207783 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto Manufacturing methods
Semiconductor package having a metal barrier
#1802Pillar-last methods for forming semiconductor devices
#1803SEMICONDUCTOR PACKAGE
#1804Interconnect structures for preventing solder bridging, and associated systems and methods
#1805Semiconductor device and method for manufacturing the same
#1806Bonded structures
#1807Semiconductor package with filler particles in a mold compound
#1808Fabrication of high-temperature superconducting striated tape combinations
#1809Semiconductor device
#1810Package structure with a barrier layer and method for forming the same
#1811Semiconductor devices having discretely located passivation material, and associated systems and methods
#1812Semiconductor device and method of manufacturing a semiconductor device
#1813Semiconductor chip and method for forming a chip pad
#1814Display substrate, production method thereof, and display apparatus
#1815Semiconductor device and method of manufacture
#1816Precise Alignment and Decal Bonding of a Pattern of Solder Preforms to a Surface
#1817Semiconductor Package Structure and Semiconductor Package Structure Fabricating Method
#1818Resistive element and method of manufacturing the resistive element
#1819Land pad design for high speed terminals
#1820Method of forming package structure
#1821Method of manufacturing semiconductor package using side molding
#1822Power semiconductor device that includes a copper layer disposed on an electrode and located away from a polyimide layer and method for manufacturing the power semiconductor device
#1823Semiconductor device and a method of manufacturing the same
#1824Semiconductor package with a wire bond mesh
#1825Self-alignment of a pad and ground in an image sensor
#1826Semiconductor apparatus and equipment
#1827Conductor design for integrated magnetic devices
#1828Semiconductor package
#1829Conductive pillar shaped for solder confinement
#1830Semiconductor device with bump structure and method of making semiconductor device
#1831Semiconductor device and manufacturing method of semiconductor device
#1832Pad structure and manufacturing method thereof in semiconductor device
#1833Seal ring for hybrid-bond
#1834Semiconductor device and method of manufacture
#1835Non-embedded silicon bridge chip for multi-chip module
#1836Semifinished product and component carrier
#1837Semiconductor logic device and system and method of embedded packaging of same
#1838Sintered solder for fine pitch first-level interconnect (FLI) applications
#1839Wafer level chip scale package structure and manufacturing method thereof
#1840Multiple plated via arrays of different wire heights on same substrate
#1841Forming metal bonds with recesses
#1842ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
#1843Semiconductor package having reduced internal power pad pitch
#1844Semiconductor device with post passivation structure
#1845Integration and bonding of micro-devices into system substrate
#1846Power semiconductor chip, method for producing a power semiconductor chip, and power semiconductor device
#1847SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND RELATED METHODS
#1848Stacked semiconductor devices and methods of forming same
#18493D Chip-on-wager-on-substrate structure with via last process
#1850Corrosion resistant aluminum bond pad structure
#1851Semiconductor device bonding area including fused solder film and manufacturing method
#1852Micro-connection structure and manufacturing method thereof
#1853Package structure with porous conductive structure and manufacturing method thereof
#1854Package structure and method of fabricating the same
#1855Copper electroplating compositions and methods of electroplating copper on substrates
#1856Copper electroplating compositions and methods of electroplating copper on substrates
#1857Bump bonded cryogenic chip carrier
#1858Semiconductor package for thermal dissipation
#1859Die stack structure with hybrid bonding structure and method of fabricating the same and package
#1860Die stack structure and method of fabricating the same
#1861Optical semiconductor package and method for manufacturing the same
#1862Chip package assembly with enhanced interconnects and method for fabricating the same
#1863Semiconductor device structure and manufacturing method
#1864Method of forming a passivation layer
#1865Method of fabricating integrated fan-out packages
#1866Redistribution circuit structures and methods of forming the same
#1867Semiconductor device and semiconductor device manufacturing method
#1868Alignment marks in substrate having through-substrate via (TSV)
#1869Testing of semiconductor chips with microbumps
#1870Element submount and method for manufacturing the same
#1871Stacked CMOS image sensor
#1872Stacked semiconductor structure and method
#18733D processor
#1874Integrated fan-out package including voltage regulators and methods forming same
#1875Methods for controlling warpage in packaging
#1876Package assembly
#1877Redistribution metal and under bump metal interconnect structures and method
#1878Mechanically anchored C4 pad and method of forming same
#1879Fan-out interconnect integration processes and structures
#1880Electronic apparatus including antennas and directors
#1881Semiconductor package with grounding device and related methods
#1882System and method for bonding package lid
#1883Methods of packaging semiconductor devices including placing semiconductor devices into die caves
#1884High electron mobility transistor (HEMT)
#1885Packages and methods of forming packages
#1886Stacked integrated circuit structure and method of forming
#1887Method of manufacturing semiconductor structure
#1888Bump structure and fabricating method thereof
#1889Chip-on-substrate packaging on carrier
#1890Conductive vias in semiconductor packages and methods of forming same
#1891Multi-chip fan out package and methods of forming the same
#1892Semiconductor apparatus and method for preparing the same
#1893Shaped interconnect bumps in semiconductor devices
#1894Expanded head pillar for bump bonds
#1895Semiconductor copper metallization structure and related methods
#1896Structure and method for semiconductor packaging
#1897Electronic device having cobalt coated aluminum contact pads
#1898Semiconductor device with superior crack resistivity in the metallization system
#1899Industrial chip scale package for microelectronic device
#1900Packages with Si-substrate-free interposer and method forming same
#1901Pre-molded leadframes in semiconductor devices
#1902Die attach surface copper layer with protective layer for microelectronic devices
#1903Integrated circuit packages and methods of forming same
#1904Leadframes in semiconductor devices
#1905Bump bonded cryogenic chip carrier
#1906Package with UBM and methods of forming
#1907Method for forming at least one electrical discontinuity in an integrated circuit, and corresponding integrated circuit
#1908Method for forming a semiconductor package
#1909Semiconductor package
#1910Semiconductor diodes employing back-side semiconductor or metal
#1911SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#1912Package structure and method of manufacturing the same
#1913Chemical mechanical polishing for hybrid bonding
#1914Bonding pad process with protective layer
#1915Semiconductor structure having counductive bump with tapered portions and method of manufacturing the same
#1916Method of forming a semiconductor device comprising top conductive pads
#1917Semiconductor structure and method for forming the same
#1918Semiconductor package device and method of manufacturing the same
#1919Manufacturing method of package structure having conductive shield
#1920Integrated fan-out packages
#1921Interconnect structures and methods for forming same
#1922Edge cut debond using a temporary filler material with no adhesive properties and edge cut debond using an engineered carrier to enable topography
#1923Method for electrical coupling and electric coupling arrangement
#1924Semiconductor chip, method for manufacturing semiconductor chip, integrated circuit device, and method for manufacturing integrated circuit device
#1925Laterally extended conductive bump buffer
#1926Semiconductor die bond pad with insulating separator
#1927Packages with si-substrate-free interposer and method forming same
#1928Method for forming metal wiring
#1929Nanostructure barrier for copper wire bonding
#1930Method of manufacturing micro light-emitting element array, transfer carrier, and micro light-emitting element array
#1931Array substrate
#1932Method for preparing a semiconductor package
#1933High-voltage MOSFET structures
#1934Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
#1935Method of manufacturing semiconductor device
#1936Semiconductor device and manufacturing method of semiconductor device
#1937SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#1938Semiconductor device and method of forming a 3D integrated system-in-package module
#1939SOLDER PAD, SEMICONDUCTOR CHIP COMPRISING SOLDER PAD, AND FORMING METHOD THEREFOR
#1940Semiconductor method for forming semiconductor structure having bump on tilting upper corner surface
#1941Method for fabricating bump structures on chips with panel type process
#1942Semiconductor device and method of forming insulating layers around semiconductor die
#1943Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices
#1944Semiconductor device
#1945SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#1946Wiring substrate and semiconductor device
#1947Structure for standard logic performance improvement having a back-side through-substrate-via
#1948Integrated passive device and fabrication method using a last through-substrate via
#1949Die-on-interposer assembly with dam structure and method of manufacturing the same
#1950Integrated fan-out package, package-on-package structure, and manufacturing method thereof
#1951Semiconductor package and method of manufacturing the same
#1952Hybrid bonding contact structure of three-dimensional memory device
#1953Polymer layers embedded with metal pads for heat dissipation
#1954Semiconductor package structure and manufacturing method thereof
#1955MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#1956Semiconductor package device
#1957Hybrid bonding systems and methods for semiconductor wafers
#1958Solder metallization stack and methods of formation thereof
#1959Semiconductor package device and method of manufacturing the same
#1960Semiconductor package with a heat spreader and method of manufacturing thereof
#1961Methods for forming interconnect assemblies with probed bond pads
#1962A-staged thermoplastic-polyimide (TPI) adhesive compound containing flat inorganic particle fillers and method of use
#1963Semiconductor device and method of manufacturing the same
#1964Flip-chip electronic device with carrier having heat dissipation elements free of solder mask
#1965Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect
#1966Semiconductor chip and method of processing a semiconductor chip
#1967LAND GRID BASED MULTI SIZE PAD PACKAGE
#1968Method of manufacturing an electronics package using device-last or device-almost last placement
#1969Semiconductor device and method for manufacturing the same
#1970Split probe pad structure and method
#1971Semiconductor device and semiconductor element with improved yield
#1972Semiconductor device and a corresponding method of manufacturing semiconductor devices
#1973Semiconductor package and method of forming the same
#1974Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices
#1975Semiconductor device
#1976Printed circuit surface finish, method of use, and assemblies made therefrom
#1977Method for forming bump structure
#1978Semiconductor device and fabrication method of the semiconductor device
#1979Passivation scheme for pad openings and trenches
#1980Packaging devices and methods of manufacture thereof
#1981PACKAGING METHOD AND PACKAGE STRUCTURE FOR FINGERPRINT RECOGNITION CHIP AND DRIVE CHIP
#1982Tall and fine pitch interconnects
#1983Semiconductor package and manufacturing method thereof
#1984Wafer-level packaging for enhanced performance
#1985Non-destructive testing of integrated circuit chips
#1986NON-DESTRUCTIVE TESTING OF INTEGRATED CIRCUIT CHIPS
#1987Method of wafer dicing for wafers with backside metallization and packaged dies
#1988Encapsulated fluid assembly emissive elements
#1989Solid-state image sensing device, manufacturing method, and electronic apparatus
#1990Bump structures for interconnecting focal plane arrays
#1991THREE-DIMENSIONAL INTEGRATED FAN-OUT WAFER LEVEL PACKAGE
#1992Thermal pads between stacked semiconductor dies and associated systems and methods
#1993Lead-free solder joining of electronic structures
#1994Method for producing electronic device with multi-layer contact
#1995Chip package structure and method for forming the same
#1996Semiconductor device with over pad metal electrode and method for manufacturing the same
#1997METHOD TO IMPROVE CMP SCRATCH RESISTANCE FOR NON PLANAR SURFACES
#1998Integrated circuit packages and methods of forming same
#1999Micromechanical component
#2000Low-temperature passivation of ferroelectric integrated circuits for enhanced polarization performance
#2001Packaged die and RDL with bonding structures therebetween
#2002Method for preparing a semiconductor apparatus
#2003Method of forming solder bumps
#2004Bonding pads with thermal pathways
#2005Integrated circuit system with carrier construction configuration and method of manufacture thereof
#2006System and method for an improved interconnect structure
#2007Semiconductor fabrication method thereof
#2008Semiconductor device including a pad and a wiring line arranged for bringing a probe into contact with the pad and method of manufacturing the same
#20093D integration method using SOI substrates and structures produced thereby
#2010Superconducting bump bonds
#2011Semiconductor device manufacturing method and semiconductor device
#2012Ultrathin layer for forming a capacitive interface between joined integrated circuit component
#2013Semiconductor device and method for manufacturing the same
#2014Integrated fan-out packages and methods of forming the same
#2015Power semiconductor device load terminal
#2016Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device
#2017Device Package with Reduced Radio Frequency Losses
#2018Semiconductor device and method for manufacturing semiconductor device
#2019Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect
#2020SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRIBUTED PADS
#2021Bonding pads with thermal pathways
#2022Method of reducing warpage of semiconductor package substrate and device for reducing warpage
#2023Integrated fan-out package structures with recesses in molding compound
#2024Packaging device and method of making the same
#2025Merged power pad for improving integrated circuit power delivery
#2026Semiconductor device with metal structure electrically connected to a conductive structure
#2027Semiconductor device and manufacturing method thereof
#2028Method of manufacturing semiconductor device
#2029Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices
#2030Semiconductor device
#2031Flat metal features for microelectronics applications
#2032A-staged thermoplastic-polyimide (TPI) adhesive compound and method of use
#2033Semiconductor device assembly with die support structures
#2034VIA STRUCTURE, SUBSTRATE STRUCTURE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SAME
#2035Thin 3D die with electromagnetic radiation blocking encapsulation
#2036Die encapsulation in oxide bonded wafer stack
#2037Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
#2038Semiconductor device and manufacture thereof
#2039Semiconductor package and manufacturing method thereof
#2040Solder ball protection in packages
#2041Circuit board incorporating semiconductor IC and manufacturing method thereof
#2042Semiconductor structure having bump on tilting upper corner surface
#20433D integration method using SOI substrates and structures produced thereby
#2044Post-passivation interconnect structure and method of forming the same
#20453D chip sharing data bus circuit
#2046Stacked semiconductor package having mold vias and method for manufacturing the same
#2047Scalable package architecture and associated techniques and configurations
#2048Semiconductor device and manufacturing method thereof
#2049Through-substrate-vias with self-aligned solder bumps
#2050Through-substrate-vias with self-aligned solder bumps
#2051Mixed UBM and mixed pitch on a single die
#2052Electrical device and a method for forming an electrical device
#20533D chip sharing data bus
#2054Semiconductor chip, semiconductor device, and electronic device
#2055Method of making fully molded peripheral package on package device
#2056Termination structure for gallium nitride Schottky diode including junction barriar diodes
#20573DIC formation with dies bonded to formed RDLs
#2058Chip package with sidewall metallization
#2059Semiconductor device and semiconductor device manufacturing method
#2060PACKAGE STRUCTURE HAVING BUMP WITH PROTECTIVE ANTI-OXIDATION COATING
#2061Semiconductor device with post passivation structure and fabrication method therefor
#20623D integration method using SOI substrates and structures produced thereby
#2063Semiconductor device and power amplifier module
#2064Semiconductor device and method of manufacturing the same
#2065Semiconductor devices for integration with light emitting chips and modules thereof
#2066ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
#2067DEVICES AND METHODS RELATED TO ELECTROSTATIC DISCHARGE PROTECTION BENIGN TO RADIO-FREQUENCY OPERATION
#2068Integrated circuit packages and methods for forming the same
#2069Systems and methods for improved delamination characteristics in a semiconductor package
#2070Multiple bond via arrays of different wire heights on a same substrate
#2071Semiconductor structure and manufacturing method thereof
#2072Semiconductor device
#2073METHOD FOR FABRICATING MICROELECTRONIC PACKAGE WITH SURFACE MOUNTED PASSIVE ELEMENT
#2074Packages with Si-substrate-free interposer and method forming same
#2075Manufacturing method of package structure having embedded bonding film
#2076Semiconductor package having exposed redistribution layer features and related methods of packaging and testing
#2077Packaging method and package structure for image sensing chip
#2078System on package architecture including structures on die back side
#2079Monolithic decoupling capacitor between solder bumps
#2080Methods of interconnect for high density 2.5D and 3D integration
#2081Method of forming vias using silicon on insulator substrate
#2082Package structure and method of forming thereof
#2083Eutectic bonding with AlGe
#2084Semiconductor device and method of manufacturing the same
#2085Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#2086Liquid ejection head substrate and semiconductor substrate
#2087Metal bonding pads for packaging applications
#2088Multi-metal contact structure
#2089Semiconductor device and method of manufacturing a semiconductor device
#2090Semiconductor device and method of manufacturing a semiconductor device
#2091Semiconductor device and method of manufacturing a semiconductor device
#2092Manufacturing method of semiconductor device and semiconductor device
#2093Semiconductor package device
#2094VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
#2095Semiconductor device and method of manufacturing the same
#2096Chip package having die structures of different heights and method of forming same
#2097Copper pillar bump structure and manufacturing method therefor
#2098Electronic package and method for manufacturing the same
#2099Semiconductor device and method of packaging
#2100Grid array connection device and method