207785 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
Power overlay structure having wirebonds and method of manufacturing same
#6002Pad structure and display device having the same
#6003Semiconductor device comprising contact structures with protection layers formed on sidewalls of contact etch stop layers
#6004Method of manufacturing a single light-emitting structure
#6005Circuit substrate interconnect
#6006Integrated circuit packaging system with under bump metallization and method of manufacture thereof
#6007Semiconductor structure with oval shaped conductor
#6008Electronic devices with semiconductor die coupled to a thermally conductive substrate
#6009Chip package and method for forming the same
#6010Package-on-package structures
#6011Multi-die package with bridge layer and method for making the same
#6012Fan out package structure and methods of forming
#6013SEMICONDUCTOR DEVICE WITH A THROUGH ELECTRODE
#6014Semiconductor device and method comprising redistribution layers
#6015Shielded radio-frequency module having reduced area
#6016Semiconductor device
#6017Packaged device with additive substrate surface modification
#6018Integration of backside heat spreader for thermal management
#6019Wafer-level flip chip device packages and related methods
#6020Semiconductor device and method of manufacturing the same
#6021Metal to metal bonding for stacked (3D) integrated circuits
#6022Three dimensional integrated circuits stacking approach
#6023Metal to metal bonding for stacked (3D) integrated circuits
#6024Metal to metal bonding for stacked (3D) integrated circuits
#6025Metal to metal bonding for stacked (3D) integrated circuits
#6026Semiconductor device and a method of manufacturing the same
#6027Chip mounting
#6028Semiconductor package structure with polymeric layer and manufacturing method thereof
#6029Electronic component
#6030Electronic component
#6031SEMICONDUCTOR DEVICES INCLUDING THROUGH-SILICON-VIAS AND METHODS OF MANUFACTURING THE SAME AND SEMICONDUCTOR PACKAGES INCLUDING THE SEMICONDUCTOR DEVICES
#6032Integrated circuit packages and methods for forming the same
#6033Semiconductor device and method of adaptive patterning for panelized packaging
#6034Test probe head for full wafer testing
#6035BVA interposer
#6036Semiconductor package having stacked chips and a heat dissipation part and method of fabricating the same
#6037Wafer process for molded chip scale package (MCSP) with thick backside metallization
#6038Semiconductor device and a method of manufacturing the same
#6039Metal routing architecture for integrated circuits
#6040Package with UBM and methods of forming
#6041Package with UBM and methods of forming
#6042Semiconductor package including an embedded surface mount device and method of forming the same
#6043Semiconductor package structure and method of fabricating the same
#6044Contact pad for semiconductor devices
#6045Substrate structure and method of manufacturing the same
#6046Manufacturing method of power MOSFET using a hard mask as a CMP stop layer between sequential CMP steps
#6047Method for bonding metallic contact areas with solution of a sacrificial layer applied on one of the contact areas
#6048Substrateless integrated circuit packages and methods of forming same
#6049Preform structure for soldering a semiconductor chip arrangement, a method for forming a preform structure for a semiconductor chip arrangement, and a method for soldering a semiconductor chip arrangement
#6050Scheme for connector site spacing and resulting structures
#6051Through-silicon via access device for integrated circuits
#6052Through-silicon via access device for integrated circuits
#6053Template and pattern forming method
#6054Packaged semiconductor devices and methods of packaging thereof
#6055Stack structures in electronic devices including passivation layers for distributing compressive force
#6056Stack packages and methods of fabricating the same
#6057Chip packages and methods of manufacture thereof
#6058Packaging device having plural microstructures disposed proximate to die mounting region
#6059Method of forming a bump on pad (BOP) bonding structure in a semiconductor packaged device
#6060SEMICONDUCTOR DEVICE
#6061Semiconductor device and its manufacturing method
#6062Semiconductor package and method of forming the same
#6063Microelectronic packages having texturized solder pads and methods for the fabrication thereof
#6064Semiconductor device and structure therefor
#6065Semiconductor manufacturing for forming bond pads and seal rings
#6066Method for manufacturing a chip arrangement
#6067Method and structure for wafer level packaging with large contact area
#6068Light-emitting device comprising active nanowires and contact nanowires and method of fabrication
#6069Semiconductor integrated circuit including power TSVS
#6070Metallized electric component
#6071Wafer with liquid molding compound and post-passivation interconnect
#6072Semiconductor package
#6073TSV formation
#6074Metal pad structure over TSV to reduce shorting of upper metal layer
#6075Apparatus and method for establishing an electrically conductive and mechanical connection
#6076Etching agent for copper or copper alloy
#6077Method for fabricating electronic device package
#6078Semiconductor device and method of manufacturing the same
#6079Integrated circuit comprising at least an integrated antenna
#6080Multiple bond via arrays of different wire heights on a same substrate
#6081Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias
#6082Making electrical components in handle wafers of integrated circuit packages
#6083Semiconductor device and method for fabricating the same
#6084Preventing misshaped solder balls
#6085ETCHING OF UNDER BUMP METALLIZATION LAYER AND RESULTING DEVICE
#6086Pad structure of a semiconductor device, method of manufacturing the pad structure and semiconductor package including the pad structure
#6087Semiconductor package
#6088Etching liquid, etching method, and method of manufacturing solder bump
#6089Method for forming interconnect structure
#6090Semiconductor device including a trench at least partially filled with a conductive material in a semiconductor substrate
#6091Common drain semiconductor device structure and method
#6092Microelectronic package with stacked microelectronic units and method for manufacture thereof
#6093Stacked structure of semiconductor chips having via holes and metal bumps
#6094Semiconductor TSV device package for circuit board connection
#6095Semiconductor TSV device package for circuit board connection
#6096Bump structural designs to minimize package defects
#6097Tin alloy electroplating solution for solder bumps including perfluoroalkyl surfactant
#6098Bump pad structure
#6099Semiconductor device
#6100MCSP power semiconductor devices and preparation methods thereof
#6101Manufacturing Method of Semiconductor Device
#6102Latch-up suppression and substrate noise coupling reduction through a substrate back-tie for 3D integrated circuits
#6103Semiconductor laser mounting with intact diffusion barrier layer
#6104Light emitting device and method for manufacturing same
#6105Array substrate, method for fabricating the same and display device
#6106Electrical connector between die pad and z-interconnect for stacked die assemblies
#6107Semiconductor device
#6108Elongated bump structures in package structure
#6109Memory device structure
#6110Semiconductor device redistribution layer with narrow trace width relative to passivation layer opening
#6111Semiconductor chip and method for forming a chip pad
#6112Semiconductor structure with an interconnect level having a conductive pad and metallic structure such as a base of a crackstop
#6113Two step method of rapid curing a semiconductor polymer layer
#6114Device and method for improving RF performance
#6115Semiconductor laser structure
#6116Schottky Diode and Method of Manufacturing the Same
#6117Copper-containing layer on under-bump metallization layer
#6118Semiconductor devices having through electrodes, methods of fabricating the same, electronic systems including the same, and memory cards including same
#6119Method of making bond pad
#6120Semiconductor device and manufacturing method thereof
#6121Moisture barrier for semiconductor structures with stress relief
#6122Semiconductor device
#6123Complementary thin film transistor drive back-plate and manufacturing method thereof, display panel
#6124Substrate interconnections having different sizes
#6125CHIP, CHIP-STACKED PACKAGE USING THE SAME, AND METHOD OF MANUFACTURING THE CHIP-STACKED PACKAGE
#6126Integrated fan-out package structures with recesses in molding compound
#6127Electronic device
#6128Device with pillar-shaped components
#6129Electronic device
#6130Semiconductor device and method of manufacturing the same
#6131Semiconductor wiring patterns
#6132PACKAGE SUBSTRATE AND METHOD OF FABRICATING SEMICONDUCTOR PACKAGE
#6133Bumps bonds formed as metal line interconnects in a semiconductor device
#6134Stacked semiconductor device
#6135Semiconductor device
#6136Electronic device and mounting structure of the same
#6137Integrated system and method of making the integrated system
#6138Semiconductor device
#6139Multi-die semiconductor structure with intermediate vertical side chip and semiconductor package for same
#6140Semiconductor devices having through electrodes, methods of manufacturing the same, and semiconductor packages including the same
#6141Methods and apparatus of packaging semiconductor devices
#6142Semiconductor device with metal film and method for manufacturing semiconductor device with metal film
#6143Semiconductor chip, semiconductor package and fabricating method thereof
#6144Semiconductor device
#6145Electronic component and method for dissipating heat from a semiconductor die
#6146Method of forming semiconductor device having a conductive via structure
#6147Semiconductor device and manufacturing method
#6148Fan-out package structure and methods for forming the same
#6149Method for carrying out a conductive direct metal bonding
#6150Multiple bond via arrays of different wire heights on a same substrate
#6151Surface finish for wirebonding
#6152Semiconductor device including a protective film
#6153Semiconductor device and method for manufacturing the semiconductor device
#6154Semiconductor chip and method of manufacturing the same
#6155SEMICONDUCTOR PACKAGE
#6156Capacitor in post-passivation structures and methods of forming the same
#6157Glass/ceramic replacement of epoxy for high temperature hermetically sealed non-axial electronic packages
#6158Contact test structure and method
#6159Method of manufacturing semiconductor package including forming a recessed region in a substrate
#6160Semiconductor device
#6161Semiconductor device having a device fixed on a substrate with an adhesive
#6162Electrostatic discharge protection device
#6163Bonding package components through plating
#6164Micro-pillar assisted semiconductor bonding
#6165Integrated circuit having electromagnetic shielding capability and manufacturing method thereof
#61663D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
#6167Interconnect structure with footing region
#6168Direct die solder of gallium arsenide integrated circuit dies and methods of manufacturing gallium arsenide wafers
#6169Methods of packaging semiconductor devices and structures thereof
#6170Method for building up a fan-out RDL structure with fine pitch line-width and line-spacing
#6171Conductive line system and process
#6172Testing of semiconductor chips with microbumps
#6173Methods of packaging semiconductor devices and packaged semiconductor devices
#6174Semiconductor device and manufacturing method therefor
#6175Semiconductor device
#6176Hybrid bonding mechanisms for semiconductor wafers
#6177Power semiconductor device with small contact footprint and the preparation method
#6178Through via structure
#61793D packages and methods for forming the same
#6180Three-dimensional semiconductor architecture
#6181Method of making integrated circuit
#6182Radiation hardened by design digital input/output circuits and related methods
#6183Shielded package assemblies with integrated capacitor
#6184Conductive pad structure and method of fabricating the same
#6185Die seal ring for integrated circuit system with stacked device wafers
#6186Semiconductor device
#6187Semiconductor device having trench adjacent to receiving area and method of forming the same
#6188Method of forming a semiconductor component comprising a second passivation layer having a first opening exposing a bond pad and a plurality of second openings exposing a top surface of an underlying first passivation layer
#6189Contact pad for semiconductor device
#6190Package systems
#6191Methods of fabricating semiconductor chip solder structures
#6192Semiconductor device
#6193Semiconductor structure having recess and manufacturing method thereof
#6194Semiconductor package device and forming the same
#6195Methods of forming semiconductor device assemblies and interconnect structures, and related semiconductor device assemblies and interconnect structures
#6196GaN power device with solderable back metal
#6197Electrical barrier layers
#6198Detecting and driving load using MOS transistor
#6199Semiconductor component with a monocrystalline semiconductor region arranged in a via region
#6200Bonding pad arrangment design for multi-die semiconductor package structure
#6201Bonding wire to bonding pad
#6202Interconnect structure with improved conductive properties and associated systems and methods
#6203Semiconductor device having solderable and bondable electrical contact pads
#6204Contact pads for integrated circuit packages
#6205Semiconductor structure with composite barrier layer under redistribution layer and manufacturing method thereof
#6206Metal pad offset for multi-layer metal layout
#6207Semiconductor devices and methods of fabricating the same
#6208Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system
#6209Semiconductor device including sense insulated-gate bipolar transistor
#6210Chip package and method for forming the same
#6211Metal bump joint structure
#6212Method of making a pillar structure having a non-metal sidewall protection structure and integrated circuit including the same
#6213Conductive connections, structures with such connections, and methods of manufacture
#6214Semiconductor device
#6215Method of forming post-passivation interconnect structure
#6216INTEGRATED CIRCUIT
#6217Chip packages and methods of manufacturing the same
#6218Method for processing a semiconductor workpiece and semiconductor workpiece
#6219Methods and apparatus of guard rings for wafer-level-packaging
#6220Conductive connections, structures with such connections, and methods of manufacture
#6221Devices and systems comprising drivers for power conversion circuits
#6222Semiconductor package and method of manufacturing the same
#6223Metal cored solder decal structure and process
#6224Bonding structures and methods of forming the same
#6225Semiconductor chip having different conductive pad widths and method of making layout for same
#6226Wafer having pad structure
#6227Methods of fabrication and testing of three-dimensional stacked integrated circuit system-in-package
#6228Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the same
#6229Structures for reducing corrosion in wire bonds
#6230Electronic component and electronic device
#6231Polymer layers embedded with metal pads for heat dissipation
#6232Electromagnetic bandgap structure for three dimensional ICS
#6233Semiconductor device
#6234SCRIBE LINE STRUCTURE AND METHOD OF FORMING SAME
#6235Semiconductor package and system with an isolation structure to reduce electromagnetic coupling
#6236Assembly structure for connecting multiple dies into a system-in-package chip and the method thereof
#6237Tin plating solution, tin plating equipment, and method for fabricating semiconductor device using the tin plating solution
#6238Three-terminal printed devices interconnected as circuits
#6239Connector structures of integrated circuits
#6240Metal contact for semiconductor device
#6241Bowl-shaped solder structure
#6242Power management applications of interconnect substrates
#6243Dicing wafers having solder bumps on wafer backside
#6244Field-effect transistor
#6245Semiconductor device for reducing propagation time of gate input signals
#6246Semiconductor device for reducing gate wiring length
#6247Optoelectronic component with integrated protection diode and method of producing same
#6248Semiconductor device and method of manufacturing the same
#6249Semiconductor device
#6250Interconnection structure having a via structure and fabrication thereof
#6251Circuits incorporating integrated passive devices having inductances in 3D configurations and stacked with corresponding dies
#6252Semiconductor device with output circuit and pad arrangements
#6253Mounting method
#6254Hybrid bonding systems and methods for semiconductor wafers
#6255Semiconductor device including a buffer layer structure for reducing stress
#6256Integrated circuit chip and fabrication method
#6257Metal contact for semiconductor device
#6258Integrated circuit device
#6259Solder pad for semiconductor device package
#6260Semiconductor device
#6261Conductive pads and methods of formation thereof
#6262Through-silicon via with low-K dielectric liner
#6263Collapsible probe tower device and method of forming thereof
#6264Chromium/titanium/aluminum-based semiconductor device contact fabrication
#6265Semiconductor device
#6266COMPOUND SEMICONDUCTOR INTEGRATED CIRCUIT WITH THREE-DIMENSIONALLY FORMED COMPONENTS
#6267Semiconductor device
#6268Wafer level device and method with cantilever pillar structure
#6269Manufacture of coated copper pillars
#6270Metal pillar bump packaging strctures and fabrication methods thereof
#6271Semiconductor chip with patterned underbump metallization and polymer film
#6272Semiconductor device
#6273Semiconductor device with thick bottom metal and preparation method thereof
#6274Interconnect etch with polymer layer edge protection
#6275Method of fabricating semiconductor device using gang bonding and semiconductor device fabricated by the same
#6276Semiconductor device and method of manufacturing the same
#6277Jointed structure and method of manufacturing same
#6278Chip package and method thereof
#6279PAD STRUCTURE FOR SEMICONDUCTOR DEVICE CONNECTION
#6280Semiconductor chip and semiconductor package having the same
#6281Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#6282Semiconductor devices and methods of making the same
#6283Semiconductor device
#6284Front-side emitting mid-infrared light emitting diode fabrication methods
#6285Substrate bonding with diffusion barrier structures
#6286Integrated circuit assemblies with reinforcement frames, and methods of manufacture
#6287Semiconductor chip and semiconductor package
#6288Semiconductor device structure and manufacturing method
#6289Solder stud structure
#6290Semiconductor device structure and manufacturing method
#6291Bump structure and method for forming the same
#6292Methods and apparatus of packaging semiconductor devices
#6293SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#6294Semiconductor device and method for forming the same
#6295Semiconductor arrangement and formation thereof
#6296Electronic device including soldered surface-mount component
#6297COF type semiconductor package and method of manufacturing the same
#6298Dam for three-dimensional integrated circuit
#6299Integrated circuit package
#6300Method for manufacturing semiconductor device and semiconductor device