207785 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
Package structure and manufacturing method
#6302Semiconductor packages and data storage devices including the same
#6303Light-emitting diode and method of fabricating the same
#6304Semiconductor structure including guard ring
#6305Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device
#6306Semiconductor device, method of manufacturing a semiconductor device, and positioning jig
#6307Single mask package apparatus
#6308Enhanced board level reliability for wafer level packages
#6309Mechanically anchored backside C4 pad
#6310Solder ball protection in packages
#6311Electrical connectivity of die to a host substrate
#6312Method of manufacturing a semiconductor device and semiconductor integrated circuit wafer
#6313Method of forming package assembly
#6314Seal ring structure with a metal pad
#6315Chip diode and diode package
#6316Thin NiB or CoB capping layer for non-noble metallic bonding landing pads
#6317Backside integration of RF filters for RF front end modules and design structure
#6318Front-side emitting mid-infrared light emitting diode
#6319Device having at least two wafers for detecting electromagnetic radiation and method for producing said device
#6320Microelectronic packages with nanoparticle joining
#6321Method for Flip-Chip Bonding Using Copper Pillars
#6322Packages with solder ball revealed through laser
#6323Packaging devices and methods of manufacture thereof
#6324Chip parts and method for manufacturing the same, circuit assembly having the chip parts and electronic device
#6325Method for manufacturing semiconductor devices having a metallisation layer
#6326Semiconductor device
#6327Method of forming surface protrusions on an article and the article with the protrusions attached
#6328Solder paste, joining method using the same and joined structure
#6329Sealing structure for a bonded wafer and method of forming the sealing structure
#6330Electronic devices utilizing contact pads with protrusions and methods for fabrication
#6331Apparatus and method for verification of bonding alignment
#6332Multi-segment monolithic LED chip
#6333Protection circuit including vertical gallium nitride schottky diode and PN junction diode
#6334Pad structure exposed in an opening through multiple dielectric layers in BSI image sensor chips
#6335Method of manufacturing a semiconductor device including applying ultrasonic waves to a ball portion of the semiconductor device
#6336Semiconductor modules with semiconductor dies bonded to a metal foil
#6337Semiconductor device
#6338Packages with stress-reducing structures and methods of forming same
#6339Self-alignment structure for wafer level chip scale package
#6340Semiconductor device with post-passivation interconnect structure and method of forming the same
#6341Copper post structure for wafer level chip scale package
#6342Semiconductor packaging structure and manufacturing method for the same
#6343Semiconductor device
#6344Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates
#6345Semiconductor structure with through silicon via and method for fabricating and testing the same
#6346Bonded processed semiconductor structures and carriers
#6347Method of forming Cu pillar bump with non-metal sidewall spacer and metal top cap
#6348Semiconductor device and method of manufacturing the same
#6349Photoelectric conversion device, image pickup system and method of manufacturing photoelectric conversion device
#6350Semiconductor device and connection checking method for semiconductor device
#6351Semiconductor device and manufacturing method thereof
#6352Semiconductor device
#6353Flip-chip hybridisation of two microelectronic components using a UV anneal
#6354Pressure sensor device including-fluorinated gel protective member disposed on a protective film
#6355Light-emitting module
#6356Microelectronic assembly having a heat spreader for a plurality of die
#6357Semiconductor device having multiple contact clips
#6358Methods for forming a semiconductor device package
#6359Microelectronic unit and package with positional reversal
#6360Semiconductor device with bump stop structure
#6361Substrate structure and fabrication method thereof
#6362System and method for 3D integrated circuit stacking
#6363Bonding pad structure with dense via array
#6364Semiconductor devices comprising getter layers and methods of making and using the same
#6365Passive component structure and manufacturing method thereof
#6366Packages for three-dimensional die stacks
#6367Power line structure for semiconductor apparatus
#6368Integrated package assembly for switching regulator
#6369System and method for bonding package lid
#6370Assembly bonding
#6371Anisotropic conductive adhesive
#6372Power conversion device
#6373Semiconductor apparatus capable of detecting whether pad and bump are stacked
#6374Flip-chip package structure and method for an integrated switching power supply
#6375GaN transistor with improved bonding pad structure and method of fabricating the same
#6376Interconnect structure and method of forming same
#6377I/O pin capacitance reduction using TSVS
#6378Chip package and method of manufacturing the same
#6379Substrate composite, method and device for bonding of substrates
#6380SOLDER-CONTAINING SEMICONDUCTOR DEVICE, MOUNTED SOLDER-CONTAINING SEMICONDUCTOR DEVICE, PRODUCING METHOD AND MOUNTING METHOD OF SOLDER-CONTAINING SEMICONDUCTOR DEVICE
#6381Semiconductor device
#6382Semiconductor structure and manufacturing method thereof
#6383Method of manufacturing semiconductor device and semiconductor device
#6384Stacked semiconductor package
#6385Interposer for integrated circuit chip package
#6386Stud bump and package structure thereof and method of manufacturing the same
#6387Semiconductor package
#6388Method of fabricating bump structure and bump structure
#6389Barrier structures between external electrical connectors
#6390INTEGRATED CIRCUIT DEVICE
#6391Method of fabricating a bond pad structure
#6392Bond pad having a trench and method for forming
#6393Chip stack with electrically insulating walls
#6394Method and apparatus for a conductive pillar structure
#6395Package on package bonding structure and method for forming the same
#6396Semiconductor device
#6397Semiconductive packaging device and manufacturing method thereof
#6398Opening in a multilayer polymeric dielectric layer without delamination
#6399SEMICONDUCTOR APPARATUS, MANUFACTURING METHOD THEREOF AND TESTING METHOD THEREOF
#6400Reduced stress TSV and interposer structures
#6401Through via contacts with insulated substrate
#6402Method of making stacked multi-chip packaging structure
#6403Semiconductor device and method of forming build-up interconnect structures over a temporary substrate
#6404Method of processing a semiconductor wafer
#6405Method for aligning micro-electronic components
#6406Grid array connection device and method
#6407Die substrate assembly and method
#6408Solder-on-die using water-soluble resist system and method
#6409Self-aligned under bump metal
#6410Backside redistribution layer (RDL) structure
#6411Semiconductor device with advanced pad structure resistant to plasma damage and method for forming the same
#6412Methods and apparatus for package with interposers
#6413Three-dimensional integrated circuit structures providing thermoelectric cooling and methods for cooling such integrated circuit structures
#6414Electronic module for a piece of vehicle-borne aeronautic equipment and a piece of aeronautic equipment for an aeronautic vehicle
#6415GaN based semiconductor light-emitting device and method for producing same
#6416Insulated gate semiconductor device and method
#6417Method for manufacturing semiconductor apparatus
#6418Conductive pad structure for hybrid bonding and methods of forming same
#6419REDISTRIBUTION LAYER ALLOY STRUCTURE AND MANUFACTURING METHOD THEREOF
#6420Bump structures for semiconductor package
#6421Methods for forming semiconductor devices with stepped bond pads
#6422Semiconductor apparatus and method for producing the same
#6423Method for manufacturing an electronic module and an electronic module
#6424Package structure integrating a start-up component, a controller, and a power switch
#6425Semiconductor component and method of manufacture
#6426Semiconductor device and method of manufacturing the same
#6427Optoelectronic component and a method for manufacturing an optoelectronic component
#6428Multiple active vertically aligned cores for three-dimensional chip stack
#6429Intermetallic compound layer on a pillar between a chip and substrate
#6430Method for handling very thin device wafers
#6431Semiconductor device
#6432Semiconductor device
#6433Stacked three dimensional semiconductor device with in-circuit antenna
#6434Intelligent chip placement within a three-dimensional chip stack
#6435Intelligent chip placement within a three-dimensional chip stack
#6436Package structure and methods of forming same
#6437Multiple active vertically aligned cores for three-dimensional chip stack
#6438Semiconductor device including a MOSFET and having a super-junction structure
#6439Device including two power semiconductor chips and manufacturing thereof
#6440Semiconductor package
#6441Semiconductor device and method for manufacturing the same
#6442BRIDGE STRUCTURE FOR EMBEDDING SEMICONDUCTOR DIE
#6443Warpage reduction in structures with electrical circuitry
#6444Carrier-less silicon interposer using photo patterned polymer as substrate
#6445Semiconductor device
#6446Method for generating die identification by measuring whether circuit is established in a package structure
#6447Substrates having ball lands, semiconductor packages including the same, and methods of fabricating semiconductor packages including the same
#6448Semiconductor packaging and manufacturing method thereof
#6449Mechanisms for forming package structure
#6450Semiconductor package
#6451SEMICONDUCTOR CHIPS WITH THROUGH-SILICON VIAS, AND SEMICONDUCTOR PACKAGES INCLUDING THE SAME
#6452Integrated circuit and fabricating method thereof
#6453Chip package and method for forming the same
#6454Method of stacking a plurality of dies to form a stacked semiconductor device, and stacked semiconductor device
#6455Wafer-level die attach metallization
#6456Discrete semiconductor device package and manufacturing method
#6457Wafer level semiconductor package and manufacturing methods thereof
#6458Self-alignment for redistribution layer
#6459Semiconductor device assembly with package interconnect extending into overlying spacer material, and associated systems, devices, and methods
#6460Through silicon via structure
#6461TSV structures and methods for forming the same
#6462Semiconductor device and manufacturing method thereof
#6463Under-bump metal structures for interconnecting semiconductor dies or packages and associated systems and methods
#6464Mechanisms for forming post-passivation interconnect structure
#6465Semiconductor device and fabricating method thereof
#6466Semiconductor device and manufacturing method thereof
#6467Pattern generator having stacked chips
#6468Fabrication methods of chip device packages
#6469Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same
#6470Package on-Package (PoP) structure including stud bulbs and method
#6471PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#6472Configurable routing for packaging applications
#6473Staged via formation from both sides of chip
#6474Post passivation interconnect structures and methods for forming the same
#6475Semiconductor device and method of manufacturing semiconductor device
#6476Semiconductor packaging device including via-in pad (VIP) and manufacturing method thereof
#6477Semiconductor constructions having through-substrate interconnects
#6478Semiconductor packaging and manufacturing method thereof
#6479Thermal dissipation through seal rings in 3DIC structure
#6480Method for singulating packaged integrated circuits and resulting structures
#6481Semiconductor packages and methods of manufacturing the same
#6482Method of forming interconnection structure of package structure
#6483Die-to-die gap control for semiconductor structure and method
#6484Chip device packages and fabrication methods thereof
#6485Methods and apparatus of packaging semiconductor devices
#6486Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#6487Packaging devices and methods of manufacture thereof
#6488Semiconductor devices and methods of forming thereof
#6489Semiconductor device and method for producing the same
#6490Semiconductor device and method for producing semiconductor device
#6491Semiconductor device and method for producing the same
#6492Vertically integrated systems
#6493Semiconductor device and method for manufacturing the same
#6494Alignment marks in substrate having through-substrate via (TSV)
#6495Method for treating a bond pad of a package substrate
#6496Semiconductor integrated circuit device
#6497Flip-chip, face-up and face-down centerbond memory wirebond assemblies
#6498Semiconductor device
#6499Semiconductor structure and manufacturing method thereof
#6500Semiconductor device for use in flip-chip bonding, which reduces lateral displacement
#6501Methods for manufacturing a chip arrangement, methods for manufacturing a chip package, a chip package and chip arrangements
#6502Semiconductor structure
#6503Silicon carbide semiconductor device and fabrication method of silicon carbide semiconductor device
#6504Conductive paste and die bonding method
#6505Integrated circuit combination of a target integrated circuit and a plurality of thin film photovoltaic cells connected thereto using a conductive path
#6506Method of manufacturing semiconductor device
#6507Stacked die package with aligned active and passive through-silicon vias
#65083D integrated circuit and methods of forming the same
#6509Structure to prevent solder extrusion
#6510Package on package structure and method of manufacturing the same
#6511Submount, encapsulated semiconductor element, and methods of manufacturing the same
#6512Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus
#6513Contact portion of wire and manufacturing method thereof
#6514Integrated circuit package with spatially varied solder resist opening dimension
#6515Semiconductor structure and manufacturing method thereof
#6516Semiconductor package and method of fabricating the same
#6517Semiconductor device for battery power voltage control
#6518Die and chip
#6519Stress buffer structures in a mounting structure of a semiconductor device
#6520Mechanism for forming patterned metal pad connected to multiple through silicon vias (TSVs)
#6521Semiconductor device with shielding layer in post-passivation interconnect structure
#6522Chip-stacked semiconductor package and method of manufacturing the same
#6523Method for producing photosensitive infrared detectors
#6524Integrated CMOS back cavity acoustic transducer and the method of producing the same
#6525Junction and electrical connection
#6526Method for processing a wafer and wafer structure
#6527Electrical connections for chip scale packaging
#6528Plug via formation with grid features in the passivation layer
#6529Method of assembly by direct bonding between two elements, each element comprising portions of metal and dielectric materials
#6530Semiconductor devices having through-vias and methods for fabricating the same
#6531Contact pad structure, an electronic component, and a method for manufacturing a contact pad structure
#65323D device packaging using through-substrate pillars
#6533Semiconductor device and method of forming patterned repassivation openings between RDL and UBM to reduce adverse effects of electro-migration
#6534Semiconductor device
#6535EXTERNAL CONNECTION TERMINAL, SEMICONDUCTOR PACKAGE HAVING EXTERNAL CONNECTION TERMINAL AND METHOD OF MANUFACTURING THE SAME
#6536Semiconductor chip and stacked semiconductor package having the same
#6537Electronic component package and method for forming same
#6538Connection member, semiconductor device, and stacked structure
#6539Chip package and method for forming the same
#6540Die edge side connection
#6541Copper ball bond features and structure
#6542Semiconductor device
#6543Electronic device, test board, and semiconductor device manufacturing method
#6544Liquid compositions and methods of fabricating a semiconductor device using the same
#6545Conductive ink for filling vias
#6546Semiconductor device and manufacturing method for the same
#6547Semiconductor device having voids between top metal layers of metal interconnects
#6548Methods of fabricating wafer-level flip chip device packages
#6549Via network structures and method therefor
#6550Bump structures in semiconductor packages and methods of fabricating the same
#6551Method for removing electroplated metal facets and reusing a barrier layer without chemical mechanical polishing
#6552Metallic particle paste, cured product using same, and semiconductor device
#6553Semiconductor device and fabrication method thereof and semiconductor structure
#6554Copper pillar bump and flip chip package using same
#6555Semiconductor device and method for manufacturing the same
#6556Apparatus and method for a component package
#6557Method for manufacturing a semiconductor device, and semiconductor device
#6558Removal of electrostatic charges from interposer for die attachment
#6559Monolithic bidirectional silicon carbide switching devices
#6560Multichip power semiconductor device
#6561Optical coupling module
#6562Semiconductor device
#6563Semiconductor device
#6564ESD protection device
#6565Semiconductor device
#6566Method of forming a memory device
#6567Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation
#6568Semiconductor device and manufacturing method of semiconductor device
#6569Three-dimensional chip stack and method of forming the same
#6570Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface
#6571Electronic device package and fabrication method thereof
#6572Dense-pitch small-pad copper wire bonded double IC chip stack packaging piece and preparation method therefor
#6573Substrate, method of fabricating the same, and application the same
#6574Wafer level dicing method
#6575Structure and method for cooling three-dimensional integrated circuits
#6576Bottom-up plating of through-substrate vias
#6577Electronic device packages having bumps and methods of manufacturing the same
#6578Substrateless power device packages
#6579Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging
#6580Interconnection structure with confinement layer
#6581METHOD OF MANUFACTURING CHIP PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING CHIP PACKAGE
#6582Semiconductor bonding structure and process
#6583Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure
#6584Stack of semiconductor structures and corresponding manufacturing method
#6585Semiconductor device with pads of enhanced moisture blocking ability
#6586Inductor structure and manufacturing method thereof
#6587Light emitting diodes and a method of packaging the same
#6588Chip-on-wafer bonding method and bonding device, and structure comprising chip and wafer
#6589Semiconductor package
#6590Semiconductor devices with through via electrodes, methods of fabricating the same, memory cards including the same, and electronic systems including the same
#6591Crack stopping structure in wafer level packaging (WLP)
#6592SEMICONDUCTOR DEVICE
#6593Multi-chip structure and method of forming same
#6594Alignment structures and methods of forming same
#6595Adhesive for semiconductor, fluxing agent, manufacturing method for semiconductor device, and semiconductor device
#6596Semiconductor package and method of manufacturing the same
#6597Electromagnetic field assisted self-assembly with formation of electrical contacts
#6598Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
#6599Packaging methods and structures for semiconductor devices
#6600Chip package and fabrication method thereof