Semiconductor device and method of making wafer level chip scale package

Structures and methods for improving solder bump connections in semiconductor devices

Electronic circuit device

Bonding structure including metal nano particle

Method for manufacturing semiconductor device, heat insulating load jig, and method for setting up heat insulating load jig

Packaging a semiconductor device having wires with polymerized insulator skin

Methods of forming articles including metal structures having maximized bond adhesion and bond reliability

Through-substrate via shielding

Semiconductor device and method of manufacturing the same

Segmented bond pads and methods of fabrication thereof

Vertical semiconductor MOSFET device with double substrate-side multiple electrode connections and encapsulation

Bump pad structure

Semiconductor device and manufacturing method thereof

Semiconductor devices with ball strength improvement

Devices, systems, and methods related to forming through-substrate vias with sacrificial plugs

Technique for wafer-level processing of QFN packages

Stack packages and methods of fabricating the same

Semiconductor device and method of manufacturing the same

Conductive pads and methods of formation thereof

Semiconductor device

Method for assembling a microelectronic chip element on a wire element, and installation enabling assembly to be performed

Semiconductor structures and methods of manufacture

Multi-function and shielded 3D interconnects

Mounting structure and mounting structure manufacturing method

SEMICONDUCTOR DEVICE WITH PLATED CONDUCTIVE PILLAR COUPLING

Semiconductor device

Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers

Semiconductor device

Solid state imaging apparatus and method of producing the same

Capacitor in post-passivation structures and methods of forming the same

Dam structure for enhancing joint yield in bonding processes

Semiconductor chip connecting semiconductor package

Interconnect structure and method of fabricating same

Semiconductor device and fabrication method thereof

Microelectronic packages having frontside thermal contacts and methods for the fabrication thereof

III-Nitride device with solderable front metal

Packaging for high power integrated circuits and infrared emitter arrays

Conductive structure and method for forming the same

Display device

Semiconductor device with pre-molding chip bonding

Semiconductor chip and stacked type semiconductor package having the same

Bond pad stack for transistors

Light emmiting diode chip

Semiconductor chips having improved solidity, semiconductor packages including the same and methods of fabricating the same

Chip package

Mechanisms for forming hybrid bonding structures with elongated bumps

Wafer level chip scale package with exposed thick bottom metal

Pad structure layout for semiconductor device

Semiconductor packages having through electrodes and methods for fabricating the same

Method of forming a reliable microelectronic assembly

Ball height control in bonding process

Micro-Spring Chip Attachment Using Solder-Based Interconnect Structures

Device having reduced pad peeling during tensile stress testing and a method of forming thereof

Metal to metal bonding for stacked (3D) integrated circuits

Stack type semiconductor package

Package with solder regions aligned to recesses

Electronic component and manufacturing method for electronic component

Electronic circuit arrangement and method of manufacturing the same

Packaging methods and packaged semiconductor devices

Leadless integrated circuit package having standoff contacts and die attach pad

Method of making a pillar structure having a non-metal sidewall protection structure

Pillar bumps and process for making same

Semiconductor device and method for manufacturing the same

Semiconductor device, fabrication method for a semiconductor device and electronic apparatus

Semiconductor device and method for manufacturing same

Semiconductor device and manufacturing method thereof

Semiconductor device

Semiconductor device

Method of fabricating semiconductor apparatus with through-silicon via and method of fabricating stack package including the semiconductor chip

Semiconductor device

Semiconductor device and manufacturing method of semiconductor device

Small footprint semiconductor package

Electroplating baths of silver and tin alloys

Moisture barrier for a wire bond

Method of assembling VCSEL chips on a sub-mount

Fan-out package structure and methods for forming the same

Semiconductor package including a substrate with a stepped sidewall structure

Semiconductor structure with sacrificial anode and passivation layer and method for forming

Surface mountable electronic component

Joining method, method for producing electronic device and electronic part

TSV structures and methods for forming the same

Copper pillar bump with cobalt-containing sidewall protection layer

Techniques for fabricating fine-pitch micro-bumps

Compliant interconnects in wafers

Three-dimensional vertically interconnected structure and fabricating method thereof

Semiconductor device comprising mold for top side and sidewall protection

Method for bonding wafers and structure of bonding part

Semiconductor package

Semiconductor device with through-substrate via covered by a solder ball and related method of production

Semiconductor device, manufacturing method thereof, and electronic apparatus

Method of making a conductive pillar bump with non-metal sidewall protection structure

Method of manufacturing semiconductor device

Methods of fabricating semiconductor stack packages

Methods of forming 3-D circuits with integrated passive devices

Chip package and method for forming the same

Chip package

Semiconductor device

Semiconductor device

Chip package and method for forming the same

Semiconductor device

Semiconductor device

Method for mounting a semiconductor chip on a carrier

Chip package and method for forming the same

Testing of semiconductor chips with microbumps

Through substrate via structures and methods of forming the same

Semiconductor device having under-bump metallization (UBM) structure and method of forming the same

Metal bump structure for use in driver IC and method for forming the same

Metal bump structure for use in driver IC and method for forming the same

Package structure and fabrication method thereof

Method of manufacturing a semiconductor device

Wide bandgap semiconductor device

Power semiconductor device, method of manufacturing the device and bonding wire

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Multiple band multiple mode transceiver front end flip-chip architecture and circuitry with integrated power amplifiers

Wafer backside interconnect structure connected to TSVs

Method of making bond pad

Metal bump joint structure and methods of forming

Semiconductor device and method of forming stress-reduced conductive joint structures

Contact pads with sidewall spacers and method of making contact pads with sidewall spacers

Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer

Image sensor package with trench insulator and fabrication method thereof

High quality factor filter implemented in wafer level packaging (WLP) integrated device

Wiring substrate and method for producing wiring substrate

Semiconductor device fabricating method

Wafer process for molded chip scale package (MCSP) with thick backside metallization

Wafer backside interconnect structure connected to TSVs

Semiconductor device and a method of manufacturing the same

Semiconductor device, semiconductor package, and electronic system

Wafer level array of chips and method thereof

Chip package and manufacturing method thereof

Semiconductor device

Layout structure of heterojunction bipolar transistors

Semiconductor element, semiconductor device and method for manufacturing semiconductor element

Pad over interconnect pad structure design

Fabrication method of semiconductor package

Methods of fabricating a chromium/titanium/aluminum-based semiconductor device contact

Chip interposer, semiconductor device, and method for manufacturing a semiconductor device

Warpage control for flexible substrates

Bonding wire for high-speed signal line

Semiconductor device and method of forming conductive vias using backside via reveal and selective passivation

Semiconductor device

Semiconductor device manufacturing method and semiconductor device

Chip and manufacturing method thereof

Semiconductor devices comprising getter layers and methods of making and using the same

Semiconductor devices comprising getter layers and methods of making and using the same

Semiconductor device and stacked semiconductor device

Methods of manufacturing flip chip semiconductor packages using double-sided thermal compression bonding

Scheme for connector site spacing and resulting structures

Through silicon via with embedded barrier pad

System and method of sensing current in a power semiconductor device

Method for manufacturing semiconductor devices having a metallisation layer

Semiconductor device having a through-substrate via

Semiconductor device and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Chip diode and diode package

Semiconductor device, method for manufacturing the same, and electronic device

Method for forming termination structure for gallium nitride Schottky diode

Method of manufacturing semiconductor device

Semiconductor package and printed circuit board

Method and apparatus of ESD protection in stacked die semiconductor device

Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof

Three-dimensional semiconductor architecture

Stress tuning for reducing wafer warpage

Fan-out interconnect structure and method for forming same

Methods and structures to facilitate through-silicon vias

Conductive line system and process

Package on-package joint structure with molding open bumps

Semiconductor device and method of forming a dual UBM structure for lead free bump connections

Integrated circuit structure having dies with connectors

Method for manufacturing a semiconductor chip with each contact pad having a pad cell associated therewith

Chip package and method for forming the same

Wafer stack protection seal

Three-terminal printed devices interconnected as circuits

Method of forming a HEMT semiconductor device and structure therefor

Light-emitting module and method of manufacturing a single light-emitting structure thereof

System and method for an improved interconnect structure

Under ball metallurgy (UBM) for improved electromigration

Transfer substrate for forming metal wiring and method for forming metal wiring with the transfer substrate

Interconnect structures and methods of forming same

Semiconductor structure having stage difference surface and manufacturing method thereof

Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package

Semiconductor chip with modified regions for dividing the chip

Semiconductor component comprising copper metallizations

Ball amount process in the manufacturing of integrated circuit

Packaging devices and methods of manufacture thereof

Interconnect structures and methods of forming same

Directly sawing wafers covered with liquid molding compound

Pad defined contact for wafer level package

WAFER-LEVEL PACKAGE MITIGATED UNDERCUT

Method and apparatus for constructing an isolation capacitor in an integrated circuit

Light emitting device

Vertical gallium nitride Schottky diode

Fabrication method of wiring structure for improving crown-like defect

Chip-on-lead package and method of forming

MEMS device and method of formation thereof

Floating bond pad for power semiconductor devices

Semiconductor device, wireless device, and storage device

Systems and methods for testing and packaging a superconducting chip

Semiconductor device, method of manufacturing thereof, signal transmission/reception method using such semiconductor device, and tester apparatus

Method of forming bump structure

Method for manufacturing a semiconductor device

Electronic device comprising at least a chip enclosed in a package and a corresponding assembly process

Integrated circuit (IC) having electrically conductive corrosion protecting cap over bond pads

Semiconductor device and method of forming micro-vias partially through insulating material around bump interconnect

Semiconductor device including a plurality of magnetic shields

Wafer level chip scale package and process of manufacture

Etching agent for copper or copper alloy

3D semiconductor device

Semiconductor constructions, semiconductor processing methods, methods of forming contact pads, and methods of forming electrical connections between metal-containing layers

Connector structures of integrated circuits

Semiconductor device and method for manufacturing the same

Chip package and method for forming the same

Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or strips

Semiconductor device and method of forming insulating layer in notches around conductive TSV for stress relief

Solderless die attach to a direct bonded aluminum substrate

Semiconductor module system having encapsulated through wire interconnect (TWI)

Structure and method of forming a pad structure having enhanced reliability

Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereof

Semiconductor device, semiconductor package, and electronic device

Bonding pad on a back side illuminated image sensor

Semiconductor device, and manufacturing method for same

Method of processing a substrate

Device including a semiconductor chip and wires

Semiconductor device allowing metal layer routing formed directly under metal pad

Semiconductor device

Electrical Connecting Element and Method for Manufacturing the Same

3D integrated circuit package with through-mold first level interconnects

Semiconductor device including a solder and method of fabricating the same

Method of processing a substrate

Method of making a die with recessed aluminum die pads

Microelectronic package with stacked microelectronic units and method for manufacture thereof

Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method

Semiconductor package including stacked chips and a redistribution layer (RDL) structure

Method of manufacturing semiconductor device capable of enhancing bonding strength between connection terminal and electrode

Packaging methods and packaged semiconductor devices

Semiconductor devices, methods of manufacture thereof, and semiconductor device packages

Chip package with improved heat dissipation and manufacturing method thereof

Flattened substrate surface for substrate bonding

Semiconductor device and fabrication method therefor, and power supply apparatus

Preform including a groove extending to an edge of the preform

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

Methods and arrangements relating to semiconductor packages including multi-memory dies

Active chip on carrier or laminated chip having microelectronic element embedded therein

Through silicon via structure

Methods and apparatus of packaging of semiconductor devices

Chip package and method for forming the same

Bump structural designs to minimize package defects

Semiconductor device having a bonding pad and shield structure and method of manufacturing the same

Package on package structures and methods for forming the same

Microelectronic assembly having a heat spreader for a plurality of die

Bonded system with coated copper conductor

Treatment method of electrodeposited copper for wafer-level-packaging process flow

In situ chamber clean with inert hydrogen helium mixture during wafer process

Method of manufacturing semiconductor device having pad region for wire-bonding

Method of manufacturing semiconductor device

Manufacturing method for semiconductor package, semiconductor package, and semiconductor device

Semiconductor package and method for fabricating base for semiconductor package

Forming interconnect structures using pre-ink-printed sheets

Bumps for chip scale packaging including under bump metal structures with different diameters

Metal routing architecture for integrated circuits

Methods and devices for fabricating and assembling printable semiconductor elements

Semiconductor device including passivation layer encapsulant

Semiconductor device

Waterfall wire bonding

Post-passivation interconnect structure and method of forming the same

Guard ring design for maintaining signal integrity

Semiconductor device and method of manufacturing the same

Method to integrate different function devices fabricated by different process technologies

Semiconductor device and method of manufacturing the same

Method for bonding of group III-nitride device-on-silicon and devices obtained thereof

Semiconductor package

Semiconductor device and method of making bumpless flipchip interconnect structures

Barrier for through-silicon via

Apparatuses and methods to enhance passivation and ILD reliability

Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties

Semiconductor device and method of simultaneous molding and thermalcompression bonding

Light-emitting device

Devices and systems for power conversion circuits

Substrate contact opening

UBM structures for wafer level chip scale packaging

Package systems and manufacturing methods thereof

Current sensor substrate and current sensor

Semiconductor device having through electrode and method of fabricating the same

Semiconductor device

Semiconductor wiring patterns

Methods and apparatus for package with interposers

Routing layer for mitigating stress in a semiconductor die

Pillar on pad interconnect structures, semiconductor devices including same and related methods

Flip chip package structure and fabrication process thereof

Low-cost low-profile solder bump process for enabling ultra-thin wafer-level packaging (WLP) packages

Normally off power electronic component

OLED device in contact with a conductor

Method for packaging low-K chip

CONTACT PAD STRUCTURE

Semiconductor device and method of forming low profile fan-out package with vertical interconnection units

Apparatus for package reinforcement using molding underfill

Power MOS device structure

Light-emitting diode and method of fabricating the same

Correcting current crowding in row bar and vias for single pad bonding

Method for permanently bonding wafers by a connecting layer by means of solid state diffusion or phase transformation