon via formed with a post passivation interconnect structure

Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure

Method for fabricating a bond

Method of manufacturing semiconductor device

Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same

Semiconductor package structure

Semiconductor device including conductive element

SEMICONDUCTOR DEVICE

Semiconductor device and wire bonding method

Electronic component device, and method of manufacturing the same

PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV)

Semiconductor device and method of manufacturing semiconductor device

Multi-component integrated circuit contacts

Grain refinement by precipitate formation in PB-free alloys of tin

Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process

Implantable microelectronic device and method of manufacture

Electronic member, electronic part and manufacturing method therefor

Barrier structures and methods for through substrate vias

WAFER LEVEL, CHIP SCALE SEMICONDUCTOR DEVICE PACKAGING COMPOSITIONS, AND METHODS RELATING THERETO

Structure of UBM and solder bumps and methods of fabrication

Solder bump confinement system for an integrated circuit package

Method of forming a copper topped interconnect structure that has thin and thick copper traces

METHODS FOR CONTROLLING WAFER AND PACKAGE WARPAGE DURING ASSEMBLY OF VERY THIN DIE

Electronic device package and method for fabricating the same

Underbump metallization structure

Semiconductor device

System and method for 3D integrated circuit stacking

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

Forming seal ring in an integrated circuit die

Semiconductor device and method for manufacturing semiconductor device

Electrical contact for a cadmium tellurium component

Method to prevent corrosion of bond pad structure

3D chip-stack with fuse-type through silicon via

Substrate bonding with metal germanium silicon material

Semiconductor device having lead free solders between semiconductor chip and frame and fabrication method thereof

Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit device

Semiconductor device and method for manufacturing

Stacked integrated chips and methods of fabrication thereof

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps

Laser bonding for stacking semiconductor substrates

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps

Wafer level vertical diode package structure and method for making the same

Through-silicon via with low-K dielectric liner

Semiconductor device having sealing film and manufacturing method thereof

Through-wafer interconnects for photoimager and memory wafers

Structures and methods for improving solder bump connections in semiconductor devices

Semiconductor processing methods

Method of manufacturing semiconductor device

CHIP PACKAGES WITH POWER MANAGEMENT INTEGRATED CIRCUITS AND RELATED TECHNIQUES

Through-hole electrode substrate and method of manufacturing the same

Through-silicon via with air gap

Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chips

Semiconductor device and method of manufacturing the same

Structures and methods for improving solder bump connections in semiconductor devices

Semiconductor device and method of confining conductive bump material during reflow with solder mask patch

Structures and methods for improving solder bump connections in semiconductor devices

METHOD OF MANUFACTURING THROUGH-SILICON-VIA AND THROUGH-SILICON-VIA STRUCTURE

Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip

Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns

SEMICONDUCTOR APPARATUS AND PROCESS OF PRODUCTION THEREOF

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor device

Bonding pad structure and manufacturing method thereof

LOW COST PROCESS FLOW FOR FABRICATION OF METAL CAPPING LAYER OVER COPPER INTERCONNECTS

Semiconductor chip used in flip chip process

Face-to-face (F2F) hybrid structure for an integrated circuit

Wafer structure with conductive bumps and fabrication method thereof

Semiconductor package and manufacturing method of the same

Method for forming thin film resistor and terminal bond pad simultaneously

Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages

Manufacturing method of transferring a wiring circuit layer on a metal support substrate to a semiconductor element

Manufacturing method for semiconductor device

Grid array connection device and method

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Semiconductor device

Method of manufacturing semiconductor devices

Semiconductor device with solder balls having high reliability

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILM

Method of forming stacked dies

Methods for forming an RF device with trench under bond pad feature

Insulating film material, multilayer wiring board and production method thereof, and semiconductor device and production method thereof

Extended redistribution layers bumped wafer

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE BOARD, SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE MODULE

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Apparatus and method for packaging circuits

Triaxial through-chip connection

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Alpha shielding techniques and configurations

Stacked semiconductor component having through wire interconnect

Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Semiconductor device with solder bump formed on high topography plated Cu pads

CHIP PACKAGE STRUCTURE

Device mounting board and semiconductor module

Semiconductor device and method for manufacturing the same

Method of forming through-silicon vias

Method of manufacturing semiconductor device

Semiconductor device including a DC-DC converter having a metal plate

Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof

WAFER LEVEL CHIP SCALE SEMICONDUCTOR PACKAGES

Double solid metal pad with reduced area

Method for manufacturing semiconductor device

Metal line in semiconductor device and method for forming the same

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Method for producing semiconductor chips using thin film technology

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BUMPED CHIP WITH DISPLACEMENT OF GOLD BUMPS

Semiconductor device including a reduced stress configuration for metal pillars

Semiconductor device and manufacturing method thereof

Electronic circuit for controlling a power field effect transistor

Three-dimensional integrated circuit stacking-joint interface structure

FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING METHOD THEREOF

Optoelectronic device having a multi-layer solder and manufacturing method thereof

Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier Layers

Process for spontaneous deposition from an organic solution

Semiconductor substrates with unitary vias and via terminals, and associated systems and methods

Semiconductor package with a metal post

ELECTRIC CONTACT AND METHOD FOR PRODUCING THE SAME AND CONNECTOR USING THE ELECTRIC CONTACTS

Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the same

Backside connection to TSVs having redistribution lines

Bonding process for CMOS image sensor

Metallic bump structure without under bump metallurgy and manufacturing method thereof

Method for manufacturing semiconductor device having electrode for external connection

Insulation covering structure for a semiconductor element with a single die dimension and a manufacturing method thereof

Device including two mounting surfaces

Semiconductor device

On-chip RF shields with front side redistribution lines

Lock and key through-via method for wafer level 3 D integration and structures produced

System and process for fabricating semiconductor packages

Protecting sidewalls of semiconductor chips using insulation films

Wiring Structure, Semiconductor Device Having the Wiring Structure, and Method for Manufacturing the Semiconductor Device

Methods and devices for fabricating and assembling printable semiconductor elements

Electronic component mounting structure

Method for the Production of a Windshield Wiping Concentrate in the Form of Tablets, Windshield Wiping Concentrate, and Corresponding Presentation

Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods

Methods of forming solder connections and structure thereof

Copper-topped interconnect structure that has thin and thick copper traces and method of forming the copper-topped interconnect structure

Process for making contact with and housing integrated circuits