Wafer level chip package and a method of fabricating thereof

Method of forming metal and metal alloy features

System and method for increasing the strength of a bond made by a small diameter wire in ball bonding

METHOD OF FORMING A MULTI-LAYER SEMICONDUCTOR STRUCTURE INCORPORATING A PROCESSING HANDLE MEMBER

Pad over active circuit system and method with frame support structure

Post passivation interconnection schemes on top of IC chip

Wafer level chip scale package and method for manufacturing the same

Systems and methods for supporting a subset of multiple interface types in a semiconductor device

Method of fabricating light emitting device and thus-fabricated light emitting device

Post passivation interconnection schemes on top of IC chip

Compact impedance transformation circuit

Semiconductor device and method of producing the same

Semiconductor device and fabricating method thereof

Semiconductor apparatus and manufacturing method of semiconductor apparatus

RELIABLE WAFER-LEVEL CHIP-SCALE PACKAGE SOLDER BUMP STRUCTURE IN A PACKAGED SEMICONDUCTOR DEVICE

Structure of wafer level package with area bump

Low fabrication cost, fine pitch and high reliability solder bump

Semiconductor chip and method for fabricating the same

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Chip package and method for fabricating the same

SEMICONDUCTOR DEVICES AND MANUFACTURING METHOD THEREFOR

Apparatus and method for packaging circuits

Semiconductor device

Light emitting device and the manufacture method thereof

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Wire bonders and methods of wire-bonding

Chip structure and process for forming the same

Microfeature workpieces having conductive interconnect structures formed by chemically reactive processes, and associated systems and methods

Low fabrication cost, fine pitch and high reliability solder bump

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Adhesion by plasma conditioning of semiconductor chip

Semiconductor device including through electrode and method of manufacturing the same

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Implantable microelectronic device and method of manufacture

Chip structure and process for forming the same

Semiconductor device and fabricating method thereof

SEMICONDUCTOR PACKAGE INCLUDING REDISTRIBUTION PATTERN AND METHOD OF MANUFACTURING THE SAME

FLIP CHIP SEMICONDUCTOR ASSEMBLY WITH VARIABLE VOLUME SOLDER BUMPS

Low fabrication cost, fine pitch and high reliability solder bump

Semiconductor device having pads

Semiconductor package and method for manufacturing the same

Process of forming an electronic device including a barrier layer

Etching solution for etching metal layer, etching method using the etching solution, and method of fabricating semiconductor product using the etching solution

Post passivation interconnection schemes on top of IC chip

Top layers of metal for integrated circuits

Post passivation interconnection schemes on top of IC chips

Method of wire bonding over active area of a semiconductor circuit

Post passivation interconnection schemes on top of IC chips

Post passivation interconnection schemes on top of IC chip

Semiconductor device and method for manufacturing same

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

SEMICONDUCTOR DEVICES AND METHODS OF FABRICATING THE SAME

Post passivation interconnection schemes on top of the IC chips

Post passivation interconnection schemes on top of the IC chips

Post passivation interconnection schemes on top of IC chip

Post passivation interconnection schemes on top of IC chip

Post passivation interconnection schemes on top of IC chip

Bond pad for wafer and package for CMOS imager

High performance system-on-chip using post passivation process

Post passivation interconnection schemes on top of IC chip

Semiconductor chip structure

High performance system-on-chip using post passivation process

BUMP STRUCTURES AND PACKAGED STRUCTURES THEREOF

Semiconductor device, method of manufacturing the same, circuit board, and electronic instrument

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Method and system for depositing alloy composition

Semiconductor element and manufacturing method thereof

METHODS OF FORMING ALUMINUM-FREE WIRE BOND PAD AND PAD SO FORMED

High performance system-on-chip using post passivation process

Process for packaging components, and packaged components

CIRCUIT BOARD AND CIRCUIT STRUCTURE

Method for setting a reference potential of a current sensor and arrangement for determining the reference potential of a power semiconductor device

Solder elements with columnar structures and methods of making the same

Semiconductor integrated circuit device

Semiconductor device and method for manufacturing the same

Interconnection structure of integrated circuit chip

High performance system-on-chip using post passivation process

High performance system-on-chip using post passivation process

Chip scale package for power devices and method for making the same

Post passivation interconnection schemes on top of the IC chips

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Semiconductor device and method of manufacturing same

Chip scale package and method for manufacturing the same

Solder Interconnect Joints For A Semiconductor Package

Electronic device including a conductive stud over a bonding pad region

Structure and method of making lidded chips

Methods of forming conductive vias and methods of forming multichip modules including such conductive vias

Electrical through contact

Integrated circuit package system with filled wafer recess

Post passivation interconnection schemes on top of the IC chips

Methods of forming electronic structures including conductive shunt layers and related structures

Solder Ball Pad Structure

Composite photoresist for modifying die-side bumps

Microelectronic device connection structure

Method of forming hole in semiconductor device using mask

Semiconductor device with interface peeling preventing rewiring layer

Solder bumps in flip-chip technologies

Contact structure having a compliant bump and a testing area

Solder connector structure and method

Bonding apparatus

Pad structure design with reduced density

Structure of image sensor module and a method for manufacturing of wafer level package

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR CHIP

Semiconductor integrated circuit device

Semiconductor device with reduced contact resistance

BLM structure for application to copper pad

Semiconductor chip and method for manufacturing same, electrode structure of semiconductor chip and method for forming same, and semiconductor device

Compliant Bumps for Integrated Circuits Using Carbon Nanotubes

Chip having two groups of chip contacts

Interconnect structure for semiconductor package

CIRCUIT HAVING A SCHOTTKY CONTACT COMPONENT

Structure of image sensor module and a method for manufacturing of wafer level package

Semiconductor module with a power semiconductor chip and a passive component and method for producing the same

Methods and apparatus for packaging integrated circuit devices

Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device

Light emitting diode chip with large heat dispensing and illuminating area

Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same

Application of PVD W/WN bilayer barrier to aluminum bondpad in wire bonding

CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME

ESD protection circuit for semiconductor device

Chip structure

Semiconductor chip structure

Method for producing chip packages, and chip package produced in this way

Chip structure with redistribution traces

Semiconductor device, mounting construction of a semiconductor device, and method of manufacturing the semiconductor device with the mounting construction

Semiconductor device, circuit substrate, electro-optic device and electronic appliance

Semiconductor device and method of producing the same

Semiconductor device having an electrode pad, a bump provided above the electrode pad and a bump foundation layer therebetween

Semiconductor component and method for producing the same

Semiconductor with reduced pad pitch

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system

Post passivation interconnection schemes on top of the IC chips

Semiconductor device with electrode pad having probe mark

Electronic device with EMI screen and packing process thereof

Copper bonding compatible bond pad structure and method

BONDING PAD STRUCTURE FOR ELECTRONIC DEVICE

Post passivation interconnection schemes on top of the IC chips

Integrated circuit and method for fabricating the same

Method for bonding wafers to produce stacked integrated circuits

Semiconductor constructions and assemblies, and electronic systems

Integrated circuit packaging system with ultra-thin die

Flip chip package and method of fabricating the same

Semiconductor device and method for manufacturing semiconductor device

Method for production of an integrated circuit bar arrangement, in particular comprising a capacitor assembly, as well as an integrated circuit arrangement

Bonding pad structure and method for making the same

Post passivation interconnection schemes on top of the IC chips

Post passivation interconnection schemes on top of IC chip

Method of providing mixed size solder bumps on a substrate using a solder delivery head

Method of providing solder bumps of mixed sizes on a substrate using solder transfer in two stages

Semiconductor package substrate for flip chip packaging

Method of providing solder bumps of mixed sizes on a substrate using a sorting mask and bumped substrate formed according to the method

Nickel tin bonding system for semiconductor wafers and devices

Method for fabricating a wafer level package with device wafer and passive component integration

Vibration-Assisted Method for Underfilling Flip-Chip Electronic Devices

Tapered die-side bumps

Structure and method of making lidded chips

Semiconductor device

Post passivation interconnection schemes on top of IC chip

Post passivation interconnection schemes on top of IC chip

Post passivation interconnection schemes on top of IC chip

Multiple-dies semiconductor device with redistributed layer pads

Post passivation interconnection schemes on top of IC chip

Post passivation interconnection schemes on top of IC chip

Semiconductor device having a contact hole extending from an upper surface of an insulating film and reaching one of a plurality of impurity regions constituting a transistor and method of manufacturing the same

Integrated circuit (IC) chip and method for fabricating the same

STACKED-TYPE WAFER LEVEL PACKAGE, METHOD OF MANUFACTURING THE SAME, WAFER-LEVEL STACK PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor Device and Manufacturing Method Thereof, Semiconductor Package, and Electronic Apparatus

System Comprising an Electrical Component and an Electrical Connecting Lead for Said Component, and Method for the Production of Said System

Structure and method of making lidded chips

SURFACE TREATMENT, SORTING AND ASSEMBLING METHODS OF MICROELECTRONIC DEVICES AND STORAGE STRUCTURE THEREOF

Capping of metal interconnects in integrated circuit electronic devices

Die configurations and methods of manufacture

Method for applying solder to redistribution lines

Die package and probe card structures and fabrication methods

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device having conductive adhesive layer and method of fabricating the same

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor devices and method of manufacturing them

RF INTEGRATED CIRCUIT WITH ESD PROTECTION AND ESD PROTECTION APPARATUS THEREOF

Semiconductor device, and life prediction circuit and life prediction method for semiconductor device

Semiconductor device, manufacturing method and apparatus for the same

Mold for forming conductive bump, method of fabricating the mold, and method of forming bump on wafer using the mold

INTEGRATED INDUCTORS AND COMPLIANT INTERCONNECTS FOR SEMICONDUCTOR PACKAGING

Via layout with via groups placed in interlocked arrangement

Electronic component, semiconductor device employing same, and method for manufacturing electronic component

Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same

Semiconductor device capable of suppressing current concentration in pad and its manufacture method

METHODS OF FORMING SOLDER CONNECTIONS AND STRUCTURE THEREOF

Methods of forming solder connections and structure thereof

Method of manufacturing an integrated circuit

Electronics package and associated method

Semiconductor device, manufacturing method of the semiconductor device, and mounting method of the semiconductor device

Wiring board and method for manufacturing the same, and semiconductor device

Integrated circuit package system with post-passivation interconnection and integration

Semiconductor device and method for producing the semiconductor device

Semiconductor device having a bonding pad and fuse and method for forming the same

SEMICONDUCTOR DEVICE, MAGNETIC SENSOR, AND MAGNETIC SENSOR UNIT

High-efficiency, overvoltage-protected, light-emitting semiconductor device

INTEGRATED CIRCUIT CHIP FORMED ON SUBSTRATE

HIGHLY COMPLIANT PLATE FOR WAFER BONDING

Semiconductor device and method for fabricating the same

Attachment method, attachment apparatus, manufacturing method of semiconductor device, and manufacturing apparatus of semiconductor device

Chip stack package and manufacturing method thereof

METHOD FOR FORMING INTERCONNECTS ON THIN WAFERS

Semiconductor device and method for fabricating the same

System and method to reduce metal series resistance of bumped chip

Semiconductor package substrate and semiconductor package having the same

Chip stack, method of fabrication thereof, and semiconductor package having the same

Modular bonding pad structure and method

Barrier layer for fine-pitch mask-based substrate bumping

Contact surrounded by passivation and polymide and method therefor

Non-cyanide gold electroplating for fine-line gold traces and gold pads

Method of wire bonding over active area of a semiconductor circuit

Semiconductor device

Method of providing solder bumps using reflow in a forming gas atmosphere

Methodology to control underfill fillet size, flow-out and bleed in flip chips (FC), chip scale packages (CSP) and ball grid arrays (BGA)

Method and apparatus for forming an electrical connection to a semiconductor substrate

Electronic module with a semiconductor chip and a component housing and methods for producing the same

Semiconductor device

Semiconductor device having pad structure for preventing and buffering stress of silicon nitride film

Metallization layer for a power semiconductor device

INTEGRATED CIRCUIT HAVING PADS AND INPUT/OUTPUT (I/O) CELLS

Semiconductor device including electrically conductive bump and method of manufacturing the same

Manufacturing a bump electrode with roughened face

Semiconductor device having low dielectric insulating film and manufacturing method of the same

Wafer level semiconductor chip packages and methods of making the same

Semiconductor chip, method of manufacturing the semiconductor chip and semiconductor chip package

Integrated circuit having stress tuning layer

Micro-package, multi-stack micro-package, and manufacturing method therefor

Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion

Super high density module with integrated wafer level packages

Method for fabricating semiconductor package with multi-layer die contact and external contact

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Semiconductor Device, Power Supply Apparatus Using Same, and Electronic Device

Devices and systems having at least one dam structure

Optically blocked reference pixels for focal plane arrays

Semiconductor light-emitting element, manufacturing method and mounting method of the same and light-emitting device

Low temperature methods of forming back side redistribution layers in association with through wafer interconnects

Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips

Semiconductor device including a buffer layer structure for reducing stress

Process for forming bumps and solder bump

Test pads on flash memory cards

Wafer level stack structure for system-in-package and method thereof

CHIP STRUCTURE AND FABRICATING PROCESS THEREOF

Manufacturing method of semiconductor device with a barrier layer and a metal layer

3D interconnect with protruding contacts

Wirebond pad for semiconductor chip or wafer

CHIP PACKAGING STRUCTURE

Method for forming C4 connections on integrated circuit chips and the resulting devices

Semiconductor device having a smaller electrostatic capacitance electrode

SEMICONDUCTOR PACKAGE STRUCTURES HAVING HEAT DISSIPATIVE ELEMENT DIRECTLY CONNECTED TO INTERNAL CIRCUIT AND METHODS OF FABRICATING THE SAME

Semiconductor device

Semiconductor device with via hole of uneven width

Chip structure with half-tunneling electrical contact to have one electrical contact formed on inactive side thereof and method for producing the same

Method of manufacturing semiconductor apparatus

Semiconductor device system and method for modifying a semiconductor device

IC chip package with minimized packaged-volume

Semiconductor device and method of manufacturing the same

Wafer level semiconductor module and method for manufacturing the same

Semiconductor components having encapsulated through wire interconnects (TWI)

Semiconductor light emitting element

Method for Electroplating and Contact Projection Arrangement

Method of manufacturing a through electrode

Semiconductor memory device and defect remedying method thereof

Solder joint flip chip interconnection having relief structure

Semiconductor apparatus and method of producing the same

Direct-write wafer level chip scale package

Semiconductor light emitting device with first and second leads

Camera module

NOVEL UNDER-BUMP METALLIZATION FOR BOND PAD SOLDERING

Apparatuses and methods to enhance passivation and ILD reliability

Bilayer Laminated Film for Bump Formation and Method of Bump Formation

Method for fabricating a transformer integrated with a semiconductor structure

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH POST-PASSIVATION INTERCONNECTION AND INTEGRATION

Physical quantity sensor, method for manufacturing the same, and resin film for bonding semiconductor chip and circuit chip

Capacitor structure of semiconductor device and method of fabricating the same

Method for fabricating a transformer integrated with a semiconductor structure

Semiconductor device and method for manufacturing the same

Method for fabricating thermal compliant semiconductor chip wiring structure for chip scale packaging

Method for forming passivation layer

Method and structure for eliminating aluminum terminal pad material in semiconductor devices

Room temperature metal direct bonding

Thin film transistor substrate and manufacturing method thereof

Semiconductor device manufacturing method

Method of manufacturing semiconductor device

Fabrication method of semiconductor integrated circuit device

Flip chip bonding structure

Systems for providing conducting pad and fabrication method thereof

Carbon nanotube via interconnect

Isolating chip-to-chip contact

Semiconductor device with guard rings that are formed in each of the plural wiring layers

Semiconductor chip comprising a metal coating structure and associated production method

High-performance semiconductor package