Semiconductor structure having integrated inductor therein

Semiconductor devices with package-level configurability

Fabrication method of semiconductor package with stacked semiconductor chips

Method of forming a solder bump structure

Semiconductor device having a redistribution line

Package on package structure and method for forming the same

Semiconductor package including capping pad having crystal grain of different size

Semiconductor device and method of manufacture

Method of fastening a semiconductor chip on a lead frame, and electronic component

Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump

Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump

Semiconductor element and semiconductor device provided with the same

IMAGING APPARATUS AND METHOD OF MANUFACTURING IMAGING APPARATUS

Semiconductor device

Bonded structures

Redistribution layer metallic structure and method

Semiconductor structure and manufacturing method thereof

Semiconductor package system and method

Co-packaged die on leadframe with common contact

Semiconductor device and method of manufacture

OPTICAL TRNSCEIVER HAVING HEAT DISSIPATION

Method for manufacturing a semiconductor device

Bonding pad layer system, gas sensor and method for manufacturing a gas sensor

Semiconductor module

Semiconductor device and method of manufacturing the same

Patterning polymer layer to reduce stress

Post-passivation interconnect structure

Semiconductor package and antenna module comprising the same

Package structure with bump

Laser processing method

Stacked semiconductor device

Photoelectric conversion device, image pickup system and method of manufacturing photoelectric conversion device

Wafer level integration including design/co-design, structure process, equipment stress management and thermal management

Bonded structures

Semiconductor device for bonding conductive layers exposed from surfaces of respective interconnection layers

Bump-on-trace design for enlarge bump-to-trace distance

Semiconductor device and bump formation process

Packaging devices and methods of manufacture thereof

Method of manufacturing an electronic device comprising a conductive pad on a protruding-through electrode

Integrated passive device and fabrication method using a last through-substrate via

Molded wafer level packaging

System and method for superconducting multi-chip module

Capacitor

Semiconductor device including stack structures having gate pads with different thicknesses

SEMICONDUCTOR PACKAGE

Buffer layer(s) on a stacked structure having a via

Multi-chip modules formed using wafer-level processing of a reconstituted wafer

Pad design for thermal fatigue resistance and interconnect joint reliability

Bowl shaped pad

Solder ball protection in packages

Semiconductor device and method of manufacturing semiconductor device

Fingerprint sensor device and method

Semiconductor device

Display panel including external conductive pad, display apparatus including the same and method of manufacturing the same

Semiconductor memory

SPILT PAD FOR PACKAGE ROUTING AND ELECTRICAL PERFORMANCE IMPROVEMENT

Semiconductor package

Semiconductor package

Electronic device and manufacturing method thereof

Semiconductor devices

Semiconductor devices having a plurality of first and second conductive strips

Semiconductor devices and manufacturing methods of the same

Fan-out semiconductor package

Redistribution metal and under bump metal interconnect structures and method

Metal bumps and method forming same

Methods of forming connector pad structures, interconnect structures, and structures thereof

Multi-metal contact structure in microelectronic component

Semiconductor device and method of manufacturing the same

Bond pad reliability of semiconductor devices

Semiconductor package having a connection structure with tapering connection via layers

Vias with metal caps for underlying conductive lines

SEMICONDUCTOR STRUCTURE HAVING THROUGH SILICON VIA STRUCTURE AND METHOD FOR FORMING THE SAME

Semiconductor packages

Solder-pinning metal pads for electronic components

Light-emitting diode and application therefor

Semiconductor device

Semiconductor device and package assembly including the same

Semiconductor device including interconnection structure including copper and tin and semiconductor package including the same

Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging

Wafer level package (WLP) and method for forming the same

Semiconductor chip fabrication and packaging methods thereof

Semiconductor package and method of fabricating the same

Semiconductor structure and manufacturing method thereof

IR assisted fan-out wafer level packaging using silicon handler

Adhesive for semiconductor device, and high productivity method for manufacturing said device

Contact structures with porous networks for solder connections, and methods of fabricating same

Semiconductor device

Solid-state imaging device and electronic apparatus

Semiconductor device manufacturing method and semiconductor device

Package structure and method of forming the same

Pad structure and manufacturing method thereof in semiconductor device

Energy storing interposer device and manufacturing method

Method of manufacturing substrate structure with filling material formed in concave portion

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Method for manufacturing semiconductor device

Stacked through-silicon vias for multi-device packages

Integrated circuit packages and methods for forming the same

Semiconductor structure with conductive structure

PAD STRUCTURES IN SEMICONDUCTOR DEVICES

Printed circuit surface finish, method of use, and assemblies made therefrom

Multiple band multiple mode transceiver front end flip-chip architecture and circuitry with integrated power amplifiers

Display panel and method of fabricating the same, display device

Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias

Semiconductor package and method of forming the same

Shielded package assemblies with integrated capacitor

Dummy metal with zigzagged edges

Packages with Si-substrate-free interposer and method forming same

Semiconductor structure with conductive structure

Logic drive using standard commodity programmable logic IC chips comprising non-volatile random access memory cells

Structure and formation method of semiconductor device with magnetic element

Embedded memory device and method for embedding memory device in a substrate

Stacked semiconductor structure and method

Electronic device with multi-layer contact and system

Power semiconductor apparatus and fabrication method for the same

Semiconductor device

Serializer-deserializer die for high speed signal interconnect

Bond enhancement structure in microelectronics for trapping contaminants during direct-bonding processes

Hetero-integrated structure

Structure and formation method of semiconductor device with magnetic element covered by polymer material

Method of manufacturing package structure

Packaged semiconductor devices for high voltage with die edge protection

Method of manufacturing wafer level low melting temperature interconnections

Apparatus for bonding substrates having a substrate holder with holding fingers and method of bonding substrates

COMPONENT TERMINATIONS FOR SEMICONDUCTOR PACKAGES

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Active package substrate having anisotropic conductive layer

Semiconductor device

Methods of forming integrated circuit structure for joining wafers and resulting structure

Semiconductor chip

Semiconductor device

Guard ring for photonic integrated circuit die

Conformal dummy die

Plurality of lead frames electrically connected to inductor chip

Stacked semiconductor devices and methods of forming same

Method for manufacturing semiconductor package having redistribution layer

Via structure for packaging and a method of forming

Method of forming a solder bump structure

Scheme for connector site spacing and resulting structures

Method of using a sacrificial conductive stack to prevent corrosion

Device package including molding compound having non-planar top surface around a die and method of forming same

Contact pad for semiconductor device

Method of manufacturing a redistribution layer, redistribution layer and integrated circuit including the redistribution layer

Eutectic bonding with AlGe

Apparatus for communication across a capacitively coupled channel

Semiconductor device including sense insulated-gate bipolar transistor

Package structure and bonding method thereof

Integrated circuit structure having dies with connectors of different sizes

SEMICONDUCTOR DEVICE

Adhesion Enhancing Structures for a Package

Fan-out semiconductor package and electronic device including the same

Integrated circuit component and package structure having the same

Photosensitive resin composition, cured pattern production method, cured product, interlayer insulating film, cover coat layer, surface protective layer, and electronic component

Semiconductor devices with through silicon vias and package-level configurability

Integrated fan-out package and method of fabricating an integrated fan-out package

Stacked integrated circuit structure and method of forming

Semiconductor device, manufacturing method, and solid-state imaging device

POST CMP PROCESSING FOR HYBRID BONDING

Semiconductor device production method

Semiconductor package

Semiconductor device, manufacturing method, and electronic device

PACKAGED SEMICONDUCTOR DEVICE AND METHOD FOR PREPARING THE SAME

Semiconductor structure and manufacturing method thereof

Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect

Heterogeneous fan-out structure and method of manufacture

Multiple sized bump bonds

Semiconductor package and method

Die-on-interposer assembly with dam structure and method of manufacturing the same

PACKAGED INTEGRATED CIRCUIT

Integrated circuit structures

Hybrid bonding with through substrate via (TSV)

Package structure with improvement layer and fabrication method thereof

Packaging structure and forming method thereof

Packaging structure and forming method thereof

Multi-chip integrated fan-out package

Inductor structure for integrated circuit

Inductor structure for integrated circuit

Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus

Bonding package components through plating

Package structure with conductive patterns in a redistribution layer

Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof

Semiconductor device and package including modified region of less density at edge of device or substrate

Package with metal-insulator-metal capacitor and method of manufacturing the same

Crack-resistant semiconductor devices

Post-passivation interconnect structure and method of forming the same

Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus

Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer

Method of manufacturing 3DIC structure

Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices

Chip parts and method for manufacturing the same, circuit assembly having the chip parts and electronic device

Semiconductor device structure and method for forming the same

Non-volatile memory with capacitors using metal under signal line or above a device capacitor

Integrated circuit packages and methods of forming same

Copper electroplating compositions and methods of electroplating copper on substrates

Superconducting bump bonds

Superconducting bump bonds

Methods and devices for fabricating and assembling printable semiconductor elements

Compound semiconductor device

Method of manufacturing a semiconductor device

Structure and method for cooling three-dimensional integrated circuits

Semiconductor device including a circuit for transmitting a signal

Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same

Forming metal bonds with recesses

Bond pads for low temperature hybrid bonding

Structure and method of forming a joint assembly

Semiconductor devices

Semiconductor device with protective protrusion

Method of forming contact holes in a fan out package

Method of providing partial electrical shielding

Method of manufacture of a semiconductor device

Semiconductor structure and method for forming the same

Display device and method for manufacturing the same

Semiconductor element, recording element substrate, and liquid discharge head

Semiconductor structure along with multiple chips bonded through microbump and manufacturing method thereof

Semiconductor device

Method of manufacturing a semiconductor element front side electrode

Semiconductor device and method of forming the same

Fabrication method of packaging structure

Semiconductor device and method for manufacturing semiconductor device

Flat metal features for microelectronics applications

Method for bonding and connecting substrates

Semiconductor device

Die structure, die stack structure and method of fabricating the same

CMOS based devices for harsh media

Micro-transfer-printable flip-chip structures and methods

Through-substrate conductor support

Semiconductor device, manufacturing method thereof, and electronic apparatus

Microelectronics package with vertically stacked dies

Interlayer connection of stacked microelectronic components

Microelectronics package with vertically stacked dies

Semiconductor package and method of manufacturing same

Film scheme for bumping

Semiconductor device and method of forming cantilevered protrusion on a semiconductor die

Hybrid bonding with uniform pattern density

Carrier-foil-attached ultra-thin copper foil

Launch structures for radio frequency integrated device packages

Through-substrate via structure and method of manufacture

Method of forming vias using silicon on insulator substrate

APPARATUSES AND METHODS FOR PIN CAPACITANCE REDUCTION INCLUDING BOND PADS AND CIRCUITS IN A SEMICONDUCTOR DEVICE

FAN-OUT CONNECTIONS OF PROCESSORS ON A PANEL ASSEMBLY

Device with pillar-shaped components

Method for packaging circuits

Method for Bonding an Electrically Conductive Element to a Bonding Partner

Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device

Stacked semiconductor package having mold vias and method for manufacturing the same

Method of manufacturing integrated fan-out package

3DIC structure and method of manufacturing the same

Semiconductor device and manufacture thereof

Method for fabricating the electronic component, and method for transposing a micro-element

Reduction of cross talk in WLCSP's through laser drilled technique

Pre-molded substrate, method of manufacturing pre-molded substrate, and hollow type semiconductor device

Implementation module for stacked connection between isolated circuit components and the circuit thereof

Semiconductor device assembly with heat transfer structure formed from semiconductor material

Stress relieving structure for semiconductor device

Die attach methods and semiconductor devices manufactured based on such methods

Fan-out semiconductor package

Method of manufacturing semiconductor device

Semiconductor device manufacturing method

Semiconductor device and electronic device having a chip size package (CSP)

Bifurcated memory die module semiconductor device

Adhesive bonding composition and method of use

Power management application of interconnect substrates

Packaging mechanisms for dies with different sizes of connectors

Semiconductor package including a redistribution line

Array substrate and method of mounting integrated circuit using the same

Methods of stacking semiconductor dies

Semiconductor device

Semiconductor device and method for manufacturing the same

Contact hole structure and fabricating method of contact hole and fuse hole

Barrier structures between external electrical connectors

METHODS OF COPPER PLATING THROUGH WAFER VIA

Semiconductor device and method of manufacturing thereof

Offset-aligned three-dimensional integrated circuit

System on package architecture including structures on die back side

Fully molded semiconductor package for power devices and method of making the same

Mechanisms for forming post-passivation interconnect structure

Semiconductor device having conductive film

Semiconductor device and method of manufacture

Impedance matching circuit for RF devices and method therefor

Interconnect crack arrestor structure and methods

SEMICONDUCTOR DEVICES AND METHODS OF MAKING THE SAME

Through-substrate vias with improved connections

Stack type power module and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device

Resin-molded electronic device with disconnect prevention

METHOD OF MANUFACTURING DISPLAY APPARATUS, DISPLAY APPARATUS, AND ELECTRONIC APPARATUS

Integrated high voltage capacitor

Nanowire enabled substrate bonding and electrical contact formation

Semiconductor memory device structure

Semiconductor device including semiconductor chip transmitting signals at high speed

Semiconductor device having via sidewall adhesion with encapsulant

Memory device

Reliable passivation for integrated circuits

Systems and methods for improved through-silicon-vias

Transistor level interconnection methodologies utilizing 3D interconnects

Electronic device with common electrode

Apparatuses comprising semiconductor dies in face-to-face arrangements

Metal bonding pads for packaging applications

Metal pillar in a film-type seconductor package