207785 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
Under bump metallurgy (UBM) and methods of forming same
#5102Semicondcutor structure and semiconductor manufacturing process thereof
#5103FLIP-CHIP, FACE-UP AND FACE-DOWN CENTERBOND MEMORY WIREBOND ASSEMBLIES
#5104Integrated circuit packages and methods for forming the same
#5105LED HAVING VERTICAL CONTACTS REDISTRIBUTED FOR FLIP CHIP MOUNTING
#5106Surface finishes for interconnection pads in microelectronic structures
#5107SEMICONDUCTOR DEVICE HAVING REDISTRIBUTION LAYER WITH COPPER MIGRATION STOPPING
#5108Conductive connections, structures with such connections, and methods of manufacture
#5109Metal-metal direct bonding method
#5110Interconnect structures for assembly of semiconductor structures including superconducting integrated circuits
#5111Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods
#5112Package assembly
#5113PRE-PLATED SUBSTRATE FOR DIE ATTACHMENT
#5114Enhanced solder pad
#5115Trap layer substrate stacking technique to improve performance for RF devices
#5116SOI wafers with buried dielectric layers to prevent CU diffusion
#5117Semiconductor devices, methods of manufacture thereof, and semiconductor device packages
#5118Self-alignment for redistribution layer
#5119Electronic switching and reverse polarity protection circuit
#5120Semiconductor device having first and second electrode layers electrically disconnected from each other by a slit
#5121Compound semiconductor device
#5122Semiconductor device and method of forming build-up interconnect structures over a temporary substrate
#5123Semiconductor package and method of manufacturing the same
#5124Semiconductor chip package with resilient conductive paste post and fabrication method thereof
#5125Package and packaging process of a semiconductor device
#5126Semiconductor device
#5127Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
#5128Bumped land grid array
#5129SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
#5130Methods for forming shielded radio-frequency modules having reduced area
#5131Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methods
#5132Interconnect structure and semiconductor structures for assembly of cryogenic electronic packages
#5133Semiconductor device including conductive layer and conductive pillar disposed on conductive layer and method of manufacturing the same
#5134Fan-out semiconductor package
#5135Fan-out semiconductor package
#5136Display apparatus
#5137Fan-out semiconductor package
#5138METHOD TO MITIGATE CHIP PACKAGE INTERACTION RISK ON DIE CORNER USING REINFORCING TILES
#5139Conductive terminal on integrated circuit
#5140Semiconductor device
#5141Thermally conductive and electrically isolating layers in semiconductor structures
#5142SEMICONDUCTOR DEVICE AND METHOD COMPRISING REDISTRIBUTION LAYERS
#5143METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#5144Electrically conductive composition
#5145Backside integration of RF filters for RF front end modules and design structure
#5146Semiconductor device assembly with heat transfer structure formed from semiconductor material
#5147Semiconductor device with a wire bonding and a sintered region, and manufacturing process thereof
#5148Bonding wire for semiconductor device
#5149Contact Bumps and Methods of Making Contact Bumps on Flexible Electronic Devices
#5150FAN-OUT SEMICONDUCTOR PACKAGE
#5151Fan-out semiconductor package
#5152High density redistribution layer (RDL) interconnect bridge using a reconstituted wafer
#5153Semiconductor device and method
#5154Method of producing a semiconductor device with through-substrate via covered by a solder ball
#5155Semiconductor device and manufacturing method thereof
#5156Semiconductor packages and methods of fabrication thereof
#5157Methods for forming a semiconductor device and semiconductor devices
#5158Semiconductor package structure and method of manufacturing the same
#5159Transparent light emitting diode film
#5160Display panel including external conductive pad, display apparatus including the same and method of manufacturing the same
#5161Structure and method for cooling three-dimensional integrated circuits
#5162Wafer-to-wafer bonding structure
#5163Hybrid bonding systems and methods for semiconductor wafers
#5164Semiconductor devices including conductive pillars
#5165Flip chip
#5166Semiconductor device and method of fabricating the same
#5167Fan-out semiconductor package
#5168Semiconductor device, method for manufacturing same, and semiconductor module
#5169Collars for under-bump metal structures and associated systems and methods
#5170Circular support substrate for semiconductor
#5171Photo-emission semiconductor device and method of manufacturing same
#5172Micro device integration into system substrate
#5173Structure and method of forming a joint assembly
#5174Bump on pad (BOP) bonding structure in semiconductor packaged device
#5175Connection structure and connecting method of circuit member
#5176Surface Conditioning And Material Modification In A Semiconductor Device
#5177Polymer resin and compression mold chip scale package
#5178Semiconductor device and method of manufacturing the same
#5179Advanced through substrate via metallization in three dimensional semiconductor integration
#5180Advanced through substrate via metallization in three dimensional semiconductor integration
#5181DISPLAY DEVICE INCLUDING AN ANISOTROPIC CONDUCTIVE FILM, AND MANUFACTURING METHOD OF THE ANISOTROPIC CONDUCTIVE FILM
#5182Semiconductor device and a method of manufacturing the same
#5183High-power amplifier package
#5184Method of fabricating a post-passivation interconnect structure
#5185Semiconductor package and fabrication method thereof
#5186Semiconductor package assembly
#5187Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact
#5188Semiconductor manufacturing apparatus having a pickup unit simultaneously picking up a plurality of semiconductor chips
#5189High electron mobility transistor (HEMT)
#5190Semiconductor device with a conductive post
#51913D integration using Al—Ge eutectic bond interconnect
#5192Barrier layer for interconnects in 3D integrated device
#5193Copper structures with intermetallic coating for integrated circuit chips
#5194Bond pad structure for bonding improvement
#5195Semiconductor package and method of manufacturing the same
#5196Multiple band multiple mode transceiver front end flip-chip architecture and circuitry with integrated power amplifiers
#5197Stacked semiconductor structure and method
#5198Package with tilted interface between device die and encapsulating material
#5199Method for forming interconnect structure
#5200Semiconductor die assemblies with heat sink and associated systems and methods
#5201Power MOSFET
#5202Microfeature workpieces having alloyed conductive structures, and associated methods
#5203Semiconductor laser mounting with intact diffusion barrier layer
#5204METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING GANG BONDING AND SEMICONDUCTOR DEVICE FABRICATED BY THE SAME
#5205Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device
#5206Power semiconductor contact structure and method for the production thereof
#5207Multi-layer metal pads
#5208Substrate structure
#5209Bonding pad structure over active circuitry
#5210Structure and formation method for chip package
#5211Through substrate vias with improved connections
#5212Semiconductor device and method for manufacturing the same
#5213Laminate package of chip on carrier and in cavity
#5214Method for forming semiconductor structure
#5215Semiconductor device and method of manufacture
#5216Implementation method for stacked connection between isolated circuit components and the circuit thereof
#5217Methods and devices for fabricating and assembling printable semiconductor elements
#5218Semiconductor device
#5219Fabrication method of semiconductor structure
#5220METHOD OF BONDING A FIRST SUBSTRATE AND A SECOND SUBSTRATE
#5221Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP
#5222Method of bonding semiconductor substrates
#5223Semiconductor device and electronic device
#5224Three-dimensional chip stack and method of forming the same
#5225Interconnect etch with polymer layer edge protection
#5226Contact pad for semiconductor device
#5227Methods of forming 3-D circuits with integrated passive devices
#5228Integrated circuits with backside metalization and production method thereof
#5229Multi-chip fan out package and methods of forming the same
#5230Bonding package components through plating
#5231Pre-plated substrate for die attachment
#5232SEMICONDUCTOR DEVICE
#5233Method of fabricating a carrier-less silicon interposer using photo patterned polymer as substrate
#5234Half bridge circuit, method of operating a half bridge circuit and a half bridge circuit package
#5235Organic light emitting display device
#5236Electronic device package having a dielectric layer and an encapsulant
#5237Method of manufacturing semiconductor device
#5238Package on package structure and method for forming the same
#5239Bond pad with micro-protrusions for direct metallic bonding
#5240Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods
#5241Localized high density substrate routing
#5242Device with pillar-shaped components
#5243IR assisted fan-out wafer level packaging using silicon handler
#5244Fan-out wafer level packaging structure
#5245Integrated system and method of making the integrated system
#5246Semiconductor package
#5247Die stack assembly using an edge separation structure for connectivity through a die of the stack
#5248Semiconductor devices and semiconductor packages
#5249Fan-out semiconductor package
#5250Semiconductor structure and fabricating method thereof
#5251Antenna cavity structure for integrated patch antenna in integrated fan-out packaging
#5252Integrated circuit chip and integrated circuit wafer with guard ring
#5253Structure and method for stabilizing leads in wire-bonded semiconductor devices
#5254Method of manufacturing semiconductor device
#5255INDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#5256Electronic device and method for producing an electronic device
#5257Interconnect structure and method of forming same
#5258SEMICONDUCTOR DEVICE CAPABLE OF DISPERSING STRESSES
#5259INTEGRATED CIRCUIT PACKAGE USING POLYMER-SOLDER BALL STRUCTURES AND FORMING METHODS
#5260Integrated fan-out package, redistribution circuit structure, and method of fabricating the same
#5261Sensor chip package assembly and electronic device having sensor chip package assembly
#5262Chip package and method for forming the same
#5263Semiconductor device and wafer level package including such semiconductor device
#5264Stacked semiconductor device structure and method
#5265Interconnection structure with confinement layer
#5266Semiconductor device and method of forming low profile fan-out package with vertical interconnection units
#5267Integrated fan-out package, integrated fan-out package array, and method of manufacturing integrated fan-out packages
#5268Electronic device
#5269System and method for bonding package lid
#5270Methods of packaging semiconductor devices including placing semiconductor devices into die caves
#5271Method for manufacturing electronic component and manufacturing apparatus of electronic component
#5272Semiconductor device having conductive bumps of varying heights
#5273Power and ground routing of integrated circuit devices with improved IR drop and chip performance
#5274Wafer-level chip-size package with redistribution layer
#5275Method of forming a temporary test structure for device fabrication
#5276Methods and apparatus of packaging semiconductor devices
#5277Semiconductor packages and methods of manufacturing the same
#5278CHIP PACKAGE AND METHOD FOR FORMING THE SAME
#5279Barrier structures between external electrical connectors
#5280Automated optical inspection of unit specific patterning
#5281Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips
#5282Semiconductor device and method of stacking semiconductor die for system-level ESD protection
#5283Method for manufacturing semiconductor apparatus, method for manufacturing flip-chip type semiconductor apparatus, semiconductor apparatus, and flip-chip type semiconductor apparatus
#5284Semiconductor unit, method of manufacturing the same, and electronic apparatus
#5285Solder resist layers for coreless packages and methods of fabrication
#5286Semiconductor structure and manufacturing method thereof
#5287Method of manufacturing a semiconductor device
#5288Semiconductor device and method of manufacture
#5289Conductive traces in semiconductor devices and methods of forming same
#5290Semiconductor device including a clip
#5291Method for singulating packaged integrated circuits and resulting structures
#5292Multi-chip structure and method of forming same
#5293Fingerprint sensor device and method
#5294Semiconductor device having gaps within the conductive parts
#5295Display apparatus with curved contacts
#5296SOLDER BUMPS FORMED ON WAFERS USING PREFORMED SOLDER BALLS WITH DIFFERENT COMPOSITIONS AND SIZES
#5297Connector structure and method of forming same
#5298Semiconductor device
#5299SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SAME
#5300Systems and methods for achieving uniformity across a redistribution layer
#5301Method for manufacturing semiconductor device
#5302Fingerprint sensor and manufacturing method thereof
#5303Chip package assembly with power management integrated circuit and integrated circuit die
#5304Semiconductor device and method of making wafer level chip scale package
#5305Semiconductor devices and processing methods
#5306BUMP-EQUIPPED ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING BUMP-EQUIPPED ELECTRONIC COMPONENT
#5307Semiconductor device
#5308Reliable passivation for integrated circuits
#5309Semiconductor device
#5310Chip part and method for manufacturing a chip part
#5311Methods for making multi-die package with bridge layer
#5312Method of manufacturing a common mode filter
#5313Connector structures of integrated circuits
#5314Device with optimized thermal characteristics
#5315Methods of manufacturing an integrated circuit having stress tuning layer
#5316Chip part and method of making the same
#5317Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area
#5318Method of producing optoelectronic component with integrated protection diode
#5319Electrode terminal, semiconductor device, and power conversion apparatus
#5320Laser-induced forming and transfer of shaped metallic interconnects
#5321Semiconductor device including built-in crack-arresting film structure
#5322Semiconductor devices and methods of manufacture thereof
#5323Power semiconductor device load terminal
#5324Method for thermo-mechanical stress reduction in semiconductor devices and corresponding device
#5325FULLY MOLDED PERIPHERAL PACKAGE ON PACKAGE DEVICE
#5326Semiconductor device processing method for material removal
#5327Bonding wire for semiconductor device
#5328Semiconductor device, manufacturing method thereof, and electronic apparatus
#5329Semiconductor device, manufacturing method thereof, and electronic apparatus
#53303D semiconductor device and structure
#5331Sawing underfill in packaging processes
#5332SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
#5333Semiconductor device and manufacturing method thereof
#5334Testing of semiconductor chips with microbumps
#5335Apparatus and associated method
#5336Integrated circuit structures with recessed conductive contacts for package on package
#5337Structure and method of reinforcing a conductor soldering point of semiconductor device
#5338SEMICONDUCTOR DEVICE
#5339Semiconductor devices with a thermally conductive layer and methods of their fabrication
#5340Methods for forming interconnect assemblies with probed bond pads
#5341Electronic device
#5342Power overlay structure and reconstituted semiconductor wafer having wirebonds
#5343Bonding wire for semiconductor device
#5344Bonding wire for semiconductor device
#5345Mechanisms for forming post-passivation interconnect structure
#5346SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#5347Embedding thin chips in polymer
#5348Wafers having a die region and a scribe-line region adjacent to the die region
#5349Dicing method for wafer-level packaging and semiconductor chip with dicing structure adapted for wafer-level packaging
#5350Multi-strike process for bonding packages and the packages thereof
#5351Via structure for packaging and a method of forming
#5352Semiconductor product with interlocking metal-to-metal bonds and method for manufacturing thereof
#5353Semiconductor structure and manufacturing method thereof
#5354Semiconductor device
#5355Method for aligning micro-electronic components
#5356Semiconductor device manufacturing method and semiconductor wafer
#5357Trace design for bump-on-trace (BOT) assembly
#5358Method and structure for wafer-level packaging
#5359Chip with I/O pads on peripheries and method making the same
#5360Semiconductor device and semiconductor device manufacturing method
#5361System and method for an improved interconnect structure
#5362SOI wafers with buried dielectric layers to prevent Cu diffusion
#5363Semiconductor package
#5364Power semiconductor device with small contact footprint and the preparation method
#5365Semiconductor devices having through electrodes and methods of manufacturing the same
#5366Semiconductor packaging structure and method
#5367Semiconductor package
#5368Nanowires for pillar interconnects
#5369Flip chip package structure and fabrication process thereof
#5370Semiconductor device with a bump contact on a TSV comprising a cavity and method of producing such a semiconductor device
#5371Self-aligned under bump metal
#5372Method of forming metal pads with openings in integrated circuits including forming a polymer extending into a metal pad
#5373Contact pad for semiconductor devices
#5374Methods of forming metal pad structures over TSVS to reduce shorting of upper metal layers
#5375Terminal structure and wiring substrate
#5376Semiconductor devices comprising getter layers and methods of making and using the same
#5377Display panel and display device including the same
#5378Method for arranging electronic switching elements, electronic switching arrangement and use of a carrier having a bonding layer
#5379Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip
#5380Semiconductor device and manufacturing method thereof
#5381Capacitor formed on heavily doped substrate
#5382Method of manufacturing a semiconductor device
#5383Semiconductor device including multiple semiconductor chips
#5384Semiconductor devices and methods of manufacture thereof
#5385Wafer-level chip-scale package with redistribution layer
#5386Transient interface gradient bonding for metal bonds
#5387Semiconductor device
#5388Semiconductor device
#5389Method to improve CMP scratch resistance for non planar surfaces
#5390Semiconductor device allowing metal layer routing formed directly under metal pad
#5391Semiconductor device and method for manufacturing semiconductor device
#5392Integrated circuit comprising at least an integrated antenna
#5393Manufacturing method of display with lighting devices
#5394Array substrate and method of mounting integrated circuit using the same
#5395Adhesive bonding composition and method of use
#5396Methods of forming connector pad structures, interconnect structures, and structures thereof
#5397Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof
#5398Structure for stacked logic performance improvement
#5399Semiconductor device having solder groove
#5400Hybrid subtractive etch/metal fill process for fabricating interconnects