Semiconductor device and bump formation process

Methods of forming microelectronic structures having a patterned surface structure

Electronic component, transposing component, method for fabricating the electronic component, and method for transposing a micro-element

Process of forming semiconductor apparatus mounting on substrate

HYBRID LOW METAL LOADING FLUX

Micro-LED module and method for fabricating the same

Semiconductor device

Manufacturing method of semiconductor package

Semiconductor device and method for manufacturing the same

Method for building up a fan-out RDL structure with fine pitch line-width and line-spacing

Semiconductor device with contact pad and fabrication method therefore

Semiconductor package with a wire bond mesh

Bond rings in semiconductor devices and methods of forming same

Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods

Semiconductor device including built-in crack-arresting film structure

Interconnect structures and methods of forming same

Conductive barrier direct hybrid bonding

Package with solder regions aligned to recesses

Thin film element and method for manufacturing the same

Semiconductor element and method for production thereof

Method for direct bonding with self-alignment using ultrasound

METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON

Bump-forming film, semiconductor device and manufacturing method thereof, and connection structure

Semiconductor device and method of manufacture

Electronic device interconnections for high temperature operability

Sensor shielding for harsh media applications

Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices

Semiconductor structure with conductive structure

Bond pad protection for harsh media applications

Semiconductor device and method of manufacturing the same

Package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising same

Methods of forming connector pad structures, interconnect structures, and structures thereof

Reliable pad interconnects

Method and structure for wafer level packaging with large contact area

Semiconductor device and manufacturing method thereof

Probe bonding device and probe bonding method using the same

Chip integration module, chip package structure, and chip integration method

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor device and semiconductor device manufacturing method

Chip-on-substrate packaging on carrier

Cured film formed by curing photosensitive resin composition and method for manufacturing same

High speed, high density, low power die interconnect system

Semiconductor device and its manufacturing method

Acoustic wave resonator and method for manufacturing the same

Semiconductor package and method for preparing the same

Semiconductor devices having metal posts for stress relief at flatness discontinuities

Sintered solder for fine pitch first-level interconnect (FLI) applications

Contact hole structure and fabricating method of contact hole and fuse hole

Semiconductor package with embedded MIM capacitor, and method of fabricating thereof

Semiconductor device having through-silicon-via and methods of forming the same

Multi-layer redistribution layer for wafer-level packaging

Packaging assembly and method of making the same

Packaging structure and fabrication method thereof

IR assisted fan-out wafer level packaging using silicon handler

Die sidewall interconnects for 3D chip assemblies

SEMICONDUCTOR DEVICE WITH COPPER MIGRATION STOPPING OF A REDISTRIBUTION LAYER

Corrosion resistant aluminum bond pad structure

Metal cored solder decal structure and process

Info structure with copper pillar having reversed profile

Bond structures and the methods of forming the same

Semiconductor copper metallization structure and related methods

Semiconductor device having a passivation layer and method of making the same

Semiconductor device, electronic component and method

ELECTRONIC DEVICE

Semiconductor device having semiconductor chip with large and small irregularities on upper and lower side surface portions thereof

Chip package

Package structure and method of forming thereof

Film scheme for bumping

Semiconductor wafer and method of ball drop on thin wafer with edge support ring

Method for manufacturing interconnect structure

Semiconductor device structure and method for forming the same

Fingerprint sensor device and method

Hermetically sealed MEMS device and its fabrication

Interconnect structure and method of forming same

Terminal structure of a power semiconductor device

Method for forming at least one electrical discontinuity in an integrated circuit, and corresponding integrated circuit

Manufacturing method of semiconductor device

Semiconductor device packages including an inductor and a capacitor

Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor element having a warped surface and production method thereof

Package structure with inductor and method of forming thereof

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

Transfer head array

Package substrate and associated fabrication method with varying depths for circuit device terminals

Substrate bonding apparatus having adsorption sectors with different vacuum pressures and method of manufacturing semiconductor device using the same

Semiconductor device package and method for forming the same

Semiconductor device and method for manufacturing the same

Bonding pad structure having island portions and method for manufacturing the same

Packaging process of electronic component

Electronic structure

Chip package structure and manufacturing method thereof

Substrateless integrated circuit packages and methods of forming same

Method for manufacturing a semiconductor structure

Method for manufacturing a semiconductor structure

Staged via formation from both sides of chip

Manufacturing method of package-on-package structure

Semiconductor device and method of manufacturing the same

Final passivation for wafer level warpage and ULK stress reduction

Fully molded miniaturized semiconductor module

Conductive line system and process

Method for manufacturing electrode of semiconductor device

Bump structures for interconnecting focal plane arrays

Conductive pillar shaped for solder confinement

Mixed UBM and mixed pitch on a single die

Mixed UBM and mixed pitch on a single die

Wafer laminate and method of producing the same

Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect

Semiconductor device

Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration

Tall and fine pitch interconnects

Method for improving wire bonding strength of an image sensor

Semiconductor device

Wafer level package and method

Wafer level integration including design/co-design, structure process, equipment stress management and thermal management

Integrated fan-out package including voltage regulators and methods forming same

Semiconductor device

Chip alignment utilizing superomniphobic surface treatment of silicon die

Conductive pillar shaped for solder confinement

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCONDUCTIVE CAPPING LAYER

Semiconductor structure and manufacturing method thereof

Microchip with cap layer for redistribution circuitry and method of manufacturing the same

Info structure with copper pillar having reversed profile

Electrical interconnect structure for an embedded electronics package

Electronic device, electronic module and methods for fabricating the same

Method for fabricating a semiconductor package

Method of forming solder bumps

Method of forming solder bumps

Method of forming solder bumps

MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCONDUCTIVE CAPPING LAYER

Pad design for reliability enhancement in packages

Repairing method, manufacturing method, device and electronics apparatus of micro-LED

Semiconductor device and method of manufacturing the same

Package-on-package structure and method

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

Multiple interconnections between die

Semiconductor device and method of forming insulating layers around semiconductor die

Semiconductor package devices and method for forming semiconductor package devices

Post-passivation interconnect structure and methods thereof

Semiconductor device structure and manufacturing method

Conductive pad structure for hybrid bonding and methods of forming same

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor structure having a composite barrier layer

Semiconductor device and method of forming a PoP device with embedded vertical interconnect units

Integrated circuit die and manufacture method thereof

Wafer level semiconductor device with wettable flanks

Method of manufacturing semiconductor device and semiconductor device

Interconnection structure including a metal post encapsulated by a joint material having concave outer surface

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

UBM (under bump metal) electrode structure for radiation detector, radiation detector and production method thereof

Semiconductor copper metallization structure and related methods

Semiconductor devices and methods for forming a semiconductor device

Method for remapping a packaged extracted die

Semiconductor device and method of manufacturing the same

Buffer layer(s) on a stacked structure having a via

POWER SEMICONDUCTOR DEVICE

Semiconductor component, method for processing a substrate and method for producing a semiconductor component

PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT

Semiconductor packaging structure and method

Method of manufacturing semiconductor structure

Method for remapping a packaged extracted die with 3D printed bond connections

CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION

Semiconductor device and manufacturing method thereof

ZN DOPED SOLDERS ON CU SURFACE FINISH FOR THIN FLI APPLICATION

Single-shot encapsulation

Semiconductor assembly and method of making same

Remapped packaged extracted die

Semiconductor device having a large area interconnect or pad

Chip part and manufacturing method thereof

Semiconductor package and method for fabricating the same

Chip package having die structures of different heights

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Pad structure and manufacturing method thereof

Semiconductor structure and manufacturing method thereof

Integrated circuit including wire structure, related method and design structure

Device package including molding compound having non-planar top surface around a die

METHOD FOR FORMING BUMP STRUCTURE

INTEGRATED CIRCUIT CHIP AND DISPLAY DEVICE INCLUDING THE SAME

Molded semiconductor package having an optical inspection feature

Fan-out semiconductor package

Semiconductor structure and manufacturing method thereof

Fan-out package and methods of forming thereof

Under bump metallurgy (UBM) and methods of forming same

Integrated circuit packages and methods for forming the same

DISPLAY DEVICES AND METHODS FOR FORMING THE SAME

Surface finishes for interconnection pads in microelectronic structures

Method for processing an electronic component and an electronic component

SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYER WITH COPPER MIGRATION STOPPING

Conductive connections, structures with such connections, and methods of manufacture

Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods

Semiconductor package and manufacturing method thereof

Chip-on-wafer package and method of forming same

Package assembly

PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT

Enhanced solder pad

Trap layer substrate stacking technique to improve performance for RF devices

Semiconductor devices, methods of manufacture thereof, and semiconductor device packages

Semiconductor device and method of forming build-up interconnect structures over a temporary substrate

Semiconductor chip package with resilient conductive paste post and fabrication method thereof

Scalable package architecture and associated techniques and configurations

Methods of forming multi-die package structures including redistribution layers

Semiconductor device

Bumped land grid array

Bonding film

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE

Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methods

Repackaged integrated circuit assembly method

Semiconductor device including conductive layer and conductive pillar disposed on conductive layer and method of manufacturing the same

Semiconductor device

SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Backside integration of RF filters for RF front end modules and design structure

Semiconductor chip, method for producing a plurality of semiconductor chips and method for producing an electronic or optoelectronic device and electronic or optoelectronic device

3D chip-on-wafer-on-substrate structure with via last process

Semiconductor device with a wire bonding and a sintered region, and manufacturing process thereof

Fan-out semiconductor package

Semiconductor device and manufacturing method thereof

Manufacturing method of semiconductor package

Hybrid bonding systems and methods for semiconductor wafers

Semiconductor devices including conductive pillars

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

Thermal pads between stacked semiconductor dies and associated systems and methods

METHOD FOR PROTECTING BOND PADS FROM CORROSION

Collars for under-bump metal structures and associated systems and methods

Connector formation methods and packaged semiconductor devices

Circular support substrate for semiconductor

Photo-emission semiconductor device and method of manufacturing same

Package structures, pop devices and methods of forming the same

Structure and method of forming a joint assembly

Surface Conditioning And Material Modification In A Semiconductor Device

Polymer resin and compression mold chip scale package

Semiconductor device and method of manufacturing the same

Chip carriers and semiconductor devices including redistribution structures with improved thermal and electrical performance

SEMICONDUCTOR CHIPS HAVING THROUGH SILICON VIAS AND RELATED FABRICATION METHODS AND SEMICONDUCTOR PACKAGES

Device and Method for UBM/RDL Routing

Semiconductor device and a method of manufacturing the same

Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact

Methods for hybrid wafer bonding integrated with CMOS processing

III-V chip preparation and integration in silicon photonics

Barrier layer for interconnects in 3D integrated device

Copper structures with intermetallic coating for integrated circuit chips

Bond pad structure for bonding improvement

Interface substrate and method of making the same

Stacked semiconductor structure and method

Method for forming interconnect structure

Power MOSFET

Semiconductor laser mounting with intact diffusion barrier layer

Power semiconductor contact structure and method for the production thereof

Method for wafer dicing

Multi-layer metal pads

Chip card module, chip card and method of forming a chip card module

Methods and devices for fabricating and assembling printable semiconductor elements

Thermocompression for semiconductor chip assembly

Fabrication method of semiconductor structure

Method for processing an electronic component and an electronic component

Semiconductor packaging with reduced cracking defects

Devices, systems, and methods for ion trapping

3DIC formation with dies bonded to formed RDLs

Method of bonding semiconductor substrates

Interconnect etch with polymer layer edge protection

Contact pad for semiconductor device

Integrated circuits with backside metalization and production method thereof

Semiconductor device having multiple gate pads

Multi-chip fan out package and methods of forming the same

Pre-plated substrate for die attachment

Semiconductor device and manufacturing method thereof

Stacked chip package structure and manufacturing method thereof

STACKED CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Method of manufacturing semiconductor device

Bond pad with micro-protrusions for direct metallic bonding

Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods

IR assisted fan-out wafer level packaging using silicon handler

Integrated system and method of making the integrated system

Chip alignment utilizing superomniphobic surface treatment of silicon die

Signal transmission insulative device and power semiconductor module

EMBEDDED DIE IN PANEL METHOD AND STRUCTURE

Semiconductor structure and fabricating method thereof

Method of manufacturing semiconductor device

Bond rings in semiconductor devices and methods of forming same

INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

Semiconductor devices for integration with light emitting chips and modules thereof

Electronic device and method for producing an electronic device

Interconnect structure and method of forming same

INTEGRATED CIRCUIT PACKAGE USING POLYMER-SOLDER BALL STRUCTURES AND FORMING METHODS

Interconnection structure with confinement layer

Semiconductor device and method of forming low profile fan-out package with vertical interconnection units

System and method for bonding package lid

Methods of packaging semiconductor devices including placing semiconductor devices into die caves

Method for manufacturing electronic component and manufacturing apparatus of electronic component

Semiconductor device having conductive bumps of varying heights

Wafer-level chip-size package with redistribution layer

Electronic component package having electronic component within a frame on a redistribution layer

3D stacked-chip package

Integrated fan-out package including voltage regulators and methods forming same

Method of manufacturing molded semiconductor packages having an optical inspection feature

Semiconductor chip, semiconductor device and manufacturing process for manufacturing the same

Barrier structures between external electrical connectors

Wafer level chip scale package having continuous through hole via configuration and fabrication method thereof

Automated optical inspection of unit specific patterning

Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips