207826 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
Multi-chip package with a supporting member and method of manufacturing the same
#7802Semiconductor package
#7803Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same
#7804Semiconductor device
#7805Semiconductor package having internal shunt and solder stop dimples
#7806Integrated circuit having stress tuning layer
#7807Semiconductor package structure and manufacturing method thereof
#7808Monolithic semiconductor switches and method for manufacturing
#7809Power semiconductor package with conductive clip
#7810Alloyed 2N copper wires for bonding in microelectronics devices
#7811Semiconductor packages usable with a mobile device
#7812Bonding material for semiconductor devices
#7813Integrated circuit assembly and method of making
#7814Structure for high-speed signal integrity in semiconductor package with single-metal-layer substrate
#7815Device having multiple wire bonds for a bond area and methods thereof
#7816Packaged die for heat dissipation and method therefor
#7817Semiconductor device including cladded base plate
#7818Multi-transistor exposed conductive clip for semiconductor packages
#7819Wafer level chip scale package
#7820SURFACE MOUNT TECHNOLOGY PROCESS FOR ADVANCED QUAD FLAT NO-LEAD PACKAGE PROCESS AND STENCIL USED THEREWITH
#7821Electronic component housing unit, electronic module, and electronic device
#7822Multiple die face-down stacking for two or more die
#7823Stacked-chip packages in package-on-package apparatus, methods of assembling same, and systems containing same
#7824Semiconductor device
#7825Semiconductor device and manufacturing method thereof
#7826Pre-encapsulated lead frames for microelectronic device packages, and associated methods
#7827Thermally efficient integrated circuit package
#7828SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#7829Wire loops, methods of forming wire loops, and related processes
#7830Thermal pad shorts test for wire bonded strip testing
#7831Semiconductor package, semiconductor package manufacturing method and semiconductor device
#7832Semiconductor device with wireless communication
#7833Method for developing a custom device
#7834Microelectronic package and method of manufacturing same
#7835LED PACKAGE STRUCTURE FOR ENHANCING MIXED LIGHT EFFECT
#7836Method and apparatus for monitoring free air ball (FAB) formation in wire bonding
#7837Packaging substrate and fabrication method thereof
#7838METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
#7839Electronic circuit, method of manufacturing electronic circuit, and mounting member
#7840Apparatus for electrostatic discharge protection and noise suppression in circuits
#7841SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#7842Semiconductor device
#7843Semiconductor device
#7844Sensor device manufacturing method and sensor device
#7845Packaging photon building blocks with top side connections and interconnect structure
#7846Semiconductor module and method for manufacturing semiconductor module
#7847Large panel leadframe
#7848Methods of fabricating electronics assemblies
#7849METHOD AND JIG FOR MANUFACTURING SEMICONDUCTOR DEVICE
#7850Low forward voltage rectifier
#7851Circuit board and method for manufacturing same
#7852High frequency circuit device
#7853Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect
#7854Package on package devices and methods of packaging semiconductor dies
#7855Low stray inductance power module
#7856Compact wirebonded power quad flat no-lead (PQFN) package
#7857POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#7858Semiconductor package and method for manufacturing the same and semiconductor package module having the same
#7859Multiple die stacking for two or more die
#7860Microelectronic package with stacked microelectronic units and method for manufacture thereof
#7861Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die
#7862Hermetic Surface Mount Packages for Diodes and Transistors
#7863Automatic wire tail adjustment system for wire bonders
#7864PRE-PLATED LEAD FRAME FOR COPPER WIRE BONDING
#7865Method of fabricating a wiring board
#7866Manufacturing method of package structure
#7867Package-on-package assembly with wire bond vias
#7868Interfaces and die packages, and appartuses including the same
#7869SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
#7870SEMICONDUCTOR DEVICE
#7871Package-on-package assembly with wire bond vias
#7872Package-on-package assembly with wire bond vias
#7873Dual interlock heatsink assembly for enhanced cavity PBGA packages, and method of manufacture
#7874Semiconductor device
#7875MULTI-CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME
#7876Package structure and the method to fabricate thereof
#7877Low impedance gate control method and apparatus
#7878DIE PACKAGE, METHOD OF MANUFACTURING THE SAME, AND SYSTEMS INCLUDING THE SAME
#7879Semiconductor structure and method for making same
#7880Semiconductor packages and electronic systems including the same
#7881Copper Stud Bump Wafer Level Package
#7882Semiconductor device and method of forming prefabricated multi-die leadframe for electrical interconnect of stacked semiconductor die
#7883Semiconductor device and method of forming a shielding layer between stacked semiconductor die
#7884Radiation-shielded semiconductor device
#7885Method for producing a power semiconductor arrangement
#7886Stub minimization with terminal grids offset from center of package
#7887Stub minimization for multi-die wirebond assemblies with parallel windows
#7888Stub minimization for assemblies without wirebonds to package substrate
#7889Packaging substrate having a holder, method of fabricating the packaging substrate, package structure having a holder, and method of fabricating the package structure
#7890POWER MODULE PACKAGE AND METHOD OF MANUFACTURING THE SAME
#7891Semiconductor package
#7892Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
#7893Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
#7894Stub minimization for assemblies without wirebonds to package substrate
#7895Power semiconductor arrangement and method for producing a power semiconductor arrangement
#7896ELECTRONIC ASSEMBLY HAVING MIXED INTERFACE INCLUDING TSV DIE
#7897Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
#7898Stub minimization for assemblies without wirebonds to package substrate
#7899Package on packaging structure and methods of making same
#7900Semiconductor package
#7901SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE THEREOF
#7902Integrated circuit packaging system with encapsulation and method of manufacture thereof
#7903Integrated circuit packaging system with stack device
#7904Semiconductor device and method of forming stacked vias within interconnect structure for Fo-WLCSP
#7905INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ENCAPSULATION AND METHOD OF MANUFACTURE THEREOF
#7906Semiconductor device and method of forming Fo-WLCSP having conductive layers and conductive vias separated by polymer layers
#7907Multi-chip and multi-substrate reconstitution based packaging
#7908Integrated circuit packaging system with external wire connection and method of manufacture thereof
#7909Integrated circuit packaging system with chip stacking and method of manufacture thereof
#7910Semiconductor device and method of forming conductive posts embedded in photosensitive encapsulant
#7911Semiconductor device and method of forming insulating layer on conductive traces for electrical isolation in fine pitch bonding
#7912Semiconductor package and method of forming z-direction conductive posts embedded in structurally protective encapsulant
#7913Lead frame having increased stability due to reinforced die pads and packaging method using such lead frame
#7914Wireless communication with dielectric medium
#7915Integrated circuit packaging system with interposer and method of manufacture thereof
#7916Light-emitting device
#7917Semiconductor device
#7918Semiconductor package and method for manufacturing the semiconductor package embedded with semiconductor chip
#7919Semiconductor device and method of forming semiconductor package using panel form carrier
#7920FLASH MEMORY CARD WITHOUT A SUBSTRATE AND ITS FABRICATION METHOD
#7921Semiconductor device
#7922Power module package
#7923Semiconductor device and method of forming RF FEM with LC filter and IPD filter over substrate
#7924Multi-die semiconductor package
#7925METHOD AND APPARATUS FOR CONNECTING INLAID CHIP INTO PRINTED CIRCUIT BOARD
#7926Method of manufacturing an electronic device package
#7927Manufacturing method of semiconductor device
#7928Method for manufacturing a chip packaging structure
#7929Method for producing chip stacks, and a carrier for carrying out the method
#7930Semiconductor integrated circuit device and method of manufacturing same
#7931Snubber circuit and method of using bipolar junction transistor in snubber circuit
#7932Snubber circuit and method of using bipolar junction transistor in snubber circuit
#7933Semiconductor apparatus
#7934TRANSISTOR STRUCTURE AND RELATED TRANSISTOR PACKAGING METHOD THEREOF
#7935Multi-chip packages providing reduced signal skew and related methods of operation
#7936Chip packaging structure and manufacturing method for the same
#7937Chip arrangement and method for producing a chip arrangement
#7938Semiconductor integrated circuit device
#7939Low loop wire bonding
#7940SEMICONDUCTOR DEVICE
#7941Semiconductor device including cladded base plate
#7942Semiconductor device and manufacturing method of the same
#7943Spot plated leadframe and IC bond pad via array design for copper wire
#7944Semiconductor chip
#7945MANUFACTURING METHOD OF PACKAGE CARRIER
#7946Reduction of etch microloading for through silicon vias
#7947Methods of forming semiconductor device packages including a semiconductor device and a redistribution element, methods of forming redistribution elements and methods for packaging semiconductor devices
#7948Method for manufacturing a package-on-package type semiconductor device
#7949METHOD FOR MANUFACTURING BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, PRINTED WIRING BOARD, INTERPOSER, AND SEMICONDUCTOR DEVICE
#7950Electronic component and method for producing same
#7951Package systems including passive electrical components
#7952Semiconductor module and cooler
#7953Transmission line for high performance radio frequency applications
#7954Encapsulated semiconductor device and method for manufacturing the same
#7955Integrated circuit packaging system with embedded thermal heat shield and method of manufacture thereof
#7956Integrated circuit packaging system with stiffener and method of manufacture thereof
#7957Semiconductor devices and methods of assembling same
#7958Electronic circuit device
#7959Semiconductor chip comprising a directional coupler having a specific main line and sub-line arrangement
#7960Method for making a sensor device using a graphene layer
#7961WIRE BONDING SYSTEM FOR SEMICONDUCTOR PACKAGE
#7962SYSTEM AND METHOD FOR PROVIDING IMPROVED IMPEDANCE MATCHING TO RF POWER TRANSISTOR USING SHUNT INDUCTANCE
#7963Die having wire bond alignment sensing structures
#7964Chip package and method for making same
#7965Component assembly using a temporary attach material
#7966Semiconductor chip with bonding wire and method for making the same
#7967Semiconductor package having supporting plate and method of forming the same
#7968PACKAGE STACKS AND METHOD OF MANUFACTURING THE SAME
#7969STACKED INTEGRATED CIRCUIT PACKAGES THAT INCLUDE MONOLITHIC CONDUCTIVE VIAS
#7970Packaging DRAM and SOC in an IC package
#7971Semiconductor device including diffusion soldered layer on sintered silver layer
#7972Through interposer wire bond using low CTE interposer with coarse slot apertures
#7973Three-dimensional integrated circuit (3DIC) formation process
#7974Power device and method of packaging same
#7975QFN DEVICE AND LEAD FRAME THEREFOR
#7976Low cost hybrid high density package
#7977Small-Outline Package for a Power Transistor
#7978Light-reflective anisotropic conductive adhesive agent, and light emitting device
#7979Bond pad monitoring structure and related method of detecting significant alterations
#7980Method for manufacturing electronic apparatus
#7981Chip on leads
#7982Manufacturing method thereof and a semiconductor device
#7983Back-to-back stacked dies
#7984SYSTEM WITH A DEFECT TOLERANT CONFIGURABLE IC
#7985UNIVERSAL PRINTED CIRCUIT BOARD AND MEMORY CARD INCLUDING THE SAME
#7986Semiconductor arrangement
#7987Package-on-package structures
#7988Multiple die in a face down package
#7989MANUFACTURING METHOD THEREOF AND A SEMICONDUCTOR DEVICE
#7990Semiconductor device
#7991Chip-packaging module for a chip and a method for forming a chip-packaging module
#7992Multi-die semiconductor package with one or more embedded die pads
#7993Semiconductor packaging for a memory device and a fabricating method thereof
#7994Semiconductor device including a recess formed above a semiconductor chip
#7995Shielded gate trench MOSFET package
#7996LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
#7997Manufacturing method using multi-step adhesive curing for sealed semiconductor device
#7998SPIRAL STAIRCASE SHAPED STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#7999Atomic layer deposition encapsulation for power amplifiers in RF circuits
#8000SEMICONDUCTOR DEVICE DIE BONDING
#8001CMOS image sensor and method for forming the same
#8002Semiconductor package structure with common gold plated metal conductor on die and substrate
#8003Semiconductor assemblies with multi-level substrates and associated methods of manufacturing
#8004Semiconductor device reducing risks of a wire short-circuit and a wire flow
#8005Semiconductor device and method of forming a stackable semiconductor package with vertically-oriented discrete electrical devices as interconnect structures
#8006Semiconductor package and system
#8007Method of fabricating a semiconductor device having recessed bonding site
#8008Light emitting device and method for manufacturing light emitting device
#8009Terminal-integrated metal base package module and terminal-integrated metal base packaging method
#8010Method of forming a semiconductor device with a contact pad on a sloped silicon dioxide surface
#8011Exposed die package for direct surface mounting
#8012DICING DIE-BONDING FILM
#8013Method for assembling at least one chip using a fabric, and fabric including a chip device
#8014DISGUISING TEST PADS IN A SEMICONDUCTOR PACKAGE
#8015Stackable integrated circuit package system
#8016Microelectronic package with stacked microelectronic elements and method for manufacture thereof
#8017Semiconductor device
#8018Bonded wire semiconductor device
#8019Pad structure including glue layer and non-low-k dielectric layer in BSI image sensor chips
#8020Semiconductor arrangement
#8021Non-reactive barrier metal for eutectic bonding process
#8022High temperature gold-free wafer bonding for light emitting diodes
#8023Microelectronic package with terminals on dielectric mass
#8024Power semiconductor chip having two metal layers on one face
#8025WAFER LEVEL CHIP SCALE PACKAGE FOR WIRE-BONDING CONNECTION
#8026SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#8027Semiconductor packages and electronic systems including the same
#8028CHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#8029POWER DEVICE PACKAGE MODULE AND MANUFACTURING METHOD THEREOF
#8030PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE WITH STRESS RELIEF STRUCTURE
#8031Glass/ceramics replacement of epoxy for high temperature hermetically sealed non-axial electronic packages
#8032Integrated circuit with electromagnetic intrachip communication and methods for use therewith
#8033Substrate for integrated modules
#8034SOFT DILUTE COPPER ALLOY WIRE, SOFT DILUTE COPPER ALLOY PLATE AND SOFT DILUTE COPPER ALLOY STRANDED WIRE
#8035Semiconductor devices compatible with mono-rank and multi-ranks
#8036Package structure with electronic component and method for manufacturing same
#8037Double-sided printed circuit board
#8038Semiconductor device and structure
#8039Semiconductor device
#8040Semiconductor device
#8041Contact pad
#8042Wafer level package and a method of forming a wafer level package
#8043Method of manufacturing semiconductor package device
#8044Semiconductor system and device
#8045Semiconductor device and method of manufacturing the same
#8046Method of manufacturing a semiconductor device
#8047Stacked die semiconductor package
#8048SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING SAME
#8049Package structure and package process
#8050Cap chip and reroute layer for stacked microelectronic module
#8051Thin foil semiconductor package
#8052SUPPORT SYSTEM FOR A SEMICONDUCTOR DEVICE
#8053METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK
#8054Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
#8055RF transistor packages with high frequency stabilization features and methods of forming RF transistor packages with high frequency stabilization features
#8056Compact production apparatus and method for producing compact
#8057Bond pad configurations for semiconductor dies
#8058Memory module in a package
#8059Memory module in a package
#8060De-skewed multi-die packages
#8061Ball grid array with improved single-ended and differential signal performance
#8062SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SAME
#8063Apparatus and methods for quad flat no lead packaging
#8064Method of forming an inductor on a semiconductor wafer
#8065SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#8066Method of forming a package substrate
#8067Thermosetting resin composition, B-stage heat conductive sheet, and power module
#8068Leadframe strip and mold apparatus for an electronic component and method of encapsulating an electronic component
#8069Laminate electronic device
#8070Power module and method for manufacturing the same
#8071RESIN COMPOSITION FOR SEMICONDUCTOR ENCAPSULATION, AND SEMICONDUCTOR DEVICE USING SAME
#8072Chip package with coplanarity controlling feature
#8073Semiconductor device packages with solder joint enhancement element and related methods
#8074SEMICONDUCTOR CARRIER, PACKAGE AND FABRICATION METHOD THEREOF
#8075Chip-stacked semiconductor package
#8076SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#8077Semiconductor module
#8078SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS
#8079SEMICONDUCTOR DEVICE PACKAGE HAVING FEATURES FORMED BY STAMPING
#8080Semiconductor device including a contact clip having protrusions and manufacturing thereof
#8081Power module package and method for manufacturing the same
#8082Power module package and method for manufacturing the same
#8083Method and apparatus for determining acceptance/rejection of fine diameter wire bonding
#8084Method of fabricating semiconductor package having substrate with solder ball connections
#8085Housing body and method for production thereof
#8086METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A HEAT SPREADER
#8087Method of manufacturing semiconductor device
#8088Four MOSFET full bridge module
#8089LIGHT EMITTING DEVICE
#8090Half-bridge electronic device with common heat sink on mounting surface
#8091Power semiconductor module
#8092Semiconductor device and manufacturing method thereof
#8093In situ-built pin-grid arrays for coreless substrates, and methods of making same
#8094Method and apparatuses for integrated circuit substrate manufacture
#8095System on a chip with interleaved sets of pads
#8096Semiconductor device
#8097Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device
#8098Stack package having flexible conductors
#8099Copper wire receiving pad
#8100Electrically conductive paste, and electrically conducive connection member produced using the paste