207785 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas ; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
Bumping process with self-aligned A1-cap and the elimination of 2nd passivation layer
#11402Semiconductor device and method of manufacturing the same
#11403Reduction of macro level stresses in copper/low-K wafers
#11404Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#11405Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#11406Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#11407Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#11408Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#11409Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#11410Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#11411Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#11412Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#11413Method for forming multi-layer bumps on a substrate
#11414Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#11415Junction structure for a terminal pad and solder, and semiconductor device having the same
#11416Semiconductor device and manufacturing method of the same
#11417Semiconductor device
#11418Semiconductor device with solder balls having high reliability
#11419Contact pad structure for flip chip semiconductor die
#11420Semiconductor chip with post-passivation scheme formed over passivation layer
#11421Stacked semiconductor device and lower module of stacked semiconductor device
#11422Integrated circuit package system including high-density small footprint system-in-package
#11423Implantable microelectronic device and method of manufacture
#11424High frequency chip packages with connecting elements
#11425Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#11426Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#11427Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#11428Low viscosity precursor compositions and methods for the deposition of conductive electronic features
#11429Bond Surface Conditioning System for Improved Bondability
#11430Semiconductor device and method for manufacturing the same
#11431BONDING PAD AND DISPLAY PANEL
#11432Sensor having semiconductor chip and circuit chip
#11433Semiconductor component of semiconductor chip size with flip-chip-like external contacts
#11434Technique for moderating stresses cause by a difference in thermal expansion coeffiecients between a substrate and an electronic component
#11435Semiconductor device that attains a high integration
#11436Bond pad structure
#11437Light emitting diode chip with reflective layer thereon
#11438SEMICONDUCTOR DEVICE
#11439Method for forming solder contacts on mounted substrates
#11440Method for forming bumps
#11441Wafer structure with electroless plating metal connecting layer and method for fabricating the same
#11442Etchant and method for forming bumps
#11443Method for forming improved bump structure
#11444Semiconductor device having strong adhesion between wiring and protective film, and manufacturing method therefor
#11445Semiconductor device with multiple designation marks
#11446Method for manufacture of wafer level package with air pads
#11447Chip packaging process
#11448Semiconductor device with electroless plating metal connecting layer and method for fabricating the same
#11449Chip scale power LDMOS device
#11450Semiconductor chip and method of manufacturing semiconductor chip
#11451Semiconductor device and fabrication method thereof
#11452SELECTIVE SOLDER DEPOSITION BY SELF-ASSEMBLY OF NANO-SIZED SOLDER PARTICLES, AND METHODS OF ASSEMBLING SOLDERED PACKAGES
#11453Methods for aligning a device and for stacking two devices in an aligned manner and device for improved stacking
#11454Conductive ball, formation method for electrode of electronic component, electronic component and electronic equipment
#11455Low stress conductive polymer bump
#11456Method for forming bonding pad and semiconductor device having the bonding pad formed thereby
#11457Semiconductor device protective structure and method for fabricating the same
#11458Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure
#11459Support structures for semiconductor devices
#11460Bond pads and methods for fabricating the same
#11461SEMICONDUCTORS AND METHODS OF MAKING
#11462Semiconductor chip having a bump with conductive particles and method of manufacturing the same
#11463Semiconductor device with front side metallization and method for the production thereof
#11464Method and apparatus for facilitating proximity communication and power delivery
#11465Semiconductor device with pad electrode for testing and manufacturing method of the same
#11466Semiconductor chip and semiconductor device
#11467Semiconductor element with conductive bumps and fabrication method thereof
#11468Electronic device, semiconductor device using same, and method for manufacturing semiconductor device
#11469Semiconductor device for radio frequency applications and method for making the same
#11470Method of manufacturing a chip
#11471Semiconductor constructions comprising multi-level patterns of radiation-imageable material
#11472Methods for protecting metal surfaces
#11473Solder bump structure for flip chip semiconductor devices and method of manufacture therefore
#11474Modular bonding pad structure and method
#11475Semiconductor device featuring large reinforcing elements in pad area
#11476CLOCK DISTRIBUTION NETWORKS AND CONDUCTIVE LINES IN SEMICONDUCTOR INTEGRATED CIRCUITS
#11477Semiconductor device having shield structure
#11478Semiconductor device with a plastic housing composition that includes filler particles and that at least partially embeds a semiconductor chip
#11479Integrated circuit solder bumping system
#11480Wiring structure of a semiconductor package and method of manufacturing the same, and wafer level package having the wiring structure and method of manufacturing the same
#11481Semiconductor device with a resin-sealed optical semiconductor element
#11482Method and system of trace pull test
#11483Electric contact and method for producing the same and connector using the electric contacts
#11484Semiconductor device and a method of manufacturing the same
#11485Method for patterning and etching a passivation layer
#11486Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces
#11487Routing under bond pad for the replacement of an interconnect layer
#11488Display device and manufacturing method of the same
#11489Semiconductor device
#11490Method for producing bonding connection of semiconductor device
#11491Electronic assembly that includes pads having a bowl shaped upper section
#11492Semiconductor apparatus integrating an electrical device under an electrode pad
#11493Selective consolidation methods for fabricating semiconductor device components and conductive features thereof
#11494Light-receiving element, manufacturing method for the same, optical module, and optical transmitting device
#11495Semiconductor chip having bond pads
#11496Semiconductor device
#11497Semiconductor device
#11498Semiconductor chip having bond pads and multi-chip package
#11499Integrated die bumping process
#11500Multi-chip stack structure
#11501Manufacturing method of electronic device
#11502Chip structure and chip package structure
#11503Flip-chip packaging process using copper pillar as bump structure
#11504Semiconductor device and method for fabricating the same
#11505Integrated circuit chip and manufacturing process thereof
#11506Semiconductor device and manufacturing method thereof
#11507Semiconductor wafer level chip package and method of manufacturing the same
#11508Semiconductor device having a probing region
#11509Semiconductor device having pads and which minimizes defects due to bonding and probing processes
#11510Adapting short-wavelength LED's for polychromatic, broadband, or “white” emission
#11511Bumping process and structure thereof
#11512Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thickness
#11513Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices
#11514Multi-chip package type semiconductor device
#11515Microfeature workpieces, carriers, and associated methods
#11516Wafer-level package and IC module assembly method for the wafer-level package
#11517Semiconductor device integrated with opto-electric component and method for fabricating the same
#11518Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology
#11519Pad open structure
#11520Chip package and bump connecting structure thereof
#11521Microfeature workpieces and methods of forming a redistribution layer on microfeature workpieces
#11522Semiconductor device and method for fabricating the same
#11523Method for forming a double embossing structure
#11524Wafer structure with a multi-layer barrier in an UBM layer network device with power supply
#11525METHOD OF SOLDER BUMPING A CIRCUIT COMPONENT AND CIRCUIT COMPONENT FORMED THEREBY
#11526Semiconductor device and semiconductor chip
#11527Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#11528Semiconductor device with reduced thickness of the semiconductor substrate
#11529Methods for forming through-wafer interconnects, intermediate structures so formed, and devices and systems having at least one solder dam structure
#11530Semiconductor device and method of manufacturing the same
#11531Microfeature workpieces having alloyed conductive structures, and associated methods
#11532Method for hybridization of two components by using different sized solder protrusions and a device that uses two components hybridized according to this method
#11533BONDING PAD STRUCTURE AND METHOD OF FORMING THE SAME
#11534Approach to high temperature wafer processing
#11535Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#11536Method of packaging and interconnection of integrated circuits
#11537Bumpless chip package
#11538High current semiconductor device system having low resistance and inductance
#11539Semiconductor connection component
#11540METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING A PHOTOSENSITIVE POLYIMIDE LAYER AND SEMICONDUCTOR DEVICES FABRICATED THEREBY
#11541Method for forming metal pad in semiconductor device
#11542Manufacturing method of semiconductor device
#11543Bonding pad structure to minimize IMD cracking
#11544Bonded structure and bonding method
#11545Semiconductor device and method of manufacturing the same
#11546Semiconductor Apparatus and Semiconductor Module
#11547Semiconductor device electronic component, circuit board, and electronic device
#11548Optical semiconductor device and method of manufacturing the same
#11549Semiconductor assembly and packaging for high current and low inductance
#11550Chip-scale Schottky device
#11551Insulated gate semiconductor device and manufacturing method thereof
#11552Method of making wafer level package structure by grinding the backside thereof and then forming metal layer on the ground side
#11553Copper-metallized integrated circuits having electroless thick copper bond pads
#11554Electrical component having a reduced substrate area
#11555Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument
#11556Semiconductor device
#11557Semiconductor device
#11558Integrated circuit with low-stress under-bump metallurgy
#11559Power plane design and jumper wire bond for voltage drop minimization
#11560Semiconductor device and method of manufacturing the same
#11561Inter-chip ESD protection structure for high speed and high frequency devices
#11562Polysilicon film with increased roughness
#11563Method for manufacturing semiconductor device
#11564Manufacturing method of semiconductor device
#11565Metal pad or metal bump over pad exposed by passivation layer
#11566Electrical interconnect structures for integrated circuits and methods of manufacturing the same
#11567Technique for efficiently patterning an underbump metallization layer using a dry etch process
#11568Semiconductor device
#11569Planar bond pad design and method of making the same
#11570Semiconductor element with conductive bumps and fabrication method thereof
#11571Flip chip package with reduced thermal stress
#11572Bonding pad on IC substrate and method for making the same
#11573Technique for forming a copper-based contact layer without a terminal metal
#11574On-chip test circuit for assessing chip integrity
#11575ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE
#11576Method of fabricating self-assembled electrical interconnections
#11577Self-assembled interconnection particles
#11578Semiconductor device, electronic module, and method of manufacturing electronic module
#11579Semiconductor package with ferrite shielding structure
#11580Microelectronic bond pad
#11581Semiconductor device and oscillator
#11582Semiconductor device
#11583Semiconductor device that suppresses variations in high frequency characteristics of circuit elements
#11584Semiconductor device
#11585Method for modifying surface of substrate and method for manufacturing semiconductor device
#11586Method of forming solder bump with reduced surface defects
#11587Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same
#11588Forming of conductive bumps for an integrated circuit
#11589Method for forming high reliability bump structure
#11590Circuit board structure integrated with semiconductor chip and method of fabricating the same
#11591Integrated circuit pad with separate probing and bonding areas
#11592Connection element for a semiconductor component and method for producing the same
#11593Dummy structures extending from seal ring into active circuit area of integrated circuit chip
#11594Semiconductor integrated circuit device and process for manufacturing the same
#11595Wafer-level-chip-scale package and method of fabrication
#11596Wafer level package and its manufacturing method
#11597Multi-component integrated circuit contacts
#11598Semiconductor device
#11599Composite metal column for mounting semiconductor device
#11600Split control pad for multiple signal
#11601Method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surface of semiconductor chip with copper pads
#11602Process for making a semiconductor device having a roughened surface
#11603Method for fabricating a light-emitting device
#11604Method and structure for reduction of soft error rates in integrated circuits
#11605Probing pads in kerf area for wafer testing
#11606Electronic parts packaging structure and method of manufacturing the same
#11607High brightness light-emitting device and manufacturing process of the light-emitting device
#11608Micro-package, multi-stack micro-package, and manufacturing method therefor
#11609Temperature dependent semiconductor module connectors
#11610Method of realizing direct bonding between metal wires and copper pads by means of thermosonic wire bonding using shielding gas spraying device
#11611Manufacturing method improving the reliability of a bump electrode
#11612Electronic substrate and electronic device
#11613Electronic component and manufacturing method thereof
#11614SEMICONDUCTOR PACKAGE WITH MOLDED BACK SIDE AND METHOD OF FABRICATING THE SAME
#11615Semiconductor device
#11616Hybrid conductive coating method for electrical bridging connection of RFID die chip to composite antenna
#11617Seedless wirebond pad plating
#11618Semiconductor device
#11619Semiconductor device
#11620Semiconductor device protective structure and method for fabricating the same
#11621Semiconductor device, manufacturing method for semiconductor device, and electronic equipment
#11622Semiconductor sensor and manufacturing method therefor
#11623Semiconductor device
#11624Method for self-assembling microstructures
#11625Multi-step etch for metal bump formation
#11626Semiconductor device
#11627Method of interconnecting terminals and method of mounting semiconductor devices
#11628Semiconductor device advantageous in improving water resistance and oxidation resistance
#11629Semiconductor device and manufacturing method of the same
#11630Under bump metallization design to reduce dielectric layer delamination
#11631Arrangement for electrically connecting semiconductor circuit arrangements to an external contact device and method for producing the same
#11632Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages
#11633Semiconductor device and method of manufacturing the same
#11634Circuitry component and method for forming the same
#11635Ultrathin semiconductor circuit having contact bumps
#11636Wafer processing method
#11637Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer
#11638Manufacturing method for packaged semiconductor device
#11639Grid array connection device and method
#11640Mechanical integrity evaluation of low-k devices with bump shear
#11641Post passivation structure for a semiconductor device and packaging process for same
#11642Magnetic sensor, and method of compensating temperature-dependent characteristic of magnetic sensor
#11643Semiconductor device and a method of manufacturing the same
#11644Semiconductor device
#11645Semiconductor device and manufacturing method of the same
#11646Reliable integrated circuit and package
#11647Semiconductor device
#11648Semiconductor device
#11649Method of manufacturing semiconductor device
#11650Semiconductor wafer package and manufacturing method thereof
#11651Semiconductor device having through electrode and method of manufacturing the same
#11652Conductive particles and method and device for manufacturing the same, anisotropic conductive adhesive and conductive connection structure, and electronic circuit components and method of manufacturing the same
#11653Electronic board, method of manufacturing the same, and electronic device
#11654Electronic board, method of manufacturing the same, and electronic device
#11655Low stress chip attachment with shape memory materials
#11656Wafer and single chip having circuit rearranged structure and method for fabricating the same
#11657Positioning flowable solder for bonding integrated circuit elements
#11658Remote chip attachment
#11659Tack & fuse chip bonding
#11660Routingless chip architecture
#11661Chip-based thermo-stack
#11662Semiconductor device and manufacturing method therefor
#11663Active packaging
#11664Chip spanning connection
#11665Post & penetration interconnection
#11666Triaxial through-chip connection
#11667Chip capacitive coupling
#11668Semiconductor device with a diffusion barrier film having a spacing for stress relief of solder bump
#11669Semiconductor device, manufacturing method for semiconductor device, electronic component, circuit substrate, and electronic apparatus
#11670Electronic chip contact structure
#11671Die stacking recessed pad wafer design
#11672Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device
#11673METHOD FOR FORMING BUMPS
#11674Nickel bonding cap over copper metalized bondpads
#11675Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors
#11676Semiconductor device and method of manufacturing a semiconductor device
#11677Semiconductor device having reduced number of external pad portions
#11678Semiconductor chip with flip chip contacts and a passivation layer with varying thickness portions surrounding contact surfaces of the semiconductor chip
#11679Method for modified bus bar with Kapton™ tape or insulative material on LOC packaged part
#11680Semiconductor device and manufacturing method thereof
#11681Method and circuit structure employing a photo-imaged solder mask
#11682Semiconductor element and manufacturing method thereof
#11683Integrated-circuit die having redundant signal pads and related integrated circuit, system, and method
#11684Method for mounting an electronic part on a substrate using a liquid containing metal particles
#11685Structure and method for bond pads of copper-metallized integrated circuits
#11686HIGH PERFORMANCE INTEGRATED CIRCUIT DEVICE AND METHOD OF MAKING THE SAME
#11687Integrated circuit device
#11688Semiconductor device
#11689Electrical component and production thereof
#11690Capacitor device, semiconductor devioce, and setting method of terminal capacitance of pad electrode thereof
#11691Semiconductor device, semiconductor device manufacturing method, and semiconductor device test method
#11692Semiconductor bond pad structures and methods of manufacturing thereof
#11693Semiconductor device
#11694Semiconductor device
#11695Offset solder bump method and apparatus
#11696Semiconductor chip with coil element over passivation layer
#11697Semiconductor device and method of manufacturing the same
#11698Microelectronic assemblies having compliant layers
#11699Micromodule, particularly for chip card
#11700Backside method for fabricating semiconductor components with conductive interconnects