207785 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
Method for establishing and closing a trench of a semiconductor component
#8702Semiconductor device having backside redistribution layers
#8703Semiconductor device including a DC-DC converter having a metal plate
#8704Power semiconductor devices integrated with clamp diodes having separated gate metal pads to avoid breakdown voltage degradation
#8705Bond pad connection to redistribution lines having tapered profiles
#8706Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device
#8707Semiconductor device having elastic solder bump to prevent disconnection
#8708PB-free solder bumps with improved mechanical properties
#8709Semiconductor chip package assembly with deflection-resistant leadfingers
#8710Germanium film optical device
#8711Fan-out wafer level package with polymeric layer for high reliability
#8712Semiconductor Process, Semiconductor Element and Package Having Semiconductor Element
#8713Semiconductor element and package having semiconductor element
#8714PAD STRUCTURE AND INTEGRATED CIRCUIT CHIP WITH SUCH PAD STRUCTURE
#8715Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip
#8716Micro-bump structure
#8717Semiconductor device and method for manufacturing the same
#8718RELIABLE LARGE DIE FAN-OUT WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURE
#8719Semiconductor package having chip using copper process
#8720Semiconductor memory device, semiconductor package and system having stack-structured semiconductor chips
#8721Manufacturing method of semiconductor device and semiconductor device
#8722Chip package
#8723Contacting a device with a conductor
#8724Method of repairing probe pads
#8725Method for fabricating electrical bonding pads on a wafer
#8726Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods
#8727Method for manufacturing chips
#8728METALLIZATION LAYER STRUCTURE FOR FLIP CHIP PACKAGE
#8729Semiconductor component of semiconductor chip size with flip-chip-like external contacts
#8730Semiconductor device and method for fabricating the same
#8731Structures and methods to reduce maximum current density in a solder ball
#8732Combined power mesh transition and signal overpass/underpass
#8733SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#8734SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#8735OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME
#8736Flow sensors having nanoscale coating for corrosion resistance
#8737Semiconductor processing methods
#8738Packaging conductive structure and method for manufacturing the same
#8739Method for low stress flip-chip assembly of fine-pitch semiconductor devices
#8740Semiconductor connection component
#8741Electrical coupling of wafer structures
#8742DETECTION CIRCUITRY FOR DETECTING BONDING CONDITIONS ON BOND PADS
#8743Semiconductor device having a microcomputer chip mounted over a memory chip
#8744Semiconductor device and electronic device
#8745Substrate for electronic device, stack for electronic device, electronice device, and method for manufacturing the same
#8746Semiconductor device and manufacturing method thereof
#8747Integrated circuit with pads connected by an under-bump metallization and method for production thereof
#8748Light emitting device, light emitting device and package, and lighting system
#8749Heat conduction for chip stacks and 3-D circuits
#8750Bonding structure and method for manufacturing same
#8751Method for inhibiting growth of nickel-copper-tin intermetallic layer in solder joints
#8752Method for manufacturing a semiconductor apparatus having a through-hole interconnection
#8753Method for manufacturing semiconductor device
#8754Methods of forming conductive vias
#8755Method for manufacturing semiconductor device
#8756ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME
#8757Conductor bump method and apparatus
#8758AREA REDUCTION FOR SURFACE MOUNT PACKAGE CHIPS
#8759Semiconductor Wafer and Method of Manufacturing the Same and Method of Manufacturing Semiconductor Device
#8760Through-silicon via with air gap
#8761Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers
#8762Interface structure for copper-copper peeling integrity
#8763Multi-chip stacked package and its mother chip to save interposer
#8764Semiconductor device and inspection method therefor
#8765Manufacturing method of a tray, a socket for inspection, and a semiconductor device
#8766Pressure-bonded ball diameter detecting apparatus and pressure-bonded ball diameter detecting method
#8767Layer structure for electrical contacting of semiconductor components
#8768Solder structure, method for forming the solder structure, and semiconductor module including the solder structure
#8769Semiconductor Device and Method of Forming Bump Structure with Multi-Layer UBM Around Bump Formation Area
#8770ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME
#87713D interconnection structure and method of manufacturing the same
#8772Semiconductor device and method for making the same
#8773MANUFACTURING METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE
#8774Semiconductor device manufacturing method comprising a metal pattern and laser modified regions in a cutting region
#8775Packaged device and method of manufacturing the same
#8776EPOXY RESIN FORMULATIONS FOR UNDERFILL APPLICATIONS
#8777Semiconductor device and method of forming electrical interconnect with stress relief void
#8778Bonding connection between a bonding wire and a power semiconductor chip
#8779Electronic device and electronic apparatus
#8780ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME
#8781EXTENDED UNDER-BUMP METAL LAYER FOR BLOCKING ALPHA PARTICLES IN A SEMICONDUCTOR DEVICE
#8782Chip and electrostatic discharge protection device thereof
#8783Semiconductor device and structure
#8784Manufacturing method of semiconductor integrated circuit device
#8785Programmable capacitor associated with an input/output pad
#8786SEMICONDUCTOR DEVICE
#8787Area efficient through-hole connections
#8788Semiconductor device and method of manufacturing same
#8789Bumping free flip chip process
#8790Pad structure for semiconductor devices
#8791ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE AND AN ELECTRICAL CONDUCTOR WITHIN A VIA AND A PROCESS OF FORMING THE SAME
#8792Backside illuminated imaging sensor with reinforced pad structure
#8793Method for creating highly compliant thermal bonds that withstand relative motion of two surfaces during temperature changes using spacing structures
#8794Bonding apparatus and bonding method
#8795Semiconductor wafer having through-hole vias on saw streets with backside redistribution layer
#8796Method for forming post bump
#8797Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods
#8798Thin-film capacitor having a connecting part of a lead conductor disposed within an opening in a protective layer
#8799Via structures and semiconductor devices having the via structures
#8800Circuit board and chip package structure
#8801Integrated Circuit
#8802Redistribution layer enhancement to improve reliability of wafer level packaging
#8803Stable gold bump solder connections
#8804Package structure and manufacturing method thereof
#8805POWER AND SIGNAL DISTRIBUTION OF INTEGRATED CIRCUITS
#8806Chip package structure and method for fabricating the same
#8807Semiconductor component having through wire interconnect with compressed bump
#8808Method of fabricating backside-illuminated image sensor
#8809Wafer level chip scale package and process of manufacture
#8810Light-emitting device
#8811Pad structure with a nano-structured coating film
#8812Semiconductor devices having redistribution structures and packages, and methods of forming the same
#8813Method and leadframe for packaging integrated circuits
#8814Bonding structure of bonding wire
#8815Semiconductor device, manufacturing method thereof, and electronic apparatus
#8816Integrated circuit packaging system with core region and bond pad and method of manufacture thereof
#8817Semiconductor device and method for manufacturing the same
#8818Connecting material having metallic particles of an oxygen state ratio and size and semiconductor device having the connecting material
#8819Semiconductor device including bottom surface wiring and manfacturing method of the semiconductor device
#8820Microelectronic assembly with impedance controlled wirebond and conductive reference element
#8821Copper bump joint structures with improved crack resistance
#8822Semiconductor device with trench-like feed-throughs
#8823Semiconductor die contact structure and method
#8824Semiconductor device and method of forming column interconnect structure to reduce wafer stress
#8825Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate
#8826SEMICONDUCTOR DEVICE AND ARRANGEMENT METHOD THEREOF
#8827Crack resistant circuit under pad structure and method of manufacturing the same
#8828Method of manufacturing integrated circuit having stress tuning layer
#8829Via forming method and method of manufacturing multi-chip package using the same
#8830Semiconductor chip, wafer stack package using the same, and methods of manufacturing the same
#8831Microelectronic assemblies having compliant layers
#8832Thermo-compression bonded electrical interconnect structure
#8833Methods for fabricating and filling conductive vias and conductive vias so formed
#8834Small area, robust silicon via structure and process
#8835Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument
#8836Semiconductor package and method for fabricating the same
#8837LEADLESS SEMICONDUCTOR DEVICE TERMINAL
#8838Routing layer for mitigating stress in a semiconductor die
#8839Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same
#8840Microelectronic assembly with impedance controlled wirebond and conductive reference element
#8841High voltage resistance coupling structure
#8842Semiconductor device suitable for a stacked structure
#8843Preventing UBM oxidation in bump formation processes
#8844Method of manufacturing a three dimensional integrated circuit by transfer of a mono-crystalline layer
#8845Stacked semiconductor package and method for manufacturing the same
#8846Semiconductor device fabrication method including formation of columnar electrodes having protrusion sections
#8847Method for manufacturing and testing an integrated electronic circuit
#8848Terminal structure, electronic device, and manufacturing method thereof
#8849Semiconductor device and electronic apparatus equipped with the semiconductor device
#8850SEMICONDUCTOR DEVICE HAVING WAFER-LEVEL CHIP SIZE PACKAGE
#8851Non-uniform alignment of wafer bumps with substrate solders
#8852Semiconductor die with integrated electro-static discharge device
#8853Electronic device and method for manufacturing thereof
#8854METALLIC BUMP STRUCTURE WITHOUT UNDER BUMP METALLURGY AND A MANUFACTURING METHOD THEREOF
#8855ASSEMBLY OF SEMICONDUCTOR CHIPS/WAFERS
#8856SYSTEM AND METHOD FOR PREVENTING METAL CORROSION ON BOND PADS
#8857Pad bonding employing a self-aligned plated liner for adhesion enhancement
#8858Semiconductor device and manufacturing method thereof
#8859Electrical connection for multichip modules
#8860Semiconductor structure, pad structure and protection structure
#8861Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers
#8862Reducing Device Mismatch by Adjusting Titanium Formation
#8863Chip design with robust corner bumps
#8864Designs and methods for conductive bumps
#8865Semiconductor device and method of self-confinement of conductive bump material during reflow without solder mask
#8866Chip having a metal pillar structure
#8867Semiconductor packages having passive elements mounted thereonto
#8868Through silicon via (TSV) wire bond architecture
#8869Solid state image capture device and method for manufacturing same
#8870Semiconductor device
#8871Semiconductor device with drain voltage protection for ESD
#8872METAL WIRING STRUCTURE COMPRISING ELECTROLESS NICKEL PLATING LAYER AND METHOD OF FABRICATING THE SAME
#8873Method of manufacturing a semiconductor device having vertical MOSFET
#8874Manufacturing method for semiconductor devices
#8875Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same
#8876Vertically stackable dies having chip identifier structures
#8877Integrated circuit with protective structure
#8878Semiconductor device having a copper plug
#8879PRE-PACKAGED STRUCTURE
#8880Wafers including patterned back side layers thereon
#8881Integrated circuit chip and flip chip package having the integrated circuit chip
#8882Chip package and fabrication method thereof
#8883Semiconductor package, semiconductor package structure including the semiconductor package, and mobile phone including the semiconductor package structure
#8884Method of manufacturing a semiconductor component and structure
#8885Method for manufacturing a semiconductor component
#8886Semiconductor device with interface peeling preventing rewiring layer
#8887Back side metallization with superior adhesion in high-performance semiconductor devices
#8888Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding
#8889DEVICE MOUNTING BOARD, AND SEMICONDUCTOR MODULE
#8890Semiconductor device with copper wire having different width portions
#8891True CSP power MOSFET based on bottom-source LDMOS
#8892SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#8893Semiconductor integrated circuit
#8894Semiconductor device and method for manufacturing same
#8895Template and pattern forming method
#8896Method of manufacturing semiconductor device
#8897Fabrication method of semiconductor device having conductive bumps
#8898Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#8899Assembly of multi-chip modules using sacrificial features
#8900SEMICONDUCTOR PACKAGE WITH PRE-FORMED BALL BONDS
#8901Wafer backside interconnect structure connected to TSVs
#8902Semiconductor package with adhesive material pre-printed on the lead frame and chip, and its manufacturing method
#8903Layered chip package
#8904Semiconductor package and method of manufacturing the semiconductor package
#8905Semiconductor device including vertical transistor and horizontal transistor
#8906METHOD OF BONDING PARTS TO SUBSTRATE USING SOLDER PASTE
#8907Process for producing a contact area of an electronic component
#8908Robust FBEOL and UBM structure of C4 interconnects
#8909Semiconductor device
#8910Protection layer for preventing UBM layer from chemical attack and oxidation
#8911Substrate and package with micro BGA configuration
#8912Interconnection of land section to wiring layers at center of external connection terminals in semiconductor device and manufacturing thereof
#8913Protected semiconductor device and method of manufacturing thereof
#8914Electronic component
#8915Method of integrating a MOSFET with a capacitor
#8916Bonding metallurgy for three-dimensional interconnect
#8917Semiconductor device having plural semiconductor chips laminated to each other
#8918Die Package
#8919Enhanced copper posts for wafer level chip scale packaging
#8920Terminal face contact structure and method of making same
#8921Semiconductor device and manufacturing method therefor
#8922Structure, method and system for assessing bonding of electrodes in FCB packaging
#8923Semiconductor Chip with Stair Arrangement Bump Structures
#8924Delamination resistant packaged die having support and shaped die having protruding lip on support
#8925Metal-oxide-semiconductor chip and fabrication method thereof
#8926Solder joint reliability in microelectronic packaging
#8927Semiconductor chip with contoured solder structure opening
#8928Methods and structures for controlling wafer curvature
#8929Self-aligned protection layer for copper post structure
#8930METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#8931Bonding pad structure and integrated circuit chip using such bonding pad structure
#8932Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device
#8933Semiconductor device having an enlarged emitter electrode
#8934Chip structure with bumps and testing pads
#8935Method of manufacturing wafer level device package
#8936Layered chip for use in soldering
#8937BONDING STRUCTURES AND METHODS OF FORMING BONDING STRUCTURES
#8938Semiconductor apparatus and fabrication method thereof
#8939Semiconductor device having stable signal transmission at high speed and high frequency
#8940Chip package with heavily doped region and fabrication method thereof
#8941Chip package with heavily doped regions and fabrication method thereof
#8942Method For Fabricating A Through Interconnect On A Semiconductor Substrate
#8943Semiconductor device layer structure and method of fabrication
#8944Semiconductor device having semiconductor chip and metal plate
#8945Room temperature metal direct bonding
#8946Semiconductor device and method of fabricating semiconductor device
#8947Method for manufacturing semiconductor device
#8948Device under bonding pad using single metallization
#8949Electronic structures including barrier layers and/or oxidation barriers defining lips and related methods
#8950Package-level integrated circuit connection without top metal pads or bonding wire
#8951Semiconductor device and method of manufacturing the same
#8952SCHOTTKY BARRIER DIODE (SBD) AND ITS OFF-SHOOT MERGED PN/SCHOTTKY DIODE OR JUNCTION BARRIER SCHOTTKY (JBS) DIODE
#8953Programmable through silicon via
#8954Method of manufacturing a semiconductor device
#8955STACK PACKAGE THAT PREVENTS WARPING AND CRACKING OF A WAFER AND SEMICONDUCTOR CHIP AND METHOD FOR MANUFACTURING THE SAME
#8956Terminal structure and manufacturing method thereof, and electronic device and manufacturing method thereof
#8957IMAGE SENSOR MODULE AND METHOD FOR MANUFACTURING THE SAME
#8958Die stacking with an annular via having a recessed socket
#8959Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element
#8960MEMS and a protection structure thereof
#8961Bond pad design for reducing the effect of package stress
#8962Structures and methods for improving solder bump connections in semiconductor devices
#8963Semiconductor devices having stress relief layers and methods for fabricating the same
#8964NICKEL-TITANUM SOLDERING LAYERS IN SEMICONDUCTOR DEVICES
#8965Semiconductor device and manufacturing method thereof
#8966FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING METHOD THEREOF
#8967Method for manufacturing electronic device
#8968Method and apparatus for manufacturing semiconductor device
#8969Process of forming an electronic device including a conductive stud over a bonding pad region
#8970Method for manufacturing a semiconductor device
#8971Method for insertion bonding and device thus obtained
#8972Semiconductor package
#8973Bond and probe pad distribution
#8974Multi-die package
#8975SEMICONDUCTOR DEVICE
#8976METALLURGY FOR COPPER PLATED WAFERS
#8977Semiconductor device and method of forming wafer level ground plane and power ring
#8978Manufacturing method of semiconductor device and semiconductor device
#8979Method of forming a semiconductor device including a stress buffer material formed above a low-k metallization system
#8980Semiconductor device having under-filled die in a die stack
#8981CMOS image sensor big via bonding pad application for AlCu Process
#8982CMOS image sensor big via bonding pad application for AICu process
#8983System with semiconductor components having encapsulated through wire interconnects (TWI)
#8984CONNECTION PAD STRUCTURE FOR AN ELECTRONIC COMPONENT
#8985Process for making contact with and housing integrated circuits
#8986METHOD OF ELECTRICALLY CONNECTING A WIRE TO A PAD OF AN INTEGRATED CIRCUIT CHIP AND ELECTRONIC DEVICE
#8987Bonding pad for preventing pad peeling
#8988Semiconductor package and semiconductor package module
#8989Package structure and method for reducing dielectric layer delamination
#8990Semiconductor packages and methods of fabricating the same
#8991Chip scale surface mounted semiconductor device package and process of manufacture
#8992Semiconductor chip package structure for achieving flip-chip type electrical connection without using wire-bonding process and method for making same
#8993Semiconductor packages, stacked semiconductor packages, and methods of manufacturing the semiconductor packages and the stacked semiconductor packages
#8994Semiconductor Device and Method of Forming Conductive TSV in Peripheral Region of Die Prior to Wafer Singulaton
#8995Semiconductor-on-insulator with back side connection
#8996Post bump and method of forming the same
#8997Packaged semiconductor chips
#8998SEMICONDUCTOR DEVICE
#8999Semiconductor-on-insulator with back side support layer
#9000Wafer-level image sensor module, method of manufacturing the same and camera module