Techniques for packaging multiple device components

System in package and method of fabricating same

Semiconductor device and method of manufacturing the same

SURFACE MOUNT CHIP

Semiconductor device, a mobile communication device, and a method for manufacturing a semiconductor device

Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure

Reduced stress TSV and interposer structures

Method for fabricating two substrates connected by at least one mechanical and electrically conductive connection and structure obtained

Wafer-level packaging mechanisms

Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact

Self-aligned protection layer for copper post structure

Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device

Method of fabricating three dimensional integrated circuit

STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT

Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units

Semiconductor device and method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die

Semiconductor component that includes a protective structure

Semiconductor integrated device

Passivated copper chip pads

Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication

Crack stopper on under-bump metallization layer

Tin-based solder ball and semiconductor package including the same

Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate

Solder bump connections

Method of determining reinforcement position of circuit substrate and substrate assembly

Mechanisms for forming fine-pitch copper bump structures

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Die bonder and bonding method

Chips having rear contacts connected by through vias to front contacts

Semiconductor structure and method for making same

System and method for 3D integrated circuit stacking

System in package and method of fabricating same

Self-aligned protection layer for copper post structure

Semiconductor light-emitting device and method for manufacturing same

Semiconductor device

Bump-on-trace (BOT) structures

Through wafer vias and method of making same

Semiconductor device with partially-etched conductive layer recessed within substrate for bonding to semiconductor die

Semiconductor device and method of forming interconnect structure over seed layer on contact pad of semiconductor die without undercutting seed layer beneath interconnect structure

Flip chip interconnect solder mask

Flip chip interconnect solder mask

Reduced-stress bump-on-trace (BOT) structures

Stacked package, method of fabricating stacked package, and method of mounting stacked package fabricated by the method

Techniques for packaging multiple device components

Stacked semiconductor component having through wire interconnect (TWI) with compressed wire

Sensor mounted in flip-chip technology at a substrate edge

Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process

Method of manufacturing semiconductor device having a bumped wafer and protective layer

SEMICONDUCTOR DEVICE

Electrostatic chucking of an insulator handle substrate

EMI Shielding in a Package Module

Test contact system for testing integrated circuits with packages having an array of signal and power contacts

Semiconductor package with a metal post and manufacturing method thereof

Wafer-level interconnect for high mechanical reliability applications

Solder bump connections

Semiconductor device having semiconductor substrate electrode pads, and external electrodes

Method of forming partially-etched conductive layer recessed within substrate for bonding to semiconductor die

Semiconductor structure and method for making same

Method and system for improving reliability of a semiconductor device

Multilevel interconnection system

METAL LAYER-ATTACHED FILM FOR ELECTRONIC COMPONENT, METHOD FOR PRODUCING THE FILM, AND USE THEREOF

SILVER-COATED BALL AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect

MOUNT STRUCTURE, ELECTRONIC APPARATUS, STRESS RELIEVING UNIT, AND METHOD OF MANUFACTURING STRESS RELIEVING UNIT

Chip structure

Semiconductor integrated circuit device

Chip structure and process for forming the same

Semiconductor device

Semiconductor device

Semiconductor chip with coil element over passivation layer

Integrated circuit packages

CONTACT STRUCTURE HAVING A COMPLIANT BUMP AND A TESTING AREA AND MANUFACTURING METHOD FOR THE SAME

Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device

Chip package and method for fabricating the same

System and Method for Improving Reliability of Integrated Circuit Packages

Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier

FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED SOLDER RESIST OPENING

Semiconductor device structures and electronic devices including same hybrid conductive vias

Grid array connection device and method

Semiconductor device having elastic solder bump to prevent disconnection

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

DETECTION CIRCUITRY FOR DETECTING BONDING CONDITIONS ON BOND PADS

Integrated circuit with pads connected by an under-bump metallization and method for production thereof

Semiconductor light-emitting device and method for manufacturing same

Semiconductor die contact structure and method

Method of fabricating a packaging structure

Method for manufacturing and testing an integrated electronic circuit

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Method for manufacturing a semiconductor component

Method for forming a current distribution structure

Protected semiconductor device and method of manufacturing thereof

Semiconductor wafer coat layers and methods therefor

Self-aligned protection layer for copper post structure

Chip structure with bumps and testing pads

Semiconductor device having a wafer level chip size package structure

Electrostatic chucking of an insulator handle substrate

Method and apparatus for manufacturing semiconductor device

Process of forming an electronic device including a conductive stud over a bonding pad region

Semiconductor device

Electronic device, method of producing the same, and semiconductor device

Surface-mounted silicon chip

Flip-chip module and method for the production thereof

Semiconductor device

Warpage resistant semiconductor package and method for manufacturing the same

Integrated package

Wafer level chip scale package

Techniques for packaging multiple device components

Semiconductor device and method of manufacturing the same

Manufacturing method of semiconductor integrated circuit device

Method for connecting two joining surfaces

Semiconductor component having through wire interconnect (TWI) with compressed wire

Semiconductor device having elastic solder bump to prevent disconnection

Three-dimensional semiconductor architecture

Semiconductor device

Semiconductor device and method of forming a thin wafer without a carrier

Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device

Metal-metal bonding of compliant interconnect

Chips having rear contacts connected by through vias to front contacts

Stress buffering package for a semiconductor component

Stress barrier structures for semiconductor chips

Stacked semiconductor package having reduced height

Method of refining solder materials

Semiconductor Device and Method of Protecting Passivation Layer in a Solder Bump Process

Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same

Reduced bottom roughness of stress buffering element of a semiconductor component

System and method for 3D integrated circuit stacking

Semiconductor device and method for manufacturing semiconductor device

Chip-scale package conversion technique for dies

Semiconductor device

Semiconductor device

Power module having stacked flip-chip and method of fabricating the power module

Methods of forming integrated circuit packages, and methods of assembling integrated circuit packages

Grid array connection device and method

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE AND METHOD FOR DESIGNING THE SAME

Interconnection of lead frame to die utilizing flip chip process

Alpha shielding techniques and configurations

SEMICONDUCTOR DEVICE

Structure and method for stacked wafer fabrication

Semiconductor device

Semiconductor package with a metal post

Semiconductor integrated circuit device

BUMP STRUCTURE FOE SEMICONDUCTOR DEVICE

Through wafer vias and method of making same

Through wafer vias and method of making same

Wafer level semiconductor module and method for manufacturing the same

Chip mounting

Circuit board and semiconductor device

Circuitry component and method for forming the same

FLIP-CHIP INTERCONNECTION WITH A SMALL PASSIVATION LAYER OPENING

Test contact system for testing integrated circuits with packages having an array of signal and power contacts

Methods of forming hybrid conductive vias including small dimension active surface ends and larger dimension back side ends

Semiconductor device and a method for manufacturing the same

Structure and manufacturing method of chip scale package

Silver-coated ball and method for manufacturing same

CONDUCTIVE STRUCTURE OF A CHIP

Method and apparatus for facilitating proximity communication and power delivery

Enhanced architectural interconnect options enabled with flipped die on a multi-chip package

Semiconductor component with improved contact pad and method for forming the same

Rectangular-shaped controlled collapse chip connection

Interconnection of lead frame to die utilizing flip chip process

Semiconductor device and method for manufacturing the same

CONTACT STRUCTURE AND CONNECTING STRUCTURE

Semiconductor module

Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board

Power semiconductor device including a double metal contact

JOINT RELIABILITY OF SOLDER JOINT BETWEEN Sn-yAg SOLDER AND Ni-P UNDER BUMP METALLIC LAYER BY COBALT ADDITION

Passivated Copper Chip Pads

Semiconductor chip package and method for manufacturing thereof

SCALABLE SUBSYSTEM ARCHITECTURE HAVING INTEGRATED COOLING CHANNELS

Flip chip interconnect solder mask

Semiconductor device

Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening

SEMICONDUCTOR PACKAGE AND METHOD THEREOF

System and Method for Improving Reliability of Integrated Circuit Packages

Warpage resistant semiconductor package and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Substrate for mounting electronic part and electronic part

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor chip with coil element over passivation layer

Inductor formed in an integrated circuit

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAME

Current distribution structure and method

Wafer structure with a buffer layer

Semiconductor device

Flip-chip component production method

PACKAGED INTEGRATED CIRCUIT AND METHOD OF FORMING THEREOF

Dual-sided chip attached modules

Semiconductor device having at least two terminals among the plurality of terminals electrically connected to each other while not being adjacent to one other and not being connected to internal circuit

Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device

Method of manufacturing semiconductor device

System and method for providing semiconductor device features using a protective layer

Electronic device, method of producing the same, and semiconductor device

Semiconductor die package with internal bypass capacitors

Method of manufacturing an electronic part mounting structure

Semiconductor package adapted for high-speed data processing and damage prevention of chips packaged therein and method for fabricating the same

Manufacturing method of semiconductor integrated circuit device

Flip-chip package structure, and the substrate and the chip thereof

Method of fabricating chip package

Chip package

Semiconductor package and multi-chip semiconductor package using the same

Structure and manufactruing method of chip scale package

Semiconductor device, chip package and method of fabricating the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Contact pad and method of forming a contact pad for an integrated circuit

HIGH-FREQUENCY CIRCUIT DEVICE AND RADAR

Semiconductor device

Semiconductor device packaged into chip size and manufacturing method thereof

BUMP STRUCTURE

Dimple free gold bump for drive IC

Methods of assembling integrated circuit packages

Semiconductor device

Semiconductor device, semiconductor wafer structure and method for manufacturing the semiconductor wafer structure

Semiconductor Device

VIA AND SOLDER BALL SHAPES TO MAXIMIZE CHIP OR SILICON CARRIER STRENGTH RELATIVE TO THERMAL OR BENDING LOAD ZERO POINT

Highly reliable low cost structure for wafer-level ball grid array packaging

Interconnection designs and materials having improved strength and fatigue life

Solder connector structure and method

Chips having rear contacts connected by through vias to front contacts

Print mask and method of manufacturing electronic components using the same

METHOD FOR FORMING CONTACT PADS

COMPLIANT BUMP STRUCTURE AND BONDING STRUCTURE

Method for producing electrically conductive bushings through non-conductive or semiconductive substrates

Chip and wafer integration process using vertical connections

Method of making reliable wafer level chip scale package semiconductor devices

Chip structure with bumps and testing pads

Power module having stacked flip-chip and method of fabricating the power module

Wiring board and capacitor to be built into wiring board

Encapsulated chip scale package having flip-chip on lead frame structure

Semiconductor integrated circuit device including wiring lines and interconnections

Semiconductor device and package including the same

DIRECT TERMINATION OF A WIRING METAL IN A SEMICONDUCTOR DEVICE

Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same

Semiconductor device and method of protecting passivation layer in a solder bump process

Microelectronic packages having improved input/output connections and methods therefor

Semiconductor device

Chip structure and process for forming the same

Contact Pad And Bump Pad Arrangement for High-Lead Or Lead-Free Bumps

Chip structure and process for forming the same

Chip structure and process for forming the same

STRUCTURE FOR CONTROLLED COLLAPSE CHIP CONNECTION WITH A CAPTURED PAD GEOMETRY

Semiconductor device

Chip structure and process for forming the same

Semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor device and manufacturing method thereof

Intergrated Circuits Device Having a Reinforcement Structure

Semiconductor device having elastic solder bump to prevent disconnection

Stress decoupling structures for flip-chip assembly

Chip structure and process for forming the same

Method of disposing and arranging dummy patterns

Method of mounting semiconductor chip to circuit substrate using solder bumps and dummy bumps

Silica nanoparticles thermoset resin compositions

Rotation joint and semiconductor device having the same

Chip structure and process for forming the same

Solder bump structure and method of manufacturing same

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE CONTAINING THE SAME

Top layers of metal for integrated circuits

Method of sealing or welding two elements to one another

INTEGRATED CIRCUIT DIE/PACKAGE INTERCONNECT

INTEGRATED CIRCUIT STRUCTURE, DISPLAY MODULE, AND INSPECTION METHOD THEREOF

CHIP STRUCTURE AND WAFER STRUCTURE

Integrated circuit with a reduced pad bump area and the manufacturing method thereof

CHIP WITH BUMP STRUCTURE

Wafer-level interconnect for high mechanical reliability applications

Managing forces of semiconductor device layers

CHIP PACKAGE, CHIP STRUCTURE AND MANUFACTURING PROCESS THEREOF

MOULD HAVING NANO-SCALED HOLES

INTEGRATED CIRCUIT INTERCONNECTION DEVICES AND METHODS

RELIABLE PRINTED WIRING BOARD ASSEMBLY EMPLOYING PACKAGES WITH SOLDER JOINTS AND RELATED ASSEMBLY TECHNIQUE

Semiconductor device having circuit blocks in a single crystal layer, and bumps on certain blocks

Electronic device and method of manufacturing the same

Microfeature workpieces having interconnects and conductive backplanes, and associated systems and methods

Chip package and method for fabricating the same

Chip structure and process for forming the same

Chip structure and process for forming the same

Semiconductor package and method for manufacturing the same

Top layers of metal for integrated circuits

Semiconductor package and method of manufacturing the same

Trace design to minimize electromigration damage to solder bumps

BUMP STRUCTURES AND PACKAGED STRUCTURES THEREOF

Stacked semiconductor components with through wire interconnects (TWI)

Semiconductor integrated circuit device

Bond Wireless Package

Electronic device including a conductive stud over a bonding pad region

Contact structure having a compliant bump and a testing area

Solder connector structure and method

Semiconductor integrated circuit device

Chip having two groups of chip contacts

Pillar Bump Package Technology

Semiconductor device and method for manufacturing semiconductor device

Semiconductor package substrate for flip chip packaging

Integrated circuit (IC) chip and method for fabricating the same

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

RF INTEGRATED CIRCUIT WITH ESD PROTECTION AND ESD PROTECTION APPARATUS THEREOF

Interposer containing bypass capacitors for reducing voltage noise in an IC device

Integrated circuit (IC) package stacking and IC packages formed by same

INTEGRATED INDUCTORS AND COMPLIANT INTERCONNECTS FOR SEMICONDUCTOR PACKAGING

CHIP STRUCTURE

Bulk metallic glass solders, foamed bulk metallic glass solders, foamed-solder bond pads in chip packages, methods of assembling same, and systems containing same