207785 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers
#7502Interconnection Between Integrated Circuit and Package
#7503Semiconductor device and method for manufacturing semiconductor device
#7504Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding
#7505Synchronous buck converter having coplanar array of contact bumps of equal volume
#7506Integrated circuit and method of making
#7507Metal pad structures in dies
#7508Semiconductor structure including guard ring
#7509Semiconductor structure including guard ring
#7510METHOD OF REPAIRING PROBE PADS
#7511Manufacturing method of semiconductor integrated circuit device
#7512Bonding pad structure for semiconductor devices
#7513Semiconductor device and method of forming protection and support structure for conductive interconnect structure
#7514Semiconductor device and method of forming protection and support structure for conductive interconnect structure
#7515Semiconductor device, semiconductor wafer and manufacturing method of semiconductor device
#7516PASTE AND METHOD FOR CONNECTING ELECTRONIC COMPONENT TO SUBSTRATE
#7517Chips having rear contacts connected by through vias to front contacts
#7518Substrate structure with compliant bump and manufacturing method thereof
#7519Method and structure of monolithically integrated ESD supperssion device
#7520Method of repairing probe pads
#7521Bonding contact area on a semiconductor substrate
#7522Semiconductor integrated circuit device
#7523Strain-compensating fill patterns for controlling semiconductor chip package interactions
#7524System and method for 3D integrated circuit stacking
#7525Semiconductor package with improved pillar bump process and structure
#7526Packaging methods and structures for semiconductor devices
#7527SEMICONDUCTOR DEVICE
#7528Substrate structure with compliant bump and manufacturing method thereof
#7529Spot plated leadframe and IC bond pad via array design for copper wire
#7530Semiconductor chip
#7531Package systems including passive electrical components
#7532Pillar structure having a non-planar surface for semiconductor devices
#7533ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
#7534Electronic circuit device
#7535Die having wire bond alignment sensing structures
#7536Die-to-die gap control for semiconductor structure and method
#7537Semiconductor wafer and laminate structure including the same
#7538Bond pad configurations for controlling semiconductor chip package interactions
#7539Self-aligned protection layer for copper post structure
#7540STACKED CHIP PACKAGE AND FABRICATION METHOD THEREOF
#7541Methods of fabricating semiconductor chip solder structures
#7542High density gallium nitride devices using island topology
#7543Bond pad monitoring structure and related method of detecting significant alterations
#7544Method and apparatus for fabricating integrated circuit device using self-organizing function
#7545Semiconductor laser mounting with intact diffusion barrier layer
#7546Bond pad structure to reduce bond pad corrosion
#7547Package-on-package structures
#7548Solder Bump Bonding In Semiconductor Package Using Solder Balls Having High-Temperature Cores
#7549Integrated circuit die with low thermal resistance
#7550MEMS device having chip scale packaging
#7551Through silicon via layout
#7552Conductive routings in integrated circuits using under bump metallization
#7553CMOS image sensor and method for forming the same
#7554Semiconductor device having a through-substrate via
#7555Semiconductor device, semiconductor package, method for manufacturing semiconductor device, and method for manufacturing semiconductor package
#7556Method for inhibiting growth of intermetallic compounds
#7557Bump pad structure
#7558Wafer level package structure and the fabrication method thereof
#7559Integrated circuit chip with reduced IR drop
#7560Semiconductor package with under bump metallization routing
#7561Wafer level chip scale package with thick bottom metal exposed and preparation method thereof
#7562Method of fabricating a semiconductor device having recessed bonding site
#7563Cleaning residual molding compound on solder bumps
#7564Method of forming a semiconductor device with a contact pad on a sloped silicon dioxide surface
#7565Structure and method for power field effect transistor
#7566WAFER LEVEL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#7567SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#7568Microelectronic package with stacked microelectronic elements and method for manufacture thereof
#7569Semiconductor device
#7570Routing layer for mitigating stress in a semiconductor die
#7571Semiconductor device comprising through-electrode interconnect
#7572Integrated inductor
#7573Pad structure including glue layer and non-low-k dielectric layer in BSI image sensor chips
#7574High temperature gold-free wafer bonding for light emitting diodes
#7575Method of making a die with recessed aluminum die pads
#7576Method and system for forming conductive bumping with copper interconnection
#7577Method of manufacturing semiconductor device
#7578TCE compensation for package substrates for reduced die warpage assembly
#7579Method for manufacturing wafer-bonded semiconductor device
#7580Power semiconductor chip having two metal layers on one face
#7581Integrated circuit comprising at least an integrated antenna
#7582WAFER LEVEL CHIP SCALE PACKAGE FOR WIRE-BONDING CONNECTION
#7583Semiconductor device and manufacturing method therefor
#7584Integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad
#7585Manufacturing method for semiconductor device
#7586Electronic chip comprising connection pillars and manufacturing method
#7587Coaxial solder bump support structure
#7588Bump structures in semiconductor device and packaging assembly
#7589Method and device for circuit routing by way of under-bump metallization
#7590Semiconductor device
#7591Glass/ceramics replacement of epoxy for high temperature hermetically sealed non-axial electronic packages
#7592Testing architecture of circuits integrated on a wafer
#7593Fused buss for plating features on a semiconductor die
#7594SOFT DILUTE COPPER ALLOY WIRE, SOFT DILUTE COPPER ALLOY PLATE AND SOFT DILUTE COPPER ALLOY STRANDED WIRE
#7595Bumping process and structure thereof
#7596Composite layered chip package
#7597Contact pad
#7598Interconnect pillars with directed compliance geometry
#7599Bonding surfaces for direct bonding of semiconductor structures
#7600Semiconductor device and a method of manufacturing the same
#7601Chip package and fabrication method thereof
#7602Techniques and structures for testing integrated circuits in flip-chip assemblies
#7603Substrate for semiconductor package and semiconductor package having the same
#7604Process for preparing a bonding type semiconductor substrate
#7605Manufacturing method of semiconductor device and semiconductor device
#7606Bond pad configurations for semiconductor dies
#7607Semiconductor device having through electrode and method of fabricating the same
#7608Optoelectronic semiconductor device
#7609Solder ball contact susceptible to lower stress
#7610Solder bump with inner core pillar in semiconductor package
#7611Semiconductor device with solder bump formed on high topography plated Cu pads
#7612Semiconductor device having antenna element and method of manufacturing same
#7613SEMICONDUCTOR PACKAGE INCLUDING AN EXTERNAL CIRCUIT ELEMENT
#7614Method of forming an inductor on a semiconductor wafer
#7615Junction barrier Schottky diode with enforced upper contact structure and method for robust packaging
#7616Electrical barrier layers
#7617Semiconductor device for improving electrical and mechanical connectivity of conductive pillers and method therefor
#7618UBM etching methods for eliminating undercut
#7619Semiconductor device, fabrication method for a semiconductor device and electronic apparatus
#7620Forming wafer-level chip scale package structures with reduced number of seed layers
#7621SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#7622SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#7623SEMICONDUCTOR CHIP AND FLIP-CHIP PACKAGE COMPRISING THE SAME
#7624Backside illumination sensor having a bonding pad structure and method of making the same
#7625Ball-limiting-metallurgy layers in solder ball structures
#7626Methods of forming a metal pattern
#7627Semiconductor device and method for manufacturing the same
#7628Microfeature workpieces having alloyed conductive structures, and associated methods
#7629Wafer Level Package and a Method of Forming the Same
#7630Semiconductor constructions
#7631Semiconductor device
#7632Interconnect barrier structure and method
#7633Multi-component integrated circuit contacts
#7634Copper wire receiving pad
#7635Conductive connecting member and manufacturing method of same
#7636Electrically conductive paste, and electrically conducive connection member produced using the paste
#7637Semiconductor device and a method of manufacturing the same
#7638Semiconductor device
#7639Backside-illuminated image sensor having a supporting substrate
#7640Light-emitting device
#7641ELECTRIC JOINT STRUCTURE AND METHOD FOR PREPARING THE SAME
#7642MICRO PIN HYBRID INTERCONNECT ARRAY
#7643Methods for controlling wafer curvature
#7644METHOD OF FORMING A BOND PAD DESIGN FOR IMPROVED ROUTING AND REDUCED PACKAGE STRESS
#7645Through wafer vias and method of making same
#7646Bond pad design for improved routing and reduced package stress
#7647Method and apparatus providing integrated circuit having redistribution layer with recessed connectors
#7648Semiconductor device and manufacturing method thereof
#7649Enhanced WLP for superior temp cycling, drop test and high current applications
#7650STACKED SEMICONDUCTOR DEVICE
#7651SEMICONDUCTOR CHIP WITH DUAL POLYMER FILM INTERCONNECT STRUCTURES
#7652Bump structure with barrier layer on post-passivation interconnect
#7653Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation
#7654Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure
#7655Methods and arrangements relating to semiconductor packages including multi-memory dies
#7656Semiconductor device and manufacturing method
#7657SEMICONDUCTOR CHIP, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE
#7658Die backside standoff structures for semiconductor devices
#7659Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#7660Electrical connection for multichip modules
#7661Semiconductor device and bonding material for semiconductor device
#7662Bump structure and process of manufacturing the same
#7663Wafer level chip scale package with reduced stress on solder balls
#7664Solder ball protection structure with thick polymer layer
#7665Back-side contact formation
#7666Electronic device and method for producing electronic device
#7667Method of forming a through-silicon via utilizing a metal contact pad in a back-end-of-line wiring level to fill the through-silicon via
#7668METHOD OF MANUFACTURING A SEMICONDUCTOR CHIP PACKAGE
#7669Layered chip package and method of manufacturing same
#7670Layered chip package and method of manufacturing same
#7671Method for producing a protective structure
#7672Flip chip assembly and process with sintering material on metal bumps
#7673Bonded semiconductor structures and methods of forming same
#7674Semiconductor device
#7675Semiconductor device and method of forming a power MOSFET with interconnect structure silicide layer and low profile bump
#7676Heterostructure containing IC and LED and method for fabricating the same
#7677Apparatus for restricting moisture ingress
#7678CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR FORMING THE SAME
#7679Method of fabricating semiconductor device
#7680Implantable microelectronic device and method of manufacture
#7681Method of manufacturing a semiconductor device
#7682Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier
#7683Back-illuminated distance measuring sensor and distance measuring device
#7684Back-illuminated distance measuring sensor and distance measuring device
#7685Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties
#7686Curing low-k dielectrics for improving mechanical strength
#7687SEMICONDUCTOR PACKAGE AND FABRICATION METHOD OF THE SAME
#7688Conductive pads defined by embedded traces
#7689Semiconductor device including excess solder
#7690Methods of forming through-substrate interconnects
#7691Semiconductor device
#7692Semiconductor device
#7693Wafer-level package device
#7694Electrical connection for chip scale packaging
#7695Semiconductor device, semiconductor package, and electronic device
#7696Power semiconductor device
#7697Interposer test structures and methods
#7698Injection molded solder process for forming solder bumps on substrates
#7699Injection molded solder process for forming solder bumps on substrates
#7700ESTIMATION OF PRESENCE OF VOID IN THROUGH SILICON VIA (TSV) BASED ON ULTRASOUND SCANNING
#7701Stacked memory module and system
#7702Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes
#7703Pad structure, circuit carrier and integrated circuit chip
#7704Aluminum Bond Pad With Trench Thinning for Fine Pitch Ultra-Thick Aluminum Products
#7705Semiconductor device having a trace comprises a beveled edge
#7706Copper bonding wire for semiconductor device and bonding structure thereof
#7707BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES
#7708SEMICONDUCTOR COMPONENT AND METHOD OF FABRICATING THE SAME
#7709Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area
#7710Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias
#7711Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer
#7712Conductive via structure
#7713Vertical ESD protection device
#7714SEMICONDUCTOR DEVICE
#7715Method of manufacturing semiconductor device
#7716Semiconductor structure having offset passivation to reduce electromigration
#7717SEMICONDUCTOR DEVICE
#7718Method for producing a metal layer on a substrate and device
#7719Electromigration immune through-substrate vias
#7720BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES
#7721Semiconductor component with a front side and a back side metallization layer and manufacturing method thereof
#7722Methods and structures for forming integrated semiconductor structures
#7723Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit
#7724Semiconductor device having a bonding pad and shield structure of different thickness
#7725Method for soldering surface-mount component and surface-mount component
#7726Method for producing a connection region on a side wall of a semiconductor body
#7727Wafer level IC assembly method
#7728Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI)
#7729Robust FBEOL and UBM structure of C4 interconnects
#7730Semiconductor device and a manufacturing method thereof
#7731Die stacking with an annular via having a recessed socket
#7732Doping Minor Elements into Metal Bumps
#7733Chip package and method for forming the same
#7734Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance
#7735Integrated circuit package and packaging methods
#7736Integrated circuit package and packaging methods
#77373D interconnection structure and method of manufacturing the same
#7738Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device
#7739EMBEDDED CAPACITOR DEVICE AND METHODS OF FABRICATION
#7740SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#7741Manufacturing electronic device having contact elements with a specified cross section
#7742Method of manufacturing a semiconductor component
#7743Method of manufacturing chip-stacked semiconductor package
#7744Backside illuminated imaging sensor with reinforced pad structure
#7745Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the Die
#7746Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the Die
#7747Buffer pad in solder bump connections and methods of manufacture
#7748Chip package and fabrication method thereof
#7749Copper pillar bump with non-metal sidewall protection structure and method of making the same
#7750Electronic device packaging structure
#7751Semiconductor structure and fabrication method thereof
#7752Techniques for improving bond pad performance
#7753EPOXY COATING ON SUBSTRATE FOR DIE ATTACH
#7754Method for Assemblying a Semiconductor Chip Package with Deflection-Resistant Leadfingers
#7755Semiconductor device and method for manufacturing the same
#7756Light projection unit and light projection device
#7757Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer
#7758Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POP
#7759Semiconductor device and method of embedding TSV semiconductor die within substrate for vertical interconnect in POP
#7760Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion
#7761Microelectronic chip, component containing such a chip and manufacturing method
#7762Contact Metal for Hybridization and Related Methods
#7763Flip-chip Mounting Structure and Flip-chip Mounting Method
#7764Filled through-silicon via with conductive composite material
#7765Semiconductor device and method of forming an interconnect structure with conductive material recessed within conductive ring over surface of conductive pillar
#7766Chip on film type semiconductor package
#7767High voltage resistance coupling structure
#7768Semiconductor device and manufacturing method of the same
#7769Method of manufacturing nitride semiconductor light emitting element having thick metal bump
#7770Etchant and method for manufacturing semiconductor device using same
#7771Routing layer for mitigating stress in a semiconductor die
#7772Flip-chip, face-up and face-down centerbond memory wirebond assemblies
#7773Semiconductor device with a layer including niobium, and/or tantalum overlying a contact pad or a metal layer
#7774SEMICONDUCTOR PACKAGE
#7775Method of making a semiconductor device having a functional capping
#7776Device and method including a soldering process
#7777Semiconductor package with embedded spiral inductor
#7778Double layer metal (DLM) power MOSFET
#7779Multi-level options for power MOSFETS
#7780LIGHT-EMITTING DIODE DIE PACKAGES AND ILLUMINATION APPARATUSES USING SAME
#7781Light-emitting diode die packages and illumination apparatuses using same
#7782Ag—Au—Pd ternary alloy bonding wire
#7783SEMICONDUCTOR DEVICE
#7784Active area bonding compatible high current structures
#7785SEMICONDUCTOR DEVICE
#7786Semiconductor device
#7787Semiconductor Device and Method of Providing Common Voltage Bus and Wire Bondable Redistribution
#7788REINFORCED VIA FARM INTERCONNECT STRUCTURE, A METHOD OF FORMING A REINFORCED VIA FARM INTERCONNECT STRUCTURE AND A METHOD OF REDESIGNING AN INTEGRATED CIRCUIT CHIP TO INCLUDE SUCH A REINFORCED VIA FARM INTERCONNECT STRUCTURE
#7789SEMICONDUCTOR CHIP WITH PATTERNED UNDERBUMP METALLIZATION
#7790Die arrangements containing an inductor coil and methods of manufacturing a die arrangement containing an inductor coil
#7791Light-emitting diode die packages and illumination apparatuses using same
#7792Etchant and method for manufacturing semiconductor device using same
#7793Method for processing a semiconductor wafer or die, and particle deposition device
#7794Solder ball contact susceptible to lower stress
#7795Semiconductor device and method for fabricating the same
#7796Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures and intermediate structures formed using such methods
#7797Methods for bonding semiconductor structures involving annealing processes, and bonded semiconductor structures formed using such methods
#7798PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE AND APPARATUS THEREFOR
#7799Method for manufacturing semiconductor devices having a glass substrate
#7800HEAT CONDUCTION FOR CHIP STACKS AND 3-D CIRCUITS