High frequency line-to-waveguide converter and high frequency package

Plastic overmolded packages with molded lid attachments

Semiconductor device package and manufacturing method

Semiconductor chip structure

BGA package with leads on chip field of the invention

Components, methods and assemblies for stacked packages

CHIP SCALE MODULE PACKAGE IN BGA SEMICONDUCTOR PACKAGE

CHIP PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

Semiconductor device and manufacturing method of the same

Stackable ceramic FBGA for high thermal applications

Stackable semiconductor package

Microelectronic package

Stacked semiconductor components with through wire interconnects (TWI)

Integrated circuit including clip

Power semiconductor component

Semiconductor light-emitting device and light-emitting display therewith

Highly Heat-Resistant Synthetic Polymer Compound and High Withstand Voltage Semiconductor Device

Apparatus, system and method for use in mounting electronic elements

Semiconductor element and manufacturing method thereof

Interconnect for improved die to substrate electrical coupling

Physical quantity sensor, lead frame, and manufacturing method therefor

Method of manufacturing semiconductor device

Process for packaging components, and packaged components

Light emitting device

CIRCUIT BOARD AND CIRCUIT STRUCTURE

Method for producing a component and device having a component

CONFIGURABLE UNIVERSAL INTERCONNECT DEVICE

Semiconductor multi-package module having package stacked over die-up flip chip ball grid array package and having wire bond interconnect between stacked packages

Functional device-mounted module and a method for mounting functional device-mounted module

Circuit board including solder ball land having hole and semiconductor package having the circuit board

Semiconductor device and method of manufacturing the same

Multi-chip package having a stacked plurality of different sized semiconductor chips, and method of manufacturing the same

High density electronic packages

Bond Wireless Package

Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device

Package structure with leadframe on offset chip-stacked structure

Electronic device and method for producing a device

Semiconductor package having flexible lead connection plate for electrically connecting base and chip

Multi-chip structure

Semiconductor chip packages and assemblies with chip carrier units

Semiconductor package and method of making using leadframe having lead locks to secure leads to encapsulant

Packaging system for semiconductor devices

REINFORCED MICRO-ELECTROMECHANICAL SYSTEM PACKAGE STRUCTURE

Integrated circuit package system with supported stacked die

Quad flat package

Package with solder-filled via holes in molding layers

STACKED INTEGRATION MODULE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE-BASE STRUCTURE OF POWER SEMICONDUCTOR DEVICE AND MANUFACTURING PROCESS OF THE SAME

Method for manufacturing a passive integrated matching network for power amplifiers

Lead frame with included passive devices

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Acceleration sensor

Structure and method of making sealed capped chips

Integrated circuit package system with down-set die pad and method of manufacture thereof

Method for fabricating chip-stacked semiconductor package

Method of fabricating a stacked die having a recess in a die BGA package

COMBINATION HEAT DISSIPATION DEVICE WITH TERMINATION AND A METHOD OF MAKING THE SAME

Optoelectronic module

Multiplexed RF isolator

Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same

Integrated circuit package system

Intergrated circuit utilizing down bond to define the function of the die and the implementing method thereof

Power semiconductor devices having integrated inductor

Semiconductor switching module and method

Integrated circuit package-in-package system

Chip-stacked package structure

SIP semiconductor device and method for manufacturing the same

MULTICHIP DEVICE AND METHOD FOR PRODUCING A MULTICHIP DEVICE

Integrated circuit package system with molding vents

Interposer and semiconductor package with reduced contact area

Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability

Stackable multi-chip package system

Integrated circuit package system for package stacking and manufacturing method thereof

Stackable multi-chip package system with support structure

Electronic Device and Method For Producing the Same

Integrated circuit package system including die stacking

Micro chip-scale-package system

SEMICONDUCTOR DEVICE WITH INTERNAL HEAT SINK

Integrated circuit package-on-package stacking system

LEADFRAME AND NON-LEAD PACKAGE THEREWITH

Lead Frame and Fabrication Method thereof

On-chip magnetic components

Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip

SEMICONDUCTOR MULTI-CHIP PACKAGE AND FABRICATION METHOD

Electronic packages with roughened wetting and non-wetting zones

Multiplexed RF isolator circuit

Multi-die DC-DC buck power converter with efficient packaging

Methods for providing and using grid array packages

Semiconductor device and its wiring method

Semiconductor device and its wiring method

Semiconductor device

Semiconductor device and manufacturing method for the same

BOND FINGER ON VIA SUBSTRATE, PROCESS OF MAKING SAME, PACKAGE MADE THEREBY, AND METHOD OF ASSEMBLING SAME

Semiconductor package

STACKED BALL GRID ARRAY SEMICONDUCTOR PACKAGE

Semiconductor package having passive component and semiconductor memory module including the same

Semiconductor device having a semiconductor chip enclosed by a body structure and a base

Dual side cooling integrated power device package and module with a clip attached to a leadframe in the package and the module and methods of manufacture

Array-Processed Stacked Semiconductor Packages

Semiconductor device

Nonvolatile memory apparatus

Bonding apparatus

Bonding apparatus and method for cleaning tip of a bonding tool

Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuit

Multi Lead Frame Power Package

Method for making a semiconductor multi-package module having inverted wire bond carrier second package

Semiconductor device and method for manufacturing same

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Leaded stacked packages having elevated die paddle

SEMICONDUCTOR CHIP

Electronic component of VQFN design and method for producing the same

Chip having two groups of chip contacts

Heat dissipating semiconductor package and heat dissipating structure thereof

Semiconductor device and manufacturing method therefor

Electronic circuit in a package-in-package configuration and production method

Brick type stackable semiconductor package

Stack type semiconductor package and method of fabricating the same

Pillar Bump Package Technology

Hybrid Microelectronic Package

Chip package structure and manufacturing method thereof

Integrated circuit package system with laminate base

Surface mount multichip devices

Chip package structure

Leaded stacked packages having integrated upper lead

Interconnect structure for semiconductor package

Integrated circuit package system with offset stacked die

Semiconductor structure of a high side driver

Semiconductor module with a power semiconductor chip and a passive component and method for producing the same

Power semiconductor apparatus

Semiconductor device and an information management system therefor

Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices

Method of fabricating a semiconductor chip package

System and method of attenuating electromagnetic interference with a grounded top film

CIRCULAR WIRE-BOND PAD, PACKAGE MADE THEREWITH, AND METHOD OF ASSEMBLING SAME

Transformer coils for providing voltage isolation

Integrated circuit module

Semiconductor chip structure

Chip structure with redistribution traces

Method of manufacturing semiconductor device

SEMICONDUCTOR PACKAGE HAVING ADVANTAGE FOR STACKING AND STACK-TYPE SEMICONDUCTOR PACKAGE

Semiconductor package and fabrication method thereof

Microelectronic packages with leadframes, including leadframes configured for stacked die packages, and associated systems and methods

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device

CHIP PACKAGE STRUCTURE AND FABRICATING METHOD THREROF

Semiconductor Package Having Improved Adhesion and Solderability

Integrated circuit package system with flashless leads

Electronic assembly and manufacturing method having a reduced need for wire bonds

Integrated circuit package system employing an exposed thermally conductive coating

Semiconductor device and method of manufacturing the same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Connection board, and multi-layer wiring board, substrate for semiconductor package and semiconductor package using connection board, and manufacturing method thereof

Apparatus and method for reducing volume of resource allocation information message in a broadband wireless communication system

Methods and systems for laser assisted wirebonding

SEMICONDUCTOR PACKAGE HAVING ELECTROMAGNETIC INTERFERENCE SHIELDING AND FABRICATING METHOD THEREOF

Quad flat no-lead (QFN) chip package assembly apparatus and method

Structure of high performance combo chip and processing method

Miniature optical element for wireless bonding in an electronic instrument

Semiconductor device with electrode pad having probe mark

Thermally conductive composite and uses for microelectronic packaging

Copper bonding compatible bond pad structure and method

BONDING PAD STRUCTURE FOR ELECTRONIC DEVICE

Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Bottom substrate of package on package and manufacturing method thereof

Lead frames, microelectronic devices with lead frames, and methods for manufacturing lead frames and microelectronic devices with lead frames

Solderability Improvement Method for Leaded Semiconductor Package

Superfine-circuit semiconductor package structure

Semiconductor device for pipe for passing refrigerant liquid

Flip chip package including a non-planar heat spreader and method of making the same

SEMICONDUCTOR PACKAGE

Integrated circuit package system with ground bonds

Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board

Integrated circuit package system with stiffener

Integrated circuit package-in-package system

Electronic module with switching functions and method for producing the same

Integrated circuit packaging system with ultra-thin die

Multi-chip semiconductor connector assemblies

Chip package structure and fabricating method thereof

Method of Manufacturing a Semiconductor Device

Semiconductor device

Semiconductor device

Bond and method for bonding two contact surfaces

Bonding pad structure and method for making the same

Transfer mold solution for molded multi-media card

CHIP-PACKAGING WITH BONDING OPTIONS CONNECTED TO A PACKAGE SUBSTRATE

Secure electronic entity such as a passport

Integrated circuit incorporating wire bond inductance

Stack package having pattern die redistribution

Multiple-dies semiconductor device with redistributed layer pads

Integrated circuit (IC) chip and method for fabricating the same

Chip stack, chip stack package, and method of forming chip stack and chip stack package

Semiconductor package having optimal interval between bond fingers for reduced substrate size

System-in-package structure

Flipped, stacked-chip IC packaging for high bandwidth data transfer buses

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Exposed top side copper leadframe manufacturing

Method of fabricating an integrated circuit with etched ring and die paddle

Solid state image pickup device, method for manufacturing the same, semiconductor device and method for manufacturing the same

Optoelectronic device

Methods of operating electronic devices, and methods of providing electronic devices

Method of manufacturing a semiconductor device

Manufacturing method for a leadless multi-chip electronic module

Encapsulated optoelectronic device

Die package and probe card structures and fabrication methods

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

Integrated circuit package system with offset stack

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Heat dissipating structure and method for fabricating the same

RF power transistor having an encapsulated chip package

Semiconductor device having heat spreader with center opening

Package Using Selectively Anodized Metal and Manufacturing Method Thereof

Compliant integrated circuit package substrate

Semiconductor package having functional and auxiliary leads, and process for fabricating it

Semiconductor apparatus with decoupling capacitor

Integrated Circuits Having Controlled Inductances

Semiconductor device, and life prediction circuit and life prediction method for semiconductor device

Micro universal serial bus (USB) memory package

METHOD OF MANUFACTURING A SEMICONDUCTOR PACKAGE USING A LEAD FRAME HAVING THROUGH HOLES OR HOLLOWS THEREIN

Manufacturing method of semiconductor device

METHOD OF ALIGNING A CONTACTLESS SEMICONDUCTOR DEVICE INTERFACE

Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages

Manufacturing method of wiring substrate

IC packages with internal heat dissipation structures

Micro power converter and method of manufacturing same

Integrated circuit and method for writing information

Integrated circuit (IC) package stacking and IC packages formed by same

Multilayer bonding ribbon

SEMICONDUCTOR DEVICE HAVING WIRE LOOP AND METHOD AND APPARATUS FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

Electronic device including a component stack and connecting elements, and connecting elements, and method for producing the electronic device

Printed circuit board for package of electronic components and manufacturing method thereof

Semiconductor device having semiconductor element with back electrode on insulating substrate

High-frequency semiconductor device

High frequency semiconductor device

Stacking structure of chip package

Semiconductor device having an element mounted on a substrate and an electrical component connected to the element

Thermal improvement for hotspots on dies in integrated circuit packages

DIE STACK CAPACITORS, ASSEMBLIES AND METHODS

Nested integrated circuit package on package system

MULTI-CHIP PACKAGE STRUCTURE

High power shunt switch with high isolation and ease of assembly

Multi-chip stacked package with reduced thickness

Package-on-package system

Semiconductor device including a digital semiconductor element and an analog semiconductor element in a common semiconductor device

Coreless cavity substrates for chip packaging and their fabrication

Semiconductor device capable of suppressing current concentration in pad and its manufacture method

Fabrication method of semiconductor integrated circuit device

Semiconductor package and method of assembling the same

Stacked Chips with Underpinning

Method of fixing curved circuit board and wire bonding apparatus

Intumescent paint coatings for inhibiting tin whisker growth and methods of making and using the same

Magnetic shielding for magnetic random access memory

Computer systems having an interposer including a flexible material

STACKED CHIP PACKAGE

Semiconductor device having improved contacts

Semiconductor Device

Method of making thermally enhanced substrate-base package

Mounting integrated circuit dies for high frequency signal isolation

Power semiconductor device connected in distinct layers of plastic

Semiconductor device

System-in-package device

Electronic Part And Method Of Producing The Same

Semiconductor device with improved high current performance

Interconnections resistant to wicking

Package structure and lead frame using the same

Methods and apparatus for a semiconductor device package with improved thermal performance

Device clamp for reducing oxidation in wire bonding

Wire bonding method for forming low-loop profiles

SEMICONDUCTOR HAVING A BONDING WIRE AND PROCESS

SAWN INTEGRATED CIRCUIT PACKAGE SYSTEM

Advanced multilayer coreless support structures and method for their fabrication

Method of forming semiconductor packaged device

METHOD OF FORMING A TRACE EMBEDDED PACKAGE

Multiple row exposed leads for MLP high density packages

Chip stack package and manufacturing method thereof

Semiconductor device encapsulated with resin composition

Backages with buried electrical feedthroughs

Semiconductor package and method for fabricating the same

Encapsulated electronic device

Semiconductor device

Stackable semiconductor package

Interlayer dielectric and pre-applied die attach adhesive materials

Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of passive element device

Process to reform a plastic packaged integrated circuit die

Ball grind array package structure

Multilayer electronic component, electronic device, and method for producing multilayer electronic component

Semiconductor package structure having enhanced thermal dissipation characteristics

Integrated circuit package system with edge connection system

Semiconductor package substrate and semiconductor package having the same

Chip stack, method of fabrication thereof, and semiconductor package having the same

Semiconductor integrated circuit device

Method of manufacturing an electronic component package

Multiple die stack apparatus employing T-shaped interposer elements

Semiconductor device having a bonding wire and method for manufacturing the same

Stacked package electronic device

Stack structure of circuit board with semiconductor component embedded therein

Stackable multi-chip package system

Stackable semiconductor package

Microelectronic package having solder-filled through-vias

Lead frame and method of manufacturing the same and semiconductor device

Leadframe IC packages having top and bottom integrated heat spreaders