Method and structure for improving the reliability of leadframe integrated circuit packages

Electric circuit device and related manufacturing method

Semiconductor device and method for manufacturing the same

Semiconductor device with reduced parasitic inductance

Light-emitting device manufacturing method and light-emitting device

Method for producing a chip-substrate connection

SUBSTRATE AND LAYOUT METHOD

Contact surrounded by passivation and polymide and method therefor

Fabrication method of semiconductor device

Separation method of semiconductor device

Non-cyanide gold electroplating for fine-line gold traces and gold pads

Integrated circuit, and a mobile phone having the integrated circuit

Interconnect structure and formation for package stacking of molded plastic area array package

Wire bonding structure and method that eliminates special wire bondable finish and reduces bonding pitch on substrates

Method of wire bonding over active area of a semiconductor circuit

Integrated circuit package having exposed thermally conducting body

Semiconductor package, chip carrier structure thereof, and method for fabricating the chip carrier

Quad flat no-lead chip carrier with stand-off

Semiconductor device

SYSTEM IN PACKAGE MODULE

Multilayer dielectric substrate and semiconductor package

Palladium-Plated Lead Finishing Structure For Semiconductor Part And Method Of Producing Semiconductor Device

High density integrated circuit apparatus, test probe and methods of use thereof

Semiconductor device having post-mold nickel/palladium/gold plated leads

Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body

Method and apparatus for forming an electrical connection to a semiconductor substrate

Electronic device substrate, electronic device and methods for making same

Multi-channel optical receiver module

Electronic device substrate, electronic device and methods for fabricating the same

Stub-tuned wirebond package

SEMICONDUCTOR PACKAGE

Integrated circuit package and multi-layer lead frame utilized

Metallization layer for a power semiconductor device

Dual-sided chip attached modules

Dual MOSFET package

Method and apparatus for cooling semiconductor device hot blocks and large scale integrated circuit (IC) using integrated interposer for IC packages

PACKAGED DEVICES AND METHODS FOR FORMING PACKAGED DEVICES

Semiconductor device and method of manufacturing the same

No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement

Circuit card module and method for fabricating the same

Integrated circuit package system with different mold locking features

Electronic component having a semiconductor power device

Copper straps

Integrated circuit having stress tuning layer

Methods and apparatus having an integrated circuit attached to fused silica

Integrated circuit chip packaging

Micro-package, multi-stack micro-package, and manufacturing method therefor

Method and apparatus for manufacture and inspection of semiconductor device

Integrated circuit package system with contoured encapsulation

High Withstand Voltage Semiconductor Device Covered with Resin and Manufacturing Method Therefor

Module With Built-In Semiconductor And Method For Manufacturing The Module

Method for fabricating semiconductor package with multi-layer die contact and external contact

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device having a chip stack on a rewiring plate

Semiconductor device

Manufacturing method of resin-molding type semiconductor device, and wiring board therefor

Stacked bump structure and manufacturing method thereof

Electronic device with integrated heat distributor

COB type IC package to enhanced bondibility of bumps embedded in substrate and method for fabricating the same

Method of fabricating microelectronic devices

THREE-DIMENSIONAL PACKAGING SCHEME FOR PACKAGE TYPES UTILIZING A SACRIFICIAL METAL BASE

INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS

Integrated circuit device with semiconductor device components embedded in plastic housing composition

Semiconductor device having shifted stacked chips

Semiconductor Housings Having Coupling Coatings

Lead frame and semiconductor device using the same

Power semiconductor module

WIRE BONDING PROCESS FOR INSULATED WIRES

High-power ball grid array package, heat spreader used in the BGA package and method for manufacturing the same

Package structure

Semiconductor chip capable of being laminated and a semiconductor device including the lamination of a plurality of semiconductor chips

CHIP PACKAGE

Test pads on flash memory cards

Wafer level stack structure for system-in-package and method thereof

Multiple chip package module and method of fabricating the same

Semiconductor device and method for manufacturing same

DIE-ON-LEADFRAME (DOL) WITH HIGH VOLTAGE ISOLATION

System and method for routing signals between side-by-side die in lead frame type system in a package (SIP) devices

Arrangement for welding workpieces by means of an ultrasonic device

CERAMIC MULTILAYER SUBSTRATE AND ITS MANUFACTURING METHOD

Method of forming stackable package

Method of making wirebond electronic package with enhanced chip pad design

Encapsulation for particle entrapment

Attaching heat sinks to integrated circuit packages

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Stackable semiconductor package

Wirebond pad for semiconductor chip or wafer

Circuit Apparatus

Power semiconductor module as H-bridge circuit and method for producing the same

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Memory package structure

SEMICONDUCTOR DEVICE PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURES HAVING HEAT DISSIPATIVE ELEMENT DIRECTLY CONNECTED TO INTERNAL CIRCUIT AND METHODS OF FABRICATING THE SAME

Molded SiP package with reinforced solder columns

Cooling mechanism for stacked die package, and method of manufacturing stacked die package containing same

Circuit apparatus and method of fabricating the apparatus

Packaging of integrated circuits to lead frames

Leadframe structures for semiconductor packages

Light emitting diode package with direct leadframe heat dissipation

System and method for providing a power bus in a wirebond leadframe package

REDUCED OXIDATION SYSTEM FOR WIRE BONDING

Chip structure with half-tunneling electrical contact to have one electrical contact formed on inactive side thereof and method for producing the same

Method of manufacturing semiconductor apparatus

Method for fabricating semiconductor package free of substrate

Carrierless chip package for integrated circuit devices, and methods of making same

Semiconductor die package including multiple dies and a common node structure

Semiconductor element mounting board and optical transmission module

Surface mounting electronic component and manufacturing method thereof

Inductor element and method for production thereof, and semiconductor module with inductor element

Filter device substrate and filter device

Semiconductor device

Integrated circuit devices with stacked package interposers

Power semiconductor component, power semiconductor device as well as methods for their production

IC chip package with minimized packaged-volume

Semiconductor power module including epoxy resin coating

Semiconductor device and method of manufacturing the same

Utra-thin substrate package technology

Semiconductor components having encapsulated through wire interconnects (TWI)

Semiconductor module featuring solder balls having lower melting point than that of solder electrode terminals of electronic device containing additional metal powder component

Ball Grid array package structure

Embedded integrated circuit package-on-package system

Leadframe enhancement and method of producing a multi-row semiconductor package

Package for optical device and method of manufacturing the same

Memory circuit system having semiconductor devices and a memory

MULTI-DIE INDUCTOR

MOSFET power package

Semiconductor device using semiconductor chip

Tail wire cutting method and bonding apparatus

Method of manufacturing a through electrode

POP Semiconductor Device Manufacturing Method

Semiconductor package, array arranged substrate structure for the semiconductor package and fabrication method of the semiconductor package

Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication

Electronic device with lead-free metal thin film formed on the surface thereof

Semiconductor memory device and defect remedying method thereof

Multilayer wiring board

Chip package

ELECTRODE, MANUFACTURING METHOD OF THE SAME, AND SEMICONDUCTOR DEVICE HAVING THE SAME

Programmable system in package

Stacked integrated circuit package-in-package system

Electronic component device

Electronic component package

Semiconductor device, substrate for producing semiconductor device and method of producing them

Overmolded semiconductor package with a wirebond cage for EMI shielding

Semiconductor device package with base features to reduce leakage

Semiconductor light emitting device with first and second leads

Circuit device

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

Semiconductor device having heat radiation member and semiconductor chip and method for manufacturing the same

Bonding Wire and Integrated Circuit Device Using the Same

Semiconductor device

Hybrid stacking package system

Chip with power and signal pads connected to power and signal lines on substrate

High frequency IC package and method for fabricating the same

Common Assembly Substrate and Applications Thereof

Integrated circuit package system with wire bond pattern

Single package wireless communication device

Hybrid flip-chip and wire-bond connection package system

Power semiconductor module with flush terminal elements

Semiconductor device having an adhesion promoting layer and method for producing it

Substrate for a microelectronic package and method of fabricating thereof

Methods and apparatus for a reduced inductance wirebond array

Integrated circuit package system with ground ring

Chip package structure

Semiconductor package and method using isolated Vplane to accommodate high speed circuitry ground isolation

Electronic device with selective nickel palladium gold plated leadframe and method of making the same

Capacitor structure of semiconductor device and method of fabricating the same

Electrical arrangement comprising a wire connection arrangement and method for the production of such an electrical arrangement

Wire bonding capillary tool having multiple outer steps

Multichip package system

Semiconductor encapsulant of epoxy resin, polyphenolic compound, filler and accelerator

QFN housing having optimized connecting surface geometry

Semiconductor device and manufacturing method thereof

Methods of Packaging Using Fluid Resin

Methods of forming semiconductor assemblies

Semiconductor device manufacturing method

Method for making a wedge wedge wire loop

Circuit device

Stacked integrated circuit package system with connection protection

UNIVERSAL CHIP PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE HAVING STACKED STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Packaged microelectronic devices recessed in support member cavities, and associated methods

Semiconductor device with guard rings that are formed in each of the plural wiring layers

Ball grid array housing having a cooling foil

High-performance semiconductor package

Semiconductor device and manufacturing method thereof

Semiconductor packaging unit with sliding cage

Power semiconductor component with a power semiconductor chip and method for producing the same

CHIP CARRIER SUBSTRATE WITH A LAND GRID ARRAY AND EXTERNAL BOND TERMINALS

Integrated circuit (IC) carrier assembly incorporating an integrated circuit (IC) retainer

Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices

Method for fabricating chip package structure

Integrated circuit die with pedestal

Semiconductor device with lead frames

Memory card

Semiconductor device including a DC-DC converter

Folding chip planar stack package

Semiconductor module with current connection element

Carbon nanotube-solder composite structures for interconnects, process of making same, packages containing same, and systems containing same

Connecting device for electronic components

HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Method of packaging integrated circuit devices using preformed carrier

Method of forming a semiconductor device having bonding pad of the second chip thinner than bonding pad of the first chip

Separation method for cutting semiconductor package assemblage for separation into semiconductor packages

Manufacturing method of a package structure

Planar circuit housing

Semiconductor device

On-die bond wires system and method for enhancing routability of a redistribution layer

Method for precision assembly of integrated circuit chip packages

Semiconductor components with through wire interconnects

Stack package utilizing through vias and re-distribution lines

Semiconductor package structure

Semiconductor device and a method of manufacturing the same

Semiconductor devices and electrical parts manufacturing using metal coated wires

Chip package with a ring having a buffer groove that surrounds the active region of a chip

Leadless semiconductor package with electroplated layer embedded in encapsulant and the method for manufacturing the same

Semiconductor device

Electronic component and its manufacturing method

Physical quantity sensor and lead frame used for same

Power transistor and power semiconductor device

Manufacturing method of a semiconductor device

Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device

Manufacturing method of semiconductor device

Microelectronic devices and methods for manufacturing microelectronic devices

Optical semiconductor device

Electronic component integrated module

Memory card structure and method for manufacturing the same

Carrierless chip package for integrated circuit devices, and methods of making same

Aluminum bump bonding for fine aluminum wire

METHOD FOR MOUNTING AN ELECTRONIC PART ON A SUBSTRATE USING A LIQUID CONTAINING METAL PARTICLES

Multichip module with improved system carrier

Integrated circuit package system

Multichip package system

Integrated circuit package-in-package system

Semiconductor device

Semiconductor device

Electronic component having a power switch with an anode thereof mounted on a die attach region of a heat sink

Leadless leadframe implemented in a leadframe-based BGA package

Connecting a plurality of bond pads and/or inner leads with a single bond wire

Chip Package Structure

Chip package and wafer treating method for making adhesive chips

Method for making QFN package with power and ground rings

Semiconductor chip assembly

Semiconductor Device Including a Plurality of Semiconductor Chips Packaged in a Common Housing

Vertical semiconductor power switch, electronic component and methods of producing the same

Production system

Wire bonding method for preventing polymer cracking

Method and structure for improving bonding reliability in bond pads

Method for manufacturing semiconductor device

Silicone Adhesive

Wiring member, resin-coated metal part and resin-sealed semiconductor device, and manufacturing method for the resin-coated metal part and the resin-sealed semiconductor device

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE

Multi-chip package

Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards

Integrated circuit package on package system

Microelectronic device assemblies including assemblies with recurved leadframes, and associated methods

Board on chip package and manufacturing method thereof

Integrated circuit package system having interconnect stack and external interconnect

Gold-bumped interposer for vertically integrated semiconductor system

Integrated circuit package system

Semiconductor package system with substrate having different bondable heights at lead finger tips

GaAs power transistor

Integrated circuit leaded stacked package system

Semiconductor chip package having a slot type metal film carrying a wire-bonding chip

Ball grid array substrate having window and method of fabricating same

SiP module with a single sided lid

Chip package and method for fabricating the same

Layer between interfaces of different components in semiconductor devices

SEMICONDUCTOR DEVICE WITH BATTERY

Semiconductor device having capacitors for reducing power source noise

Microelectromechanical microphone packaging system

Microelectonic packages and methods therefor

Electronic Component With Stacked Semiconductor Chips And Heat Dissipating Means

Semiconductor package structure and method for manufacturing the same

Sub-assembly

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Semiconductor package and method for fabricating the same

Method for manufacturing semiconductor device

Method for fabricating stacked semiconductor components with through wire interconnects

Semiconductor device for an ultra wideband standard for ultra-high-frequency communication, and method for producing the same

Semiconductor device

Semiconductor device with semiconductor device components embedded in plastic package compound

Stackable integrated circuit package system with multiple interconnect interface

System for fabricating semiconductor components with through wire interconnects

Electronic assembly and method for forming the same

Stacked integrated circuit package system

Thermally-enhanced ball grid array package structure and method

Semiconductor device and semiconductor module therewith

Power semiconductor device and method for producing it

Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component

INTEGRATED CIRCUIT CHIP AND PACKAGE

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages

No lead package with heat spreader

Multi-row lead frame

Integrated circuit package system including die stacking

Transmission line substrate and semiconductor package

Semiconductor bulk resistance element

Apparatus And Method For Temperature-Interrupting Protection Of An Electric Device

Method and apparatus for forming bumps for semiconductor interconnections using a wire bonding machine

CENTER PAD TYPE IC CHIP WITH JUMPERS, METHOD OF PROCESSING THE SAME AND MULTI CHIP PACKAGE

Manufacturing method of semiconductor module including solid-liquid diffusion joining steps