207826 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
Optical sensor package and method of making an optical sensor package
#3002SEMICONDUCTOR DEVICE
#3003Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer
#3004Microelectronic packages having a die stack and a device within the footprint of the die stack
#3005Method and device for controlling operation using temperature deviation in multi-chip
#3006Chip interconnecting method, interconnect device and method for forming chip packages
#3007Method for forming chip packages and a chip package
#3008Method for forming chip packages and a chip package having a chipset comprising a first chip and a second chip
#3009Through-substrate void filling for an integrated circuit assembly
#3010Chip Module, Use of Chip Module, Test Arrangement and Test Method
#3011Covers for semiconductor package components
#3012WIRE SHAPE MEASUREMENT DEVICE, WIRE THREE-DIMENSIONAL IMAGE GENERATION METHOD, AND WIRE SHAPE MEASUREMENT METHOD
#3013Light emitting apparatus
#3014Hybrid bonding with uniform pattern density
#3015Semiconductor package device
#3016Package structure and method of fabricating the same
#3017Printed circuit board and electronic component package
#3018PACKAGE WITH LOAD TERMINALS ON WHICH COUPLED POWER COMPONENT AND LOGIC COMPONENT ARE MOUNTED
#3019AN ELECTRICAL CONNECTION STRUCTURE AND AN ELECTRONIC DEVICE INCLUDING THE SAME
#3020Semiconductor device and method of manufacturing semiconductor device
#3021Semiconductor module and method for manufacturing semiconductor module
#3022EMBEDDED SEMICONDUCTIVE CHIPS IN RECONSTITUTED WAFERS, AND SYSTEMS CONTAINING SAME
#3023Memory device comprising programmable command-and-address and/or data interfaces
#3024SENSOR PACKAGE WITH INTERFERENCE REDUCTION AND METHOD OF OPERATION
#3025Semiconductor device
#3026Semiconductor assemblies with hybrid fanouts and associated methods and systems
#3027Package-on-package assembly with wire bond vias
#3028Power semiconductor module and power converter
#3029Signal isolator having enhanced creepage characteristics
#3030Semiconductor device and method of manufacturing the same
#3031Raised via for terminal connections on different planes
#3032Semiconductor light emitting device
#3033Offset interposers for large-bottom packages and large-die package-on-package structures
#3034Power semiconductor device
#3035Semiconductor circuit device
#3036Systems and methods for optimizing looping parameters and looping trajectories in the formation of wire loops
#3037Semiconductor device, power converter, and method of manufacturing semiconductor device
#3038Device package having a lateral power transistor with segmented chip pad
#3039TWO SIDED BONDABLE LEAD FRAME
#3040Electronic molded package
#3041Methods of Packaging Semiconductor Devices and Packaged Semiconductor Devices
#3042Semiconductor module
#3043MODULE-TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING MODULE-TYPE SEMICONDUCTOR DEVICE
#3044Semiconductor apparatus and manufacturing method of semiconductor apparatus
#3045SEMICONDUCTOR DEVICE HAVING DOLMEN STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SUPPORT PIECE FORMATION LAMINATE FILM AND MANUFACTURING METHOD THEREFOR
#3046Semiconductor packages
#3047Semiconductor device assembly and method therefor
#3048SEMICONDUCTOR DEVICE
#3049Semiconductor device
#3050Power semiconductor module for improved heat dissipation and power density, and method for manufacturing the same
#3051Semiconductor device
#3052Electrical apparatus
#3053Electronic element mounting substrate and electronic device
#3054Memories and memory components with interconnected and redundant data interfaces
#3055Semiconductor device structure with magnetic element
#3056Wafer-level bonding of obstructive elements
#3057Semiconductor device and manufacturing method thereof
#3058Process for manufacturing a chip-card module with soldered electronic component
#3059Semiconductor package structure including an encapsulant having a cavity exposing an interposer
#3060Semiconductor device with a metal plate
#3061Semiconductor module, power semiconductor module, and power electronic equipment using the semiconductor module or the power semiconductor module
#3062Multi wire bonding with current sensing method
#3063Manufacturing method of housing for semiconductor device
#3064Packaging Structure and Power Amplifier
#3065Power module and process for manufacturing the same
#3066Electronic power module
#3067Fabrication and use of through silicon vias on double sided interconnect device
#3068Semiconductor package including semiconductor chips
#3069Semiconductor device
#3070Methods of embedding magnetic structures in substrates
#3071Flexible interposer
#3072Fluorinated polymers with low dielectric loss for environmental protection in semiconductor devices
#3073Package structure and manufacturing method thereof
#3074Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, semiconductor device using the same, and manufacturing method thereof
#3075PACKAGE ROUTING FOR CROSSTALK REDUCTION IN HIGH FREQUENCY COMMUNICATION
#3076Semiconductor device
#3077Package structure and manufacturing method thereof
#3078Method for manufacturing a semiconductor package having a conductive pad with an anchor flange
#30793D semiconductor devices and structures with at least two single-crystal layers
#3080Current sensor package with continuous insulation
#3081High dielectric constant material at locations of high fields
#3082Devices and methods related to dual-sided radio-frequency package with overmold structure
#3083Electronic package with wettable flank and shielding layer and manufacturing method thereof
#3084Semiconductor device having a metallization structure
#3085Low RF crosstalk devices via a slot for isolation
#3086Semiconductor package with solder standoff
#3087Semiconductor package with improved board level reliability
#3088Semiconductor device and electronic device
#3089Semiconductor device and manufacturing method thereof
#3090Terahertz element and semiconductor device
#3091Semiconductor device
#3092BONDING WIRE FOR SEMICONDUCTOR DEVICES
#3093Power semiconductor module and power conversion apparatus
#3094Package structure
#3095Optical module
#3096Transmitter component, receiver component, transceiver circuit, and gate driver circuit with integrated antenna structure
#3097Voltage-controlled switching device with resistive path
#3098Light-emitting device
#3099Thermal transfer structures for semiconductor die assemblies
#3100Semiconductor device
#3101Semiconductor package and method of manufacturing the semiconductor package
#3102Semiconductor device package having galvanic isolation and method therefor
#3103Semiconductor device
#3104THERMALLY ENHANCED ELECTRONIC PACKAGES FOR GAN POWER INTEGRATED CIRCUITS
#3105Method of manufacturing semiconductor device and semiconductor device
#3106Power electronic modules including one or more layers including a polymer produced via a frontal ring-opening polymerization process
#3107Leadframe package with pre-applied filler material
#3108Reliable semiconductor packages
#3109IC PACKAGE PROVIDING ISOLATED FILTER ON LEAD-FRAME
#3110Semiconductor device
#3111Film in substrate for releasing z stack-up constraint
#3112Semiconductor packages
#3113Semiconductor device including bond pad with fixing parts fixed onto insulating film
#3114Semiconductor device including a bidirectional switch
#3115Molded RF power package
#3116Semiconductor device
#3117Semiconductor package with dams
#31183D semiconductor memory device and structure
#31193D semiconductor device and structure with a built-in test circuit for repairing faulty circuits
#3120Semiconductor device
#3121Semiconductor package device
#3122Straight wirebonding of silicon dies
#3123Integrated half-bridge power converter
#3124Edge-notched substrate packaging and associated systems and methods
#3125Compact leadframe package
#3126SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#3127Semiconductor device
#3128Method of manufacturing electronic devices with a cap and molding
#31293D semiconductor device and structure with high-k metal gate transistors
#3130LIGHT EMITTING DIODE PACKAGE HAVING A SMALL LIGHT EMITTING SURFACE
#3131Semiconductor device
#3132Semiconductor device
#3133Semiconductor packages
#3134Dicing die attach film, and semiconductor package using the same and method of producing semiconductor package
#3135Electronic device
#3136Semiconductor package
#3137Electronic apparatus and semiconductor integrated circuit device
#3138Semiconductor device
#3139Semiconductor device
#3140Semiconductor device
#3141Semiconductor device
#3142SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE MANUFACTURING METHOD
#3143Sensor package and manufacturing method thereof
#3144Electronic element mounting substrate and electronic device
#3145Semiconductor device and method of manufacturing semiconductor device
#3146Semiconductor package including stacked semiconductor chips
#3147Interconnection structure and semiconductor package including the same
#3148Apparatuses and systems having ball grid arrays and associated microelectronic devices and device packages
#3149Semiconductor device
#3150Lead frame-based semiconductor package
#3151Semiconductor module
#3152Long-life extended temperature range embedded diode design for electrostatic chuck with multiplexed heaters array
#3153Fingerprint sensor device and method
#3154Method of forming package structure
#3155Semiconductor package including a substrate, a semiconductor device, and a mold
#3156Semiconductor package including vertical interconnector
#3157Semiconductor device
#3158Semiconductor device and manufacturing method thereof
#3159Semiconductor device having a redistribution layer
#3160Solder joints on nickel surface finishes without gold plating
#3161Semiconductor device
#3162Semiconductor device
#3163Electronic devices in semiconductor package cavities
#3164Shielded electronic component package
#3165Wire bonding for semiconductor devices
#3166Semiconductor device and fabrication method of the semiconductor device
#3167Semiconductor device and antenna device
#3168Coupled semiconductor package
#3169Semiconductor package including plurality of recesses and molding member with plurality of protrusions that fill the recesses
#3170Devices, systems, and methods for stacked die packages
#3171Semiconductor device and method for fabricating the same
#3172Semiconductor package
#3173Semiconductor package having die pad with cooling fins
#3174SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
#3175Hermetic package for high CTE mismatch
#3176Hermetic package for high CTE mismatch
#3177Semiconductor device and manufacturing method for semiconductor device
#3178Semiconductor device package and method for manufacturing the same
#3179MULTI-CHIP PACKAGE
#3180Semiconductor package including plurality of semiconductor chips on common connection structure
#3181Integrated circuit (IC) package with stacked die wire bond connections, and related methods
#3182Integrated power switching device heat sink
#3183Ground wing portion for electronic package device
#3184Package comprising wire bonds configured as a heat spreader
#3185Semiconductor package and method for fabricating a semiconductor package
#3186Unit with wiring board, module, and equipment
#3187Isolation device and method of transmitting a signal across an isolation material using wire bonds
#3188Multichip package manufacturing process
#3189Semiconductor devices, semiconductor device packages, electronic systems including same, and related methods
#3190Method of manufacturing semiconductor device
#3191Integrated circuit package and die
#3192Package-on-package semiconductor assemblies and methods of manufacturing the same
#3193Shielded electronic package and method of fabrication
#3194Semiconductor device
#3195STRENGTHENED WIRE-BOND
#3196Electronic package
#3197POWER SEMICONDUCTOR MODULE AND MANUFACTURING METHOD FOR POWER SEMICONDUCTOR MODULE
#3198SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#3199IC PACKAGE
#3200PACKAGED SEMICONDUCTOR ASSEMBLIES AND METHODS FOR MANUFACTURING SUCH ASSEMBLIES
#3201Semiconductor device package and method of manufacturing the same
#3202Semiconductor package
#3203Radio-frequency switching devices having improved voltage handling capability
#3204Methods related to radio-frequency switching devices having improved voltage handling capability
#3205Light emitting diode package structure and manufacturing method thereof and display device
#3206SYSTEMS AND METHODS FOR POWERING AN INTEGRATED CIRCUIT HAVING MULTIPLE INTERCONNECTED DIE
#3207Palladium-coated copper bonding wire, manufacturing method of palladium-coated copper bonding wire, wire bonding structure using the same, semiconductor device and manufacturing method thereof
#3208Semiconductor device package comprising a pin in the form of a drilling screw
#3209Semiconductor device package and semiconductor device
#3210Semiconductor package having a conductive pad with an anchor flange
#3211SEMICONDUCTOR DEVICE AND METHOD FOR DIAGNOSING DETERIORATION OF SEMICONDUCTOR DEVICE
#3212Radio frequency transistor amplifiers having leadframes with integrated shunt inductors and/or direct current voltage source inputs
#3213Multi-zone radio frequency transistor amplifiers
#3214Semiconductor package and method of fabricating the same
#3215Printed circuit board compensation structure for high bandwidth and high die-count memory stacks
#3216Semiconductor device and corresponding method
#3217Packaging of a semiconductor device with a plurality of leads
#3218SEMICONDUCTOR DEVICE
#3219Electronic element mounting substrate, and electronic device
#3220Methods for producing 3D semiconductor memory device and structure utilizing alignment marks
#3221Semiconductor package and method of manufacturing semiconductor package
#3222Camera module having curved imager
#3223Multi-die fine grain integrated voltage regulation
#3224Semiconductor device and method for manufacturing same
#3225Semiconductor package and production method thereof, and semiconductor device
#3226Sensor package structure
#3227Protection of integrated circuits
#3228Integrated module with electromagnetic shielding
#3229Semiconductor device
#3230Power semiconductor module
#3231Light emitting diode package and display apparatus including the same
#3232Semiconductor device including sense insulated-gate bipolar transistor
#3233SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE
#3234Self-aligned interconnect structure
#3235Semiconductor device and method for manufacturing the same
#3236Semiconductor chip package device
#3237Methods and apparatus for package with interposers
#3238SUPPORT SUBSTRATE FOR INTEGRATED CIRCUIT, ELECTRONIC DEVICE, AND CORRESPONDING PRODUCTION AND PACKAGING METHODS
#3239Stacked semiconductor die assemblies with support members and associated systems and methods
#3240Light emitting device module and display apparatus having the same
#3241Stacked semiconductor die assemblies with die support members and associated systems and methods
#3242Stacking structure, package structure and method of fabricating the same
#3243Method for manufacturing a semiconductor package
#3244Semiconductor package with heatsink
#3245Module with connection lugs for supply lines
#3246Semiconductor package with signal distribution element
#3247Spring bar leadframe, method and packaged electronic device with zero draft angle
#3248Molded air-cavity package and device comprising the same
#3249Transient liquid phase bonding compositions and power electronics assemblies incorporating the same
#3250Semiconductor device structure with magnetic element covered by polymer material
#3251Semiconductor package
#3252Packaged semiconductor device with electroplated pillars
#3253Methods of manufacturing an integrated circuit having stress tuning layer
#3254Electronic package
#3255Semiconductor device
#3256Packaging process for plating with selective molding
#3257Fault tolerant memory systems and components with interconnected and redundant data interfaces
#3258Reliable semiconductor packages
#3259SEMICONDUCTOR DEVICE
#3260Semiconductor device including vertical wire bonds
#3261Wire bonding method and wire bonding device
#3262Backside metalization with through-wafer-via processing to allow use of high Q bond wire inductances
#3263Palladium-coated copper bonding wire, wire bonding structure, semiconductor device, and manufacturing method of semiconductor device
#3264Ground reference shape for high speed interconnect
#3265DC and AC magnetic field protection for MRAM device using magnetic-field-shielding structure
#3266Semiconductor device
#3267Power semiconductor module
#3268Semiconductor package and method of manufacturing the same
#3269Semiconductor device
#3270Semiconductor device having control terminal and control substrate
#3271Packaging process for side-wall plating with a conductive film
#3272Multi-chip package with reduced calibration time and ZQ calibration method thereof
#3273Semiconductor device
#3274Packaged LEDs with phosphor films, and associated systems and methods
#3275Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer
#3276Method for bonding insulated coating wire, connection structure, method for stripping insulated coating wire and bonding apparatus
#3277Multi-sided cooling semiconductor package and method of manufacturing the same
#3278Semiconductor module
#3279Semiconductor device and method for manufacturing semiconductor device
#3280Semiconductor device
#3281Wire bonding method and wire bonding apparatus
#3282Semiconductor package and method of forming the same
#3283Semiconductor package with EMI shield and fabricating method thereof
#3284Packaged Semiconductor Device With Multilayer Stress Buffer
#3285Semiconductor apparatus
#3286Semiconductor package and method of manufacturing the semiconductor package
#3287Stacked decoupling capacitors with integration in a substrate
#3288Package structure and method of forming the same
#3289Semiconductor device and method of manufacturing the same
#3290Semiconductor package having a lead frame including die paddles and method of making the same
#3291Semiconductor device
#3292Semiconductor devices including a lower semiconductor package, an upper semiconductor package on the lower semiconductor package, and a connection pattern between the lower semiconductor package and the upper semiconductor package
#3293Methods for producing a 3D semiconductor memory device comprising charge trap junction-less transistors
#3294Method for producing a 3D semiconductor memory device and structure
#3295Optical module
#3296Semiconductor device and method for manufacturing same
#3297Semiconductor package and methods of manufacturing a semiconductor package
#3298Semiconductor device
#3299Electronic chip support device and corresponding manufacturing method
#3300Semiconductor device with a protected element