207783 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto Manufacturing methods
High performance system-on-chip using post passivation process
#5402Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument
#5403High performance system-on-chip using post passivation process
#5404High performance system-on-chip using post passivation process
#5405Method and system for depositing alloy composition
#5406Semiconductor element and manufacturing method thereof
#5407METHODS OF FORMING ALUMINUM-FREE WIRE BOND PAD AND PAD SO FORMED
#5408Chip package and method for fabricating the same
#5409High performance system-on-chip using post passivation process
#5410Solder elements with columnar structures and methods of making the same
#5411Semiconductor device and method for manufacturing the same
#5412Interconnection structure of integrated circuit chip
#5413High performance system-on-chip using post passivation process
#5414High performance system-on-chip using post passivation process
#5415Interconnect structures with bond-pads and methods of forming bump sites on bond-pads
#5416Chip scale package and method for manufacturing the same
#5417Electronic device including a conductive stud over a bonding pad region
#5418Methods of forming electronic structures including conductive shunt layers and related structures
#5419Solder Ball Pad Structure
#5420Solder bumps in flip-chip technologies
#5421Solder connector structure and method
#5422Bonding apparatus
#5423Pad structure design with reduced density
#5424Semiconductor device and method of manufacturing the same
#5425SEMICONDUCTOR CHIP
#5426Compliant Bumps for Integrated Circuits Using Carbon Nanotubes
#5427High speed, high density, low power die interconnect system
#5428Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same
#5429Semiconductor device, circuit substrate, electro-optic device and electronic appliance
#5430Semiconductor device and method of producing the same
#5431Semiconductor device having an electrode pad, a bump provided above the electrode pad and a bump foundation layer therebetween
#5432Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
#5433Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system
#5434Semiconductor device with electrode pad having probe mark
#5435Electronic device with EMI screen and packing process thereof
#5436Copper bonding compatible bond pad structure and method
#5437Integrated circuit and method for fabricating the same
#5438Method for bonding wafers to produce stacked integrated circuits
#5439Semiconductor constructions and assemblies, and electronic systems
#5440Integrated circuit packaging system with ultra-thin die
#5441Flip chip package and method of fabricating the same
#5442Semiconductor device and method for manufacturing semiconductor device
#5443Bonding pad structure and method for making the same
#5444Semiconductor package substrate for flip chip packaging
#5445Tapered die-side bumps
#5446Integrated circuit (IC) chip and method for fabricating the same
#5447STACKED-TYPE WAFER LEVEL PACKAGE, METHOD OF MANUFACTURING THE SAME, WAFER-LEVEL STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME
#5448Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus
#5449SURFACE TREATMENT, SORTING AND ASSEMBLING METHODS OF MICROELECTRONIC DEVICES AND STORAGE STRUCTURE THEREOF
#5450Capping of metal interconnects in integrated circuit electronic devices
#5451Die configurations and methods of manufacture
#5452Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#5453Electronic component, semiconductor device employing same, and method for manufacturing electronic component
#5454Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same
#5455Semiconductor device capable of suppressing current concentration in pad and its manufacture method
#5456Methods of forming solder connections and structure thereof
#5457Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device
#5458Ball-limiting metallurgies, solder bump compositions used therewith, packages assembled thereby, and methods of assembling same
#5459Integrated circuit package system with post-passivation interconnection and integration
#5460Semiconductor device and method for producing the semiconductor device
#5461Semiconductor device having a bonding pad and fuse and method for forming the same
#5462HIGHLY COMPLIANT PLATE FOR WAFER BONDING
#5463Semiconductor device and method for fabricating the same
#5464Chip stack package and manufacturing method thereof
#5465METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS
#5466Semiconductor device and method for fabricating the same
#5467Contact surrounded by passivation and polymide and method therefor
#5468Non-cyanide gold electroplating for fine-line gold traces and gold pads
#5469Method of wire bonding over active area of a semiconductor circuit
#5470Semiconductor device
#5471Electronic module with a semiconductor chip and a component housing and methods for producing the same
#5472Semiconductor device with semiconductor chips mounted on mounting board via conductive anaotubes
#5473Wafer level semiconductor chip packages and methods of making the same
#5474Super high density module with integrated wafer level packages
#5475Method for fabricating semiconductor package with multi-layer die contact and external contact
#5476Semiconductor device and method of producing the same
#5477Stacked bump structure and manufacturing method thereof
#5478Low temperature methods of forming back side redistribution layers in association with through wafer interconnects
#5479CHIP STRUCTURE AND FABRICATING PROCESS THEREOF
#5480Manufacturing method of semiconductor device with a barrier layer and a metal layer
#54813D interconnect with protruding contacts
#5482CHIP PACKAGING STRUCTURE
#5483Method for forming C4 connections on integrated circuit chips and the resulting devices
#5484Semiconductor device having a smaller electrostatic capacitance electrode
#5485Semiconductor device with via hole of uneven width
#5486Chip structure with half-tunneling electrical contact to have one electrical contact formed on inactive side thereof and method for producing the same
#5487IC chip package with minimized packaged-volume
#5488Semiconductor device and method of manufacturing the same
#5489Semiconductor components having encapsulated through wire interconnects (TWI)
#5490Method for Electroplating and Contact Projection Arrangement
#5491Method of manufacturing a through electrode
#5492Semiconductor apparatus and method of producing the same
#5493Direct-write wafer level chip scale package
#5494NOVEL UNDER-BUMP METALLIZATION FOR BOND PAD SOLDERING
#5495Apparatuses and methods to enhance passivation and ILD reliability
#5496Bilayer Laminated Film for Bump Formation and Method of Bump Formation
#5497Method for fabricating a transformer integrated with a semiconductor structure
#5498Semiconductor die packages using thin dies and metal substrates
#5499Capacitor structure of semiconductor device and method of fabricating the same
#5500Method for fabricating a transformer integrated with a semiconductor structure
#5501Semiconductor device and method for manufacturing the same
#5502Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging
#5503Method for forming metal bumps
#5504Method and structure for eliminating aluminum terminal pad material in semiconductor devices
#5505Room temperature metal direct bonding
#5506Carbon nanotube via interconnect
#5507High-performance semiconductor package
#5508Semiconductor device and manufacturing method thereof
#5509Semiconductor device including a DC-DC converter
#5510Semiconductor device and medium of fabricating the same
#5511Structure and method to improve current-carrying capabilities of C4 joints
#5512Semiconductor components with through wire interconnects
#5513Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5514Method for manufacturing bump of wafer level package
#5515Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device
#5516Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument
#5517METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES
#5518GaAs integrated circuit device and method of attaching same
#5519Wire bonding method for preventing polymer cracking
#5520Method, system, and apparatus for gravity assisted chip attachment
#5521Method and structure for improving bonding reliability in bond pads
#5522Method of forming a bump and a connector structure having the bump
#5523Method and apparatus for providing structural support for interconnect pad while allowing signal conductance
#5524PROCESSES FOR FORMING PHOTOVOLTAIC FEATURES
#5525Chip package and method for fabricating the same
#5526Solder bump structure for flip chip package and method for manufacturing the same
#5527Method for manufacturing semiconductor device
#5528Method for fabricating stacked semiconductor components with through wire interconnects
#5529System for fabricating semiconductor components with through wire interconnects
#5530METHOD OF FABRICATING ULTRA THIN FLIP-CHIP PACKAGE
#5531Semiconductor device, electronic device and fabrication method of the same
#5532Bond pad structures with reduced coupling noise
#5533Entire encapsulation of Cu interconnects using self-aligned CuSiN film
#5534Semiconductor device and manufacturing method for the same
#5535Apparatus for integrated input/output circuit and verification method thereof
#5536Semiconductor package having an optical device and a method of making the same
#5537Semiconductor device having improved wire-bonding reliability and method of manufacturing the same
#5538Power composite integrated semiconductor device and manufacturing method thereof
#5539Nanoscale probes for electrophysiological applications
#5540PAD STRUCTURE FOR BONDING PAD AND PROBE PAD AND MANUFACTURING METHOD THEREOF
#5541ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES
#5542Method of fabricating semiconductor memory device and semiconductor memory device driver
#5543Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#5544Semiconductor device
#5545Method of producing a semiconductor device by forming an oxide film on a resin layer
#5546Methods for fabricating and filling conductive vias and conductive vias so formed
#5547Active area bonding compatible high current structures
#5548Method of fabrication on high coplanarity of copper pillar for flip chip packaging application
#5549Solder bump confinement system for an integrated circuit package
#5550Method of fabricating wafer level package
#5551Method for forming a redistribution layer in a wafer structure
#5552Solder bump on a semiconductor substrate
#5553Semiconductor device, reticle used in fabricating method for the same and fabrication method thereof
#5554Electronic devices including solder bumps on compliant dielectric layers
#5555Semiconductor device
#5556Semiconductor device with visible indicator and method of fabricating the same
#5557LOW VISCOSITY PRECURSOR COMPOSITIONS AND METHODS FOR THE DEPOSITION OF CONDUCTIVE ELECTRONIC FEATURES
#5558Solder composition and method of bump formation therewith
#5559Structure and method for bond pads of copper-metallized integrated circuits
#5560Bonding pad structure
#5561Wafer level chip scale package having a gap and method for manufacturing the same
#5562Method of manufacturing semiconductor device including bonding pad and fuse elements
#5563Semiconductor device including fuse elements and bonding pad
#5564Three-dimensional package and method of making the same
#5565Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#5566Semiconductor device having flange structure
#5567Method for fabricating circuit component
#5568Method for fabricating last level copper-to-C4 connection with interfacial cap structure
#5569Method of wire bonding over active area of a semiconductor circuit
#5570Method of wire bonding over active area of a semiconductor circuit
#5571Method of wire bonding over active area of a semiconductor circuit
#5572Semiconductor device, dicing saw and method for manufacturing the semiconductor device
#5573Semiconductor device having alignment post electrode and method of manufacturing the same
#5574Carbon nanotube circuit component structure
#5575METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT
#5576Semiconductor chip with bond area
#5577METHOD OF FORMING PAD OF SEMICONDUCTOR DEVICE
#5578Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps
#5579Manufacturing method for semiconductor device and semiconductor device
#5580Super high-density module with integrated wafer level packages
#5581Compliant terminal mountings with vented spaces and methods
#5582CHIP STRUCTURE AND CHIP MANUFACTURING PROCESS
#5583Semiconductor device and method of manufacturing the same
#5584Super high-density module with integrated wafer level packages
#5585Compliant terminal mountings with vented spaces and methods
#5586Method for fabricating a probing pad of an integrated circuit chip
#5587Thin-film capacitor and method for fabricating the same, electronic device and circuit board
#5588Method of manufacturing semiconductor device
#5589PAD STRUCTURE OF SEMICONDUCTOR DEVICE AND FORMATION METHOD
#5590PAD STRUCTURE IN A SEMICONDUCTOR DEVICE AND A METHOD OF FORMING A PAD STRUCTURE
#5591Apparatus and method incorporating discrete passive components in an electronic package
#5592Method for mounting bumps on an under metallurgy layer
#5593Integrated circuit having bond pad with improved thermal and mechanical properties
#5594Semiconductor device having a through electrode with a low resistance and method of manufacturing the same
#5595Integrated circuit chip with external pads and process for fabricating such a chip
#5596Integrated circuit devices including compliant material under bond pads and methods of fabrication
#5597Method of fabricating electrical connection terminal of embedded chip
#5598Adhesion by plasma conditioning of semiconductor chip surfaces
#5599Method and system for increasing yield of vertically integrated devices
#5600Semiconductor element, production process thereof, semiconductor laser and production process thereof
#5601Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device
#5602Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5603Interconnect assemblies and methods
#5604Semiconductor device having high frequency components and manufacturing method thereof
#5605Semiconductor device manufacturing method
#5606Circuit under pad structure and bonding pad process
#5607Bond pad for low K dielectric materials and method for manufacture for semiconductor devices
#5608Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
#5609Low cost bonding pad and method of fabricating same
#5610Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5611Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5612Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5613Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5614Structure of bumps forming on an under metallurgy layer and method for making the same
#56153D integrated circuits using thick metal for backside connections and offset bumps
#5616Semiconductor device having align mark layer and method of fabricating the same
#5617Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing
#5618Integrated circuit package system with bump pad
#5619Semiconductor assembly having substrate with electroplated contact pads
#5620Damascene patterning of barrier layer metal for C4 solder bumps
#5621Wafer redistribution structure with metallic pillar and method for fabricating the same
#5622INTEGRATED CIRCUIT PACKAGE SYSTEM
#5623Semiconductor chip having bond pads
#5624Semiconductor chip having bond pads
#5625Chip structure and manufacturing method of the same
#5626Semiconductor package including a semiconductor die having redistributed pads
#5627Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same
#5628Wafer level package having redistribution interconnection layer and method of forming the same
#5629Semiconductor chip having bond pads
#5630Method of Forming Bump, Method of Forming Image Sensor Using the Method, Semiconductor Chip and the Sensor so Formed
#5631Electrical interconnection structure formation
#5632Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5633Low viscosity precursor compositions and methods for the deposition of conductive electronics features
#5634Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5635Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5636Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5637Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5638Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5639Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5640Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5641CHIP STRUCTURE WITH SOLDER BUMP AND METHOD FOR PRODUCING THE SAME
#5642Bumping process with self-aligned A1-cap and the elimination of 2nd passivation layer
#5643Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5644Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5645Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5646Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5647Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5648Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5649Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5650Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5651Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5652Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5653Semiconductor device with solder balls having high reliability
#5654Implantable microelectronic device and method of manufacture
#5655Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5656Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5657Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5658Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#5659Semiconductor device that attains a high integration
#5660Light emitting diode chip with reflective layer thereon
#5661Method for forming solder contacts on mounted substrates
#5662Method for forming bumps
#5663Etchant and method for forming bumps
#5664Method for forming improved bump structure
#5665Semiconductor device with multiple designation marks
#5666Method for manufacture of wafer level package with air pads
#5667Semiconductor chip and method of manufacturing semiconductor chip
#5668Semiconductor device and fabrication method thereof
#5669SELECTIVE SOLDER DEPOSITION BY SELF-ASSEMBLY OF NANO-SIZED SOLDER PARTICLES, AND METHODS OF ASSEMBLING SOLDERED PACKAGES
#5670Support structures for semiconductor devices
#5671Hybrid module and method of manufacturing the same
#5672Semiconductor device with front side metallization and method for the production thereof
#5673Semiconductor device with pad electrode for testing and manufacturing method of the same
#5674Semiconductor element with conductive bumps and fabrication method thereof
#5675Methods for protecting metal surfaces
#5676Solder bump structure for flip chip semiconductor devices and method of manufacture therefore
#5677Integrated circuit solder bumping system
#5678Semiconductor device with a resin-sealed optical semiconductor element
#5679Electric contact and method for producing the same and connector using the electric contacts
#5680Method for patterning and etching a passivation layer
#5681Routing under bond pad for the replacement of an interconnect layer
#5682Display device and manufacturing method of the same
#5683QFN/SON compatible package with SMT land pads
#5684Electronic assembly that includes pads having a bowl shaped upper section
#5685Semiconductor chip having bond pads
#5686Semiconductor chip having bond pads and multi-chip package
#5687Component mounting method and component-mounted body
#5688Flip-chip packaging process using copper pillar as bump structure
#5689Protective barrier layer for semiconductor device electrodes
#5690Semiconductor device and manufacturing method thereof
#5691Semiconductor wafer level chip package and method of manufacturing the same
#5692Bumping process and structure thereof
#5693Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness
#5694Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices
#5695Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology
#5696Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
#5697Method for forming a double embossing structure
#5698Semiconductor device and method of manufacturing the same
#5699Microfeature workpieces having alloyed conductive structures, and associated methods
#5700BONDING PAD STRUCTURE AND METHOD OF FORMING THE SAME