207785 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
Power MOSFET device and manufacturing process thereof
#4502Semiconductor structure having integrated inductor therein
#4503Multi-chip fan out package and methods of forming the same
#4504Semiconductor apparatus and method for preparing the same
#4505Shaped interconnect bumps in semiconductor devices
#4506Expanded head pillar for bump bonds
#4507Method and apparatus for forming backside die planar devices and saw filter
#4508Semiconductor copper metallization structure and related methods
#4509Structure and method for semiconductor packaging
#4510Electronic device having cobalt coated aluminum contact pads
#4511Semiconductor device with superior crack resistivity in the metallization system
#4512Industrial chip scale package for microelectronic device
#4513Chip packages with sintered interconnects formed out of pads
#4514Pre-molded leadframes in semiconductor devices
#4515Semiconductor die assemblies with heat sink and associated systems and methods
#4516Leadframes in semiconductor devices
#4517Testing architecture of circuits integrated on a wafer
#4518Two-component bump metallization
#4519Bump bonded cryogenic chip carrier
#4520Semiconductor packages and methods of forming the same
#4521Package with UBM and methods of forming
#4522Method for forming a semiconductor package
#4523Semiconductor package
#4524Semiconductor diodes employing back-side semiconductor or metal
#4525SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#4526Chemical mechanical polishing for hybrid bonding
#4527METHOD FOR PREPARING A SEMICONDUCTOR STRUCTURE
#4528Bonding pad process with protective layer
#4529Integrated circuit packages
#4530Semiconductor structure having counductive bump with tapered portions and method of manufacturing the same
#4531Method of forming a semiconductor device comprising top conductive pads
#4532Semiconductor structure and method for forming the same
#4533Semiconductor package device and method of manufacturing the same
#4534Via architecture for increased density interface
#4535Method for manufacturing package structure having elastic bump
#4536Semiconductor device and method
#4537Dense redistribution layers in semiconductor packages and methods of forming the same
#4538Semiconductor device and method for fabricating the same
#4539Interconnect structures and methods for forming same
#4540Integrated circuit stacking approach
#4541METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#4542Wire bonding tool including a wedge tool
#4543Semiconductor chip, method for manufacturing semiconductor chip, integrated circuit device, and method for manufacturing integrated circuit device
#4544"Lead-Free Solder Ball"
#4545Laterally extended conductive bump buffer
#4546Via structure for packaging and a method of forming
#4547Spoked solder pad to improve solderability and self-alignment of integrated circuit packages
#4548Semiconductor die bond pad with insulating separator
#4549Semiconductor package structure
#4550Semiconductor device with copper corrosion inhibitors
#4551Package structure having integrated circuit component with conductive terminals of different dimensions
#4552Micro-transfer-printable flip-chip structures and methods
#4553Thermosonically bonded connection for flip chip packages
#4554Nanostructure barrier for copper wire bonding
#4555CONNECTION STRUCTURE AND MANUFACTURING METHOD THEREOF, AND SENSOR
#4556Array substrate
#4557Method for preparing a semiconductor package
#4558Memory device
#4559High-voltage MOSFET structures
#4560Semiconductor device and manufacturing method of semiconductor device
#4561Semiconductor device
#4562Silicon carbide semiconductor device having a step film formed between a plating film and a first electrode
#4563Semiconductor device and method of forming a 3D integrated system-in-package module
#4564Integrated fan-out stacked package with fan-out redistribution layer (RDL)
#4565Post-passivation interconnect structure
#4566Semiconductor method for forming semiconductor structure having bump on tilting upper corner surface
#4567Interconnect structure of three-dimensional memory device
#4568Method for fabricating bump structures on chips with panel type process
#4569Semiconductor device and method of forming insulating layers around semiconductor die
#4570Device module having a plurality of dies electrically connected by posts
#4571Electronic component including a conductive pillar and method of manufacturing the same
#4572Multi-pin-wafer-level-chip-scale-packaging solution for high power semiconductor devices
#4573Semiconductor device
#4574SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#4575Structure for standard logic performance improvement having a back-side through-substrate-via
#4576FINE PITCH AND SPACING INTERCONNECTS WITH RESERVE INTERCONNECT PORTION
#4577Semiconductor package and manufacturing method thereof
#4578Integrated passive device and fabrication method using a last through-substrate via
#4579Die-on-interposer assembly with dam structure and method of manufacturing the same
#4580Integrated fan-out package
#4581Semiconductor package and method of manufacturing the same
#4582Mask assembly and method for fabricating a chip package
#4583Package structure of fingerprint identification chip
#4584Polymer layers embedded with metal pads for heat dissipation
#4585MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#4586Semiconductor package device
#4587SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
#4588Hybrid bonding systems and methods for semiconductor wafers
#4589Wire bond connection with intermediate contact structure
#4590Solder metallization stack and methods of formation thereof
#4591Semiconductor devices having discretely located passivation material, and associated systems and methods
#4592Semiconductor package with a heat spreader and method of manufacturing thereof
#4593Methods for forming interconnect assemblies with probed bond pads
#4594Semiconductor device and method of manufacturing the same
#4595Semiconductor chip including a plurality of pads
#4596Semiconductor device and method of forming WLCSP
#4597Semiconductor module and method for manufacturing the same
#4598Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect
#4599Power electronics assembly having an adhesion layer, and method for producing said assembly
#4600Semiconductor chip and method of processing a semiconductor chip
#4601LAND GRID BASED MULTI SIZE PAD PACKAGE
#4602Interchip backside connection
#4603Semiconductor device and method for manufacturing the same
#4604Semiconductor device and semiconductor element with improved yield
#4605Semiconductor packages and methods of forming same
#4606Soldering a conductor to an aluminum metallization
#4607Methods of making semiconductor device modules with increased yield
#4608Measuring device
#4609Semiconductor device
#4610Semiconductor device and a corresponding method of manufacturing semiconductor devices
#4611Semiconductor device and method of forming a curved image sensor
#46123D integrated circuit and methods of forming the same
#4613Direct substrate to solder bump connection for thermal management in flip chip amplifiers
#4614Semiconductor package and method of forming the same
#4615SEMICONDUCTOR DEVICES
#4616Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devices
#4617Semiconductor device
#4618Printed circuit surface finish, method of use, and assemblies made therefrom
#4619Package structure of fingerprint identification chip
#4620Semiconductor device with photonic and electronic functionality and method for manufacturing a semiconductor device
#4621Semiconductor die having stacking structure of silicon-metallic conductive layer-silicon
#4622Semiconductor device including a buffer layer structure for reducing stress
#4623Method for forming bump structure
#4624Passivation scheme for pad openings and trenches
#4625Packaging devices and methods of manufacture thereof
#4626Fingerprint chip package and method for processing same
#4627PACKAGING METHOD AND PACKAGE STRUCTURE FOR FINGERPRINT RECOGNITION CHIP AND DRIVE CHIP
#4628Interconnect structures with intermetallic palladium joints and associated systems and methods
#4629Wire bonding systems and related methods
#4630Embedded die package multichip module
#4631Tall and fine pitch interconnects
#4632Conductive ball and electronic device
#4633Semiconductor device and method of forming micro interconnect structures
#4634Stacked semiconductor device structure and method
#4635Electronic component device
#4636Passivation layer having opening for under bump metallurgy
#4637Wafer-level packaging for enhanced performance
#4638Wafer-level packaging for enhanced performance
#4639Method of wafer dicing for wafers with backside metallization and packaged dies
#4640Apparatus comprising a semiconductor arrangement
#4641Semiconductor device and semiconductor module
#4642Solid-state image sensing device, manufacturing method, and electronic apparatus
#4643Bump structures for interconnecting focal plane arrays
#4644THREE-DIMENSIONAL INTEGRATED FAN-OUT WAFER LEVEL PACKAGE
#4645Semiconductor device and manufacturing method thereof
#4646Lead-free solder joining of electronic structures
#4647Method for producing electronic device with multi-layer contact
#4648Chip package structure and method for forming the same
#4649Metal pad modification
#4650Semiconductor device with over pad metal electrode and method for manufacturing the same
#4651METHOD TO IMPROVE CMP SCRATCH RESISTANCE FOR NON PLANAR SURFACES
#4652High-power amplifier package
#4653Semiconductor device having bonding regions exposed through protective films provided on circuit patterns onto which components are soldered
#4654Power semiconductor device and method for manufacturing power semiconductor device
#4655Method of manufacture of a semiconductor device
#4656Offset test pads for WLCSP final test
#4657Multi-chip structure and method of forming same
#4658Semiconductor device
#4659SEMICONDUCTOR COMPONENT HAVING AN ESD PROTECTION DEVICE
#4660Low-temperature passivation of ferroelectric integrated circuits for enhanced polarization performance
#4661Packaged die and RDL with bonding structures therebetween
#4662Method for preparing a semiconductor apparatus
#4663Method of forming solder bumps
#4664Bonding pads with thermal pathways
#4665Integrated circuit system with carrier construction configuration and method of manufacture thereof
#4666System and method for an improved interconnect structure
#4667Semiconductor fabrication method thereof
#4668Wafer level package (WLP) and method for forming the same
#4669Semiconductor device including a pad and a wiring line arranged for bringing a probe into contact with the pad and method of manufacturing the same
#4670Electronic device including redistribution layer pad having a void
#4671Superconducting bump bonds
#4672Inductors for chip to chip near field communication
#4673Solid state image sensor and manufacturing method thereof
#4674Multi-chip modules formed using wafer-level processing of a reconstitute wafer
#4675Using an interconnect bump to traverse through a passivation layer of a semiconductor die
#4676Semiconductor package including bump
#4677Power semiconductor device load terminal
#4678Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device
#4679Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect
#4680Integrated circuit package with pre-wetted contact sidewall surfaces
#4681SEMICONDUCTOR PACKAGE INCLUDING A SEMICONDUCTOR DIE HAVING REDISTRIBUTED PADS
#4682Micro device integration into system substrate
#4683MICRO DEVICE INTEGRATION INTO SYSTEM SUBSTRATE
#4684Display panel including external conductive pad, display apparatus including the same and method of manufacturing the same
#4685Semiconductor package having a plurality of chips and method of manufacturing the same
#4686ELECTRONIC DEVICE, ELECTRONIC DEVICE MANUFACTURING METHOD, AND ELECTRONIC APPARATUS
#4687Bonding pads with thermal pathways
#4688Electronic packaging structure
#4689Method of reducing warpage of semiconductor package substrate and device for reducing warpage
#4690Semiconductor device
#46913D chip sharing clock interconnect layer
#4692Integrated fan-out package structures with recesses in molding compound
#4693Packaging device and method of making the same
#4694Semiconductor device with metal structure electrically connected to a conductive structure
#4695Semiconductor device and manufacturing method thereof
#4696Method of manufacturing semiconductor device
#4697Fan-out semiconductor device
#4698Localized high density substrate routing
#4699Through-substrate via structure and method of manufacture
#4700Method and fixture for chip attachment to physical objects
#4701INVERSION-TYPE PACKAGE STRUCTURE FOR FLIP CHIP AND FLIP CHIP HAVING THE SAME
#4702Flat metal features for microelectronics applications
#4703Semiconductor device package with a conductive post
#4704METHOD OF FORMING SURFACE PROTRUSIONS ON AN ARTICLE AND THE ARTICLE WITH THE PROTRUSIONS ATTACHED
#4705METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING CONDUCTIVE ADHESIVE AND SEMICONDUCTOR DEVICE FABRICATED BY THE SAME
#4706Integrated circuit comprising at least an integrated antenna
#4707Semiconductor device assembly with die support structures
#4708Semiconductor package and method of forming the same
#4709VIA STRUCTURE, SUBSTRATE STRUCTURE INCLUDING THE SAME, AND METHOD FOR MANUFACTURING THE SAME
#4710Thin 3D die with electromagnetic radiation blocking encapsulation
#4711Fan-out semiconductor package and electronic device including the same
#4712Die bond pad design to enable different electrical configurations
#4713Die encapsulation in oxide bonded wafer stack
#4714Semiconductor devices, methods of manufacture thereof, and packaged semiconductor devices
#4715Combing bump structure and manufacturing method thereof
#4716Fan-out structure and manufacture thereof
#4717Semiconductor device and manufacture thereof
#4718Semiconductor package and manufacturing method thereof
#4719Solder ball protection in packages
#4720Semiconductor chip, and fabrication and packaging methods thereof
#4721Semiconductor structure having bump on tilting upper corner surface
#4722Post-passivation interconnect structure and method of forming the same
#4723Semiconductor structures and fabrication methods thereof
#4724Power module with improved reliability
#4725Pad structure for front side illuminated image sensor
#4726Stacked semiconductor package having mold vias and method for manufacturing the same
#4727ELECTRICAL COMPONENT WITH THIN SOLDER RESIST LAYER AND METHOD FOR THE PRODUCTION THEREOF
#4728Semiconductor device and manufacturing method thereof
#4729Through-substrate-vias with self-aligned solder bumps
#4730Through-substrate-vias with self-aligned solder bumps
#4731Mixed UBM and mixed pitch on a single die
#4732Semiconductor package system and method
#4733Fan-out semiconductor package
#4734Electrical device and a method for forming an electrical device
#4735Semiconductor device with first and second semiconductor chips connected to insulating element
#4736Semiconductor chip, semiconductor device, and electronic device
#47373D chip sharing power interconnect layer
#4738Method of making fully molded peripheral package on package device
#4739Termination structure for gallium nitride Schottky diode including junction barriar diodes
#4740Fabrication and use of through silicon vias on double sided interconnect device
#4741Chip package with sidewall metallization
#4742Dam for three-dimensional integrated circuit
#4743Semiconductor device and semiconductor device manufacturing method
#4744PACKAGE STRUCTURE HAVING BUMP WITH PROTECTIVE ANTI-OXIDATION COATING
#4745SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#4746Semiconductor device and method of manufacturing the same
#4747Wafer level dicing method and semiconductor device
#4748Method for manufacturing semiconductor device including heating and pressuring a laminate having an adhesive layer
#4749Semiconductor device and power amplifier module
#4750Semiconductor device and method of manufacturing the same
#4751Manufacturing method of semiconductor structure
#4752ADDING CAP TO COPPER PASSIVATION FLOW FOR ELECTROLESS PLATING
#4753Fan-out semiconductor package
#4754Semiconductor device
#4755SEMICONDUCTOR DEVICE
#4756DEVICES AND METHODS RELATED TO ELECTROSTATIC DISCHARGE PROTECTION BENIGN TO RADIO-FREQUENCY OPERATION
#4757Integrated circuit packages and methods for forming the same
#4758Multiple bond via arrays of different wire heights on a same substrate
#4759Semiconductor device including solder bracing material with a rough surface, and manufacturing method thereof
#4760Semiconductor device
#4761Backside substrate openings in transistor devices
#4762Fan-out wafer level package with resist vias
#4763Semiconductor device and ball bonder
#4764Semiconductor device
#4765Semiconductor package having exposed redistribution layer features and related methods of packaging and testing
#4766Semiconductor device and solid-state imaging device
#4767Sacrificial alignment ring and self-soldering vias for wafer bonding
#4768System on package architecture including structures on die back side
#4769Methods of interconnect for high density 2.5D and 3D integration
#4770Plurality of semiconductor devices encapsulated by a molding material attached to a redistribution layer
#4771Method of forming vias using silicon on insulator substrate
#4772Method of forming semiconductor device having a dual material redistribution line
#4773Eutectic bonding with AlGe
#4774Semiconductor device having a surface insulator layer and manufacturing method therefor
#4775Semiconductor device and method of manufacturing the same
#4776Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#4777FLEXIBLE DISPLAY PANELS AND THE MANUFACTURING METHODS THEREOF
#4778Wafer level chip scale filter packaging using semiconductor wafers with through wafer vias
#4779SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#4780Method of manufacturing semiconductor device
#4781Injection molded solder bumping
#4782Thermal bonding sheet and thermal bonding sheet with dicing tape
#4783Liquid ejection head substrate and semiconductor substrate
#4784Integrated package assembly for switching regulator
#4785Semiconductor optical element and method for manufacturing the same
#4786Adjustable losses on bond wire arrangement
#4787Semiconductor device with multiple substrates electrically connected through an insulating film
#4788Method of embedding WLCSP components in E-WLB and E-PLB
#4789System-in-package with double-sided molding
#4790Semiconductor device and method for manufacturing the same
#4791Metal bonding pads for packaging applications
#4792Multi-metal contact structure
#4793Semiconductor device and method of manufacturing a semiconductor device
#4794Semiconductor device and method of manufacturing a semiconductor device
#4795Semiconductor device and method of manufacturing a semiconductor device
#4796Manufacturing method of semiconductor device and semiconductor device
#4797Semiconductor device and manufacturing method thereof
#4798Sensor package and manufacturing method thereof
#4799VISIBILITY EVENT NAVIGATION METHOD AND SYSTEM
#4800Composition for removing silicone resins and method of thinning substrate by using the same