207785 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
Redistribution layer metallic structure and method
#4202SYSTEMS AND METHODS FOR WAFER-LEVEL MANUFACTURING OF DEVICES HAVING LAND GRID ARRAY INTERFACES
#4203Semiconductor device with copper structure
#4204ELECTRONIC DEVICE, SUBSTRATE, AND ELECTRONIC COMPONENT
#4205Semiconductor package system
#4206Dry etch process landing on metal oxide etch stop layer over metal layer and structure formed thereby
#4207Semiconductor device and power amplifier module
#4208Vertical gallium nitride Schottky diode
#4209PACKAGING METHOD AND PACKAGING STRUCTURE FOR SEMICONDUCTOR CHIP
#4210Semiconductor device and electronic apparatus
#42113D integrated circuit (3DIC) structure
#4212Semiconductor chip and semiconductor package including the same
#4213Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#4214Flip chip package utilizing trace bump trace interconnection
#4215Metal pad modification
#4216Semiconductor fabrication apparatus and semiconductor fabrication method
#4217Display device and preparation method therefor
#4218Solderless interconnection structure and method of forming same
#4219Semiconductor packages
#4220Electronic-component-embedded substrate having a wiring line with a roughened surface, electronic component device, and communication module
#4221Semiconductor device and method for manufacturing the same
#4222Semiconductor device
#4223Composite component and mounting structure therefor
#4224Repair method
#4225Signal routing in complex quantum systems
#4226Grid array connection device and method
#4227Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond
#4228EXPOSING CIRCUITRY FOR DIE TESTING
#42293D image sensor
#42303D stack of electronic chips
#4231Connector structure and method of forming same
#4232SEMICONDUCTOR DEVICE
#4233Integrated fan-out package and method of fabricating the same
#4234Electronic device
#4235Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#4236Integrated fan-out package and the methods of manufacturing
#4237Passivation scheme for pad openings and trenches
#4238Methods of forming microelectronic devices having a patterned surface structure
#4239SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#4240Semiconductor device and method
#4241Semiconductor structure with through silicon via and method for fabricating and testing the same
#4242Flexibile interfaces using through-silicon via technology
#4243Power semiconductor device with optimized field-plate design
#4244Semiconductor package and methods of manufacturing a semiconductor package
#4245Methods of manufacturing RF filters
#4246Semiconductor packages and methods of forming same
#4247BARRIER LAYER FOR INTERCONNECTS IN 3D INTEGRATED DEVICE
#4248Semiconductor module, electronic component and method of manufacturing a semiconductor module
#4249Wafer Level UGA (UBM Grid Array) & PGA (Pad Grid Array) for Low Cost Package
#4250Info structure with copper pillar having reversed profile
#4251Eutectic bonding with ALGe
#4252CMOS sensors and methods of forming the same
#4253Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
#4254Chip package structure
#4255MANUFACTURING METHOD OF DIE-STACK STRUCTURE
#4256Fabrication method of semiconductor structure
#4257Micro-connection structure and manufacturing method thereof
#4258Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices
#4259Nickel alloy for semiconductor packaging
#4260Semiconductor device
#4261Electronic substrate and electronic apparatus
#4262Antenna with graded dielectirc and method of making the same
#4263Load sensing devices, packages, and systems
#4264Contact photolithography-based nanopatterning using photoresist features having re-entrant profiles
#4265Back biasing of FD-SOI circuit blocks
#4266Micro-LED module and method for fabricating the same
#4267Methods and systems for improving power delivery and signaling in stacked semiconductor devices
#4268Trace Design for Bump-on-Trace (BOT) Assembly
#4269Semiconductor device modules including a die electrically connected to posts and related methods
#4270Semiconductor devices and semiconductor devices including a redistribution layer
#4271Bond structures and the methods of forming the same
#4272Semiconductor device and method of manufacture
#4273Image sensors with deep silicon etch and related methods
#4274Semiconductor device and semiconductor package including the same
#4275Methods of manufacturing an integrated circuit having stress tuning layer
#4276Semiconductor device with shielding structure for cross-talk reduction
#4277Via for semiconductor device connection and methods of forming the same
#4278Semiconductor device
#4279Conductive line system and process
#4280Semiconductor device having a surface insulating layter and manufacturing method therefor
#4281Fingerprint sensor device and method
#4282Resin composition
#4283Display device
#4284Electronic system having increased coupling by using horizontal and vertical communication channels
#4285Semiconductor package
#4286Semiconductor packages and methods of forming the same
#4287Semiconductor packages
#4288Metal pad modification
#4289Interconnect structures and methods of forming same
#4290Semiconductor Devices and Methods of Manufacture Thereof
#4291Methods of forming connector pad structures, interconnect structures, and structures thereof
#4292Semiconductor package and method of fabricating the same
#4293Increased contact alignment tolerance for direct bonding
#4294Packaged semiconductor devices and methods of packaging thereof
#4295Semiconductor device
#4296Method for singulating packaged integrated circuits and resulting structures
#4297Integrated fan-out package and manufacturing method thereof
#4298Resin composition
#4299Solderless inter-component joints
#4300Logic drive with brain-like elasticity and integrality based on standard commodity FPGA IC chips using non-volatile memory cells
#4301Semiconductor structure and manufacturing method thereof
#4302Interconnect structures with intermetallic palladium joints and associated systems and methods
#4303Hybrid wafer-to-wafer bonding and methods of surface preparation for wafers comprising an aluminum metalization
#4304Conductive barrier direct hybrid bonding
#4305Manufacturing method for reflowed solder balls and their under bump metallurgy structure
#4306VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
#4307Light-emitting device
#4308Apparatus and method related to sensor die ESD protection
#4309Semiconductor device assembly with heat transfer structure formed from semiconductor material
#4310Reducing loss in stacked quantum devices
#4311Bond pads with surrounding fill lines
#4312Semiconductor chips and semiconductor packages including the same
#4313Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
#4314Package with metal-insulator-metal capacitor and method of manufacturing the same
#4315Heterogeneous fan-out structure and method of manufacture
#4316Elastic wave device
#4317Hybrid bond pad structure
#4318Die encapsulation in oxide bonded wafer stack
#4319Wire ball bonding in semiconductor devices
#4320Semiconductor device
#4321Semiconductor device
#4322Bond pad structure for bonding improvement
#4323SEMICONDUCTOR DEVICES COMPRISING METALLIZATIONS COMPOSED OF POROUS COPPER AND ASSOCIATED PRODUCTION METHODS
#4324Polymer resin and compression mold chip scale package
#4325Semiconductor device and method of manufacturing the same
#4326Compound semiconductor device
#4327Semiconductor package including a redistribution line
#4328Circuit for providing electrostatic discharge protection on an integrated circuit and associated method and apparatus
#4329Stacked package including exterior conductive element and a manufacturing method of the same
#4330Semiconductor device with protection layer surrounding a bonding pad
#4331SEMICONDUCTOR DEVICE HAVING A BUMP STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#4332Package with solder regions aligned to recesses
#4333Process for mounting a matrix-array electroluminescent component on a carrier
#4334Semiconductor die having stacking structure of silicon-metallic conductive layer-silicon
#4335High voltage isolation structure and method
#4336Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment
#4337SEMICONDUCTOR PACKAGE
#4338Semiconductor package
#4339Stacked image sensor package and stacked image sensor module including the same
#4340Bonding method of fixing an object to a rough surface
#4341SEMICONDUCTOR PACKAGE WITH EXTERNALLY ACCESSIBLE WIREBONDS
#4342Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system
#4343Methods for bump planarity control
#4344Electronic product
#4345Semiconductor package having a metal barrier
#4346Electronic devices with bond pads formed on a molybdenum layer
#4347Pillar-last methods for forming semiconductor devices
#4348SEMICONDUCTOR PACKAGE
#4349Method of using a sacrificial conductive stack to prevent corrosion
#4350METHODS FOR THERMAL MANAGEMENT IN AMPLIFIERS
#4351Semiconductor device
#4352Chip structure
#4353Designs and methods for conductive bumps
#4354Location displacement detection method, location displacement detection device, and display device
#4355Interconnect structures for preventing solder bridging, and associated systems and methods
#4356Semiconductor device and method for manufacturing the same
#4357Semiconductor device
#4358Radio-frequency isolation cavities and cavity formation
#4359Topside radio-frequency isolation cavity configuration
#4360Method of manufacturing a semiconductor device and a cleaning composition for an adhesive layer
#4361Chip ESD protection circuit
#4362Semiconductor device
#4363Bonding pad architecture using capacitive deep trench isolation (CDTI) structures for electrical connection
#4364Structure with micro device
#4365SEMICONDUCTOR STORAGE CUBE WITH ENHANCED SIDEWALL PLANARITY
#4366SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#4367Package structure with a barrier layer and method for forming the same
#4368Semiconductor devices having discretely located passivation material, and associated systems and methods
#4369Semiconductor device and method of manufacturing a semiconductor device
#4370Semiconductor chip and method for forming a chip pad
#4371Display substrate, production method thereof, and display apparatus
#4372Semiconductor chip
#4373Fan-out semiconductor package
#4374Semiconductor package
#4375Sensor device with carbon nanotube sensor positioned on first and second substrates
#4376Semiconductor device and method of manufacture
#4377Qubit-detector die assemblies
#4378Semiconductor Package Structure and Semiconductor Package Structure Fabricating Method
#4379Selective recess
#4380Packaged RF power amplifier
#4381Resistive element and method of manufacturing the resistive element
#4382Package with support structure
#4383ACCIDENTAL FUSE PROGRAMMING PROTECTION CIRCUITS
#4384Method of manufacturing semiconductor package using side molding
#4385Power semiconductor device that includes a copper layer disposed on an electrode and located away from a polyimide layer and method for manufacturing the power semiconductor device
#4386Semiconductor device and a method of manufacturing the same
#4387Semiconductor element
#4388Crack sensor for sensing cracks in a solder pad, and method for production quality control
#4389SOI wafers with buried dielectric layers to prevent CU diffusion
#4390Semiconductor apparatus
#4391Semiconductor device structures for burn-in testing and methods thereof
#4392Jointing material, fabrication method for semiconductor device using the jointing material, and semiconductor device
#4393Semiconductor device and method of manufacturing the same
#4394Self-alignment of a pad and ground in an image sensor
#4395Semiconductor apparatus and equipment
#4396Semiconductor structure including plurality of chips along with air gap and manufacturing method thereof
#4397System and method for routing signals in complex quantum systems
#4398Conductor design for integrated magnetic devices
#4399Semiconductor package
#4400Semiconductor device with bump structure and method of making semiconductor device
#4401Semiconductor device and method of manufacturing
#4402Semiconductor device and manufacturing method of semiconductor device
#4403Pad structure and manufacturing method thereof in semiconductor device
#4404Semiconductor device and method for manufacturing the same
#4405Semiconductor device and method of manufacture
#4406Semiconductor chip module and semiconductor package including the same
#4407Semiconductor chip and power module, and manufacturing method of the same
#4408Semiconductor apparatus
#4409Interconnect structure with redundant electrical connectors and associated systems and methods
#4410Semifinished product and component carrier
#4411Electronic device and mounting structure of the same
#4412Drive integrated circuit and display device including the same
#4413Sintered solder for fine pitch first-level interconnect (FLI) applications
#4414PACKAGE WITH ISOLATION STRUCTURE
#4415Wafer level chip scale package structure and manufacturing method thereof
#4416Semiconductor device and amplifier assembly
#4417Device isolator with reduced parasitic capacitance
#4418Method of manufacturing a semiconductor device
#4419Semiconductor device
#4420Semiconductor device
#4421Semiconductor package including processor chip and memory chip
#4422Multiple plated via arrays of different wire heights on same substrate
#4423Multi-chip modules formed using wafer-level processing of a reconstituted wafer
#4424Forming metal bonds with recesses
#4425Multi-chip integrated fan-out package
#4426Semiconductor devices and semiconductor packages
#4427ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME
#4428Integration and bonding of micro-devices into system substrate
#4429Electronic element and electronic device comprising the same
#4430Chip, flexible display panel and display device
#4431Power semiconductor chip, method for producing a power semiconductor chip, and power semiconductor device
#4432SEMICONDUCTOR BACKMETAL AND OVER PAD METALLIZATION STRUCTURES AND RELATED METHODS
#4433Semiconductor package and method
#4434Method of making an integrated circuit package including an integrated circuit die soldered to a bond pad of a carrier
#4435Semiconductor package and method
#4436Stacked semiconductor devices and methods of forming same
#4437CMOS sensors and methods of forming the same
#4438SEMICONDUCTOR PACKAGE
#4439Integrated fan-out package and method of fabricating an integrated fan-out package
#4440Microelectronic device stacks having interior window wirebonding
#4441Conductive paste and die bonding method
#4442Detection of foreign particles during wire bonding
#4443Package structure and manufacturing method thereof
#4444SEMICONDUCTOR DEVICE
#4445Corrosion resistant aluminum bond pad structure
#4446Semiconductor device bonding area including fused solder film and manufacturing method
#4447Micro-connection structure and manufacturing method thereof
#4448Package structures
#4449Method of manufacturing semiconductor device and semiconductor device
#4450Package structure and method of manufacturing the same
#4451Integrated fan-out package and manufacturing method thereof
#4452Package structure and method of fabricating the same
#4453Copper electroplating compositions and methods of electroplating copper on substrates
#4454Two-component bump metallization
#4455Bump bonded cryogenic chip carrier
#4456Package structure and manufacturing method thereof
#4457Semiconductor package for thermal dissipation
#4458Die stack structure and method of fabricating the same
#4459Fabrication method of high aspect ratio solder bumping with stud bump and injection molded solder, and flip chip joining with the solder bump
#4460Chip package assembly with enhanced interconnects and method for fabricating the same
#4461Semiconductor device structure and manufacturing method
#4462Package on package structure and method for forming the same
#4463Semiconductor package assembly
#4464Semiconductor package
#4465Semiconductor device
#4466Semiconductor device and semiconductor device manufacturing method
#4467Alignment marks in substrate having through-substrate via (TSV)
#4468Testing of semiconductor chips with microbumps
#4469Flip chip amplifier for wireless device
#4470Stacked CMOS image sensor
#4471Ultra-dense LED projector
#4472Package-on-package (PoP) structure including stud bulbs
#4473Stacked semiconductor structure and method
#4474Mechanisms for forming hybrid bonding structures with elongated bumps
#4475Package assembly
#4476Semiconductor device suppressing an inclination of a semiconductor element after solder bonding
#4477Bump on pad (BOP) bonding structure in semiconductor packaged device
#4478Redistribution metal and under bump metal interconnect structures and method
#4479Semiconductor structure and method for manufacturing the same
#4480Mechanically anchored C4 pad and method of forming same
#4481Method and apparatus of ESD protection in stacked die semiconductor device
#4482Semiconductor structure
#4483Semiconductor package
#4484Power distribution network of integrated circuit
#4485Semiconductor die contact structure and method
#4486Dummy metal with zigzagged edges
#4487Package with tilted interface between device die and encapsulating material
#4488System and method for bonding package lid
#4489Film for package substrate, semiconductor package, display device, and methods of fabricating the film, the semiconductor package, the display device
#4490Methods of packaging semiconductor devices including placing semiconductor devices into die caves
#4491Method of yield prejudgment and bump re-assignment and computer readable storage medium
#4492JOINT STRUCTURE, ELECTRONIC COMPONENT MODULE, ELECTRONIC COMPONENT UNIT, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT UNIT
#4493Semiconductor device having first and second electrode layers electrically disconnected from each other by a slit
#4494High electron mobility transistor (HEMT)
#4495Semiconductor device
#4496Stacked integrated circuit structure and method of forming
#4497Bump structure and fabricating method thereof
#4498High speed semiconductor device with noise reduction wiring pattern
#4499Chip package structure and method for manufacturing the same
#4500Package structures and methods of forming the same