Semiconductor-on-insulator with back side heat dissipation

Method and device for wafer scale packaging of optical devices using a scribe and break process

Semiconductor device and method of manufacturing the same

Methods of forming light emitting devices having current reducing structures

Under land routing

Structures and methods to improve lead-free C4 interconnect reliability

Solder interconnect pads with current spreading layers

NICKEL-TITANUM CONTACT LAYERS IN SEMICONDUCTOR DEVICES

Ribbon connecting electrical components

Die-to-die electrical isolation in a semiconductor package

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Semiconductor device

Compound semiconductor device and connectors

Semiconductor device and a method of manufacturing the same

Semiconductor device having a groove and a junction termination extension layer surrounding a guard ring layer

SEMICONDUCTOR DEVICE AND PROCESS FOR PRODUCING THE SAME

Formation of TSV backside interconnects by modifying carrier wafers

Manufacturing method of semiconductor device including Au bump on seed film

Methods for producing an ultrathin semiconductor circuit

Three-dimensional integrated circuits with protection layers

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

Semiconductor device, and method of fabricating semiconductor device

Semiconductor device bonding wire and wire bonding method

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor chip, method of fabricating the same, and stack module and memory card including the same

Electrical property altering, planar member with solder element in IC chip package

Bond pad with integrated transient over-voltage protection

Semiconductor chip

Fabrication method of semiconductor device having conductive bumps

Circuit Device and Method of Manufacturing Thereof

SEMICONDUCTOR DEVICE, CAMERA MODULE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Surface depressions for die-to-die interconnects and associated systems

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Wafer level stack structure for system-in-package and method thereof

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Thru silicon enabled die stacking scheme

Metallic Bump Structure Without Under Bump Metallurgy And a Manufacturing Method Thereof

Standing chip scale package

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE HAVING AN EVEN COATING THICKNESS USING ELECTRO-LESS PLATING AND RELATED DEVICE

Light emitting apparatus and method for producing the same

Method for manufacturing semiconductor device

INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING

Warpage resistant semiconductor package and method for manufacturing the same

Hermeticity testing

Connection pad structure for an image sensor on a thinned substrate

Semiconductor substrate with interlayer connection and method for production of a semiconductor substrate with interlayer connection

Semiconductor chip passivation structures and methods of making the same

Interconnect structures having lead-free solder bumps

Method of forming wire bonds in semiconductor devices

SEMICONDUCTOR PACKAGE, STACK MODULE, CARD, AND ELECTRONIC SYSTEM

Apparatus for restricting moisture ingress

Semiconductor device

Faraday cage for circuitry using substrates

High-voltage semiconductor device

Power semiconductor devices integrated with clamp diodes sharing same gate metal pad

SEMICONDUCTOR DEVICE

Substrate for flip chip bonding and method of fabricating the same

HERMETICALLY-SEALED ELECTRICAL CIRCUIT APPARATUS

Metallic electrode forming method and semiconductor device having metallic electrode

INTERPOSER SUBSTRATE, LSI CHIP AND INFORMATION TERMINAL DEVICE USING THE INTERPOSER SUBSTRATE, MANUFACTURING METHOD OF INTERPOSER SUBSTRATE, AND MANUFACTURING METHOD OF LSI CHIP

Semiconductor device and method for manufacturing the same

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor integrated circuit device

SEMICONDUCTOR PACKAGES AND MANUFACTURING METHOD THEREOF

Semiconductor device and method of forming an interconnect structure with TSV using encapsulant for structural support

Semiconductor device, semiconductor wafer and manufacturing method of the same

Processed wafer via

Method of forming a bond pad

Package structure of compound semiconductor device and fabricating method thereof

Structure and method for power field effect transistor

Semiconductor device

Joint structure and electronic component

DEVICES CONTAINING SILVER COMPOSITIONS DEPOSITED BY MICRO-DEPOSITION DIRECT WRITING SILVER CONDUCTOR LINES

Component built-in wiring board and manufacturing method of component built-in wiring board

Electronic component and method of connecting with multi-profile bumps

WIREBOND STRUCTURES

Semiconductor device

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF INSPECTING AN ELECTRICAL CHARACTERISTIC OF A SEMICONDUCTOR DEVICE

Aluminum bond pads with enhanced wire bond stability

CONDUCTIVE BUMP STRUCTURE FOR SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Method for providing a redistribution metal layer in an integrated circuit

Method of chip repair by stacking a plurality of bad dies

Semiconductor module for stacking and stacked semiconductor module

Wafer level chip scale package

Semiconductor device including double-sided multi-electrode chip embedded in multilayer wiring substrate

METHODS AND SYSTEMS FOR FABRICATION OF MEMS CMOS DEVICES

Semiconductor device having surface protective films on bond pad

Semiconductor device

Semiconductor device with an improved solder joint

Manufacturing method for electronic devices

Semiconductor package

Electronic system and method for manufacturing a three-dimensional electronic system

Semiconductor package and manufacturing method of the semiconductor package

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Power MOSFET package

Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation

Circuit substrate and method for utilizing packaging of the circuit substrate

Semiconductor device

Semiconductor device

Structure and method of forming a pad structure having enhanced reliability

Bump pad structure

Semiconductor device and manufacturing method thereof

Semiconductor device driving bridge-connected power transistor

Light-emitting device

Semiconductor device and method of manufacturing the same

Semiconductor bond pad patterns and method of formation

Semiconductor component with terminal contact surface

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the same

Germanium film optical device fabricated on a glass substrate

Integrated circuit package and method for fabrication thereof

LOW THERMAL RESISTANCE AND ROBUST CHIP-SCALE-PACKAGE (CSP), STRUCTURE AND METHOD

Barrier layer for fine-pitch mask-based substrate bumping

Method of interconnecting electronic wafers

Thermally enhanced wafer level package

Semiconductor device

High quality electrical contacts between integrated circuit chips

Semiconductor device

Integrated circuit packaging system and method of manufacture thereof

Dual Interconnection in Stacked Memory and Controller Module

Semiconductor device, method of manufacturing the same, and silane coupling agent

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Light emitting device and method of fabricating the same

Semiconductor device and method for manufacturing the same

PACKAGE STRUCTURE FOR INTEGRATED CIRCUIT DEVICE AND METHOD OF THE SAME

Method and system for providing a low-profile semiconductor assembly

Light emitting apparatus and fabrication method thereof

Semiconductor chip package with undermount passive devices

Semiconductor device

Receive circuit for connectors with variable complex impedance

Circuit device, method of manufacturing the circuit device, device mounting board and semiconductor module

Semiconductor device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Panel, semiconductor device and method for the production thereof

SEMICONDUCTOR DEVICE HAVING AT LEAST ONE BUMP WITHOUT OVERLAPPING SPECIFIC PAD OR DIRECTLY CONTACTING SPECIFIC PAD

Method of forming an inductor on a semiconductor wafer

Solid-state imaging device comprising through-electrode

High breakdown voltage semiconductor device and high voltage integrated circuit

Anti-reflection structures for CMOS image sensors

Semiconductor chip pad structure and method for manufacturing the same

Metal wiring structures for uniform current density in C4 balls

Active area bonding compatible high current structures

3D chip-stack with fuse-type through silicon via

Semiconductor package and method of packaging semiconductor devices

Remote chip attachment

Substrate and semiconductor device

PACKAGE WITH SEMICONDUCTOR DEVICE AND INTEGRATED CIRCUIT MOUNTED THEREIN AND METHOD FOR MANUFACTURING SUCH PACKAGE

Semiconductor wafer and method of manufacturing the same and method of manufacturing semiconductor device

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR DEVICE

Ball-limiting-metallurgy layers in solder ball structures

Semiconductor device and semiconductor module employing thereof

Conductive through connection and forming method thereof

Unit pixel of image sensor having three-dimensional structure and method for manufacturing the same

Bumped, self-isolated GaN transistor chip with electrically isolated back surface

Structures for improving current carrying capability of interconnects and methods of fabricating the same

Semiconductor device having elastic solder bump to prevent disconnection

Bonding of substrates including metal-dielectric patterns with metal raised above dielectric

Electronic board, method of manufacturing the same, and electronic device

Three-dimensional semiconductor architecture

Semiconductor element, method for manufacturing the same, and mounting structure having the semiconductor element mounted thereon

Semiconductor device

Semiconductor device with pads overlapping wiring layers including dummy wiring

SEMICONDUCTOR DEVICE AND IMAGING DEVICE USING THE SEMICONDUCTOR DEVICE

Semiconductor device with I/O cell and external connection terminal and method of manufacturing the same

Semiconductor device, circuit substrate, electro-optic device and electronic appliance

Chip-size-package semiconductor chip and manufacturing method

Integrated circuit chip using top post-passivation technology and bottom structure technology

Interconnect structure and a method of fabricating the same

Semiconductor device and method of manufacturing the same

Semiconductor device having integral structure of contact pad and conductive line

Interconnect structure for a semiconductor device

METALLIC BONDING STRUCTURE FOR COPPER AND SOLDER

Chip packages

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor package and method of forming

Electronic component with mechanically decoupled ball connections

Filp chip interconnection structure with bump on partial pad and method thereof

Semiconductor device

Semiconductor device and method of forming a thin wafer without a carrier

Semiconductor device and method of forming enhanced UBM structure for improving solder joint reliability

Chip stack package and method of fabricating the same

Semiconductor package fabrication process and semiconductor package

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and manufacturing method therefor

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Integrated circuit having wiring structure, solid image pickup element having the wiring structure, and imaging device having the solid image pickup element

Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device

Light emitting device

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Via Using Zn or Zn Alloys and Its Making Method, 3D Chip Stack Packages Using Thereof

IO cell with multiple IO ports and related techniques for layout area saving

Semiconductor device with arrangement of parallel conductor lines being insulated, between and orthogonal to external contact pads

Metal-metal bonding of compliant interconnect

Barrier for through-silicon via

SEMICONDUCTOR DEVICE, AND STACKED STRUCTURE, PACKAGE, MODULE, AND ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHOD OF FABRICATING THE SAME

Semiconductor device and method of manufacturing the same

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Structure and method for sealing cavity of micro-electro-mechanical device

Integrated circuit packaging system with an interposer and method of manufacture thereof

Making a semiconductor device having conductive through organic vias

SEMICONDUCTOR DEVICE AND BACKSIDE ILLUMINATION SOLID-STATE IMAGING DEVICE

Electrostatic discharge structure for 3-dimensional integrated circuit through-silicon via device

Multiple layer strain gauge

Apparatus and method for manufacturing semiconductor device

Method for manufacturing semiconductor apparatus

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Method for bonding wafers to produce stacked integrated circuits

Imaging device

Microelectronic assembly with impedance controlled wirebond and conductive reference element

Flexible packaging for chip-on-chip and package-on-package technologies

Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die

Semiconductor constructions

Microelectronic assemblies having compliancy and methods therefor

Semiconductor device having a conductive bump

Flip chip semiconductor package and fabrication method thereof

Wire loop and method of forming the wire loop

Reducing stress between a substrate and a projecting electrode on the substrate

Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide

Method for fabricating semiconductor components using maskless back side alignment to conductive vias

Contact portion of wire and manufacturing method thereof

Electrical interconnect forming method

Electrical interconnect forming method

Conductive ball mounting apparatus and conductive ball mounting method

Joint Structure Between a Wound Coil and An IC-Chip for a Noncontact RFID Device and Methods of Manufacturing The Same

Electrical interconnect structure

Electronic substrate

Wire bond interconnection

Chips having rear contacts connected by through vias to front contacts

Semiconductor apparatus and method of manufacturing semiconductor apparatus

Stress buffering package for a semiconductor component

Leadless integrated circuit package having standoff contacts and die attach pad

Leadless integrated circuit package having standoff contacts and die attach pad

Stress barrier structures for semiconductor chips

EMBEDDED CAPACITOR DEVICE AND METHODS OF FABRICATION

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Manufacturing method for an electronic substrate

METHOD OF PRODUCING SEMICONDUCTOR DEVICE

Manufacturing method of semiconductor device

Method of manufacturing ball grid array type semiconductor device

Semiconductor device

Method and apparatus for ultra thin wafer backside processing

Electronic substrate, semiconductor device, and electronic device

Electromigration-Resistant Flip-Chip Solder Joints

Metallization system of a semiconductor device including metal pillars having a reduced diameter at the bottom

Chip capacitive coupling

MIM decoupling capacitors under a contact pad

Light emitting device having luminescent layer with opening to exposed bond pad on light emitting die for wire bonding pad to substrate

Module having a stacked magnetic device and semiconductor device and method of forming the same

Semiconductor device

Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same

Through-silicon via formed with a post passivation interconnect structure

Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure

Solder bump UBM structure

Stacked semiconductor package having reduced height

Method for fabricating a bond

Module having a stacked magnetic device and semiconductor device and method of forming the same

Method of manufacturing semiconductor device

Formation of solder bumps

Bonding pad structure, electronic device having a bonding pad structure and methods of fabricating the same

Semiconductor chip with reinforcement layer and method of making the same

Semiconductor package structure

Semiconductor device including conductive element

SEMICONDUCTOR DEVICE

Semiconductor device and wire bonding method

Electronic component device, and method of manufacturing the same

PROCESS FOR ELECTRODEPOSITION OF COPPER CHIP TO CHIP, CHIP TO WAFER AND WAFER TO WAFER INTERCONNECTS IN THROUGH-SILICON VIAS (TSV)

Semiconductor device and method of manufacturing semiconductor device

Multi-component integrated circuit contacts

Method of manufacturing light-emitting device

Back-illuminated distance measuring sensor and distance measuring device

Semiconductor device and method for manufacturing semiconductor device

Bond pad support structure for semiconductor device

Grain refinement by precipitate formation in PB-free alloys of tin

Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE USING THE SAME

MICROWAVE CIRCUIT ASSEMBLY

THRU SILICON ENABLED DIE STACKING SCHEME

Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD)

Light-emitting diode die package and method for producing same

Implantable microelectronic device and method of manufacture

Electronic member, electronic part and manufacturing method therefor

Barrier structures and methods for through substrate vias

WAFER LEVEL, CHIP SCALE SEMICONDUCTOR DEVICE PACKAGING COMPOSITIONS, AND METHODS RELATING THERETO

Structure of UBM and solder bumps and methods of fabrication

Reinforced structure for a stack of layers in a semiconductor component

Semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Method for producing an electrical and mechanical connection and an assembly comprising such a connection

METHOD OF FORMING CONNECTION TERMINAL

Method of forming a copper topped interconnect structure that has thin and thick copper traces

METHODS FOR CONTROLLING WAFER AND PACKAGE WARPAGE DURING ASSEMBLY OF VERY THIN DIE

Electronic device package and method for fabricating the same

Through-Silicon Via Sidewall Isolation Structure

Reduced bottom roughness of stress buffering element of a semiconductor component

Underbump metallization structure

Semiconductor device