Semiconductor device and method for manufacturing the same

Semiconductor device and method for fabricating the same

Semiconductor device having through-electrode

MOLDED INSULATOR IN PACKAGE ASSEMBLY

Semiconductor device with bond pad wiring lead-out arrangement avoiding bond pad probe mark area

Semiconductor device and method of forming a thin wafer without a carrier

Backside cavity formation in semiconductor devices

Cavity formation in interface layer in semiconductor devices

Fingerprint sensor and manufacturing method thereof

Semiconductor device

Semiconductor device, manufacturing method thereof, and electronic apparatus

Reliable device assembly

Semiconductor structure with sacrificial anode and method for forming

Semiconductor structure and manufacturing method thereof

Stacking arrangement for integration of multiple integrated circuits

Electronic device including a metal substrate and a semiconductor module embedded in a laminate

Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping

Method of manufacturing semiconductor device by applying molding layer in substrate groove

Semiconductor die assembly and methods of forming thermal paths

Package on package bonding structure and method for forming the same

Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC)

Semiconductor device including built-in crack-arresting film structure

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor structure with composite barrier layer under redistribution layer and manufacturing method thereof

Integration of backside heat spreader for thermal management

Integrated circuit comprising at least an integrated antenna

Chip package and manufacturing method thereof

Semiconductor device

Semiconductor device with advanced pad structure resistant to plasma damage and metnod for forming same

Reconstituted wafer-level package dram with conductive interconnects formed in encapsulant at periphery of the package

Plastic-packaged semiconductor device having wires with polymerized insulating layer

Wire bonding systems and related methods

Semiconductor package

Methods of forming multiple conductive features in semiconductor devices in a same formation process

Semiconductor package and method for fabricating base for semiconductor package

Semiconductor device contact structure having stacked nickel, copper, and tin layers

Method of fabricating semiconductor device having voids between top metal layers of metal interconnects

Processing of thick metal pads

Conductive traces in semiconductor devices and methods of forming same

High voltage polymer dielectric capacitor isolation device

Power MOSFET and manufacturing method thereof

Device isolator with reduced parasitic capacitance

Semiconductor device including a protective film

Semiconductor device and manufacturing method therefor

Integration of heat spreader for beol thermal management

Power module and method of manufacturing power module

Methods and devices for fabricating and assembling printable semiconductor elements

Semiconductor apparatus, solid state imaging device, imaging apparatus and electronic equipment, and manufacturing method thereof

Semiconductor packages with socket plug interconnection structures

Semiconductor packages with pillar and bump structures

Semiconductor device and method of forming wafer level ground plane and power ring

Warpage reduction in structures with electrical circuitry

Die-on-interposer assembly with dam structure and method of manufacturing the same

Manufacturing method of chip package structure

Au-based solder die attachment semiconductor device and method for manufacturing the same

Semiconductor device having through-silicon-via and methods of forming the same

Conductive line system and process

Manufacturing method of package substrate and package manufacturing method of semiconductor device

Magnetic shielding of MRAM package

Semiconductor apparatus

Method for producing a circuit carrier arrangement having a carrier which has a surface formed by an aluminum/silicon carbide metal matrix composite material

Electronic device and method for production

Interconnect structure and method of fabricating same

Electronic device with interconnection structure oblate ellipsoid-shaped aperture

Metal bond pad with cobalt interconnect layer and solder thereon

Fan-out interconnect structure and method for forming same

Method of forming contact holes in a fan out package

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR STRUCTURE

Staged via formation from both sides of chip

Semiconductor Package with Embedded Die

Semiconductor device and manufacturing method

Methods and devices for fabricating and assembling printable semiconductor elements

Display device

Apparatus, system, and method for collecting a target material

Semiconductor device and method of manufacturing the same

Three-dimensional chip stack and method of forming the same

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and manufacturing method thereof

Packaging devices and methods of manufacture thereof

Integrated circuit assemblies with reinforcement frames, and methods of manufacture

Chip part and method of making the same

Semiconductor device and wafer level package including such semiconductor device

Power and ground routing of integrated circuit devices with improved IR drop and chip performance

Semiconductor device

Semiconductor device and method of forming an embedded SoP fan-out package

Semiconductor device and method of forming stacked vias within interconnect structure for FO-WLCSP

System and method for dual-region singulation

Testing of semiconductor chips with microbumps

Adjustable losses of bond wire arrangement

Interconnect structure with redundant electrical connectors and associated systems and methods

Semiconductor package assembly with passive device

Method of manufacturing connector structures of integrated circuits

Alignment structures and methods of forming same

Methods for forming pillar bumps on semiconductor wafers

Semiconductor device and method of manufacturing the same

Method of forming redistribution layer

Stub minimization for assemblies without wirebonds to package substrate

Method of producing a large number of support apparatus which can be surface-mounted, arrangement of a large number of support apparatus which can be surface-mounted, and support apparatus which can be surface-mounted

Semiconductor device

Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips

Photoelectric conversion device, image pickup system and method of manufacturing photoelectric conversion device

Fully molded peripheral package on package device

Interfacial alloy layer for improving electromigration (EM) resistance in solder joints

HYBRID INTERCONNECT FOR LOW TEMPERATURE ATTACH

Semiconductor device and method for manufacturing the same

Semiconductor device for preventing crack in pad region and fabricating method thereof

Semiconductor device

Packaged integrated circuit including a switch-mode regulator and method of forming the same

Semiconductor structure and manufacturing method thereof

Interconnect structures, packaged semiconductor devices, and methods of packaging semiconductor devices

Packaging devices and methods of manufacture thereof

Semiconductor package and manufacturing method thereof

Method for Detecting a Crack in a Semiconductor Body of a Semiconductor Component

Method of manufacturing semiconductor device and semiconductor device

Integrated WLUF and SOD process

Method for fabricating package structure

Capacitor in post-passivation structures and methods of forming the same

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

Reduced volume interconnect for three-dimensional chip stack

Devices and methods related to electrostatic discharge protection benign to radio-frequency operation

Semiconductor device and manufacturing method of same

Anisotropic conductive film

Semiconductor device

Semiconductor device and solid-state imaging device

Semiconductor packages and methods of forming the same

3D integration using Al—Ge eutectic bond interconnect

Integrated circuit die with corner IO pads

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Spoked solder pad to improve solderability and self-alignment of integrated circuit packages

Reliable interconnect

Laminated chip having microelectronic element embedded therein

Mechanisms for forming metal-insulator-metal (MIM) capacitor structure

Wiring substrate, method for manufacturing wiring substrate, electronic device and method for manufacturing electronic device

Semiconductor die assemblies with heat sink and associated systems and methods

Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof

Semiconductor device including a buffer layer structure for reducing stress

Methods of forming conductive materials on semiconductor devices, and methods of forming electrical interconnects

Electrode connection structure and electrode connection method

Semiconductor device, integrated circuit structure using the same, and manufacturing method thereof

Method and apparatus of ESD protection in stacked die semiconductor device

Semiconductor device having wires

Bonding pad surface damage reduction in a formation of digital pattern generator

Method for the diffusion soldering of an electronic component to a substrate

Micro device integration into system substrate

Image sensor packages and methods of fabricating the same

Post-passivation interconnect structure and method of forming same

Methods of forming semiconductor packages with an intermetallic layer comprising tin and at least one of silver, copper or nickel

Semiconductor device

Antenna cavity structure for integrated patch antenna in integrated fan-out packaging

Semiconductor device, semiconductor wafer and manufacturing method of semiconductor device

Fan-out wafer level packaging structure

Semiconductor packaging and manufacturing method thereof

Glass frit wafer bond protective structure

Device comprising a ductile layer and method of making the same

Multi-chip structure and method of forming same

Manufacturing method of ultra-thin semiconductor device package assembly

Bump structures, semiconductor device and semiconductor device package having the same

Chip module and method for forming the same

Multilayer structure for a semiconductor device and a method of forming a multilayer structure for a semiconductor device

Connection pads for a fingerprint sensing device

Package with low stress region for an electronic component

Integrated circuit structure having dies with connectors

Semiconductor chip and method of processing a semiconductor chip

Bonding method including adjusting surface contours of a bonding system

Package with multiple plane I/O structure

IGBT device and method for packaging whole-wafer IGBT chip

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Hybrid bonding with air-gap structure

Localized high density substrate routing

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

Semiconductor device

Isolator with reduced susceptibility to parasitic coupling

IC-package interconnect for millimeter wave systems

Pad structure and display device having the same

Semiconductor device, semiconductor package, and method for manufacturing semiconductor device

Semiconductor packages and related methods

Laser assisted transfer welding process

Wafer to wafer bonding process and structures

Display device and array substrate for display device

Semiconductor structure and method of fabricating the same

INTEGRATED CIRCUIT SYSTEM WITH CARRIER CONSTRUCTION CONFIGURATION AND METHOD OF MANUFACTURE THEREOF

Semiconductor structure with UBM layer and method of fabricating the same

Fuse package and light emitting device module using the same

Semiconductor device

Wiring substrate

Semiconductor device

Detecting and driving load using transistor

Semiconductor device and method for manufacturing same

Corrosion-resistant copper bonds to aluminum

Chip package and method for forming the same

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and its manufacturing method

Through substrate vias with improved connections

Environmental hardened packaged integrated circuit

Method for through silicon via structure

Ultraviolet reflective rough adhesive contact

Electronic device mounted on a substrate

Low profile reinforced package-on-package semiconductor device

Interconnect structures for wafer level package and methods of forming same

Semiconductor device having connection terminal of solder

Method and structure for wafer-level packaging

Integrated circuits with backside metalization and production method thereof

Integrated CMOS back cavity acoustic transducer and the method of producing the same

Semiconductor device, method for manufacturing the same, and electronic device

Air trench in packages incorporating hybrid bonding

Method of packaging integrated circuits

Semiconductor bonding structure and process

Semiconductor device

Semiconductor substrate and manufacturing method thereof

SEMICONDUCTOR LIGHT-EMITTING DEVICE AND SEMICONDUCTOR LIGHT-EMITTING APPARATUS HAVING THE SAME

Semiconductor package and manufacturing method thereof

Semiconductor device

Semiconductor device and manufacturing method therefor

Semiconductor device

Semiconductor die and package jigsaw submount

Visibility event navigation method and system

Methods of manufacturing a semiconductor device

Semiconductor device and an electronic device

Compound semiconductor device

Semiconductor devices having stacked structures and methods for fabricating the same

Semiconductor device, a power semiconductor device, and a method for processing a semiconductor device

Semiconductor device and method for manufacturing semiconductor device

Semiconductor devices having a TSV, a front-side bumping pad, and a back-side bumping pad

Organic thin film passivation of metal interconnections

3D integrated circuit and methods of forming the same

Apparatus, system, and method for collecting a target material

Bonding pad on a back side illuminated image sensor

Semiconductor device

Semiconductor device and manufacturing method thereof

Semiconductor device with a wire bonding and a sintered region, and manufacturing process thereof

Method for wafer level packaging

Semiconductor structure having a conductive bump with a plurality of bump segments

Device package with reduced thickness and method for forming same

Bond Pad Having Ruthenium Covering Passivation Sidewall

FIRST-PACKAGED AND LATER-ETCHED THREE-DIMENSIONAL FLIP-CHIP SYSTEM-IN-PACKAGE STRUCTURE AND PROCESSING METHOD THEREFOR

Semiconductor device and method of manufacturing the same

Semiconductor device

Method for manufacturing semiconductor device with metal-containing film layer at bonding surface thereof

Ball amount process in the manufacturing of integrated circuit

Method of forming a bondpad and bondpad

Method for manufacturing a semiconductor device, and semiconductor device

Chip package and method for forming the same

Semiconductor device and manufacturing method thereof

Semiconductor device with inhibited electromigration and manufacturing method thereof

DEVICE CONNECTION THROUGH A BURIED OXIDE LAYER IN A SILICON ON INSULATOR WAFER

Method of filling probe indentations in contact pads

Method for processing a semiconductor substrate and a method for processing a semiconductor wafer

Reliability improvement of polymer-based capacitors by moisture barrier

Semiconductor devices

Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus

Semiconductor device and method of forming the same

Semiconductor package and electronic device having heat dissipation pattern and/or heat conducting line

Semiconductor device including an embedded surface mount device and method of forming the same

Wafer-level stack chip package and method of manufacturing the same

Electrical apparatus

Semiconductor device and manufacturing method for the same

Semiconductor device

Chip using triple pad configuration and packaging method thereof

Semiconductor device having a porous metal layer and an electronic device having the same

IO power bus mesh structure design

Chip package having a dual through hole redistribution layer structure

Method of manufacturing semiconductor device

System and method for an improved interconnect structure

LED having vertical contacts redistributed for flip chip mounting

Semiconductor structure and manufacturing method thereof

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Semiconductor device in which an electrode of a semiconductor element is joined to a joined member and methods of manufacturing the semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Bond pad structure with dual passivation layers

Semiconductor device comprising a conductive film joining a diode and switching element

Semiconductor device having a low-adhesive bond substrate pair

Method of making a semiconductor device having a functional capping

Bump-on-trace design for enlarge bump-to-trace distance

Interconnect structures and methods of forming same

Packaged semiconductor device with interior polygonal pads

Interconnect structure and method of forming same

Planar passivation for pads

Microelectronic package utilizing multiple bumpless build-up structures and through-silicon vias

Interconnect crack arrestor structure and methods

Method of forming metal pads with openings in integrated circuits including forming a polymer plug extending into a metal pad

Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect

Light emitting diodes and a method of packaging the same

Methods of forming 3-D circuits with integrated passive devices

Method of forming a chip assembly with a die attach liquid

Semiconductor device and manufacturing method thereof

Bond pad structure for low temperature flip chip bonding

Package on package structure and method for forming the same

Semiconductor package structure and manufacturing method thereof

Method of using aluminum layer as etching stop layer for patterning a platinum layer

Semiconductor package with electromagnetic shielding member

Electrical connections for chip scale packaging

Semiconductor package

Electronic device with first and second contact pads and related methods

Embedding thin chips in polymer

Vertically integrated systems

Improving the strength of micro-bump joints

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Metallisation for semiconductor device