Under bump metallurgy structure and wafer structure using the same and method of manufacturing wafer structure

Solder bump interconnect for improved mechanical and thermo-mechanical performance

Electronic structures including barrier layers defining lips

Ubm Pad, Solder Contact and Methods for Creating a Solder Joint

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

STRUCTURE FOR PREVENTING PAD PEELING

Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same

Through silicon via dies and packages

Integrated circuit package and method for operating and fabricating thereof

Method of fabricating a wafer structure having a pad and a first protection layer and a second protection layer

Front-end processing of nickel plated bond pads

Method of Manufacturing Electrical Conductors for a Semiconductor Device

Enhanced copper posts for wafer level chip scale packaging

Cylindrical bonding structure and method of manufacture

Metal interconnect System and Method for Direct Die Attachment

SEMICONDUCTOR DEVICE WITH BONDING PAD SUPPORT STRUCTURE

Semiconductor device and fabrication method thereof

Bonding pad structure disposed in semiconductor device and related method

METHOD FOR FABRICATING METAL PAD

Semiconductor device and fabrication methods thereof

Semiconductor device packaged into chip size and manufacturing method thereof

Method for adhering semiconductor devices

Monitoring cool-down stress in a flip chip process using monitor solder bump structures

Alignment mark, semiconductor chip including the same, semiconductor package including the chip and methods of fabricating the same

Semiconductor device and method of manufacturing same

Semiconductor device with multilayered metal pattern

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING BOAC/COA

Reliable metal bumps on top of I/O pads after removal of test probe marks

Chip assembly with interconnection by metal bump

Semiconductor module manufacturing method, semiconductor module, and mobile device

Methods of assembling integrated circuit packages

Semiconductor device and method for manufacturing the same

Semiconductor devices and assemblies including back side redistribution layers in association with through wafer interconnects

Semiconductor device and manufacturing method thereof

Package structure for integrated circuit device

Semiconductor chip and manufacturing method thereof

Methods of forming a semiconductor device including a diffusion barrier film

Package-in-package using through-hole via die on saw streets

Packaging board, rewiring, roughened conductor for semiconductor module of a portable device, and manufacturing method therefor

Semiconductor package substrate structure and manufacturing method thereof

Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer

Extended redistribution layers bumped wafer

LED epiwafer pad manufacturing process & new construction thereof

Semiconductor device and process for fabricating the same

Semiconductor device

Highly reliable low cost structure for wafer-level ball grid array packaging

WAFER LEVEL PACKAGE AND FABRICATING METHOD THEREOF

Semiconductor device and method for manufacturing the same

Workpiece with semiconductor chips and molding, semiconductor device and method for producing a workpiece with semiconductors chips

Selective etch of TiW for capture pad formation

METHOD FOR FORMING BUMPS ON UNDER BUMP METALLURGY

Method for fabricating a probing pad of an integrated circuit chip

Three-dimensional semiconductor device

Integration type semiconductor device and method for manufacturing the same

Semiconductor Device and Method for Fabricating the Same

Low fabrication cost, fine pitch and high reliability solder bump

Semiconductor device and manufacturing method of the same

Method of manufacturing a semiconductor device having an even coating thickness using electro-less plating, and related device

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Method of making solder pad

Semiconductor device and method for manufacturing the same

Chip package

Electromigration-Resistant Flip-Chip Solder Joints

TOP LAYERS OF METAL FOR INTEGRATED CIRCUITS

UBM structure for strengthening solder bumps

Solder connector structure and method

Semiconductor device and method of manufacturing the same

METHOD FOR FABRICATING CONTACT PADS

Chips having rear contacts connected by through vias to front contacts

Method of creating contour structures to highlight inspection region

Semiconductor device with electrode pad having probe mark

Integrated circuit package system with protected conductive layers for pads and method of manufacturing thereof

Semiconductor device

SEMICONDUCTOR DEVICE WITH STRENGTHENED PADS

Semiconductor device including an insulating film and insulating pillars and manufacturing method of the semiconductor device

METHOD FOR FORMING CONTACT PADS

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Sensor-type semiconductor device and manufacturing method thereof

Method of joining electronic package capable of prevention for brittle fracture

Method of fabricating intergrated circuit chip

Method of wire bonding over active area of a semiconductor circuit

Stackable semiconductor device and fabrication method thereof

Semiconductor device with Al pad

Method of forming solder bump on high topography plated Cu

Copper die bumps with electromigration cap and plated solder

Chip and wafer integration process using vertical connections

Method for manufacturing electric connections in wafer

Electronic part, method for fabricating electronic part, acceleration sensor, and method for fabricating acceleration sensor

Method of making an interconnect structure

Wirebond structure and method to connect to a microelectronic die

Method of making reliable wafer level chip scale package semiconductor devices

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Apparatus comprising a device and method for producing it

Semiconductor Device and Method of Manufacturing Same, Wiring Board and Method of Manufacturing Same, Semiconductor Package, and Electronic Device

Semiconductor device and manufacturing method of the same

Soldering structure and method using Zn

Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns

Semiconductor device with grounding structure

Semiconductor device manufacturing method and semiconductor device

Metallic electrode forming method and semiconductor device having metallic electrode

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Carbon nanotube bond pad structure and method therefor

Semiconductor device and method of manufacturing the same

Semiconductor wafer, semiconductor device, and semiconductor device manufacturing method

Method for manufacturing semiconductor device, and method and structure for implementing semiconductor device

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Layer sequence and method of manufacturing a layer sequence

SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME, AND POWER CONVERSION APPARATUS INCORPORATING THIS SEMICONDUCTOR DEVICE

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATION THEREOF

INTERCONNECTIONS FOR FLIP-CHIP USING LEAD-FREE SOLDERS AND HAVING REACTION BARRIER LAYERS

Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same

Conductive structure for a semiconductor integrated circuit and method for forming the same

Packaging conductive structure and method for manufacturing the same

Conductive structure for a semiconductor integrated circuit and method for forming the same

SEMICONDUCTOR DEVICE FOR WHICH ELECTRICAL TEST IS PERFORMED WHILE PROBE IS IN CONTACT WITH CONDUCTIVE PAD

Semiconductor sensor and manufacturing method therefor

Undercut-free BLM process for Pb-free and Pb-reduced C4

Method of low temperature wafer bonding through Au/Ag diffusion

Bumping process and bump structure

Semiconductor device comprising electromigration prevention film and manufacturing method thereof

Semiconductor device with magnetic powder mixed therein and manufacturing method thereof

Integrated circuit package system with bump over via

Integrated circuit package having large conductive area and method for fabricating the same

Low fabrication cost, fine pitch and high reliability solder bump

Bump structure having a reinforcement member

Hybrid module and method of manufacturing the same

Ink jet recording head and method for manufacturing the same

SEMICONDUCTOR DEVICE AND METHOD OF FORMING METAL PAD OF SEMICONDUCTOR DEVICE

Electronic device having metal pad structure and method of fabricating the same

Semiconductor device

Bonding pad of semiconductor integrated circuit, method for manufacturing the bonding pad, semiconductor integrated circuit, and electronic device

Semiconductor device and manufacturing method thereof

Bump structure with annular support

Redistribution circuit structure

Under bump metallurgy structure of a package and method of making same

Package structure for optoelectronic device and fabrication method thereof

Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof

Power MOSFET wafer level chip-scale package

Method for reduction of soft error rates in integrated circuits

Method for manufacturing a three-dimensional semiconductor device and a wafer used therein

INTEGRATED CIRCUITS WITH CONDUCTIVE FEATURES IN THROUGH HOLES PASSING THROUGH OTHER CONDUCTIVE FEATURES AND THROUGH A SEMICONDUCTOR SUBSTRATE

APPARATUS FOR INTEGRATED INPUT/OUTPUT CIRCUIT AND VERIFICATION METHOD THEREOF

METHOD FOR CHIP TO PACKAGE INTERCONNECT

MICROELECTRONIC DIE INCLUDING SOLDER CAPS ON BUMPING SITES THEREOF AND METHOD OF MAKING SAME

SEMICONDUCTOR DEVICE HAVING FUSE CIRCUIT ON CELL REGION AND METHOD OF FABRICATING THE SAME

Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers

Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages

METHODS OF FORMING STEPPED BUMPS AND STRUCTURES FORMED THEREBY

DIRECT TERMINATION OF A WIRING METAL IN A SEMICONDUCTOR DEVICE

Method to reduce UBM undercut

STACK PACKAGE HAVING REDUCED ELECTRICAL CONNECTION LENGTH SUITABLE FOR HIGH SPEED OPERATIONS AND METHOD OF MANUFACTURING THE SAME

Methods of forming stepped bumps and structures formed thereby

Structure of super thin chip scale package and method of the same

Semiconductor devices and methods of forming the same

INTEGRATED ELECTRONIC CIRCUIT CHIP COMPRISING AN INDUCTOR

Semiconductor chip and method of manufacturing semiconductor chip

Semiconductor device and method of forming passive devices

Voltage regulator integrated with semiconductor chip

Semiconductor device and method of protecting passivation layer in a solder bump process

METHOD FOR FABRICATING A CIRCUIT

High surface area aluminum bond pad for through-wafer connections to an electronic package

Semiconductor device

Heat dissipating chip structure and fabrication method thereof and package having the same

Microelectronic assemblies having compliancy and methods therefor

Semiconductor device having through vias

Process for making contact with and housing integrated circuits

Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device

Method for fabricating a circuit component

Method of manufacturing wafer level chip size package

Semiconductor apparatus and manufacturing method of semiconductor apparatus

Semiconductor integrated circuit

DEVICE HAVING CONTACT PAD WITH A CONDUCTIVE LAYER AND A CONDUCTIVE PASSIVATION LAYER

Semiconductor processing methods, methods of forming contact pads, and methods of forming electrical connections between metal-containing layers

Dummy patterns and method of manufacture for mechanical strength of low K dielectric materials in copper interconnect structures for semiconductor devices

STRUCTURE FOR CONTROLLED COLLAPSE CHIP CONNECTION WITH A CAPTURED PAD GEOMETRY

Tubular-shaped bumps for integrated circuit devices and methods of fabrication

Semiconductor device and method for manufacturing the same

Semiconductor device

Semiconductor chip and production process therefor

Wafer bonding method of system in package

INTEGRATED CIRCUITS WITH CONDUCTIVE FEATURES IN THROUGH HOLES PASSING THROUGH OTHER CONDUCTIVE FEATURES AND THROUGH A SEMICONDUCTOR SUBSTRATE

Solder Bump/Under Bump Metallurgy Structure for High Temperature Applications

Function element and function element mounting structure

Semiconductor wafer

Method for Preparing an Intergrated Circuits Device Having a Reinforcement Structure

Semiconductor device and manufacturing method of the same

Optimum padset for wire bonding RF technologies with high-Q inductors

Semiconductor device and method of manufacturing the same

Wafer level chip scale package, method of manufacturing the same, and semiconductor chip module including the wafer level chip scale package

Semiconductor device and method of manufacturing semiconductor device

Intergrated Circuits Device Having a Reinforcement Structure

Semiconductor device having elastic solder bump to prevent disconnection

Semiconductor chip and method of producing the same

SEMICONDUCTOR INTEGRATED CIRCUIT AND FABRICATION METHOD FOR THE SAME

Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereof

Method of disposing and arranging dummy patterns

Mounting method of semiconductor element using outside connection projection electyrode and manufacturing method of semiconductor device using outside connection projection electrode

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud-bumps

Bonding structures and methods of forming bonding structures

STRUCTURE FOR PREVENTING PAD PEELING AND METHOD OF FABRICATING THE SAME

Bond pad design to minimize dielectric cracking

Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart

Method of fabricating electronic device having sacrificial anode, and electronic device fabricated by the same

Chip and manufacturing method and application thereof

SEMICONDUCTOR DEVICE INCLUDING CORROSION RESISTANT WIRING STRUCTURE

INTERGRATED CIRCUIT DEVICE, CHIP, AND METHOD OF FABRICATING THE SAME

METHOD FOR IMPROVED COPPER LAYER ETCHING OF WAFERS WITH C4 CONNECTION STRUCTURES

Method for manufacturing semiconductor device with reduced damage to metal wiring layer

Use of palladium in IC manufacturing with conductive polymer bump

Wire and solder bond forming methods

Wire and solder bond forming methods

METHOD AND STRUCTURE OF PATTERN MASK FOR DRY ETCHING

Packaged semiconductor chips

METHOD AND STRUCTURE OF PATTERN MASK FOR DRY ETCHING

System and method for solder bump plating

Solder joint reliability in microelectronic packaging

High performance system-on-chip using post passivation process

Semiconductor package with embedded die

Semiconductor package

Through-wafer interconnects for photoimager and memory wafers

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Metal filled through via structure for providing vertical wafer-to-wafer interconnection

Semiconductor device, wiring of semiconductor device, and method of forming wiring

Plating Device, Plating Method, Semiconductor Device, And Method For Manufacturing Semiconductor Device

Method of manufacturing complementary metal oxide semiconductor image sensor

Technique for forming a passivation layer without a terminal metal

Bonding structure and fabrication thereof

METALLIZATION LAYER STACK WITHOUT A TERMINAL ALUMINUM METAL LAYER

Semiconductor integrated circuit and method for manufacturing the same

METHOD FOR PRODUCING AN INTEGRATED CIRCUIT INCLUDING A CONNECTION CONTACT ON A SEMICONDUCTOR BODY

Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor device

High performance system-on-chip using post passivation process

Semiconductor module arrangement

Semiconductor Device and Method of Fabricating the Same

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Terminal pad structures and methods of fabricating same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Method of fabricating semiconductor package structure

Semiconductor device with bonding pad support structure

Interconnections for fine pitch semiconductor devices and manufacturing method thereof

Bonding and probing pad structures

Wafer-level interconnect for high mechanical reliability applications

Low fabrication cost, fine pitch and high reliability solder bump

BUMP ELECTRODE INCLUDING PLATING LAYERS AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

Dual layer dielectric stack for microelectronics having thick metal lines

Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance

Semiconductor element comprising a supporting structure and production method

Managing forces of semiconductor device layers

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device

CHIP PACKAGE, CHIP STRUCTURE AND MANUFACTURING PROCESS THEREOF

Stack package having guard ring which insulates through-via interconnection plug and method for manufacturing the same

Method of forming metal lines and bumps for semiconductor devices

Apparatus and method incorporating discrete passive components in an electronic package

Electronic device and method for production

METHOD OF FABRICATING A WIRE BOND PAD WITH Ni/Au METALLIZATION

Semiconductor device having sealing film and manufacturing method thereof

Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

Semiconductor device

Removing dry film resist residues using hydrolyzable membranes

Pad over active circuit system and method with meshed support structure

Electrical interconnection structure formation

Wafer level chip package and a method of fabricating thereof

Method of forming metal and metal alloy features

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

Pad over active circuit system and method with frame support structure

Method of fabricating light emitting device and thus-fabricated light emitting device

Semiconductor device and method of producing the same

Semiconductor device and fabricating method thereof

Low fabrication cost, fine pitch and high reliability solder bump

Semiconductor chip and method for fabricating the same

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Chip package and method for fabricating the same

Apparatus and method for packaging circuits

Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods

Low fabrication cost, fine pitch and high reliability solder bump

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Adhesion by plasma conditioning of semiconductor chip

Semiconductor device including through electrode and method of manufacturing the same

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Implantable microelectronic device and method of manufacture

Semiconductor device and fabricating method thereof

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION PATTERN AND METHOD OF MANUFACTURING THE SAME

FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS

Low fabrication cost, fine pitch and high reliability solder bump

Semiconductor package and method for manufacturing the same

Process of forming an electronic device including a barrier layer

Etching solution for etching metal layer, etching method using the etching solution, and method of fabricating semiconductor product using the etching solution

Method of wire bonding over active area of a semiconductor circuit

Semiconductor device and method for manufacturing same

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Bond pad for wafer and package for CMOS imager

High performance system-on-chip using post passivation process