Package and package-on-package structure having elliptical columns and ellipsoid joint terminals

Semiconductor element and method for identifying semiconductor element

Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells

Semiconductor device and method of manufacturing a semiconductor device

Buffer Defense Band (BDB) Outside the Seal Ring to Enhance Crack Stopping in IC's

Die attach surface copper layer with protective layer for microelectronic devices

Manufacturing fluid sensing packages

Semiconductor device and power amplifier module

Bonding pads with thermal pathways

Solid-state image pickup element and electronic apparatus

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS

Semiconductor device package including embedded conductive elements

Bonding pad, semiconductor structure, and method of manufacturing semiconductor structure

METHODS OF FABRICATING SEMICONDUCTOR PACKAGE

METHODS OF FABRICATING SEMICONDUCTOR PACKAGE

Lead-free solder joining of electronic structures

Chip package structure

Semiconductor device including conductive structure

Wafer-level package including under bump metal layer

Integrated circuit features with obtuse angles and method forming same

Structure for standard logic performance improvement having a back-side through-substrate-via

Semiconductor device with contact pad

Chip package having die structures of different heights and method of forming same

Method of manufacturing semiconductor structure

Semiconductor device having a redistribution line

IMAGING APPARATUS AND METHOD OF MANUFACTURING IMAGING APPARATUS

Semiconductor device

Redistribution layer metallic structure and method

Semiconductor structure and manufacturing method thereof

Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices

Semiconductor device and method of manufacture

Bonding pad layer system, gas sensor and method for manufacturing a gas sensor

METHOD FOR DETERMINING BONDING PAD SPACING ON THE SURFACE OF BONDING WIRE CHIP

Semiconductor package device and method of manufacturing the same

Patterning polymer layer to reduce stress

Method of manufacturing semiconductor package

Wafer level integration including design/co-design, structure process, equipment stress management and thermal management

Semiconductor device for bonding conductive layers exposed from surfaces of respective interconnection layers

3D packages and methods for forming the same

Semiconductor device and bump formation process

Packaging devices and methods of manufacture thereof

Method of manufacturing an electronic device comprising a conductive pad on a protruding-through electrode

Integrated passive device and fabrication method using a last through-substrate via

Molded wafer level packaging

Packages and methods of forming packages

Semiconductor device

Buffer layer(s) on a stacked structure having a via

Methods for controlling warpage in packaging

Pad design for thermal fatigue resistance and interconnect joint reliability

Bowl shaped pad

Solder ball protection in packages

Fingerprint sensor device and method

ELECTRONIC ASSEMBLY AND METHOD OF FORMING SAME

Semiconductor device, semiconductor component and method of fabricating a semiconductor device

Semiconductor device

Semiconductor devices having a plurality of first and second conductive strips

Redistribution metal and under bump metal interconnect structures and method

Metal bumps and method forming same

Package and manufacturing method thereof

Methods of forming connector pad structures, interconnect structures, and structures thereof

Multi-metal contact structure in microelectronic component

Semiconductor device and method of manufacturing the same

Vias with metal caps for underlying conductive lines

Multi-pitch ball grid array

Semiconductor structure with polyimide packaging and manufacturing method

Probe methodology for ultrafine pitch interconnects

Solder-pinning metal pads for electronic components

Light-emitting diode and application therefor

Semiconductor device

Semiconductor device and package assembly including the same

Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same

Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging

Hybrid under-bump metallization component

Semiconductor structure and manufacturing method thereof

IR assisted fan-out wafer level packaging using silicon handler

Contact structures with porous networks for solder connections, and methods of fabricating same

Method for encapsulating emissive elements for fluidic assembly

Solid-state imaging device and electronic apparatus

Semiconductor device manufacturing method and semiconductor device

Pad structure and manufacturing method thereof in semiconductor device

Method of manufacturing substrate structure with filling material formed in concave portion

Method for manufacturing semiconductor device

Integrated circuit packages and methods for forming the same

Semiconductor structure with conductive structure

PAD STRUCTURES IN SEMICONDUCTOR DEVICES

Printed circuit surface finish, method of use, and assemblies made therefrom

Three-dimensional integrated stretchable electronics

III-V CHIP PREPARATION AND INTEGRATION IN SILICON PHOTONICS

Conductive pillar shaped for solder confinement

Semiconductor device with improved thermal dissipation and manufacturing methods

Connector formation methods and packaged semiconductor devices

Semiconductor structure with conductive structure

Stacked semiconductor structure and method

Electronic device with multi-layer contact and system

Semiconductor device

Serializer-deserializer die for high speed signal interconnect

Semiconductor device and method of forming the same

Semiconductor package and method of manufacturing a semiconductor package

Packaged semiconductor devices for high voltage with die edge protection

Method of manufacturing wafer level low melting temperature interconnections

Apparatus for bonding substrates having a substrate holder with holding fingers and method of bonding substrates

COMPONENT TERMINATIONS FOR SEMICONDUCTOR PACKAGES

INTERFACE SUBSTRATE AND METHOD OF MAKING THE SAME

MAGNETIC CORE INDUCTORS ON PACKAGE SUBSTRATES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Stacked semiconductor devices and methods of forming same

Method for manufacturing semiconductor package having redistribution layer

MAGNETIC SENSOR

Semiconductor device and method of manufacturing the same

Semiconductor devices and methods of manufacturing the same

Scheme for connector site spacing and resulting structures

Method of using a sacrificial conductive stack to prevent corrosion

CHIP PACKAGING METHOD

Device package including molding compound having non-planar top surface around a die and method of forming same

Contact pad for semiconductor device

Method of manufacturing a redistribution layer, redistribution layer and integrated circuit including the redistribution layer

Eutectic bonding with AlGe

Optoelectronic component and method for producing an optoelectronic component

Integrated fan-out package including voltage regulators and methods forming same

Adhesion Enhancing Structures for a Package

Semiconductor package with filler particles in a mold compound

Encapsulated emissive element for fluidic assembly

Through silicon via design for stacking integrated circuits

Stacked integrated circuit structure and method of forming

Semiconductor device, manufacturing method, and solid-state imaging device

Semiconductor device production method

Semiconductor package

Semiconductor device, manufacturing method, and electronic device

Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films

Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect

Heterogeneous fan-out structure and method of manufacture

Die-on-interposer assembly with dam structure and method of manufacturing the same

Integrated circuit structures

Electronic device and method for manufacturing the same

Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus

Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof

Post-passivation interconnect structure and method of forming the same

Selective shielding of ambient light at chip level

Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer

Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices

Semiconductor device structure and method for forming the same

Integrated fan-out packages

Non-embedded silicon bridge chip for multi-chip module

Copper electroplating compositions and methods of electroplating copper on substrates

Superconducting bump bonds

Superconducting bump bonds

Methods and devices for fabricating and assembling printable semiconductor elements

Forming metal bonds with recesses

SEMICONDUCTOR STRUCTURE AND METHOD OF FORMING THE SAME

Bond pads for low temperature hybrid bonding

Structure and method of forming a joint assembly

Semiconductor devices

Molded Semiconductor Package

Semiconductor interconnect structure and method

Method of providing partial electrical shielding

Semiconductor structure

Bonding support structure (and related process) for wafer stacking

Display device and method for manufacturing the same

Semiconductor element, recording element substrate, and liquid discharge head

Device and method for UBM/RDL routing

Semiconductor device

Method of manufacturing a semiconductor element front side electrode

Fabrication method of packaging structure

Apparatus and method for the minimization of undercut during a UBM etch process

Flat metal features for microelectronics applications

Semiconductor memory device

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor device

Die structure, die stack structure and method of fabricating the same

Semiconductor structure and method for wafer scale chip package

Hybrid mask for deep etching

Microelectronics package with vertically stacked dies

Interlayer connection of stacked microelectronic components

Microelectronics package with vertically stacked dies

Semiconductor package and method of manufacturing same

Film scheme for bumping

Bonded body and method for manufacturing the same

Semiconductor structures and methods of forming the same

Carrier-foil-attached ultra-thin copper foil

Method of forming vias using silicon on insulator substrate

Through silicon via design for stacking integrated circuits

Packages with Si-substrate-free interposer and method forming same

Method for calibrating a component mounting apparatus

HEAT DISSIPATION SUBSTRATE, METHOD FOR PREPARING SAME, APPLICATION OF SAME, AND ELECTRONIC DEVICE

Power converter

Stacked semiconductor package having mold vias and method for manufacturing the same

Method of manufacturing integrated fan-out package

Single-shot encapsulation

Semiconductor device and manufacture thereof

Method for fabricating the electronic component, and method for transposing a micro-element

Fan-out package and methods of forming thereof

3D stacked-chip package

Wiring structure, electronic device and method for manufacturing the same

Method of manufacturing semiconductor device

Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography

Adhesive bonding composition and method of use

Power management application of interconnect substrates

Stiffener package and method of fabricating stiffener package

Semiconductor device

Contact hole structure and fabricating method of contact hole and fuse hole

Barrier structures between external electrical connectors

METHODS OF COPPER PLATING THROUGH WAFER VIA

Semiconductor device and method of manufacturing thereof

Offset-aligned three-dimensional integrated circuit

System on package architecture including structures on die back side

DBI to Si bonding for simplified handle wafer

Mechanisms for forming post-passivation interconnect structure

Interconnect crack arrestor structure and methods

Semiconductor device and method for manufacturing the same

METHOD OF MANUFACTURING DISPLAY APPARATUS, DISPLAY APPARATUS, AND ELECTRONIC APPARATUS

Package structure and method of manufacturing the same

Low temperature bonded structures

Semiconductor memory device structure

Multi-chip semiconductor package

Reliable passivation for integrated circuits

Systems and methods for semiconductor packages using photoimageable layers

Interconnect layer contact and method for improved packaged integrated circuit reliability

Packaging process

3D IC package with RDL interposer and related method

Metal bonding pads for packaging applications

Redistribution layer metallic structure and method

SYSTEMS AND METHODS FOR WAFER-LEVEL MANUFACTURING OF DEVICES HAVING LAND GRID ARRAY INTERFACES

Package structure having sensor die with touch sensing electrode, and method of fabricating the same

Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby

Semiconductor device and power amplifier module

Vertical gallium nitride Schottky diode

Semiconductor device and method for manufacturing same

Display device and preparation method therefor

Semiconductor device and method for manufacturing the same

Package and package-on-package structure having elliptical conductive columns

Semiconductor device

Grid array connection device and method

Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond

Seal ring for hybrid-bond

3D stack of electronic chips

Connector structure and method of forming same

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

Solid-state imaging device including a sensor substrate and a logic substrate

Semiconductor package having reduced internal power pad pitch

Passivation scheme for pad openings and trenches

Methods of forming microelectronic devices having a patterned surface structure

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor device having a passivation layer

Semiconductor device and method

Power semiconductor device with optimized field-plate design

Semiconductor package and methods of manufacturing a semiconductor package

BARRIER LAYER FOR INTERCONNECTS IN 3D INTEGRATED DEVICE

Semiconductor module, electronic component and method of manufacturing a semiconductor module

Wafer Level UGA (UBM Grid Array) & PGA (Pad Grid Array) for Low Cost Package

Info structure with copper pillar having reversed profile

Eutectic bonding with ALGe

Process for manufacturing assembly pads on a carrier for the self-assembly of an electronic circuit on the carrier

Chip package structure

Fabrication method of semiconductor structure

Pad design for reliability enhancement in packages

Micro-connection structure and manufacturing method thereof

Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices

Nickel alloy for semiconductor packaging

Device package with reduced radio frequency losses

High density routing for heterogeneous package integration

Method of manufacturing ring-shaped member and ring-shaped member

Contact photolithography-based nanopatterning using photoresist features having re-entrant profiles

Micro-LED module and method for fabricating the same

Semiconductor devices and semiconductor devices including a redistribution layer

Semiconductor device and method for manufacturing same

Bond structures and the methods of forming the same

Semiconductor device and method of manufacture

Conductive line system and process

Fingerprint sensor device and method

Resin composition

Interconnect structures and methods of forming same

Semiconductor Devices and Methods of Manufacture Thereof

Methods of forming connector pad structures, interconnect structures, and structures thereof

Method for singulating packaged integrated circuits and resulting structures

Display device and method of manufacturing the same

Resin composition

Solderless inter-component joints

Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells

Semiconductor device having multiple gate pads

3D IC package with RDL interposer and related method

Conductive barrier direct hybrid bonding

Manufacturing method for reflowed solder balls and their under bump metallurgy structure

VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM

Light-emitting device

Bond pads with surrounding fill lines

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

Heterogeneous fan-out structure and method of manufacture

Method for manufacturing semiconductor device

Die encapsulation in oxide bonded wafer stack

Bond pad structure for bonding improvement

SEMICONDUCTOR DEVICES COMPRISING METALLIZATIONS COMPOSED OF POROUS COPPER AND ASSOCIATED PRODUCTION METHODS

Polymer resin and compression mold chip scale package

Semiconductor device and method of manufacturing the same

METHOD FOR FABRICATING ELECTRONIC PACKAGE HAVING A SHIELDING LAYER

Semiconductor device with protection layer surrounding a bonding pad

SEMICONDUCTOR DEVICE HAVING A BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Package with solder regions aligned to recesses

Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment

Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system

Electronic product