Method of manufacturing a semiconductor device

Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers

Light-emitting device, light-emitting element and method of manufacturing same

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component

Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit

Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels

Camera module and method of producing the same

SEMICONDUCTOR DEVICE INCLUDING COLUMNAR ELECTRODES HAVING PLANAR SIZE GREATER THAN THAT OF CONNECTION PAD PORTION OF WIRING LINE, AND MANUFACTURING METHOD THEREOF

Wafer level package and method of manufacturing the same

Crystal structure of a solder bump of flip chip semiconductor device

Methods of forming C4 round dimple metal stud bumps for fine pitch packaging applications and structures formed thereby

Semiconductor device and method for fabricating semiconductor device

Three-dimensional package and method of making the same

Semiconductor light emitting apparatus having stacked reflective dielectric films

Method of fabricating a high Q factor integrated circuit inductor

Method of manufacturing stacked semiconductor package using improved technique of forming through via

Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI)

Method of testing insulation property of wafer-level chip scale package and TEG pattern used in the method

SEMICONDUCTOR DEVICE

Semiconductor device bonding with stress relief connection pads

Method of forming collapse chip connection bumps on a semiconductor substrate

Semiconductor device and method of fabricating semiconductor device

Solder joint reliability in microelectronic packaging

Methods of forming semiconductor constructions and assemblies

Semiconductor integrated circuit device, mounting structure of semiconductor integrated circuit device, and method for manufacturing semiconductor integrated circuit device

Semiconductor device

Bond pad for wafer and package for CMOS imager

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and camera module

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Bond pad structure and method for producing same

Through silicon via layout

Method for forming bumps in substrates with through vias

Structures and methods for improving solder bump connections in semiconductor devices

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Capacitor contact formed concurrently with bond pad metallization

Maskless Process for Solder Bump Production

Copper bonding method

Method of forming support structures for semiconductor devices

Method and apparatus for improvements in chip manufacture and design

SEMICONDUCTOR DEVICE, SEMICONDUCTOR CHIP, MANUFACTURING METHODS THEREOF, AND STACK PACKAGE

Semiconductor device capable of suppressing warping in a wafer state and manufacturing method thereof

Semiconductor device and method for manufacturing the same

Under bump metallization for on-die capacitor

CONTACT SURROUNDED BY PASSIVATION AND POLYMIDE AND METHOD THEREFOR

Method and system for forming conductive bumping with copper interconnection

Chip package and method for fabricating the same

Packaging structural member

SEMICONDUCTOR DEVICE PACKAGE WITH INSULATOR RING

Semiconductor device having non parallel cleavage planes in a substrate and supporting substrate

Light emitting diode and method of the same

Manufacturing method of semiconductor device and semiconductor manufacturing apparatus therefor

Integrated connection arrangements

Semiconductor package and method for packaging a semiconductor package

Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package

Semiconductor device and method of manufacturing semiconductor device

Semiconductor chip passivation structures and methods of making the same

SEMICONDUCTOR DEVICE HAVING AN ANTI-PAD PEELING-OFF STRUCTURE

Apparatuses and methods to enhance passivation and ILD reliability

Standing chip scale package

Chip pad resistant to antenna effect and method

Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device

Wafer level edge stacking

Multi-layer thick metallization structure for a microelectronic device, intergrated circuit containing same, and method of manufacturing an integrated circuit containing same

SEMICONDUCTOR DEVICE HAVING SOLDER BUMPS PROTRUDING BEYOND INSULATING FILMS

Semiconductor package with joint reliability, entangled wires including insulating material

Semiconductor package and method for manufacturing semiconductor package

Method and apparatus for wafer level integration using tapered vias

Circuitry component and method for forming the same

Semiconductor device having copper interconnect for bonding

Semiconductor device and method of manufacturing the same

FLIP-CHIP INTERCONNECTION WITH A SMALL PASSIVATION LAYER OPENING

Wafer level package and manufacturing method thereof

Substrate including alignment columnar member and plural protection columnar members, and method of making the same

Semiconductor device and method for manufacturing thereof

Semiconductor device and method of shielding semiconductor die from inter-device interference

Semiconductor device and method of manufacturing the same

Maskless Process for Solder Bumps Production

METHOD OF FABRICATING SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR WAFER, AND METHOD OF SAWING THE SEMICONDUCTOR WAFER

Structure and Method for Reliable Solder Joints

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR DEVICE

Methods and devices for fabricating and assembling printable semiconductor elements

Semiconductor chip and method for fabricating the same

Semiconductor device and a method for manufacturing the same

Wirebondless wafer level package with plated bumps and interconnects

Electronic device package and fabrication method thereof

Electronics device package and fabrication method thereof

Packaging structure and method for fabricating the same

CONDUCTIVE STRUCTURE OF A CHIP

Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the same

Semiconductor device and manufacturing method thereof

Image sensor package, camera module having same and manufacturing method for the same

Formation of a through-electrode by inkjet deposition of resin pastes

RELIABILITY WCSP LAYOUTS

Semiconductor storage device, semiconductor storage device manufacturing method and package resin forming method

Semiconductor component with improved contact pad and method for forming the same

Methods and designs for localized wafer thinning

Pad cushion structure and method of fabrication for Pb-free C4 integrated circuit chip joining

Display device and manufacturing method of the same

Wire bonding to connect electrodes

Intermetallic diffusion block device and method of manufacture

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME

Low fabrication cost, fine pitch and high reliability solder bump

Die stacking with an annular via having a recessed socket

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor processing methods

Final via structures for bond pad-solder ball interconnections

Integrated circuit system having different-size solder bumps and different-size bonding pads

Semiconductor device and manufacturing method of the same

Approach to high temperature wafer processing

Underbump metallurgy for enhanced electromigration resistance

Flip chip interconnection structure with bump on partial pad and method thereof

Structure for reduction of soft error rates in integrated circuits

Pulse-laser bonding method for through-silicon-via based stacking of electronic components

Method of manufacturing semiconductor device and semiconductor device

CONDUCTIVE STRUCTURE OF A CHIP AND METHOD FOR MANUFACTURING THE SAME

Semiconductor Device Having High-Density Interconnect Array with Core Pillars Formed With OSP Coating

Semiconductor device and manufacturing method thereof

Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof

Semiconductor device with integrated passive circuit and method of making the same using sacrificial substrate

Low impedance gold electrode, apparatus, method and electrolyte solution for fabricating the same

Flip chip semiconductor assembly with variable volume solder bumps

Semiconductor device and method for manufacturing the same

Semiconductor device manufacturing method

Semiconductor interconnect structure with stacked vias separated by signal line and method therefor

Fluorine depleted adhesion layer for metal interconnect structure

Semiconductor device and method of supporting a wafer during backgrinding and reflow of solder bumps

Solder structures including barrier layers with nickel and/or copper

Semiconductor device and manufacturing method thereof

Semiconductor device and a method of manufacturing the same

SUBSTRATE MODULE, METHOD FOR MANUFACTURING SUBSTRATE MODULE, AND ELECTRONIC DEVICE

Chipstack package and manufacturing method thereof

Wirebond over post passivation thick metal

Electronic parts packaging structure and method of manufacturing the same

Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same

Semiconductor apparatus having a through-hole interconnection

Semiconductor package and method of making the same

MODIFICATION OF PB-FREE SOLDER ALLOY COMPOSITIONS TO IMPROVE INTERLAYER DIELECTRIC DELAMINATION IN SILICON DEVICES AND ELECTROMIGRATION RESISTANCE IN SOLDER JOINTS

Device mounting board and manufacturing method therefor, and semiconductor module

Bond pad structure

Method for manufacturing a wafer level package

Wafer level chip scale package and process of manufacture

Light emitting diode and method for manufacturing the same

Method for fabricating package structures for optoelectronic devices

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Post bump and method of forming the same

WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFFICIENCY WITH AN EMF SHIELD AND A METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

High performance system-on-chip inductor using post passivation process

Method of forming bonding pad opening

INTEGRATION SCHEME FOR EXTENSION OF VIA OPENING DEPTH

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Stack package and method for manufacturing the same

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Micropad formation for a semiconductor

Semiconductor device having a refractory metal containing film and method for manufacturing the same

Method of forming a bump structure using an etching composition for an under bump metallurgy layer

Bonding pad structure and semiconductor device including the bonding pad structure

Semiconductor device and the method of manufacturing the same

ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

Forming a 3-D semiconductor die structure with an intermetallic formation

Pad in semicondcutor device and fabricating method thereof

Semiconductor device and method of manufacturing the same

WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDITIONING

Semiconductor device and method of manufacturing the same

Semiconductor chip having conductive member for reducing localized voltage drop

Pass-through 3D interconnect for microelectronic dies and associated systems and methods

Semiconductor device and manufacturing method thereof

Forming robust solder interconnect structures by reducing effects of seed layer underetching

Semiconductor element, semiconductor device, and fabrication method thereof

METHOD OF MANUFACTURING A SEMICONDUCOTOR DEVICE

UNDER BUMP METALLURGY STRUCTURE OF SEMICONDUCTOR DEVICE PACKAGE

Semiconductor chip, method of fabricating the same and semiconductor chip stack package

Semiconductor device employing wafer level chip size package technology

Terminal pad structures and methods of fabricating same

Thermal mechanical flip chip die bonding

Bonding pad for anti-peeling property and method for fabricating the same

Thick metal interconnect with metal pad caps at selective sites and process for making the same

Semiconductor package having redistribution layer

Semiconductor device and manufacturing method of the same

Method of opening pad in semiconductor device

Thick metal interconnect with metal pad caps at selective sites and process for making the same

METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE

Method of forming a crack stop laser fuse with fixed passivation layer coverage

LCD Driver IC and Method for Manufacturing the Same

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM ALLOY

Warpage resistant semiconductor package and method for manufacturing the same

STRUCTURE OF THREE-DIMENSIONAL STACKED DICE WITH VERTICAL ELECTRICAL SELF-INTERCONNECTIONS AND METHOD FOR MANUFACTURING THE SAME

Method for fabricating electrical bonding pads on a wafer

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM COPPER ALLOY

Protected solder ball joints in wafer level chip-scale packaging

Manufacturing method of redistribution circuit structure

Method for forming an electrical structure comprising multiple photosensitive materials

Undercut-free BLM process for Pb-free and Pb-reduced C4

Semiconductor device

Copper pillar tin bump on semiconductor chip and method of forming the same

Method of manufacturing semiconductor device with through hole

Method of manufacturing a wafer level package that uses the same seed layer for selectively electroplating a rewiring pattern and a conductive pillar

Semiconductor device and a method of manufacturing the same

Manufacturing method of semiconductor integrated device with inverting plating cup

Method of forming an inductor on a semiconductor wafer

Method for micro component self-assembly

Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Back end integrated WLCSP structure without aluminum pads

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Method for manufacturing a semiconductor device

Wafer-level chip scale package and method for fabricating and using the same

Method of manufacturing chip-on-chip semiconductor device

Wafer of circuit board and joining structure of wafer or circuit board

JUNCTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Stacked semiconductor package and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Device including a semiconductor chip having a plurality of electrodes

Chip structure

METAL PAD OF SEMICONDUCTOR DEVICE

BONDING PAD FOR ANTI-PEELING PROPERTY AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

Semiconductor package

Electronic device

Through-silicon vias and methods for forming the same

Inductor formed in an integrated circuit

Methods for forming a through via

Method of forming metallic bump and seal for semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF BUMP FORMATION

I/O pad structures for integrated circuit devices

Semiconductor package having a crack-propagation preventing unit

Wafer packaging method

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Semiconductor device with copper wirebond sites and methods of making same

Chemical removal of oxide layer from chip pads

Semiconductor device and method of laser-marking wafers with tape applied to its active surface

Solder bump with inner core pillar in semiconductor package

BONDING PAD STRUCTURE ALLOWING WIRE BONDING OVER AN ACTIVE AREA IN A SEMICONDUCTOR DIE AND METHOD OF MANUFACTURING SAME

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Semiconductor device and method of forming interconnect structure in non-active area of wafer

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

Redistribution layer for wafer-level chip scale package and method therefor

Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes

Semiconductor device and method of manufacturing the same

Structure and method for fabricating flip chip devices

Methods for removing contaminants from aluminum-comprising bond pads and integrated circuits therefrom

Semiconductor connection component

Semiconductor device and method of manufacturing the same

Semiconductor device and methods of manufacturing semiconductor devices

Semiconductor device and producing method of the same

Flip chip for electrical function test and manufacturing method thereof

UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROLESS NICKEL DEPOSITION

Wire bond pads

Semiconductor device and method of manufacturing the same

Nail-shaped pillar for wafer-level chip-scale packaging

Post passivation structure for a semiconductor device and packaging process for same

Structure of gold bumps and gold conductors on one IC die and methods of manufacturing the structures

Electrode structure in semiconductor device and related technology

Wafer level packaging of semiconductor chips

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method for manufacturing a device having a high aspect ratio via

Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device

Cascode current sensor for discrete power semiconductor devices

Power semiconductor component with metal contact layer and production method therefor

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body

Image sensor package with trench insulator and fabrication method thereof

INTERCONNECT ASSEMBLIES AND METHODS

Method of manufacturing semiconductor device

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices

Bridge type pad structure of a semiconductor device

Small area, robust silicon via structure and process

Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing

SOLDER BUMP ON A SEMICONDUCTOR SUBSTRATE

SEMICONDUCTOR CHIP WITH SOLDER BUMP AND METHOD OF FABRICATING THE SAME

Conductor bump method and apparatus

Multi-chip stack structure having through silicon via and method for fabrication the same

Semiconductor device

Bond pad stacks for ESD under pad and active under pad bonding

Semiconductor device and method for manufacturing the same

Crosstalk-free WLCSP structure for high frequency application

Methods of attaching a die to a substrate

Weldable contact and method for the production thereof

Three-dimensional die-stacking package structure

Bonding pad for preventing pad peeling and method for fabricating the same

Semiconductor device

Enhanced reliability of wafer-level chip-scale packaging (WLCSP) die separation using dry etching

Layout of dummy patterns

Semiconductor device having through electrode and method of fabricating the same

Semiconductor device and method for manufacturing the same

Semiconductor device including fuse elements and bonding pad

ELECTRODE STRUCTURE BODY AND METHOD OF FORMING THE SAME, ELECTRONIC COMPONENT, AND MOUNTING SUBSTRATE

Semiconductor device including a stress buffer

Self-aligned wafer or chip structure, and self-aligned stacked structure

Metal pad formation method and metal pad structure using the same

ELECTROLYTIC NI PLATING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Power composite integrated semiconductor device and manufacturing method thereof