Semiconductor device and manufacturing method thereof

Semiconductor device that improves electrical connection reliability

Semiconductor chip having fine pitch bumps and bumps thereon

Multi-chip package for reducing parasitic load of pin

Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices

Semiconductor device including a DC-DC converter

Integrated-circuit chip with offset external pads and method for fabricating such a chip

Grounding structure of semiconductor device including a conductive paste

Semiconductor device and medium of fabricating the same

Varistor and light-emitting apparatus

Varistor and light-emitting apparatus

Semiconductor integrated circuit device

Structure and method to improve current-carrying capabilities of C4 joints

Method for precision assembly of integrated circuit chip packages

Method and system for stacking integrated circuits

Semiconductor components with through wire interconnects

Semiconductor constructions having interconnect structures, methods of forming interconnect structures, and methods of forming semiconductor constructions

Stack package utilizing through vias and re-distribution lines

Electronic component having exposed surfaces

Semiconductor integrated circuit device

Semiconductor component having test pads and method and apparatus for testing same

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Method of manufacturing wafer level stack package

Method for manufacturing bump of wafer level package

Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device

Semiconductor device and method of manufacturing the same, electronic device and method of manufacturing the same, and electronic instrument

Semiconductor component having test pads and method and apparatus for testing same

Semiconductor device, manufacturing method and mounting method of the semiconductor device, circuit board, and electronic apparatus

Flip-chip type semiconductor device

Micro-element package having a dual-thickness substrate and manufacturing method thereof

Semiconductor device

Aluminum bump bonding for fine aluminum wire

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

Integrated Circuit Chip With Electrostatic Discharge Protection Device

METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES

Semiconductor device

Semiconductor package containing multi-layered semiconductor chips

Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink

Connecting a plurality of bond pads and/or inner leads with a single bond wire

Semiconductor chip for producing a controllable frequency

GaAs integrated circuit device and method of attaching same

Wire bonding method for preventing polymer cracking

Method, system, and apparatus for gravity assisted chip attachment

Method and structure for improving bonding reliability in bond pads

Composite bump

Method of forming a bump and a connector structure having the bump

Method and apparatus for providing structural support for interconnect pad while allowing signal conductance

Semiconductor device

Integrated circuit package system having interconnect stack and external interconnect

Semiconductor device and method of manufacturing the same

Gold-bumped interposer for vertically integrated semiconductor system

Integrated circuit package system

Semiconductor device and manufacturing process thereof

PROCESSES FOR FORMING PHOTOVOLTAIC FEATURES

Electronic substrate, semiconductor device, and electronic device

Chip package and method for fabricating the same

Solder bump structure for flip chip package and method for manufacturing the same

Pad part of semiconductor device having optimal capacitance between pins

SEMICONDUCTOR DEVICE WITH BATTERY

Bond pad structure for wire bonding

Thin film capacitor device used for a decoupling capacitor and having a resistor inside

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Chip packaging process

Method for manufacturing semiconductor device

Method for fabricating stacked semiconductor components with through wire interconnects

System for fabricating semiconductor components with through wire interconnects

METHOD OF FABRICATING ULTRA THIN FLIP-CHIP PACKAGE

Wiring board with connection electrode formed in opening and semiconductor device using the same

Post passivation interconnection schemes on top of the IC chips

Semiconductor apparatus

Semiconductor device, electronic device and fabrication method of the same

Redistribution connecting structure of solder balls

Flip-Chip Device Having Underfill in Controlled Gap

Bond pad structures with reduced coupling noise

Semiconductor device and semiconductor module therewith

Apparatus And Method For Temperature-Interrupting Protection Of An Electric Device

Entire encapsulation of Cu interconnects using self-aligned CuSiN film

Semiconductor device and manufacturing method for the same

Processed wafer via

Semiconductor device and manufacturing the same

Stacked chip-based system and method

Process for wafer level treatment to reduce stiction and passivate micromachined surfaces and compounds used therefor

Cap layer for an aluminum copper bond pad

Semiconductor package featuring thin semiconductor substrate and liquid crystal polymer sheet, and method for manufacturing such semiconductor package

Apparatus for integrated input/output circuit and verification method thereof

Semiconductor component comprising an integrated semiconductor chip and a chip housing, and electronic device

Semiconductor device and manufacturing method for the same

Semiconductor package including transformer or antenna

Semiconductor package having an optical device and a method of making the same

Method of manufacturing an inlet member for an electronic tag

Semiconductor device and method for manufacturing the semiconductor device

Method of manufacturing semiconductor device

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE WITH PROTECTION LAYER

Semiconductor device having improved wire-bonding reliability and method of manufacturing the same

Power composite integrated semiconductor device and manufacturing method thereof

Nanoscale probes for electrophysiological applications

PAD STRUCTURE FOR BONDING PAD AND PROBE PAD AND MANUFACTURING METHOD THEREOF

ACTIVE AREA BONDING COMPATIBLE HIGH CURRENT STRUCTURES

Connection structure and method for fabricating the same

Method of fabricating semiconductor memory device and semiconductor memory device driver

Semiconductor apparatus including a radiator for diffusing the heat generated therein

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Semiconductor device with signal line having decreased characteristic impedance

Semiconductor device

Patterned gold bump structure for semiconductor chip

Wire bond and redistribution layer process

Method of producing a semiconductor device by forming an oxide film on a resin layer

Methods for fabricating and filling conductive vias and conductive vias so formed

Active area bonding compatible high current structures

Methods of forming metal layers using multi-layer lift-off patterns

Method of fabrication on high coplanarity of copper pillar for flip chip packaging application

Method of fabricating wafer level package

Apparatus and method for manufacturing semiconductor device

Wafer level chip scale package (WLCSP) with high reliability against thermal stress

Semiconductor device having a bump formed over an electrode pad

Method for forming a redistribution layer in a wafer structure

Wiring board with conductive wirings and protrusion electrodes

Solder bump on a semiconductor substrate

Semiconductor device with an improved solder joint

Semiconductor device, reticle used in fabricating method for the same and fabrication method thereof

Electronic devices including solder bumps on compliant dielectric layers

Semiconductor device

Microelectromechanical semiconductor component with cavity structure and method for producing the same

Semiconductor device with visible indicator and method of fabricating the same

LOW VISCOSITY PRECURSOR COMPOSITIONS AND METHODS FOR THE DEPOSITION OF CONDUCTIVE ELECTRONIC FEATURES

Solder composition and method of bump formation therewith

Method for forming multi-layer bumps on a substrate

Semiconductor arrangement

Structure and method for bond pads of copper-metallized integrated circuits

Bonding pad structure

Wafer level chip scale package having a gap and method for manufacturing the same

Solder wall structure in flip-chip technologies

Stack of semiconductor chips

Multi-chips module package and manufacturing method thereof

Method of manufacturing semiconductor device including bonding pad and fuse elements

Semiconductor device including fuse elements and bonding pad

Light emitting device for enhancing brightness

Thin-film capacitor and method of manufacturing the same

Insulating film forming method capable of enhancing adhesion of silicon carbide film, etc. and semiconductor device

Three-dimensional package and method of making the same

Joining method, method of mounting semiconductor package using the same, and substrate-joining structure prepared by the joining method

Semiconductor device and manufacturing method of them

Semiconductor device and method for fabricating the same

Multilayer integrated circuit for RF communication and method for assembly thereof

Semiconductor device with surface-mountable external contacts and method for manufacturing the same

Wafer level stack structure for system-in-package and method thereof

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device having flange structure

Semiconductor devices with oxide coatings selectively positioned over exposed features including semiconductor material and solutions for forming the coatings

Triaxial through-chip connection

Method for fabricating circuit component

Method for fabricating last level copper-to-C4 connection with interfacial cap structure

Microelectronic interconnect device comprising localised conductive pins

Semiconductor device, method of manufacturing the same, and camera module

Multi-chip stack package and fabricating method thereof

LIGHT-EMITTING DIODE PACKAGE STRUCTURE

Method of wire bonding over active area of a semiconductor circuit

Method of wire bonding over active area of a semiconductor circuit

Semiconductor package and fabricating method thereof

Method of wire bonding over active area of a semiconductor circuit

Semiconductor device, dicing saw and method for manufacturing the semiconductor device

Semiconductor device having alignment post electrode and method of manufacturing the same

Carbon nanotube circuit component structure

METHOD OF WIRE BONDING OVER ACTIVE AREA OF A SEMICONDUCTOR CIRCUIT

Semiconductor chip with bond area

Methods of forming back side layers for thinned wafers

METHOD OF FORMING PAD OF SEMICONDUCTOR DEVICE

METHOD FOR MANUFACTURING MOSFET ON SEMICONDUCTOR DEVICE

Thermally balanced via

Electrical connections made with dissimilar metals

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Contact spring application to semiconductor devices

Multi-chip package system

Compact camera module

Heater, reflow apparatus, and solder bump forming method and apparatus

Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps

Manufacturing method for semiconductor device and semiconductor device

Method of fabricating a semiconductor integrated circuit that includes patterning a semiconductor substrate with a first photomask that uses metal for blocking light and patterning the same substrate with a second photomask that uses organic resin for blocking light

Electronic device and method of manufacturing the same, circuit board, and electronic instrument

Method for Manufacturing Chip Package Structures

Method and system of trace pull test

Tin-bismuth (Sn-Bi) family alloy solder and semiconductor device using the same

Package structure and manufacturing method thereof

Super high-density module with integrated wafer level packages

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Method of fabricating passivation

Test pads on flash memory cards

Electronic part mounting method

Electronic micromodule and method for manufacturing the same

Object and bonding method thereof

Nanostructure-based package interconnect

Common drain dual semiconductor chip scale package and method of fabricating same

Compliant terminal mountings with vented spaces and methods

System to wirebond power signals to flip-chip core

CHIP STRUCTURE AND CHIP MANUFACTURING PROCESS

Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof

Semiconductor device and manufacturing method of the same

Semiconductor device and method of manufacturing the same

Super high-density module with integrated wafer level packages

Microelectronic elements with compliant terminal mountings and methods for making the same

Hermetically sealed integrated circuits and method

Compliant terminal mountings with vented spaces and methods

Optimized contact design for thermosonic bonding of flip-chip devices

Method for fabricating a probing pad of an integrated circuit chip

Wafer structure and bumping process

Thin-film capacitor and method for fabricating the same, electronic device and circuit board

Method of manufacturing semiconductor device

Wafer-level flipchip package with IC circuit isolation

PAD STRUCTURE OF SEMICONDUCTOR DEVICE AND FORMATION METHOD

Semiconductor device having metal interconnection structure and method for forming the same

PAD STRUCTURE IN A SEMICONDUCTOR DEVICE AND A METHOD OF FORMING A PAD STRUCTURE

Semiconductor device

Semiconductor device comprising a vertical semiconductor component and method for producing the same

Semiconductor die structure featuring a triple pad organization

Apparatus and method incorporating discrete passive components in an electronic package

Electronics package with an integrated circuit device having post wafer fabrication integrated passive components

Methods and apparatus for packaging integrated circuit devices

Method for mounting bumps on an under metallurgy layer

Integrated circuit having bond pad with improved thermal and mechanical properties

METHOD FOR MANUFACTURING A WAFER LEVEL CHIP SCALE PACKAGE

Elastic conductive resin, and electronic device including elastic conductive bumps made of the elastic conductive resin

Integrated circuit chip with external pads and process for fabricating such a chip

Integrated circuit devices including compliant material under bond pads and methods of fabrication

Method of fabricating electrical connection terminal of embedded chip

Adhesion by plasma conditioning of semiconductor chip surfaces

Method and system for increasing yield of vertically integrated devices

Method for packaging microelectronic devices

Semiconductor device with a wiring substrate and method for producing the same

Semiconductor element, production process thereof, semiconductor laser and production process thereof

CIRCUIT FILM WITH BUMP, FILM PACKAGE USING THE SAME, AND RELATED FABRICATION METHODS

Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit board, and electronic device

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Interconnect assemblies and methods

Semiconductor device having high frequency components and manufacturing method thereof

Eliminate IMC cracking in post wirebonded dies: macro level stress reduction by modifying dielectric/metal film stack in be layers during Cu/Low-K processing

Semiconductor device manufacturing method

Circuit under pad structure and bonding pad process

Method for forming solder balls with a stable oxide layer by controlling the reflow ambient

Individualized low parasitic power distribution lines deposited over active integrated circuits

Bonding structure with buffer layer and method of forming the same

Bond pad for low K dielectric materials and method for manufacture for semiconductor devices

Flip chip package and manufacturing method of the same

Intermediate connection for flip chip in packages

A SEMICONDUCTOR HAVING A COPPER-BASED METALLIZATION STACK WITH A LAST ALUMINUM METAL LINE LAYER

Semiconductor device

Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Semiconductor packages having leadframe-based connection arrays

Interposer and stacked chip package

Low cost bonding pad and method of fabricating same

Semiconductor device and a method of manufacturing the same

Method and apparatus that provides differential connections with improved ESD protection and routing

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Structure of bumps forming on an under metallurgy layer and method for making the same

3D integrated circuits using thick metal for backside connections and offset bumps

Semiconductor Device with Improved Stud Bump

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

Hybrid solder pad

SEMICONDUCTOR DEVICE

Alternate pad structures/passivation inegration schemes to reduce or eliminate IMC cracking in post wire bonded dies during Cu/Low-K BEOL processing

Interconnecting element between semiconductor chip and circuit support and method

Integrated circuit package system with bump pad

Integrated passive device system

SEMICONDUCTOR DEVICE

Semiconductor assembly having substrate with electroplated contact pads

Damascene patterning of barrier layer metal for C4 solder bumps

PROCESSING METHOD FOR SEMICONDUCTOR STRUCTURE

Wafer redistribution structure with metallic pillar and method for fabricating the same

Process for preparing a bonding type semiconductor substrate

Semiconductor chip having bond pads

Semiconductor chip having bond pads

Wafer level chip scale packaging structure and method of fabricating the same

Package and package module of the package

Chip and package structure

Chip structure and manufacturing method of the same

Semiconductor device

Semiconductor device

Semiconductor package including a semiconductor die having redistributed pads

Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same

Wafer level package having redistribution interconnection layer and method of forming the same

Semiconductor chip having bond pads

SEMICONDUCTOR STRUCTURE

Method of Forming Bump, Method of Forming Image Sensor Using the Method, Semiconductor Chip and the Sensor so Formed

Electrical interconnection structure formation

BRACE FOR WIRE LOOP

Solder joint flip chip interconnection

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Low viscosity precursor compositions and methods for the deposition of conductive electronics features

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Low viscosity precursor compositions and methods for the deposition of conductive electronic features

Constant voltage diode

CHIP STRUCTURE WITH SOLDER BUMP AND METHOD FOR PRODUCING THE SAME