Methods and structures for reducing heat exposure of thermally sensitive semiconductor devices

Semiconductor package structure having an air gap and method for forming

Power module package with a fastening unit including a non-conductive portion

Solder flow impeding feature on a lead frame

Package-in-packages and methods of formation thereof

Thermally enhanced semiconductor package

Electronic device including silicon carbide diode dies

Semiconductor device including a gate wiring connected to at least one semiconductor chip

Lead Frame Packages and Methods of Formation Thereof

Stacked packaging improvements

Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices

Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Semiconductor device and method of forming an embedded SOP fan-out package

Electro-thermal cooling devices and methods of fabrication thereof

Semiconductor device apparatus and assembly with opposite die orientations

Package structure having micro-electro-mechanical system element and method of fabrication the same

SYSTEM AND METHOD FOR INSPECTING FREE AIR BALL

Wedge bonder and a method of cleaning a wedge bonder

Thermally enhanced semiconductor package with conductive clip

Semiconductor device

Semiconductor device packaging having plurality of wires bonding to a leadframe

Carrier-free land grid array IC chip package and preparation method thereof

Semiconductor modules and methods of formation thereof

Methods, circuits and systems for a package structure having wireless lateral connections

Integrated circuit packaging system with tiebar-less design and method of manufacture thereof

Method for manufacturing printed circuit boards

Multilayer electronic support structure with cofabricated metal core

Dicing die bond film and method of manufacturing semiconductor device

Manufacturing method of light-emitting device

TEST VEHICLES FOR ENCAPSULATED SEMICONDUCTOR DEVICE PACKAGES

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

Electric device package and method of making an electric device package

Package-on-package assembly with wire bond vias

Embedded semiconductive chips in reconstituted wafers, and systems containing same

Chip arrangement and method for producing a chip arrangement

Solderless die attach to a direct bonded aluminum substrate

Electronic device and method for production

Short and low loop wire bonding

Semiconductor device and a method of manufacturing the same

Bond pad assessment for wire bonding

Method of manufacturing electronic device and electronic device

Semiconductor module and method for manufacturing the same

Power electronic devices

Semiconductor device, inverter device provided with semiconductor device, and in-vehicle rotating electrical machine provided with semiconductor device and inverter device

Semiconductor package having reliable electrical connection and assembling method

Integrated circuit die assembly with heat spreader

Chip package and method for forming the same

Package-in-Package for High Heat Dissipation Having Leadframes and Wire Bonds

Semiconductor package and fabrication method thereof

PACKAGE STRUCTURE HAVING MEMS ELEMENT AND FABRICATION METHOD THEREOF

MULTI-CORE WIRE

Multi-chip-scale package

Method of manufacturing semiconductor package having no chip pad

Circuit module such as a high-density lead frame array (HDA) power module, and method of making same

Semiconductor device

Multi-chip package and method of manufacturing thereof

Semiconductor power module and method of manufacturing the same

Method of adjusting the receive frequency of an RF receiver die

Manufacturing method of substrate for a semiconductor package, manufacturing method of semiconductor package, substrate for a semiconductor package and semiconductor package

Wafer-level process for fabricating photoelectric modules

Semiconductor device packages with solder joint enhancement elements

Low loop wire bonding

Semiconductor element housing package and semiconductor device equipped with the same

Semiconductor device

Chip package and method for forming the same

Structure and Method for Inductors Integrated into Semiconductor Device Packages

Semiconductor device and production method thereof

Method of manufacturing a semiconductor device including through silicon plugs

Through wire interconnect (TWI) for semiconductor components having wire in via and bonded connection with substrate contact

Semiconductor device and method of forming through vias with reflowed conductive material

Semiconductor device and method of forming open cavity in TSV interposer to contain semiconductor die in WLCSMP

Semiconductor die and method of forming Fo-WLCSP vertical interconnect using TSV and TMV

Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

Lead structures with vertical offsets

Semiconductor packages and methods of formation thereof

Method for making circuit board

Thermally enhanced electronic package

Microelectronic wireless transmission device

Method for the wafer-level integration of shape memory alloy wires

Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

Stacked semiconductor packages

Integrated power converter package with die stacking

Semiconductor device and method of forming a shielding layer over a semiconductor die disposed in a cavity of an interconnect structure and grounded through the die TSV

Printed wiring board and method for manufacturing printed wiring board

Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates

Method of manufacturing leadless integrated circuit packages having electrically routed contacts

Package with integrated pre-match circuit and harmonic suppression

Circuit device

Circuit device

Circuit device

Circuit device and method for manufacturing same

Sensor array package

METHOD AND SYSTEM FOR WAFER AND STRIP LEVEL BATCH DIE ATTACH ASSEMBLY

Package carrier

Package structure and substrate bonding method

Chip assembly and chip assembling method

Stud bump structure for semiconductor package assemblies

Low profile interposer with stud structure

Semiconductor device and method of forming a thin wafer without a carrier

Semiconductor device having improved thermal properties

Vertically packaged integrated circuit

Semiconductor Devices and Methods of Manufacturing and Using Thereof

Semiconductor module with a semiconductor chip and a passive component and method for producing the same

Semiconductor structure with low-melting-temperature conductive regions, and method of repairing a semiconductor structure

Adhesive composition for semiconductor and adhesive film comprising the same

Method for producing a component and device comprising a component

Circuit arrangement for a thermally conductive chip assembly and a manufacturing method

CHIP PACKAGE AND METHOD FOR ASSEMBLING SAME

Semiconductor device

Pad structure of a semiconductor device, method of manufacturing the pad structure and semiconductor package including the pad structure

Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection

SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNECTION

Semiconductor device including a polymer disposed on a carrier

Chip package and method of forming the same

Off-chip vias in stacked chips

Leadless array plastic package with various IC packaging configurations

Offset interposers for large-bottom packages and large-die package-on-package structures

SYSTEM AND METHODS FOR WIRE BONDING

Power module

Power module and lead frame for power module

Multi-chip light emitter packages and related methods

Semiconductor device and method of manufacturing the semiconductor device

Electronic devices with multiple amplifier stages and methods of their manufacture

SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME

Wirebonded semiconductor package

Lead frame with grooved lead finger

Integrated circuit package and method of forming the same

Semiconductor device and method of forming the same

Package including an underfill material in a portion of an area between the package and a substrate or another package

Providing voltage isolation on a single semiconductor die

Electronic apparatus, a method for deciding a failure, and a method for estimating a fatigue life

Multifunction sensor as PoP microwave PCB

Package on package structures and methods for forming the same

Monolithic Power Converter Package with Through Substrate vias

Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die

Support device for a semiconductor chip and optoelectronic component with a carrier device and electronic component with a carrier device

Semiconductor device and a manufacturing method thereof

PCB based RF-power package window frame

Semiconductor packages and methods of formation thereof

Multichip power semiconductor device

Lead frame including an insulating resin layer entirely covering lead surface, and semiconductor device including the same

Stacked packaged integrated circuit devices, and methods of making same

High frequency transition matching in an electronic package for millimeter wave semiconductor dies

Semiconductor device

Multi-chip light emitter packages and related methods

Junction material, manufacturing method thereof, and manufacturing method of junction structure

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

High-frequency transmission module and optical connector having stacked chips connected via wire bonding

Electronic device

Semiconductor device

Semiconductor integrated circuit device

Integrated circuit packaging system with a grid array with a leadframe and method of manufacture thereof

Microelectronic package

Power semiconductor device module

GALLIUM ARSENIDE DEVICES WITH COPPER BACKSIDE FOR DIRECT DIE SOLDER ATTACH

Packaged microelectronic devices recessed in support member cavities, and associated methods

Stacked semiconductor package

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METHOD OF MANUFACTURE THEREOF

Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof

Solid-state device including a conductive bump connected to a metal pattern and method of manufacturing the same

High performance power module

Integrated power transistor circuit having a current-measuring cell

Adhesive composition, an adhesive sheet and a production method of a semiconductor device

Adhesive composition, an adhesive sheet and a production method of a semiconductor device

Manufacturing method of semiconductor device

Molded leadframe substrate semiconductor package

Chip assembly and chip assembling method

Integrated circuit chip using top post-passivation technology and bottom structure technology

Semiconductor device

Joint structure for substrates and methods of forming

Wire Bonding Structures for Integrated Circuits

Packaged integrated device die between an external and internal housing

SEMICONDUCTOR PACKAGE HAVING PROTECTIVE LAYER AND METHOD OF FORMING THE SAME

Semiconductor packages with lead extensions and related methods

Electronic system having increased coupling by using horizontal and vertical communication channels

Semiconductor device

Method of manufacturing lead frame

PRESSURE-SENSITIVE ADHESIVE TAPE FOR RESIN ENCAPSULATION AND METHOD FOR PRODUCING RESIN ENCAPSULATION TYPE SEMICONDUCTOR DEVICE

Semiconductor device having a fuse

Power module

Wiring board and semiconductor device

Method of manufacturing semiconductor device having chip stacks combined in relation to the number of chips having defects

Semiconductor device and method of forming vertically offset conductive pillars over first substrate aligned to vertically offset BOT interconnect sites formed over second substrate

Semiconductor component that includes a protective structure

Package on package structure

Protection layers for conductive pads and methods of formation thereof

Copper interconnects having a titanium-platinum-titanium assembly between copper and compound semiconductor

SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method of manufacturing the same

Method for manufacturing semiconductor devices having a glass substrate

Power semiconductor module with method for manufacturing a sintered power semiconductor module

High voltage semiconductor devices including electric arc suppression material and methods of forming the same

Method for assembling a circuit board

Wireless device, and information processing apparatus and storage device including the wireless device

Method for package-on-package assembly with wire bonds to encapsulation surface

Production method of high-density SIM card package

Integrated circuit packaging system with interconnects

Functional spacer for SIP and methods for forming the same

Devices and methods related to a sputtered titanium tungsten layer formed over a copper interconnect stack structure

Power semiconductor module

Lead frame for mounting LED elements, lead frame with resin, method for manufacturing semiconductor devices, and lead frame for mounting semiconductor elements

Light-emitting device

Embedded electronic component

Heavy-wire bond arrangement and method for producing same

Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices

Package

Semiconductor packages

SiP system-integration IC chip package and manufacturing method thereof

Wafer-scale package structures with integrated antennas

Semiconductor chip comprising a plurality of contact pads and a plurality of associated pad cells

Method and apparatus for high pressure sensor device

INTEGRATED CIRCUIT PACKAGE

Electronic assembly and method for producing same

Positioning system

Power module and output circuit

Package-on-package assembly with wire bond vias

PACKAGE-ON-PACKAGE TYPE SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME

Semiconductor packages and methods of manufacturing the same

No-flow underfill for package with interposer frame

Package with interposer frame and method of making the same

Semiconductor package structure

Package manufacturing method and semiconductor device

Optoelectronic semiconductor component

PCB HAVING INDIVIDUAL REFLECTIVE STRUCTURE AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE USING THE SAME

Wire bonding method in circuit device

Memory device comprising programmable command-and-address and/or data interfaces

System and method for an electronic package with a fail-open mechanism

SEMICONDUCTOR DEVICE INCLUDING VOLTAGE CONVERTER CIRCUIT, AND METHOD OF MAKING THE SEMICONDUCTOR DEVICE

Packaged integrated circuit using wire bonds

Method of manufacturing semiconductor device and semiconductor device

OPTIMIZATION OF COPPER PLATING THROUGH WAFER VIA

Methods of stress balancing in gallium arsenide wafer processing

Processes and structures for IC fabrication

Semiconductor component and corresponding production method

Semiconductor substrate and semiconductor chip

Light emitter packages and devices having improved wire bonding and related methods

Semiconductor device

Resin molding, surface mounted light emitting apparatus and methods for manufacturing the same

Electromagnetic resonance coupler

Multi-dimensional integrated circuit structures and methods of forming the same

Semiconductor device structures and electronic devices including hybrid conductive vias, and methods of fabrication

Integrated circuit package assembly and method of forming the same

Biosensor capacitor

Molding method for COB-EUSB devices and metal housing package

Leadframe and semiconductor package made using the leadframe

Package leadframe for dual side assembly

Power semiconductor module and method of manufacturing the same

Method of recovering a bonding apparatus from a bonding failure

Bonding structure of multilayer copper bonding wire

METHODS OF FABRICATING A PACKAGE-ON-PACKAGE DEVICE AND PACKAGE-ON-PACKAGE DEVICES FABRICATED BY THE SAME

Integrated circuit package and method of assembling an integrated circuit package

Substrate structure, semiconductor package device, and manufacturing method of semiconductor package

DISCRETE POWER TRANSISTOR PACKAGE HAVING SOLDERLESS DBC TO LEADFRAME ATTACH

Stackable microelectronic package structures

Chip package structure

Integrated Circuit Device With Wire Bond Connections

Integrated passive devices

Semiconductor device and method for manufacturing the same

Method of fabricating a packaged semiconductor

Package method for electronic components by thin substrate

Package carrier and manufacturing method thereof

Gate driver with digital ground

Semiconductor package with package on package structure

Chip-on-lead package and method of forming

Semiconductor package with a bridge interposer

Integrated circuit packages having redistribution structures

Integrated compact MEMS device with deep trench contacts

Surface-mounting light emitting diode device and method for manufacturing the same

Method of manufacturing printed wiring board

Semiconductor package, packaging substrate and fabrication method thereof

SEMICONDUCTOR PACKAGE HAVING INTERPOSER COMPRISING A PLURALITY OF SEGMENTS

SEMICONDUCTOR CHIP AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME

Semiconductor package having a metal member and a resin mold, which are bonded to a silane coupling agent and an intermediate layer of an oxide film

Window clamp top plate for integrated circuit packaging

Module including a discrete device mounted on a DCB substrate

Semiconductor package including stacked semiconductor chips and a redistribution layer

Electronics device package and fabrication method thereof

SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Semiconductor light-emitting device, method for producing same, and display device

MOBILE ELECTRONIC DEVICES UTILIZING RECONFIGURABLE PROCESSING TECHNIQUES TO ENABLE HIGHER SPEED APPLICATIONS WITH LOWERED POWER CONSUMPTION

Method for packaging semiconductors at a wafer level

Semiconductor Device and Fabrication Method

Integrated circuit packaging system with package-on-package and method of manufacture thereof

Integrated circuit packaging system with terminals and method of manufacture thereof

Integrated circuit packaging system with contacts and method of manufacture thereof

Integrated circuit packaging system with leads and method of manufacturing thereof

Integrated circuit packaging system with routable trace and method of manufacture thereof

Semiconductor module

Integrated circuit packaging system with leads and method of manufacture thereof

Leadframe interposer over semiconductor die and TSV substrate for vertical electrical interconnect

Integrated circuit packaging system with pad and method of manufacture thereof

Packaged leadless semiconductor device

Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe

Method for manufacturing photocoupler, and photocoupler lead frame sheet

Semiconductor modules and methods of forming the same

Semiconductor device having a chip mounting portion on which a separated plated layer is disposed