207785 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
Coupling inductors in an IC device using interconnecting elements with solder caps and resulting devices
#5402Semiconductor device and method of manufacturing the same
#5403Extrusion-resistant solder interconnect structures and methods of forming
#5404CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#5405Semiconductor device
#5406SEMICONDUCTOR DEVICE
#5407Semiconductor device
#5408Semiconductor device
#5409Conductive paths through dielectric with a high aspect ratio for semiconductor devices
#5410Semiconductor package including a semiconductor die having redistributed pads
#5411Sintering materials and attachment methods using same
#5412Microelectronic package with stacked microelectronic units and method for manufacture thereof
#5413Split ball grid array pad for multi-chip modules
#5414Mechanisms for forming hybrid bonding structures with elongated bumps
#5415Method of manufacturing semiconductor device
#5416Metal bump joint structure
#5417Semiconductor chip mounted on a packaging substrate
#5418COPPER-CONTAINING C4 BALL-LIMITING METALLURGY STACK FOR ENHANCED RELIABILITY OF PACKAGED STRUCTURES AND METHOD OF MAKING SAME
#5419Method and apparatus for forming backside die planar devices and saw filter
#5420Semiconductor device package, electronic device and method of manufacturing electronic devices using wafer level chip scale package technology
#5421Semiconductor structure and manufacturing method thereof
#5422Chip packages and methods of manufacture thereof
#5423Package with solder regions aligned to recesses
#5424Methods and apparatus of guard rings for wafer-level-packaging
#5425Structure and formation method for chip package
#5426Semiconductor devices and methods of making the same
#5427Semiconductor device with modified current distribution
#5428Integrated circuit device
#5429Semiconductor packages with an intermetallic layer
#5430Interconnect structures and methods for fabricating interconnect structures
#5431Semiconductor device and method of making a semiconductor device
#5432SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#5433Semiconductor device and semiconductor package including the same
#5434Power integrated module
#5435Semiconductor device
#5436Fan-out semiconductor package and electronic device including the same
#5437Low-profile microdisplay module
#5438Coating electronic component
#5439Semiconductor device and method of manufacturing the same
#5440Display apparatus
#5441Chip-stacked semiconductor package and method of manufacturing the same
#5442Stacked integrated circuit structure and method of forming
#5443Electronic device, electronic part, and solder
#5444INTEGRATED CIRCUIT DEVICE HAVING THROUGH VIA BASED ALIGNMENT KEYS AND METHODS OF FORMING THE SAME
#5445Electronic device, method for manufacturing the electronic device, and electronic apparatus
#5446Shielded package assemblies with integrated capacitor
#5447Power management application of interconnect substrates
#5448ELECTRONIC COMPONENT
#5449System and method for dual-region singulation
#5450Semiconductor process
#5451High-frequency modules
#5452Solder bump placement for grounding in flip chip amplifiers
#5453Pad structure for front side illuminated image sensor
#5454Solder bump placement for emitter-ballasting in flip chip amplifiers
#5455Semiconductor device and semiconductor package
#5456Gallium arsenide devices with copper backside for direct die solder attach
#5457Method and apparatus for creating a bond between objects based on formation of inter-diffusion layers
#5458Solderless interconnection structure and method of forming same
#5459MASKLESS SELECTIVE RETENTION OF A CAP UPON A CONDUCTOR FROM A NONCONDUCTIVE CAPPING LAYER
#5460Solder bump placement for thermal management in flip chip amplifiers
#5461Wafer-level packaging sensing device and method for forming the same
#5462Semiconductor device and package including solder bumps with strengthened intermetallic compound
#5463Semiconductor device
#5464Pillar structure and manufacturing method thereof
#5465Silver bonding wire for semiconductor device containing indium, gallium, and/or cadmium
#5466Semiconductor chip with patterned underbump metallization and polymer film
#5467Semiconductor die contact structure and method
#5468Semiconductor chip device
#5469Surface finishes for interconnection pads in microelectronic structures
#5470Semiconductor device and method
#5471Trap layer substrate stacking technique to improve performance for RF devices
#5472Semiconductor device
#5473Local semiconductor wafer thinning
#5474Semiconductor chip module and semiconductor package including the same
#5475Radiation detector UBM electrode structure body, radiation detector, and method of manufacturing same
#5476Radio-frequency isolation using front side opening
#5477Integrated circuit package
#5478Semiconductor structure and manufacturing method thereof
#5479Laser-induced forming and transfer of shaped metallic interconnects
#5480Semiconductor chips including redistribution interconnections and related semiconductor packages
#5481Interconnect structures for fine pitch assembly of semiconductor structures and related techniques
#5482Semiconductor chip including a plurality of pads
#5483ELECTRICAL BARRIER LAYERS
#5484Semiconductor device load terminal
#5485SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME
#5486Configurable routing for packaging applications
#5487Semiconductor device and method of manufacturing semiconductor device
#5488Semiconductor device and method of manufacture
#5489Wafer level package (WLP) and method for forming the same
#5490Semiconductor device and method of forming a curved image sensor
#5491Array substrate and manufacturing method thereof, and display apparatus thereof
#5492Semiconductor device and method of aligning semiconductor wafers for bonding
#5493Semiconductor device and method of forming modular 3D semiconductor package with horizontal and vertical oriented substrates
#5494Method of manufacturing an integrated stacked package with a fan-out redistribution layer (RDL) and a same encapsulating process
#5495Method for bonding a chip to a wafer
#5496Designs and methods for conductive bumps
#5497Cu pillar bump with L-shaped non-metal sidewall protection structure
#5498PACKAGE STRUCTURE, CHIP STRUCTURE AND FABRICATION METHOD THEREOF
#5499Semiconductor devices with solder-based connection terminals and method of forming the same
#5500Methods and apparatus for solder connections
#5501Bonding pad structure, bonding ring structure, and MEMS device packaging method
#5502Semiconductor device
#5503Backside redistribution layer (RDL) structure
#5504SEMICONDUCTOR DEVICE AND METHOD OF FORMING AN ALIGNMENT STRUCTURE IN BACKSIDE OF A SEMICONDUCTOR DIE
#5505Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assemblies
#5506Dummy metal with zigzagged edges
#5507Through-substrate via structure and method of manufacture
#5508Semiconductor device and method of forming cantilevered protrusion on a semiconductor die
#5509Semiconductor device and method of forming micro interconnect structures
#5510Method for removing material from a substrate using in-situ thickness measurement
#5511Testing architecture of circuits integrated on a wafer
#5512Semiconductor device and control method for the same
#5513Semiconductor device including semiconductor chip, wiring, conductive material, and contact part
#5514Semiconductor device
#5515Collars for under-bump metal structures and associated systems and methods
#5516Surface mount high-frequency circuit
#5517Fully molded miniaturized semiconductor module
#5518Chip package and manufacturing method thereof
#5519Apparatus, system and method for collecting a target material
#5520Semiconductor device and method for manufacturing the same
#55213D-joining of microelectronic components with conductively self-adjusting anisotropic matrix
#5522Air trench in packages incorporating hybrid bonding
#5523Semiconductor package and method of forming the same
#5524Anchored interconnect
#5525Semiconductor device allowing metal layer routing formed directly under metal pad
#5526Package systems including passive electrical components
#5527Method of making layered structure with metal layers using resist patterns and electrolytic plating
#5528Organic light emitting display device
#5529SEMICONDUCTOR DEVICE
#5530Semiconductor packaging and manufacturing method thereof
#5531Semiconductor chip, semiconductor package including the same, and method of fabricating the same
#5532Semiconductor device assemblies including intermetallic compound interconnect structures
#5533Semiconductor package and manufacturing method thereof
#5534Semiconductor device, and method of fabricating the same
#5535Semiconductor device and method of manufacturing the semiconductor device
#5536Method for forming fuse pad and bond pad of integrated circuit
#5537Semiconductor device having a conductive via structure
#5538Sintered conductive matrix material on wire bond
#5539Semiconductor device having wire bonding connection and method for manufacturing the same
#5540Semiconductor device
#5541Method of manufacturing semiconductor device and semiconductor device
#5542Method of forming a temporary test structure for device fabrication
#5543High quality electrical contacts between integrated circuit chips
#5544Display apparatus with a data driving chip and a gate driving chip disposed on a same side of a display panel
#5545Electronic device having an intermediate layer disposed between two electrically-conductive layers
#5546Semiconductor device and method of manufacturing thereof
#5547INTEGRATED CIRCUIT PACKAGE
#5548Bonding pads with thermal pathways
#5549Semiconductor apparatus, method for manufacturing the same, electronic device, and moving body
#5550METHOD, A SEMICONDUCTOR DEVICE AND A LAYER ARRANGEMENT
#5551Packaged device with additive substrate surface modification
#5552Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus
#5553Method for fabricating glass substrate package
#5554Electronic apparatus and method for manufacturing electronic apparatus
#5555Semiconductor device structure and method for forming the same
#5556Method of fabricating chip package with laser
#5557Scheme for connector site spacing and resulting structures
#5558Stress tuning for reducing wafer warpage
#5559Apparatus and method for verification of bonding alignment
#5560Method for packaging circuits
#5561Method of assembly semiconductor device with through-package interconnect
#5562Three dimensional integrated circuits stacking approach
#5563Integrated fan-out package structures with recesses in molding compound
#5564Semiconductor device, semiconductor package, and method for manufacturing semiconductor device
#5565Semiconductor device having a protective material with a first pH formed around cooper wire bonds and aluminum pads for neutralizes a second pH of an outer encapsulant material
#5566Semiconductor device and semiconductor package
#5567Substrate structure with selective surface finishes for flip chip assembly
#5568BOND PAD STRUCTURE FOR LOW TEMPERATURE FLIP CHIP BONDING
#5569Semiconductor package having a substrate structure with selective surface finishes
#5570Integrated circuits having copper bonding structures with silicon carbon nitride passivation layers thereon and methods for fabricating same
#5571Methods and structures to repair device warpage
#5572Method of packaging semiconductor devices
#5573Method of manufacturing semiconductor device and semiconductor device
#5574Capacitor in post-passivation structures and methods of forming the same
#5575Method of electroplating photoresist defined features from copper electroplating baths containing reaction products of imidazole and bisepoxide compounds
#5576Photoresist cleaning composition used in photolithography and a method for treating substrate therewith
#5577Semiconductor devices
#5578Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#5579Bonding structure for semiconductor package and method of manufacturing the same
#5580Semiconductor device and its manufacturing method
#5581Semiconductor devices and methods of forming thereof
#5582Packaging devices and methods of manufacture thereof
#5583Opening in a multilayer polymeric dielectric layer without delamination
#5584Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminate
#5585Semiconductor device and method comprising redistribution layers
#5586Semiconductor device with trench-like feed-throughs
#5587Transistors having offset contacts for reduced off capacitance
#5588Forming recesses in molding compound of wafer to reduce stress
#5589Package on-package (PoP) structure including stud bulbs
#5590Process for producing a structure by assembling at least two elements by direct adhesive bonding
#5591WAFER CIRCUIT
#5592Method of forming a semiconductor device with bump stop structure
#5593CHIP SCALE SENSING CHIP PACKAGE AND A MANUFACTURING METHOD THEREOF
#5594Semiconductor chip having a dense arrangement of contact terminals
#5595Method and structure for wafer level packaging with large contact area
#5596Semiconductor device with through-substrate via covered by a solder ball
#5597Fan-out wafer level packaging structure
#5598Pre-package and methods of manufacturing semiconductor package and electronic device using the same
#5599Radio frequency probe apparatus
#5600Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same
#5601Flip chip bonding alloys
#5602USING AN INTERCONNECT BUMP TO TRAVERSE THROUGH A PASSIVATION LAYER OF A SEMICONDUCTOR DIE
#5603Semiconductor structure and manufacturing method thereof
#5604Method of producing a semiconductor device with through-substrate via covered by a solder ball
#5605Self-aligned under bump metal
#5606Method for manufacturing semiconductor device, semiconductor manufacturing apparatus, and wafer lift pin-hole cleaning jig
#5607Through-body via liner deposition
#5608Underfill material, laminated sheet and method for producing semiconductor device
#5609Semiconductor device
#5610Solid state imaging apparatus and method of producing the same
#5611Semiconductor device
#5612Lead-free soldering method and soldered article
#5613Semiconductor devices having metal bumps with flange
#5614Semiconductor device processing method for material removal
#5615Through-body via formation techniques
#5616Insulated die
#5617Semiconductor structures including carrier wafers and attached device wafers, and methods of forming such semiconductor structures
#5618Method for manufacturing semiconductor device
#56193DIC stacking device and method of manufacture
#5620Wafer backside interconnect structure connected to TSVs
#5621Packaging device and method of making the same
#5622Semiconductor device and a method of manufacturing the same
#5623Under bump metallurgy (UBM) and methods of forming same
#5624Semiconductor device and bump formation process
#5625Semiconductor package system and method
#5626Semiconductor integrated circuit device
#5627Stacked semiconductor devices and methods of forming same
#5628Semiconductor device having a bonding pad
#5629Multilayer semiconductor integrated circuit device
#5630Electronic element and manufacturing method
#5631Corrosion resistant aluminum bond pad structure
#5632Semiconductor device with metal structure electrically connected to a conductive structure
#5633Semiconductor device and manufacturing method thereof
#5634Semiconductor device and method of manufacture thereof
#5635SEMICONDUCTOR DEVICE AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#5636Termination structure for gallium nitride schottky diode
#5637Method of flip-chip assembly of two electronic components by UV annealing, and assembly obtained
#5638Concentric bump design for the alignment in die stacking
#5639Semiconductor devices with ball strength improvement
#5640Semiconductor device and manufacturing method thereof
#5641Semiconductor device allowing metal layer routing formed directly under metal pad
#5642Conductive pillar shaped for solder confinement
#5643Wiring board and electronic device
#5644Electronic device with periphery contact pads surrounding central contact pads
#5645Cu core ball, solder paste, formed solder, Cu core column, and solder joint
#5646Alternative compositions for high temperature soldering applications
#5647Semiconductor chip with redundant thru-silicon-vias
#5648Semiconductor device and method of manufacturing the same
#5649Grid array connection device and method
#5650Electronic devices with semiconductor die attached with sintered metallic layers, and methods of formation of such devices
#5651Stacked semiconductor device
#5652Resonant circuit including bump pads
#5653Double-sided vertical semiconductor device with thinned substrate
#5654Wafer bonding process and structure
#5655Semiconductor device and method for manufacturing the same
#5656Semiconductor device
#5657Semiconductor package and method of manufacturing thereof
#5658Semiconductor device comprising regions of different current drive capabilities
#5659Semiconductor structure having a patterned surface structure and semiconductor chips including such structures
#5660Multiple band multiple mode transceiver front end flip-chip architecture and circuitry with integrated power amplifiers
#5661Semiconductor device and manufacturing method of semiconductor device
#5662Printed circuit boards having blind vias, method of testing electric current flowing through blind via thereof and method of manufacturing semiconductor packages including the same
#5663INTEGRATED CIRCUIT
#5664Packaging devices and methods of manufacture thereof
#5665Electric apparatus including electric patterns for suppressing solder bridges
#5666Solder metallization stack and methods of formation thereof
#5667Method of producing a semiconductor device with protruding contacts
#5668Semiconductor package and mounting structure thereof
#5669Semiconductor device and manufacturing method of semiconductor device
#5670Semiconductor device and method for producing semiconductor device
#5671Integrated packaging of multiple double sided cooling planar bond power modules
#5672Semiconductor structure having thermal backside core
#5673FAN-OUT WAFER LEVEL PACKAGE AND FABRICATION METHOD THEREOF
#5674Method for manufacturing semiconductor light-emitting device and semiconductor light-emitting device
#5675Compound semiconductor device
#5676Semiconductor device, manufacturing method thereof, and electronic apparatus
#5677Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#5678Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#5679Semiconductor package assembly with facing active surfaces of first and second semiconductor die and method for forming the same
#5680Mechanisms of forming connectors for package on package
#5681Interconnect structure with improved conductive properties and associated systems and methods
#5682Method for fabricating semiconductor package having a multi-layer molded conductive substrate and structure
#5683Semiconductor device assembly with heat transfer structure formed from semiconductor material
#5684Conductive pad structure for hybrid bonding and methods of forming same
#5685Conductive paths through dielectric with a high aspect ratio for semiconductor devices
#5686Substrate structure with array of micrometer scale copper pillar based structures and method for manufacturing same
#5687Semiconductor devices comprising getter layers and methods of making and using the same
#5688Wafer stack protection seal
#5689Methods of packaging semiconductor devices and structures thereof
#5690Flip chip module with enhanced properties
#5691Lead-free solder ball
#5692Radio frequency isolation using substrate opening
#5693Radio frequency isolation cavity formation using sacrificial material
#5694Method for manufacturing semiconductor package structure
#5695Semiconductor device
#5696Semiconductor substrate and semiconductor package structure having the same
#5697Conductive connections, structures with such connections, and methods of manufacture
#5698Chip packaging structures
#5699Moisture barrier for semiconductor structures with stress relief
#5700Cavity formation in semiconductor devices