207785 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
Memory device
#4802Fabrication method of semiconductor package with stacked semiconductor chips
#4803Semiconductor device and method of manufacturing the same
#4804Pad structure and integrated circuit die using the same
#4805SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#4806Method of manufacturing a semiconductor device
#4807Semiconductor device and method of forming WLCSP
#4808Electronic assembly using bismuth-rich solder
#4809Copper pillar bump structure and manufacturing method therefor
#4810Electronic package and method for manufacturing the same
#4811Semiconductor device and method of packaging
#4812Semiconductor module
#4813Semiconductor device and method for manufacturing the same
#4814Semiconductor device
#4815Grid array connection device and method
#4816Semiconductor device and bump formation process
#4817Methods of forming microelectronic structures having a patterned surface structure
#4818High power gallium nitride devices and structures
#4819Acoustic wave device
#4820Semiconductor device
#4821Electronic device by laser-induced forming and transfer of shaped metallic interconnects
#4822Semiconductor package and manufacturing method thereof
#4823Electronic component, transposing component, method for fabricating the electronic component, and method for transposing a micro-element
#4824Compound semiconductor substrate and power amplifier module
#4825Method of forming contact holes in a fan out package
#4826Mechanisms for forming metal-insulator-metal (MIM) capacitor structure
#4827SEMICONDUCTOR DEVICE AND METHOD OF FORMING CANTILEVERED PROTRUSION ON A SEMICONDUCTOR DIE
#4828Package structure
#4829HYBRID LOW METAL LOADING FLUX
#4830Micro-LED module and method for fabricating the same
#4831Semiconductor device
#4832Semiconductor package with rigid under bump metallurgy (UBM) stack
#4833Manufacturing method of semiconductor package
#4834Semiconductor device and method for manufacturing the same
#4835Semiconductor device with contact pad and fabrication method therefore
#4836Semiconductor package assembly
#4837RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE
#4838Semiconductor device
#4839Semiconductor storage device
#4840Fan-out semiconductor package
#4841Integrated ESD event sense detector
#4842Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#4843Integrated circuit structures with recessed conductive contacts for package on package
#4844Method for preparing a semiconductor apparatus
#4845Bonded structures
#4846Semiconductor device including built-in crack-arresting film structure
#4847Interconnect structures and methods of forming same
#4848Package with solder regions aligned to recesses
#4849Thin film element and method for manufacturing the same
#4850Forming bonding structures by using template layer as templates
#4851Package structure and manufacturing method thereof
#4852Semiconductor element and method for production thereof
#4853Wrap-around source/drain method of making contacts for backside metals
#4854Method for direct bonding with self-alignment using ultrasound
#4855METAL BOND PAD WITH COBALT INTERCONNECT LAYER AND SOLDER THEREON
#4856Bump-forming film, semiconductor device and manufacturing method thereof, and connection structure
#4857Semiconductor device and method of manufacture
#4858Electronic device interconnections for high temperature operability
#4859Semiconductor device and method of manufacturing the same
#4860Backside redistribution layer (RDL) structure
#4861Sensor shielding for harsh media applications
#4862Semiconductor devices including through-silicon-vias and methods of manufacturing the same and semiconductor packages including the semiconductor devices
#4863High power gallium nitride devices and structures
#4864Semiconductor structure with conductive structure
#4865Bond pad protection for harsh media applications
#4866Semiconductor device and method of manufacturing the same
#4867Solution deposited magnetically guided chiplet displacement
#4868Package substrate comprising side pads on edge, chip stack, semiconductor package, and memory module comprising same
#4869SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#4870Methods of forming connector pad structures, interconnect structures, and structures thereof
#4871Reliable pad interconnects
#4872Thin 3D die with electromagnetic radiation blocking encapsulation
#4873Method and structure for wafer level packaging with large contact area
#4874Package with metal-insulator-metal capacitor and method of manufacturing the same
#4875Method of manufacturing a semiconductor device and a cleaning composition for an adhesive layer
#4876Stacked semiconductor device
#4877Front-side emitting mid-infrared light emitting diode
#4878Advanced node cost reduction by ESD interposer
#4879Chip integration module, chip package structure, and chip integration method
#4880Semiconductor device and semiconductor device manufacturing method
#4881Package with tilted interface between device die and encapsulating material
#4882Semiconductor device with sealing portion to suppress connection corrosion
#4883Cured film formed by curing photosensitive resin composition and method for manufacturing same
#4884Integrated fan-out stacked package with fan-out redistribution layer (RDL)
#4885Fan-out semiconductor package
#4886Semiconductor device with frame having arms and related methods
#4887Semiconductor device and its manufacturing method
#4888Acoustic wave resonator and method for manufacturing the same
#4889Interconnect structures with intermetallic palladium joints and associated systems and methods
#4890Semiconductor devices having metal posts for stress relief at flatness discontinuities
#4891Semiconductor device and manufacturing method therefor
#4892Sintered solder for fine pitch first-level interconnect (FLI) applications
#4893Contact hole structure and fabricating method of contact hole and fuse hole
#4894Fan-out semiconductor package
#4895High-frequency module
#4896Bonded structures with integrated passive component
#4897Semiconductor device having through-silicon-via and methods of forming the same
#4898Array substrate and method of mounting integrated circuit using the same
#4899Semiconductor device including plural semiconductor chips
#4900Electronic device and mounting structure of the same
#4901Semiconductor device and manufacturing method for semiconductor device
#4902Packaging assembly and method of making the same
#4903Semiconductor device and method of forming cantilevered protrusion on a semiconductor die
#4904Packaging structure and fabrication method thereof
#4905IR assisted fan-out wafer level packaging using silicon handler
#4906Microelectronic assembly from processed substrate
#4907Semiconductor device having a protruding interposer edge face
#4908Semiconductor device manufacturing method
#4909SEMICONDUCTOR DEVICE WITH COPPER MIGRATION STOPPING OF A REDISTRIBUTION LAYER
#4910Corrosion resistant aluminum bond pad structure
#4911Metal cored solder decal structure and process
#4912Info structure with copper pillar having reversed profile
#4913Light emitting element
#4914Semiconductor device and electronic device having a chip size package (CSP) stack
#4915IMAGING DEVICE, MANUFACTURING METHOD, AND ELECTRONIC DEVICE
#4916SEMICONDUCTOR PACKAGE
#4917Bond structures and the methods of forming the same
#4918Semiconductor copper metallization structure and related methods
#4919Semiconductor device, electronic component and method
#4920FLIP-CHIP PACKAGING DIODE WITH A MULTICHIP STRUCTURE
#4921Scanning methods for focus control for lithographic processing of reconstituted wafers
#4922Display and repair method thereof
#4923Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus
#4924Semiconductor device and method
#4925Method for electrically contacting a component by galvanic connection of an open-pored contact piece, and corresponding component module
#4926Semiconductor structure and fabrication method thereof
#4927Display apparatus
#4928Film scheme for bumping
#4929Semiconductor wafer and method of ball drop on thin wafer with edge support ring
#4930Semiconductor device structure and method for forming the same
#4931Method of fabricating redistribution circuit structure
#4932Package structure and method for forming the same
#4933High thermal conductivity vias by additive processing
#4934Integrated circuit nanoparticle thermal routing structure in interconnect region
#4935Accidental fuse programming protection circuits
#4936Fingerprint sensor device and method
#4937Hermetically sealed MEMS device and its fabrication
#4938Interconnect structure and method of forming same
#4939Terminal structure of a power semiconductor device
#4940Through via structure and method
#4941Manufacturing method of semiconductor device
#4942Semiconductor device including sense insulated-gate bipolar transistor
#4943Semiconductor device packages including an inductor and a capacitor
#4944Photoelectric conversion device, image pickup system and method of manufacturing photoelectric conversion device
#4945Semiconductor device, manufacturing method, solid state image sensor, and electronic equipment
#4946Semiconductor packages with leadframes and related methods
#4947Semiconductor chip
#4948SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#4949Semiconductor element having a warped surface and production method thereof
#4950Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers
#4951Semiconductor devices and methods of making the same
#4952Package structures and methods of forming the same
#4953Bonding wire for semiconductor device
#4954Electronic system having increased coupling by using horizontal and vertical communication channels
#49553D-joining of microelectronic components with conductively self-adjusting anisotropic matrix
#4956High-frequency circuit
#4957Bonding wire for semiconductor device
#4958SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC ELEMENT MODULE USING THE SAME
#4959Active chip on carrier or laminated chip having microelectronic element embedded therein
#4960Separation of integrated circuit structure from adjacent chip
#4961Implementation method for stacked connection between isolated circuit components and the circuit thereof
#4962Integrated circuit module and method of forming same
#4963Semiconductor device package and method for forming the same
#4964Semiconductor device and method for manufacturing the same
#4965Bonding pad structure having island portions and method for manufacturing the same
#4966Semiconductor device and semiconductor package including the same
#4967Electronic structure
#4968Semiconductor package
#4969Semiconductor package and method of fabricating semiconductor package
#4970Substrateless integrated circuit packages and methods of forming same
#4971Method for manufacturing a semiconductor structure
#4972Method for manufacturing a semiconductor structure
#4973Staged via formation from both sides of chip
#4974Method of manufacturing semiconductor package
#4975Semiconductor device
#4976Semiconductor device and method of manufacturing the same
#4977Chip parts and method for manufacturing the same, circuit assembly having the chip parts and electronic device
#4978Final passivation for wafer level warpage and ULK stress reduction
#4979Semiconductor device and manufacturing method thereof
#4980Cavity formation in backside interface layer for radio-frequency isolation
#4981Fully molded miniaturized semiconductor module
#4982Conductive line system and process
#4983CHIP PACKAGING STRUCTURE AND PACKAGING METHOD
#4984METHOD OF FORMING AN INTERPOSER AND A METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#4985Bump structures for interconnecting focal plane arrays
#4986Electronic system having increased coupling by using horizontal and vertical communication channels
#4987Semiconductor package including stacked semiconductor chips electrically connected to redistribution layers
#4988Mixed UBM and mixed pitch on a single die
#4989Mixed UBM and mixed pitch on a single die
#4990Chip package and method for forming the same
#4991Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect
#4992Semiconductor device
#4993Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration
#4994Tall and fine pitch interconnects
#4995Method for improving wire bonding strength of an image sensor
#4996Fan-out semiconductor package
#4997Fan-out semiconductor package
#4998Package structure with bump
#4999Semiconductor package
#5000Reversible semiconductor die
#5001Semiconductor device
#5002Integrated III-V device and driver device units and methods for fabricating the same
#5003Integrated circuit package assembly with wire end above a topmost component
#5004Semiconductor device
#5005Wafer level package and method
#5006Metal pillar in a film-type semiconductor package
#5007Fan-out semiconductor package
#5008Semiconductor device and method of manufacture
#5009Method of forming a temporary test structure for device fabrication
#5010Method of forming a temporary test structure for device fabrication
#5011Semiconductor device
#5012Wafer level integration including design/co-design, structure process, equipment stress management and thermal management
#5013Method of manufacturing semiconductor device
#5014Semiconductor device
#5015Chip alignment utilizing superomniphobic surface treatment of silicon die
#5016MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCONDUCTIVE CAPPING LAYER
#5017Semiconductor structure and manufacturing method thereof
#5018Info structure with copper pillar having reversed profile
#5019Radio-frequency isolation using cavity formed in interface layer
#5020Display device having a plurality of pad terminals
#5021Array substrate and methods of manufacturing same, and display panel and display apparatus including the array substrate
#5022Cavity formation using sacrificial material
#5023Semiconductor device including two or more chips mounted over wiring substrate
#5024METALLIC RIBBON FOR POWER MODULE PACKAGING
#5025Semiconductor package and method for fabricating the same
#5026Method of forming solder bumps
#5027Method of forming solder bumps
#5028MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCONDUCTIVE CAPPING LAYER
#5029Semiconductor device including a buffer layer structure for reducing stress
#5030Electrical connectivity of die to a host substrate
#5031Semiconductor device and method of aligning semiconductor wafers for bonding
#5032Conductive paste for bonding
#5033Packaging for high power integrated circuits and infrared emitter arrays
#5034Semiconductor device and method of manufacturing the same
#5035Chip assembly
#5036Semiconductor package devices and method for forming semiconductor package devices
#5037Semiconductor device structure and manufacturing method
#5038Conductive pad structure for hybrid bonding and methods of forming same
#5039SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#5040Semiconductor structure having a composite barrier layer
#5041Shielded package assemblies with integrated capacitor
#5042Semiconductor device and method of forming a PoP device with embedded vertical interconnect units
#5043Integrated circuit die and manufacture method thereof
#5044Wafer level semiconductor device with wettable flanks
#5045Method of manufacturing semiconductor device and semiconductor device
#5046Display device
#5047Metal bonding pads for packaging applications
#5048Interconnection structure including a metal post encapsulated by a joint material having concave outer surface
#5049Method of forming a solder bump structure
#5050Fan-out semiconductor package
#5051UBM (under bump metal) electrode structure for radiation detector, radiation detector and production method thereof
#5052Semiconductor copper metallization structure and related methods
#5053Polymer layer on metal core for plurality of bumps connected to conductive pads
#5054Semiconductor devices and methods for forming a semiconductor device
#5055Method for remapping a packaged extracted die
#5056Buffer layer(s) on a stacked structure having a via
#5057LAND GRID BASED MULTI SIZE PAD PACKAGE
#5058Semiconductor wafer and method of ball drop on thin wafer with edge support ring
#5059POWER SEMICONDUCTOR DEVICE
#5060Integrated circuit die having a split solder pad
#5061PHOTOSENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT
#5062Package-on-package (PoP) structure including stud bulbs
#5063Semiconductor packaging structure and method
#5064Semiconductor device
#5065CHIP ARRANGEMENT AND METHOD FOR FORMING A CONTACT CONNECTION
#5066Semiconductor integrated circuit device
#5067Semiconductor device and manufacturing method thereof
#5068Elongated bump structures in package structure
#5069ZN DOPED SOLDERS ON CU SURFACE FINISH FOR THIN FLI APPLICATION
#5070Method of forming a semiconductor device including strain reduced structure
#5071Remapped packaged extracted die
#5072Semiconductor device having a large area interconnect or pad
#5073Composite bond structure in stacked semiconductor structure
#5074LEAD CARRIER STRUCTURE AND PACKAGES FORMED THEREFROM WITHOUT DIE ATTACH PADS
#5075Electronic component, electronic component mounting substrate, and electronic component mounting method to facilitate positional alignment between the electronic component and the mounting substrate
#5076Chip part and manufacturing method thereof
#5077Light emitting device and lighting apparatus including the same
#5078Method for manufacturing semiconductor device
#5079INTERCONNECT STRUCTURE WITH IMPROVED CONDUCTIVE PROPERTIES AND ASSOCIATED SYSTEMS AND METHODS
#5080Vertical Memory Module Enabled by Fan-Out Redistribution Layer
#5081Pad structure and manufacturing method thereof
#5082Semiconductor structure and manufacturing method thereof
#5083Integrated circuit including wire structure, related method and design structure
#5084Dense redistribution layers in semiconductor packages and methods of forming the same
#5085Die attach methods and semiconductor devices manufactured based on such methods
#5086Semiconductor device
#5087Semiconductor package assembly with passive device
#5088Package structure having magnetic bonding between substrates
#5089Package structure and method of forming the same
#5090Device package including molding compound having non-planar top surface around a die
#5091METHOD FOR FORMING BUMP STRUCTURE
#5092INTEGRATED CIRCUIT CHIP AND DISPLAY DEVICE INCLUDING THE SAME
#5093Method for manufacturing semiconductor structure
#5094Semiconductor structure and manufacturing method thereof
#5095Resurfaceable contact pad for silicon or organic redistribution interposer for semiconductor probing
#5096Semiconductor device having a dual material redistribution line
#5097Ultraviolet reflective rough adhesive contact
#5098Device isolator with reduced parasitic capacitance
#5099Interconnect structure with redundant electrical connectors and associated systems and methods
#5100Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire