SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Via network structures and method therefor

METHODS OF FORMING BONDED SEMICONDUCTOR STRUCTURES, AND SEMICONDUCTOR STRUCTURES FORMED BY SUCH METHODS

Semiconductor device having pad region for wire-bonding and method of manufacturing the semiconductor device

Methods for forming a semiconductor structure

Method for the production of an electronic component and electronic component produced according to this method

Semiconductor device and method of manufacturing the same

Semiconductor die having fine pitch electrical interconnects

Integrated circuit device

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Selective electromigration improvement for high current C4s

Semiconductor device

RELIABLE SOLDER BUMP COUPLING WITHIN A CHIP SCALE PACKAGE

Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure

Voltage switchable dielectric for die-level electrostatic discharge (ESD) protection

Semiconductor device and manufacturing method thereof

Semiconductor packages

Semiconductor device and method of manufacturing the same

Method of fabricating a semiconductor chip with supportive terminal pad

LAYOUT SCHEME FOR AN INPUT OUTPUT CELL

Semiconductor device

Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus

Apparatuses and methods to enhance passivation and ILD reliability

IC wafer having electromagnetic shielding effects and method for making the same

Reduction of fluorine contamination of bond pads of semiconductor devices

Devices including bond pad having protective sidewall seal

Compression and cold weld sealing method for an electrical via connection

Production method for thick film metal electrode and production method for thick film resist

High voltage semiconductor device and driving circuit

IC devices having TSVS including protruding tips having IMC blocking tip ends

Protection of reactive metal surfaces of semiconductor devices during shipping by providing an additional protection layer

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC SYSTEM USING THE SAME

POWER CONVERTER

Template and pattern forming method

Semiconductor die with integrated electro-static discharge device

Air-gap C4 fluidic I/O interconnects and methods of fabricating same

Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates

Semiconductor device and method of confining conductive bump material during reflow with solder mask patch

Solder bump interconnect

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor device and method for manufacturing the same

Chip package and method for forming the same

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer

Semiconductor device and method of manufacturing the same

Process for wet passivation of bond pads for protection against subsequent TMAH-based processing

Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereof

Active matrix substrate

Moisture barrier for a wire bond

Semiconductor device and method of forming vertical interconnect structure between semiconductor die and substrate

Flip chip package

Semiconductor device and fabrication method thereof

IGBT power semiconductor package having a conductive clip

Semiconductor device having a bus configuration which reduces electromigration

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Through-hole electrode substrate and method of manufacturing the same

Interconnections for fine pitch semiconductor devices and manufacturing method thereof

Semiconductor packages and methods of packaging semiconductor devices

Semiconductor device and method for manufacturing the same

Semiconductor apparatus, method for manufacturing the same and electric device

Semiconductor devices including a through-substrate conductive member with an exposed end

Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP

Semiconductor device and method of forming conductive THV and RDL on opposite sides of semiconductor die for RDL-to-RDL bonding

Semiconductor device and method of forming bond wires between semiconductor die contact pads and conductive TOV in peripheral area around semiconductor die

Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer

Ni plating of a BLM edge for Pb-free C4 undercut control

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

Bonded Semiconductor Structure With Pyramid-Shaped Alignment Openings and Projections

Solid-state imaging device, manufacturing method thereof, electronic apparatus, and semiconductor device

Routing method for flip chip package and apparatus using the same

Methods of fabricating semiconductor devices

Display device

Bond pad structure

Semiconductor device and method of forming multi-layered UBM with intermediate insulating buffer layer to reduce stress for semiconductor wafer

Joining electrode, method of manufacturing the same, semiconductor device, and method of manufacturing the same

Apparatus and methods for uniform metal plating

WAFER CHIP SCALE PACKAGE CONNECTION SCHEME

Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process

Chip package with plank stack of semiconductor dies

Semiconductor-on-insulator with back side connection

Semiconductor device including gate electrode provided over active region in P-type nitride semiconductor layer and method of manufacturing the same, and power supply apparatus

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR MODULE, AND MOBILE DEVICE

Method for mounting a semiconductor chip on a carrier

Semiconductor device and manufacturing method therefor

Passivation layer for semiconductor device packaging

On-Chip RF shields with front side redistribution lines

Process for forming an anti-oxidant metal layer on an electronic device

Testing of semiconductor chips with microbumps

Semiconductor chip and fabricating method thereof

Integrated circuit package system with post-passivation interconnection and integration

Patterns of passivation material on bond pads and methods of manufacture thereof

Devices containing silver compositions deposited by micro-deposition direct writing silver conductor lines

MEMS and protection structure thereof

Semiconductor chip package structure, semiconductor chip and semiconductor chip group

Semiconductor device including a lead frame

Semiconductor device and a method of manufacturing the same

PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor-on-insulator with back side strain inducing material

METHOD OF FORMING UNDERBUMP METALLURGY STRUCTURE EMPLOYING SPUTTER-DEPOSITED NICKEL COPPER ALLOY

IC device having low resistance TSV comprising ground connection

WAFER-LEVEL CHIP SCALE PACKAGING OF METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT-TRANSISTORS (MOSFET'S)

Stacked semiconductor device

Semiconductor device, method for manufacturing the same, and data processing device

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Interconnection structure

Elongated bump structure for semiconductor devices

Extended under-bump metal layer for blocking alpha particles in a semiconductor device

Chip package structure with ENIG plating

Semiconductor device and method of forming stud bumps over embedded die

Method of making ferroelectric memory device with barrier layer and novolac resin passivation layer

INPUT/OUTPUT CORE DESIGN AND METHOD OF MANUFACTURE THEREFOR

Stacked structure of chips

IC device having low resistance TSV comprising ground connection

WIRING STRUCTURE OF SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE WIRING STRUCTURE

Circuit substrate and method of manufacturing same

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Manufacturing method of semiconductor device and semiconductor device

Chip package and method for forming the same

Multichip Packages

METHOD FOR JOINING BONDING WIRE, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

COPPER-BASED METALLIZATION SYSTEM INCLUDING AN ALUMINUM-BASED TERMINAL LAYER

Semiconductor device

Flow sensors having nanoscale coating for corrosion resistance

Area efficient through-hole connections

Pad bonding employing a self-aligned plated liner for adhesion enhancement

METHOD FOR PACKAGING WAFER

Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP

Three-dimensional integrated circuits with protection layers

Layered chip package and method of manufacturing the same

Device including two semiconductor chips and manufacturing thereof

Semiconductor package and method for fabricating the same

Semiconductor device and method of forming column interconnect structure to reduce wafer stress

Structures for improving current carrying capability of interconnects and methods of fabricating the same

Thermally enhanced semiconductor package system

DIRECT THROUGH VIA WAFER LEVEL FANOUT PACKAGE

Semiconductor apparatus having penetration electrode and method for manufacturing the same

Using backside passive elements for multilevel 3D wafers alignment applications

Solid-state imaging element, method for manufacturing solid-state imaging element, and electronic device

Semiconductor device and stacked semiconductor device

DEVICE ALLOWING SUPPRESSION OF STRESS ON CHIP

Structure of electrolessly palladium and gold plated films and process for making the same, assembled structure of palladium and gold plated films bonded with copper or copper-palladium wire and assembling process therefore

Accurate alignment for stacked substrates

Method for forming chip package

Method of manufacturing semiconductor device

Shared Electrostatic Discharge Protection For Integrated Circuits, Integrated Circuit Assemblies And Methods For Protecting Input/Output Circuits

Patternable adhesive composition, semiconductor package using the same, and method of manufacturing semiconductor package

Forming through-silicon-vias for multi-wafer integrated circuits

PACKAGE STRUCTURE, PACKAGING SUBSTRATE AND CHIP

Semiconductor Device and Method of Forming Bond Wires and Stud Bumps in Recessed Region of Peripheral Area around the Device for Electrical Interconnection to Other Devices

METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR SEMICONDUCTOR PACKAGE

Chip package and method for forming the same

Increasing dielectric strength by optimizing dummy metal distribution

Dummy metal design for packaging structures

METHOD FOR FORMING AN OVER PAD METALIZATION (OPM) ON A BOND PAD

Driver for a semiconductor chip

Warpage control features on the bottomside of TSV die lateral to protruding bottomside tips

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

SEMICONDUCTOR DEVICE INCLUDING A HEAT SPREADER

Geometry of contact sites at brittle inorganic layers in electronic devices

Chip-exposed semiconductor device

Semiconductor device

Integrated circuit chip and fabrication method

Method of manufacturing semiconductor device

Semiconductor device

Semiconductor device having a copper plug

Methods and designs for localized wafer thinning

Chip package and method for forming the same

Flip chip device having simplified routing

Wafer level molding structure

Stack type semiconductor package and method of fabricating the same

Anti-reflection structures for CMOS image sensors

Methods and Structures Involving Terminal Connections

Semiconductor package with a metal post and manufacturing method thereof

Ultrasonic wire bonding method for a semiconductor device

Method of manufacturing semiconductor device including plural semiconductor chips stacked together

Vacuum wafer level packaging method for micro electro mechanical system device

Vertically integrated systems

Method for producing vias in fan-out wafers using dry film and conductive paste, and a corresponding semiconductor package

BALL GRID ARRAY METHOD AND STRUCTURE

Three-dimensional system-in-package package-on-package structure

Chip scale surface mounted semiconductor device package and process of manufacture

Semiconductor power device having a super-junction structure

Semiconductor device including capacitor under pad

Light-emitting diode die package and method for producing same

Light-emitting diode die package and method for producing same

Method and apparatus of fabricating a pad structure for a semiconductor device

Chip pad resistant to antenna effect and method

Method of forming semiconductor device

Solder paste, joining method using the same and joined structure

CRACK REDUCTION AT METAL/ORGANIC DIELECTRIC INTERFACE

Semiconductor devices and methods of manufacturing semiconductor devices

Method of fabricating a TSV for 3D packaging of semiconductor device

Semiconductor device

Simultaneous wafer bonding and interconnect joining

Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods

Localized alloying for improved bond reliability

Semiconductor device and method of manufacturing semiconductor device

Bump structure and manufacturing method thereof

Method for chip scale package and package structure thereof

IC device having electromigration resistant feed line structures

Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures

SEMICONDUCTOR DEVICE

Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps

3D integrated circuit device fabrication with precisely controllable substrate removal

Void-free wafer bonding using channels

Methods of forming light emitting devices having current reducing structures

Integrated circuit for detecting defects of through chip via

Semiconductor device

3D integrated circuit device fabrication with precisely controllable substrate removal

Integrated circuit package connected to a data transmission medium

Semiconductor device for battery power voltage control

Semiconductor wiring patterns

Semiconductor device and method of manufacture thereof

Integrated circuit chip and fabrication method

Wafer-level interconnect for high mechanical reliability applications

BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES

Solder bump connections

Compliant interconnects in wafers

INTEGRATED CIRCUITS AND FABRICATION PROCESS THEREOF

Semiconductor device and method of forming an inductor within interconnect layer vertically separated from semiconductor die

Chip package and method for forming the same

Semiconductor component with a semiconductor via

Chip package and method for forming the same

Methods of manufacturing a semiconductor device

Aluminum enhanced palladium CMP process

Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package

Offset solder vias, methods of manufacturing and design structures

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Soft error rate mitigation by interconnect structure

Transistor power switch device and method of measuring its characteristics

Method of processing a substrate

Surface mount semiconductor device

SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF

MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME

Through silicon via for use in integrated circuit chips

STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEMICONDUCTOR DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor packages and methods of manufacturing the same

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME

ELECTRONIC DEVICE, RESONATOR, OSCILLATOR AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME

Semiconductor Device with Cross-shaped Bumps and Test Pads Alignment

Semiconductor device having conductive vias and semiconductor package having semiconductor device

Semiconductor device and semiconductor package having the same

Semiconductor device and manufacturing method thereof

Contact Array for Substrate Contacting

Integrated circuit manufacturing method and integrated circuit

Wafer level chip package and a method of fabricating thereof

Solder interconnect pads with current spreading layers

SEMICONDUCTOR DEVICE

Integrated circuit package and physical layer interface arrangement

SEMICONDUCTOR SUBSTRATE AND METHOD THEREOF

Semiconductor device and method of forming passive devices

Semiconductor package

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS, MOUNTING METHOD AND SEMICONDUCTOR CHIP FOR VERTICAL MOUNTING ONTO CIRCUIT SUBSTRATES

PACKAGE CARRIER

Wiring structure for improving crown-like defect and fabrication method thereof

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

Method Of Manufacturing Semiconductor Package Board

Heater design for heat-trimmed thin film resistors

Input/output core design and method of manufacture therefor

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

Semiconductor package with bonding wires of reduced loop inductance

Electrical connector between die pad and z-interconnect for stacked die assemblies

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Wafer level semiconductor package and manufacturing methods thereof

METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Conductive pads defined by embedded traces

Adding cap to copper passivation flow for electroless plating

Grain refinement by precipitate formation in Pb-free alloys of tin

Ni plating of a BLM edge for Pb-free C4 undercut control

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DEVICE MOUNT AND METHOD OF MANUFACTURE THEREOF

Semiconductor device and method of manufacturing semiconductor device

Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD)

Semiconductor device

Semiconductor device manufacturing method and semiconductor device

Contact pad

Laser assisted transfer welding process

Vialess integration for dual thin films—thin film resistor and heater

Light emitting device with electrode having recessed concave portion

Silicon structure having bonding pad

Semiconductor structure and method for making same

Electroplated posts with reduced topography and stress

SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR PACKAGE

Seal ring in an integrated circuit die

SEMICONDUCTOR DEVICE, SEMICONDUCTOR GROUP MEMBER AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Etching composition for an under-bump metallurgy layer

ALUMINUM BOND PADS WITH ENHANCED WIRE BOND STABILITY

ELECTRICALLY CONDUCTIVE INTERCONNECT SYSTEM AND METHOD

Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device

Pattern layout in semiconductor device

Electronic component and electronic device

Electronic device and electronic apparatus

Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias

Bonding wire for semiconductor device

Semiconductor device and method for manufacturing the same