207826 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
SEMICONDUCTOR APPARATUS
#2702SEMICONDUCTOR PACKAGE
#2703Integrated passive device (IPD) components and a package and processes implementing the same
#2704CLIP STRUCTURE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#2705SEMICONDUCTOR DEVICE
#2706Semiconductor device
#2707Sensor lens assembly having non-soldering configuration
#2708Power amplifier modules including semiconductor resistor and tantalum nitride terminated through wafer via
#2709CHARGED-PARTICLE DETECTOR PACKAGE FOR HIGH SPEED APPLICATIONS
#2710Semiconductor package with recessed molding region disposed below housing and above semiconductor chip
#2711Semiconductor die stack having bent wires and vertical wires and a semiconductor package including the semiconductor die stack
#2712Semiconductor device with sense terminal
#2713Packaged transistor amplifiers that include integrated passive device matching structures having distributed shunt inductances
#2714ELECTROMAGNETIC INTERFERENCE SHIELDING PACKAGE STRUCTURES AND FABRICATING METHODS THEREOF
#2715INTEGRATED CIRCUIT OPTICAL PACKAGE
#2716Power management
#2717METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE
#2718CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
#2719FARADAY CAGE PLASTIC CAVITY PACKAGE WITH PRE-MOLDED CAVITY LEADFRAME
#27203D chip package based on vertical-through-via connector
#2721Semiconductor package
#2722Semiconductor device with galvanically isolated semiconductor chips
#2723SWITCHING DEVICE, SEMICONDUCTOR DEVICE, AND SWITCHING DEVICE MANUFACTURING METHOD
#2724Interdigitated outward and inward bent leads for packaged electronic device
#2725Semiconductor device with improved performance in operation and improved flexibility in the arrangement of power chips
#2726SEMICONDUCTOR DEVICE
#2727Semiconductor package device and method of manufacturing the same
#2728Semiconductor devices and methods of manufacturing semiconductor devices
#2729SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE
#2730Camera module and molded photosensitive assembly and manufacturing method thereof, and electronic device
#2731Stacked semiconductor device
#2732Semiconductor device assemblies including multiple stacks of different semiconductor dies
#2733CHIP PACKAGING METHOD AND CHIP PACKAGING STRUCTURE
#2734Package-on-package assembly with wire bonds to encapsulation surface
#2735Integrated circuit package structure with conductive stair structure and method of manufacturing thereof
#2736Semiconductor package with connection lug
#2737Semiconductor Package and Method of Manufacturing the Same
#27383D semiconductor device and structure with memory
#2739COPPER PASTE FOR JOINING, METHOD FOR MANUFACTURING JOINED BODY, AND JOINED BODY
#2740Semiconductor package
#2741SEMICONDUCTOR DEVICE
#2742Electronics unit with integrated metallic pattern
#2743CONTACT ASSEMBLY FOR AN ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
#2744MICROELECTRONIC DEVICE PACKAGE INCLUDING ANTENNA AND SEMICONDUCTOR DEVICE
#2745Sensor package structure
#2746Semiconductor package, and a package on package type semiconductor package having the same
#2747Semiconductor packages and manufacturing methods for the same
#2748Semiconductor package, method of manufacturing the same and metal bridge applied to the semiconductor package
#2749Semiconductor device packaging leadframe assembly and method therefor
#2750PACKAGED POWER SEMICONDUCTOR DEVICE AND POWER CONVERTER
#2751Power semiconductor module arrangement
#2752THROUGH WAFER ISOLATION ELEMENT BACKSIDE PROCESSING
#2753Display device
#2754SEMICONDUCTOR PACKAGE AND ELECTRONIC DEVICE
#2755DISPLAY DEVICE
#2756Low profile sensor packages
#2757Semiconductor package and method of fabricating same
#2758SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#2759Self-aligned interconnect structure
#2760DISPLAY DEVICE AND METHOD OF MANUFACTURING DISPLAY DEVICE
#2761Stud bump for wirebonding high voltage isolation barrier connection
#2762Semiconductor package with layer structures, antenna layer and electronic component
#2763Pad structure design in fan-out package
#2764Bondwire protrusions on conductive members
#2765Semiconductor device with sealed semiconductor chip
#2766Offset interposers for large-bottom packages and large-die package-on-package structures
#2767Semiconductor memory device
#2768Semiconductor structure and method of forming the same
#2769Ultra small molded module integrated with die by module-on-wafer assembly
#2770Selective metallization of integrated circuit packages
#2771Integrated transformer module
#2772Semiconductor device
#2773SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR APPARATUS
#2774Devices and methods related to metallization of ceramic substrates for shielding applications
#2775SEMICONDUCTOR DEVICE
#2776Siliconized heterogeneous optical engine
#2777Semiconductor device and method for manufacturing semiconductor device
#2778Semiconductor assemblies with systems and methods for managing high die stack structures
#2779Semiconductor devices with multiple substrates and die stacks
#2780SEMICONDUCTOR MODULE
#2781SEMICONDUCTOR DEVICE, POWER CONVERSION DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#2782Semiconductor device with redistribution pattern and method for fabricating the same
#2783Integrated Circuit Package and Method
#2784Pre-molded lead frames for semiconductor packages
#2785Connection structure and method of forming the same
#2786Semiconductor package and method of fabricating the same
#2787Semiconductor device, semiconductor system, moving body, and method for manufacturing semiconductor device
#2788METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND COLLET
#27893D semiconductor device and structure with single-crystal layers
#2790Method for producing a 3D semiconductor device and structure with single crystal transistors and metal gate electrodes
#2791EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME
#2792High frequency package
#2793Semiconductor device
#2794Semiconductor assemblies with hybrid fanouts and associated methods and systems
#2795Semiconductor package including a dummy pad
#2796Wire bonding apparatus and method for manufacturing semiconductor device
#2797SEMICONDUCTOR DEVICE AND SEMICONDUCTOR CHIP
#2798Package structure and method for fabricating the same
#2799Semiconductor package structure and method for manufacturing the same
#2800Semiconductor packages
#2801Semiconductor package including under bump metallization pad
#2802Semiconductor device and method of manufacturing semiconductor device
#2803GRID ARRAY TYPE LEAD FRAME PACKAGE
#2804Method for monitoring online state of bonding wire of IGBT module
#2805Semiconductor storage device
#2806Light-emitting substrate, method of manufacturing light-emitting substrate, and display device
#2807Semiconductor device
#2808Power module
#2809WIRE BONDING STATE DETERMINATION METHOD AND WIRE BONDING STATE DETERMINATION DEVICE
#2810Semiconductor Device and Method of Disposing Electrical Components Above and Below Substrate
#2811CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
#2812Dummy structure of stacked and bonded semiconductor device
#2813Ceramic Encapsulating Casing and Mounting Structure Thereof
#2814SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
#2815Fuses for packaged semiconductor devices
#2816Semiconductor device
#2817Semiconductor device
#2818SEMICONDUCTOR PACKAGE
#2819Isolated temperature sensor device package
#2820Semiconductor Device
#2821SEMICONDUCTOR DEVICE PACKAGE WITH CONDUCTIVE VIAS AND METHOD OF MANUFACTURING
#2822Power module with graphite plate
#2823Semiconductor Package Mounting Platform with Integrally Formed Heat Sink
#2824TEMPORARY PROTECTIVE FILM FOR SEMICONDUCTOR ENCAPSULATION MOLDING, LEAD FRAME WITH TEMPORARY PROTECTIVE FILM, ENCAPSULATION MOLDED BODY WITH TEMPORARY PROTECTIVE FILM, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#2825Package assembly for plating with selective molding
#2826Power semiconductor module and power converter
#2827Component arrangement, package and package arrangement, as well as production method
#2828Semiconductor device
#2829Light emitting device and method of manufacturing the same
#2830Semiconductor package structure and methods of manufacturing the same
#2831DICING DIE ATTACH FILM AND METHOD OF PRODUCING THE SAME, AND SEMICONDUCTOR PACKAGE AND METHOD OF PRODUCING THE SAME
#2832Application of conductive via or trench for intra module EMI shielding
#2833Multichip packaged semiconductor device
#2834Electric drive module
#2835Electronic device and electronic device mounting structure
#2836Semiconductor package having an encapsulant comprising conductive fillers and method of manufacture
#2837Power module and fabrication method of the same, graphite plate, and power supply equipment
#2838Integrated circuit and associated method
#2839SOLID-STATE IMAGING DEVICE
#2840Optical sensor, and method for manufacturing optical sensor
#2841Semiconductor device
#2842Semiconductor device
#2843POWER SEMICONDUCTOR MODULE
#2844SEMICONDUCTOR DEVICE
#2845Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each other
#2846SEMICONDUCTOR MODULE COMPRISING A SEMICONDUCTOR AND COMPRISING A SHAPED METAL BODY THAT IS ELECTRICALLY CONTACTED BY THE SEMICONDUCTOR
#2847Structure and method of forming a joint assembly
#2848Protective elements for bonded structures
#2849Semiconductor device package
#2850Semiconductor package
#2851SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE
#2852POWER SEMICONDUCTOR MODULE, POWER CONVERSION APPARATUS, AND MOVING BODY
#2853SEMICONDUCTOR DEVICE
#2854SEMICONDUCTOR DEVICE
#2855SEMICONDUCTOR DEVICE
#2856SEMICONDUCTOR DEVICE
#2857Semiconductor device
#2858Semiconductor device
#2859SEMICONDUCTOR DEVICE
#2860SEMICONDUCTOR DEVICE
#2861SEMICONDUCTOR DEVICE
#2862Semiconductor device
#2863Heat sink, semiconductor package and semiconductor module
#2864Beta-sialon phosphor and light emitting device
#2865Secure semiconductor integration and method for making thereof
#2866Thinning system in package
#2867SEMICONDUCTOR DEVICE
#2868INTEGRATED PACKAGE ELECTRONIC DEVICE STRUCTURE
#2869Package-on-package semiconductor assemblies and methods of manufacturing the same
#2870Interconnection substrate, semiconductor package, and method of manufacturing interconnection substrate
#2871Method of manufacturing semiconductor devices and corresponding semiconductor device
#2872System in package
#2873Semiconductor device
#2874SEMICONDUCTOR MODULE AND MANUFACTURING METHOD OF SEMICONDUCTOR MODULE
#2875Semiconductor manufacturing apparatus and method of manufacturing semiconductor device using the same, and semiconductor device
#2876Semiconductor device and method of stacking semiconductor die for system-level ESD protection
#2877PHOTORELAY
#2878Semiconductor device package having galvanic isolation and method therefor
#2879Method for manufacturing a semiconductor package
#2880Semiconductor module and method of manufacturing semiconductor module
#2881Semiconductor devices with flexible connector array
#2882SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#2883BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN
#2884Power module
#2885TEMPORARY PROTECTIVE FILM, REEL BODY, PACKAGING BODY, PACKAGE BODY, TEMPORARY PROTECTIVE BODY, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#2886Method and device for producing a housing
#2887Doherty amplifier
#2888Camera module, and photosensitive assembly and manufacturing method therefor
#2889Package and semiconductor device
#2890Semiconductor package structure and packaging method thereof
#2891APPARATUS AND METHOD FOR MULTI-DIE INTERCONNECTION
#2892SEMICONDUCTOR DEVICE
#2893Semiconductor package with plurality of grooves on lower surface
#2894Method for Fabricating a Substrate with a Solder Stop Structure, Substrate with a Solder Stop Structure and Electronic Device
#2895MULTIROW GULL-WING PACKAGE FOR MICROELECRONIC DEVICES
#2896Multi-chip package with reinforced isolation
#2897Semiconductor structure and manufacturing method thereof
#2898Die attached leveling control by metal stopper bumps
#2899Semiconductor module
#2900Semiconductor device and method of manufacturing semiconductor device
#2901Silicon carbide semiconductor device and method of manufacturing silicon carbide semiconductor device
#2902Semiconductor package including a through-electrode penetrating a molding part
#2903Method and apparatus for through silicon die level interconnect
#2904Power module
#29053D semiconductor memory device and structure
#2906Method for predicting reliability of semiconductor device
#2907Semiconductor package, semiconductor package manufacturing method, and electronic device
#2908Semiconductor device
#2909Device packages with uniform components and methods of forming the same
#2910Semiconductor device
#2911Sensor package structure
#2912Ball bond impedance matching
#2913Semiconductor device with branch electrode terminal and method of manufacturing semiconductor device
#2914Package substrate, and semiconductor package including the package substrate
#2915Semiconductor device
#2916PACKAGED POWER SEMICONDUCTOR DEVICE
#2917Fault isolation analysis method and computer-readable storage medium
#2918Biometric sensor and device including the same
#2919Power Semiconductor Module and Method of Forming the Same
#2920Semiconductor device
#2921Amplifier having improved stability
#2922Semiconductor device and manufacturing method thereof
#2923Through-hole electrode substrate
#2924Semiconductor package system and related methods
#2925Integrated circuit package with electro-optical interconnect circuitry
#2926Semiconductor device and inspection method
#2927Pressure sensor assembly for use in implantable medical device including a substrate having via that extends through substrate along via axis between first major surface and second major surface of substrate
#2928Semiconductor device and temperature measurement method
#2929Fluorescent body, method for manufacturing same, and light-emitting device using same
#2930Switching device and electronic circuit
#2931Integrated high voltage capacitor
#2932Circular bond finger pad
#2933EMBEDDED COPPER STRUCTURE FOR MICROELECTRONICS PACKAGE
#2934Semiconductor apparatus, power module, and manufacturing method of semiconductor apparatus
#2935Semiconductor element, apparatus, and chip
#2936Semiconductor device
#2937Integrated circuit lead frame and semiconductor device thereof
#2938Package structure with through via extending through redistribution layer and method of manufacturing the same
#2939Stacked die cavity package
#2940Substrate structure, and fabrication and packaging methods thereof
#2941Light-emitting device and displayer
#2942Semiconductor device and manufacturing method, and electronic appliance
#2943ENABLING SENSOR TOP SIDE WIREBONDING
#2944Naked Eye Stereoscopic Display Device and Naked Eye Stereoscopic Display Unit
#2945Semiconductor device, power conversion device, and method for manufacturing semiconductor device
#2946CONFIGURABLE LEADED PACKAGE
#2947METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE, DIE, AND DIE PACKAGE
#2948Method for manufacturing an electronic power module using polymer preforms
#2949Printed circuit board and method of producing printed circuit board
#2950Semiconductor device
#2951CHIP STRUCTURE, PACKAGING STRUCTURE AND MANUFACTURING METHOD OF CHIP STRUCTURE
#2952SEMICONDUCTOR DEVICE AND POWER CONVERTER
#2953Electromagnetic shielding package structure comprising electroplating layer and package method thereof
#2954Semiconductor device and measurement device
#2955Spring bar leadframe, method and packaged electronic device with zero draft angle
#2956SEMICONDUCTOR PACKAGES WITH ENGAGEMENT SURFACES
#2957Integrated circuit structure
#2958HIGH VOLTAGE TRANSISTOR WITH A FIELD PLATE
#2959SEMICONDUCTOR PACKAGE INCLUDING PROCESSOR CHIP AND MEMORY CHIP
#2960Semiconductor module
#2961Biometric sensor module for a smart card and method for manufacturing such a module
#2962Semiconductor device package having thermally conductive pathways
#2963Antenna in package having antenna on package substrate
#2964Light emitting device package
#2965Semiconductor packages with vertical passive components
#2966Package for power semiconductor devices
#2967STACK PACKAGES INCLUDING A HYBRID WIRE BONDING STRUCTURE
#2968Multi-die package structure and multi-die co-packing method
#2969Stacked semiconductor package
#2970WIRE BONDING APPARATUS, METHOD FOR MANUFACTURE OF SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE
#2971Semiconductor package, electronic apparatus, and method for manufacturing semiconductor package
#2972Semiconductor package
#2973Semiconductor device assemblies and systems with one or more dies at least partially embedded in a redistribution layer (RDL) and methods for making the same
#2974Semiconductor device and method of the same
#2975Strain-induced shift mitigation in semiconductor packages
#2976Semiconductor device having tapered metal coated sidewalls
#2977Semiconductor device and method of forming leadframe with clip bond for electrical interconnect
#2978Semiconductor package with nickel-silver pre-plated leadframe
#2979Heat conduction pattern for cooling a power module
#2980Electronic package with surface contact wire extensions
#2981Power module and related methods
#2982Dual-side cooling semiconductor packages and related methods
#2983Semiconductor device package and a method of manufacturing the same
#2984Semiconductor device and power conversion device
#2985MODULE
#2986Semiconductor package
#2987Semiconductor device package and method for manufacturing the same
#2988Semiconductor device and semiconductor module
#2989Electric drive module
#2990Semiconductor package having wettable lead flank and method of making the same
#2991Semiconductor device packages, packaging methods, and packaged semiconductor devices
#2992MODULE
#2993Semiconductor package including stacked semiconductor chips
#2994Memory card
#2995Semiconductor package including stacked semiconductor chips
#2996Semiconductor package including stacked semiconductor chips
#2997Nanowires plated on nanoparticles
#2998Printed circuit board and electronic component package
#29993D integrations and methods of making thereof
#3000Semiconductor device package with die cavity substrate