System and method for 3D integrated circuit stacking

WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

Forming seal ring in an integrated circuit die

On-chip heat spreader

Process for packaging components, and packaged components

NOVEL BUILD-UP PACKAGE FOR INTEGRATED CIRCUIT DEVICES, AND METHODS OF MAKING SAME

Semiconductor device and method for manufacturing semiconductor device

Method and structures of monolithically integrated ESD suppression device

Insulated gate semiconductor device

Light sensor using wafer-level packaging

Electrical contact for a cadmium tellurium component

Method to prevent corrosion of bond pad structure

3D chip-stack with fuse-type through silicon via

Programmable through silicon via

Substrate bonding with metal germanium silicon material

SEMICONDUCTOR PACKAGE WITH WEDGE BONDED CHIP

Semiconductor device and electronic apparatus equipped with the semiconductor device

Semiconductor device having lead free solders between semiconductor chip and frame and fabrication method thereof

Semiconductor integrated circuit device and a method for manufacturing a semiconductor integrated circuit device

Semiconductor device and method for manufacturing

Semiconductor device including bonding pads and semiconductor package including the semiconductor device

Method of teaching eyepoints for wire bonding and related semiconductor processing operations

High-yield method of exposing and contacting through-silicon vias

Stacked integrated chips and methods of fabrication thereof

Semiconductor device and fabrication method for the same

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps

Contact pad supporting structure and integrated circuit for crack suppresion

Fusible I/O interconnection systems and methods for flip-chip packaging involving substrate-mounted stud bumps

Wafer level vertical diode package structure and method for making the same

Method and apparatus for stacked die package with insulated wire bonds

Semiconductor device including wires connecting electrodes to an inner lead

Through-silicon via with low-K dielectric liner

Metal schemes of trench MOSFET for copper bonding

Light emitting device with improved light extraction efficiency

Semiconductor light emitting device

Semiconductor device having sealing film and manufacturing method thereof

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Through-wafer interconnects for photoimager and memory wafers

Electronic device and electronic apparatus

SEMICONDUCTOR DEVICE

Electronic device package and fabrication method thereof

Semiconductor device with output circuit arrangement

Structures and methods for improving solder bump connections in semiconductor devices

Semiconductor processing methods

Method of manufacturing semiconductor device

Memory card and method for manufacturing the same

CHIP PACKAGES WITH POWER MANAGEMENT INTEGRATED CIRCUITS AND RELATED TECHNIQUES

Through-hole electrode substrate and method of manufacturing the same

Through-silicon via with air gap

Semiconductor device

Backside metal of redistribution line with silicide layer on through-silicon via of semiconductor chips

Semiconductor device and method of manufacturing the same

Structures and methods for improving solder bump connections in semiconductor devices

Semiconductor device

SEMICONDUCTOR DEVICE INCLUDING A COST-EFFICIENT CHIP-PACKAGE CONNECTION BASED ON METAL PILLARS

Semiconductor device and method of confining conductive bump material during reflow with solder mask patch

Structures and methods for improving solder bump connections in semiconductor devices

SEMICONDUCTOR PACKAGE, MANUFACTURING METHOD THEREOF AND IC CHIP

Semiconductor device and semiconductor package including the same

METHOD OF MANUFACTURING THROUGH-SILICON-VIA AND THROUGH-SILICON-VIA STRUCTURE

Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip

High power integrated circuit device having bump pads

True CSP power MOSFET based on bottom-source LDMOS

RADIATION DETECTOR

Package carrier

Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns

SEMICONDUCTOR APPARATUS AND PROCESS OF PRODUCTION THEREOF

Electrical assembly

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Semiconductor device

Bonding pad structure and manufacturing method thereof

LOW COST PROCESS FLOW FOR FABRICATION OF METAL CAPPING LAYER OVER COPPER INTERCONNECTS

Solder limiting layer for integrated circuit die copper bumps

Semiconductor device

Semiconductor device

Semiconductor chip used in flip chip process

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR DEVICE

Fabrication method of circuit board

Face-to-face (F2F) hybrid structure for an integrated circuit

Wafer structure with conductive bumps and fabrication method thereof

Semiconductor package and manufacturing method of the same

Power module having stacked flip-chip and method of fabricating the power module

Semiconductor device having an inorganic coating layer applied over a junction termination extension

Method for forming thin film resistor and terminal bond pad simultaneously

Semiconductor integrated circuit

Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission

Doping of lead-free solder alloys and structures formed thereby

Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages

Manufacturing method for semiconductor device

Method for low stress flip-chip assembly of fine-pitch semiconductor devices

Semiconductor device

Grid array connection device and method

SEMICONDUCTOR DEVICE AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

Semiconductor device and method for fabricating the same

Semiconductor device with a vertical interconnect structure for 3-D FO-WLCSP

Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structures

Semiconductor dice with backside trenches filled with elastic material for improved attachment, packages using the same, and methods of making the same

Semiconductor device having a mounting substrate with a capacitor interposed therebetween

WAFER JOINING METHOD, WAFER COMPOSITE, AND CHIP

Light emitting device and method for manufacturing same

Method for packaging circuits

Method of manufacturing semiconductor devices

Methods for fabricating semiconductor components with conductive interconnects having planar surfaces

METHOD OF INTERCONNECTING CHIPS USING CAPILLARY MOTION

Semiconductor device with solder balls having high reliability

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILM

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILM

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE IN WHICH BOTTOM SURFACE AND SIDE SURFACE OF SEMICONDUCTOR SUBSTRATE ARE COVERED WITH RESIN PROTECTIVE FILM

Method of forming stacked dies

Integrated circuit packaging system and method of manufacture thereof

Light-emitting diode die packages and illumination apparatuses using same

Methods for forming an RF device with trench under bond pad feature

Insulating film material, multilayer wiring board and production method thereof, and semiconductor device and production method thereof

Semiconductor device, and method of manufacturing multilayer wiring board and semiconductor device

Extended redistribution layers bumped wafer

Semiconductor chip bump connection apparatus and method

DEVICE MOUNTING BOARD AND METHOD OF MANUFACTURING THE BOARD, SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE MODULE

Manufacturing method of semiconductor device, and semiconductor device

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Apparatus and method for packaging circuits

Semiconductor device and method of forming bond wires and stud bumps in recessed region of peripheral area around the device for electrical interconnection to other devices

Triaxial through-chip connection

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF PRODUCING EXTERNAL PADS ON A SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Alpha shielding techniques and configurations

Stacked semiconductor component having through wire interconnect

Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief

Semiconductor device

Semiconductor devices

Electronic device and method for manufacturing thereof

Chip package structure and method of fabricating the same

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE

Semiconductor device having electrode pad, and wireless circuit device including the semiconductor device

Semiconductor integrated circuit device

Semiconductor device with solder bump formed on high topography plated Cu pads

CHIP PACKAGE STRUCTURE

Packaging structure

Integrated sensor including sensing and processing die mounted on opposite sides of package substrate

Semiconductor device with reduced pad pitch

Device mounting board and semiconductor module

Semiconductor device and method for manufacturing the same

Method of forming through-silicon vias

Method of manufacturing semiconductor device

Semiconductor device including a DC-DC converter having a metal plate

Bonding pad structure for back illuminated optoelectronic device and fabricating method thereof

SEMICONDUCTOR DEVICE

Optoelectronic semiconductor device

Semiconductor device and connection checking method for semiconductor device

3-D circuits with integrated passive devices

Trench MOSFET with trench source contact having copper wire bonding

Double solid metal pad with reduced area

Semiconductor chip with through-silicon-via and sidewall pad

Integrated circuit packaging system with increased connectivity and method of manufacture thereof

Substrate with chips mounted thereon, method of manufacturing substrate with chips mounted thereon, display, and method of manufacturing display

Method for manufacturing semiconductor device

Method and apparatus for stacked die package with insulated wire bonds

Protective layer for bond pads

Metal line in semiconductor device and method for forming the same

RELIABLE WAFER-LEVEL CHIP-SCALE SOLDER BUMP STRUCTURE

Flip Chip Interconnection Structure Having Void-Free Fine Pitch and Method Thereof

Copper-containing C4 ball-limiting metallurgy stack for enhanced reliability of packaged structures and method of making same

Semiconductor device and method of manufacturing semiconductor device

Structure and method for stacked wafer fabrication

Planar multi semiconductor chip package

MULTIPLE CHIPS ON A SEMICONDUCTOR CHIP WITH COOLING MEANS

Bond pad array for complex IC

Semiconductor module

Method for sorting and acquiring semiconductor element, method for producing semiconductor device, and semiconductor device

Semiconductor test pad structures

Component with Mechanically Loadable Connecting Surface

Method for producing semiconductor chips using thin film technology

Semiconductor body and method for voltage regulation

Conductive paths for transmitting an electrical signal through an electrical connector

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

BUMPED CHIP WITH DISPLACEMENT OF GOLD BUMPS

Semiconductor device including a reduced stress configuration for metal pillars

Chip structure and chip package structure

Semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor packing having offset stack structure

Semiconductor device and manufacturing method thereof

Semiconductor device

Semiconductor package with passivation island for reducing stress on solder bumps

SEMICONDUCTOR DEVICE

METHOD OF PRODUCING SEMICONDUCTOR DEVICE PROVIDED WITH FLIP-CHIP MOUNTED SEMICONDUCTOR ELEMENT

Semiconductor chip, method of manufacturing the semiconductor chip and semiconductor chip package including an inclined via hole

SEMICONDUCTOR CHIP HAVING VIA ELECTRODES AND STACKED SEMICONDUCTOR CHIPS INTERCONNECTED BY THE VIA ELECTRODES

MICROELECRONIC ASSEMBLY AND METHOD FOR FORMING THE SAME

Electronic circuit for controlling a power field effect transistor

Three-dimensional integrated circuit stacking-joint interface structure

Semiconductor electronic component and semiconductor device using the same

Wafer level package using stud bump coated with solder

FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING METHOD THEREOF

Optoelectronic device having a multi-layer solder and manufacturing method thereof

Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier Layers

Process for spontaneous deposition from an organic solution

Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effect

Semiconductor substrates with unitary vias and via terminals, and associated systems and methods

Semiconductor package with a metal post

Semiconductor integrated circuit device

Semiconductor package with embedded spiral inductor

ELECTRIC CONTACT AND METHOD FOR PRODUCING THE SAME AND CONNECTOR USING THE ELECTRIC CONTACTS

Pad structure of semiconductor integrated circuit apparatus

Semiconductor device

Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the same

Bond pad connection to redistribution lines having tapered profiles

Backside connection to TSVs having redistribution lines

Interconnect structures and methods

Bonding process for CMOS image sensor

Forming solder balls on substrates

Carbon nanotube-reinforced solder caps, and chip packages and systems containing same

Metallic bump structure without under bump metallurgy and manufacturing method thereof

Semiconductor package

Multi-chip package

Module having a stacked passive element and method of forming the same

Method for manufacturing semiconductor device having electrode for external connection

Adhesive tape and semiconductor device using the same

Inter connection structure including copper pad and pad barrier layer, semiconductor device and electronic apparatus including the same

Insulation covering structure for a semiconductor element with a single die dimension and a manufacturing method thereof

Semiconductor device

On-chip RF shields with front side redistribution lines

Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device

Photosensitive resin composition, insulating film, protective film, and electronic equipment

System and process for fabricating semiconductor packages

Protecting sidewalls of semiconductor chips using insulation films

Bond pad structure having dummy plugs and/or patterns formed therearound

Connection by fitting together two soldered inserts

Wiring Structure, Semiconductor Device Having the Wiring Structure, and Method for Manufacturing the Semiconductor Device

Wafer level packaged MEMS integrated circuit

METAL INTERCONNECTION

High-Electrical-Current Wafer Level Packaging, High-Electrical-Current WLP Electronic Devices, and Methods of Manufacture Thereof

Semiconductor device for battery power voltage control

Through Substrate Conductors

Methods and devices for fabricating and assembling printable semiconductor elements

Electronic component mounting structure

Castellation wafer level packaging of integrated circuit chips

Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods

Integrated circuit device

Methods of forming solder connections and structure thereof

Copper-topped interconnect structure that has thin and thick copper traces and method of forming the copper-topped interconnect structure

Resin sheet, circuit device and method of manufacturing the same

PACKAGING STRUCTURE, PACKAGING METHOD AND PHOTOSENSITIVE DEVICE

Bond pad structures and semiconductor devices using the same

Semiconductor device and method of forming a fan-in package-on-package structure using through silicon vias

Process for making contact with and housing integrated circuits

Method for manufacturing semiconductor device

Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers

Light-emitting device, light-emitting element and method of manufacturing same

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

METHOD OF FORMING BALL BOND

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Semiconductor chip capable of increased number of pads in limited region and semiconductor package using the same

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit

Semiconductor device and method of forming shielding layer over integrated passive device using conductive channels

Semiconductor device

LED structure

Semiconductor package structures

Wafer level compliant packages for rear-face illuminated solid state image sensors

Camera module and method of producing the same

Electronic component mounting structure and method for manufacturing the same

COPPER PAD FOR COPPER WIRE BONDING

SEMICONDUCTOR DEVICE INCLUDING COLUMNAR ELECTRODES HAVING PLANAR SIZE GREATER THAN THAT OF CONNECTION PAD PORTION OF WIRING LINE, AND MANUFACTURING METHOD THEREOF

Wafer level package and method of manufacturing the same

Crystal structure of a solder bump of flip chip semiconductor device

Semiconductor wafer with adhesive protection layer

Methods of forming C4 round dimple metal stud bumps for fine pitch packaging applications and structures formed thereby

Semiconductor device including stress relaxation gaps for enhancing chip package interaction stability

ENHANCED WIRE BOND STABILITY ON REACTIVE METAL SURFACES OF A SEMICONDUCTOR DEVICE BY ENCAPSULATION OF THE BOND STRUCTURE

Three-dimensional package and method of making the same

3-D integrated semiconductor device comprising intermediate heat spreading capabilities

Semiconductor package

Semiconductor device having a suspended isolating interconnect

Substrate for semiconductor package and semiconductor package having the same

Semiconductor light emitting apparatus having stacked reflective dielectric films

Semiconductor light emitting device and semiconductor light emitting apparatus

Semiconductor light-emitting device and method for manufacturing same

SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME

Bonded structure and bonding method

Method of fabricating a high Q factor integrated circuit inductor

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages

Method of manufacturing stacked semiconductor package using improved technique of forming through via

3D integrated circuit device fabrication using interface wafer as permanent carrier

Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI)

Integrated circuit package employing predetermined three-dimensional solder pad surface and method for making same

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Electronic device having a chip stack

SEMICONDUCTOR DEVICE

Semiconductor device bonding with stress relief connection pads

Method of forming collapse chip connection bumps on a semiconductor substrate

Semiconductor device and method of fabricating semiconductor device

Solder joint reliability in microelectronic packaging

3D integrated circuit device fabrication with precisely controllable substrate removal

Semiconductor device and electronic apparatus using the same

Semiconductor device with a charge carrier compensation structure and process

Flip chip light emitting diode with epitaxial strengthening layer and manufacturing method thereof

Electrode structure and method for forming bump

Methods of forming semiconductor constructions and assemblies