207827 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor Transistor
#302Offset interposers for large-bottom packages and large-die package-on-package structures
#303BOND PAD TOPOLOGY TO MITIGATE CRACK FORMATION
#304SEMICONDUCTOR DEVICE
#305Face-to-face semiconductor device with fan-out porch
#306Semiconductor device
#307RIBBON BONDING GROUND PLANE FOR RADIO FREQUENCY PERFORMANCE IMPROVEMENT IN ELECTRO-OPTICAL DEVICES
#308SEMICONDUCTOR DEVICE
#309SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#310SEMICONDUCTOR PACKAGE
#311SEMICONDUCTOR DEVICE
#312SEMICONDUCTOR DEVICE
#313LEAD FRAME AND ELECTRONIC COMPONENT
#314SEMICONDUCTOR MODULE
#315MICRO PACKAGE STRUCTURE
#316SEMICONDUCTOR DEVICES HAVING ALIGNED FRONT-END INTERFACE CONTACTS AND BACK-END INTERFACE CONTACTS, AND ASSOCIATED SYSTEMS AND METHODS
#317REPEATER SCHEME FOR INTER-DIE SIGNALS IN MULTI-DIE PACKAGE
#318INTER-DIE SIGNAL LOAD REDUCTION TECHNIQUE IN MULTI-DIE PACKAGE
#319Semiconductor device
#320INSULATION MODULE AND GATE DRIVER
#321MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD FRAME
#322POWER ELECTRONICS ARRANGEMENT WITH PARALLEL CONNECTED SEMICONDUCTOR SWITCHES, POWER ELECTRONICS DEVICE, MOTOR VEHICLE, AND METHOD FOR PRODUCING A POWER ELECTRONICS ARRANGEMENT
#323Package structure
#324Semiconductor package with thermal relaxation block and manufacturing method thereof
#325Through stack bridge bonding devices and associated methods
#326CROSS STACK BRIDGE BONDING DEVICES AND ASSOCIATED METHODS
#327SEMICONDUCTOR APPARATUS
#328SEMICONDUCTOR DEVICE
#329ESD protection for multi-die integrated circuits (ICs) including integrated passive devices
#330TRANSISTOR DEVICE, SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING A TRANSISTOR DEVICE
#331SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#332SEMICONDUCTOR DEVICE
#333SEMICONDUCTOR DEVICE
#334SEMICONDUCTOR DEVICE
#335Power semiconductor package having first and second lead frames
#336METHOD FOR MANUFACTURING WINDOW BALL GRID ARRAY (WBGA) PACKAGE
#337WINDOW BALL GRID ARRAY (WBGA) PACKAGE
#338Semiconductor package structure and packaging method thereof
#339SEMICONDUCTOR DEVICE
#340SEMICONDUCTOR PACKAGE
#341Semiconductor device and method for manufacturing the same
#342SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#343Pad structure for enhanced bondability
#344SEMICONDUCTOR DEVICE
#345MULTI-CHIP DEVICE WITH GATE REDISTRIBUTION STRUCTURE
#346Through electrode substrate and semiconductor device
#347Package for power semiconductor devices
#348PACKAGE STRUCTURE FOR POWER SEMICONDUCTOR DEVICES WITH IMPROVED PARASITIC PARAMETERS
#349SEMICONDUCTOR DEVICE
#350DISCRETE POWER SEMICONDUCTOR PACKAGE
#351SEMICONDUCTOR PACKAGE MODULE INCLUDING VERTICAL TERMINALS
#352Temperature-stable composite of a stranded wire having a contact pad
#353Power Semiconductor Module and Manufacturing Method
#354RIBBON SHIELD DEVICE AND METHOD
#355DC and AC magnetic field protection for MRAM device using magnetic-field-shielding structure
#356Semiconductor packages with roughened conductive components
#357LEADFRAME
#358SEMICONDUCTOR DEVICE
#359INVERTED LEADS FOR PACKAGED ISOLATION DEVICES
#360SEMICONDUCTOR DEVICE
#361Semiconductor device
#362WIRING STRUCTURE, SEMICONDUCTOR MODULE, AND VEHICLE
#363ELECTRONIC PACKAGE, PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
#364SEMICONDUCTOR MODULE
#365PACKAGING STRUCTURE AND PACKAGING METHOD OF HIGH-POWER RADIO FREQUENCY DEVICE
#366MULTI-ROLE SEMICONDUCTOR DEVICE SUBSTRATES, SEMICONDUCTOR DEVICE ASSEMBLIES EMPLOYING THE SAME, AND METHODS FOR FORMING THE SAME
#367SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#368PACKAGE STRUCTURE
#369Shielded electronic component package
#370LEADED SEMICONDUCTOR PACKAGE WITH LEAD MOLD FLASH REDUCTION
#371Switching device and electronic circuit
#372Switching device and electronic circuit
#373Switching device and electronic circuit
#374Methods of determining a sequence for creating a plurality of wire loops in connection with a workpiece
#375SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#376Three-dimensional functional integration
#377Semiconductor package including stacked semiconductor chips
#378Packaging of a semiconductor device with a plurality of leads
#379SEMICONDUCTOR DEVICE
#380Sensor package structure
#381Semiconductor device
#382Isolation device and method of transmitting a signal across an isolation material using wire bonds
#383CIRCUIT MODULE
#384ESD protection device
#385SEMICONDUCTOR MODULE
#386PACKAGE BASE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#387LIGHT EMITTING DISPLAY APPARATUS
#388PAD ARRANGING METHOD AND PAD ARRANGEMENT STRUCTURE
#389PACKAGING STRUCTURE FOR POWER MODULE, PACKAGING METHOD AND ELECTRIC VEHICLE
#390SURFACE-MOUNT DEVICE WIRE BONDING IN SEMICONDUCTOR DEVICE ASSEMBLIES
#391SEMICONDUCTOR DEVICE
#392Semiconductor device and method for manufacturing the same
#393Semiconductor device including a bidirectional switch
#394Semiconductor power module
#395Semiconductor fuse with multi-bond wire
#396Semiconductor device
#397Semiconductor package
#398Electronic Package and Electronic Device Comprising the Same
#399SEMICONDUCTOR DEVICE
#400Semiconductor module
#401Semiconductor device and method of manufacturing the same
#402SEMICONDUCTOR DEVICE
#403Semiconductor package including semiconductor chips
#404Packaged stackable electronic power device for surface mounting and circuit arrangement
#405ELECTRONIC PACKAGE STRUCTURE AND CHIP THEREOF
#406SEMICONDUCTOR PACKAGE INCLUDING STACKED SEMICONDUCTOR CHIPS
#407GATE DRIVER PACKAGE FOR UNIFORM COUPLING TO DIFFERENTIAL SIGNAL BOND WIRE PAIRS
#408Two-step decapsulation technique for semiconductor package having silver bond wires
#4093D chip with shared clock distribution network
#410LEADFRAME PACKAGE WITH METAL INTERPOSER
#411SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#412Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
#413Semiconductor package and method of manufacturing the same
#414SEMICONDUCTOR DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#415SEMICONDUCTOR DEVICE
#416SEMICONDUCTOR MODULE
#417Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold
#418SEMICONDUCTOR PACKAGE
#419SEMICONDUCTOR DEVICE
#420SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#421Semiconductor device
#422SEMICONDUCTOR PACKAGE
#423SEMICONDUCTOR UNIT AND SEMICONDUCTOR DEVICE
#424SEMICONDUCTOR PACKAGE INCLUDING AN ENCAPSULANT
#425MICROELECTRONIC ASSEMBLIES WITH DIRECT ATTACH TO CIRCUIT BOARDS
#426ELECTROMAGNETIC SHIELDS WITH BONDING WIRES FOR SUB-MODULES
#427SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#428Wire bond wires for interference shielding
#429Semiconductor packages
#430Semiconductor device including re-distribution pads disposed at different levels and a method of manufacturing the same
#431SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
#432Semiconductor package structure with heat sink and method preparing the same
#433Semiconductor packages with pass-through clock traces and associated systems and methods
#434Packages with electrical fuses
#435METHOD OF ASSEMBLING SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE
#436Semiconductor package including stacked chip structure
#437SEMICONDUCTOR PACKAGE
#438Bond pad connection layout
#439Semiconductor device and method for manufacturing the same
#440LIGHT MODULE AND LIDAR APPARATUS HAVING AT LEAST ONE LIGHT MODULE OF THIS TYPE
#441Integrated circuit package having wirebonded multi-die stack
#442SEMICONDUCTOR DEVICE ASSEMBLY WITH THROUGH-PACKAGE INTERCONNECT AND ASSOCIATED SYSTEMS, DEVICES, AND METHODS
#443Impedance controlled electrical interconnection employing meta-materials
#444Multi-chip package and method of providing die-to-die interconnects in same
#445Heat slug attached to a die pad for semiconductor package
#446Face-to-face semiconductor device with fan-out porch
#447Semiconductor package
#448MEMORY DEVICE INCLUDING CIRCUITRY UNDER BOND PADS
#449Universal Surface-Mount Semiconductor Package
#450Method of floated singulation
#451Semiconductor packages
#452Semiconductor package
#453Semiconductor device package connector structure and method therefor
#454Semiconductor package structure and method for manufacturing the same
#455Semiconductor device
#456Power amplifier modules including semiconductor resistor and tantalum nitride terminated through wafer via
#457Semiconductor die stack having bent wires and vertical wires and a semiconductor package including the semiconductor die stack
#458LOW COST RELIABLE FAN-OUT FAN-IN CHIP SCALE PACKAGE
#459Activation of dynamic filter generation for message management systems through gesture-based input
#460Power management
#461METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE
#462Semiconductor device assemblies including multiple stacks of different semiconductor dies
#463Package-on-package assembly with wire bonds to encapsulation surface
#464Method of forming a semiconductor package with connection lug
#465Semiconductor package
#466CONTACT ASSEMBLY FOR AN ELECTRONIC COMPONENT, AND METHOD FOR PRODUCING AN ELECTRONIC COMPONENT
#467Semiconductor module with bond wire loop exposed from a molded body and method for fabricating the same
#468Semiconductor device with sealed semiconductor chip
#469Offset interposers for large-bottom packages and large-die package-on-package structures
#470Semiconductor module
#471Semiconductor memory device
#472Semiconductor devices with multiple substrates and die stacks
#473Electronic device with exposed tie bar
#474High frequency package
#475Semiconductor device
#476Semiconductor package including a dummy pad
#477Plurality of transistors attached to a heat sink with a periphery notch
#478Semiconductor device
#479CONNECTING STRIP FOR DISCRETE AND POWER ELECTRONIC DEVICES
#480Semiconductor Device
#481Power semiconductor module and power converter
#482High power transistor with interior-fed fingers
#483Semiconductor device
#484Protective elements for bonded structures
#485Semiconductor device package
#486Semiconductor package
#487Semiconductor device
#488Heat sink, semiconductor package and semiconductor module
#489SEMICONDUCTOR DEVICE
#490Semiconductor packages and methods of forming same
#491Semiconductor device and manufacturing method thereof
#492BOTTOM PACKAGE EXPOSED DIE MEMS PRESSURE SENSOR INTEGRATED CIRCUIT PACKAGE DESIGN
#493Power module
#494Semiconductor package structure and packaging method thereof
#495Semiconductor device and method for manufacturing semiconductor device
#496Semiconductor package with plurality of grooves on lower surface
#497Semiconductor device
#498Reduction in susceptibility of analog integrated circuits and sensors to radio frequency interference
#499Bonded semiconductor devices and methods of forming the same
#500SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#501Semiconductor package system and related methods
#502Semiconductor device and temperature measurement method
#503Switching device and electronic circuit
#504Semiconductor package with thermal relaxation block and manufacturing method thereof
#505Power semiconductor module with low inductance gate crossing
#506Semiconductor device and method of manufacturing semiconductor device
#507Semiconductor element, apparatus, and chip
#508Semiconductor device including semiconductor dies of differing sizes and capacities
#509SEMICONDUCTOR DEVICE
#510Semiconductor device and measurement device
#511HIGH VOLTAGE TRANSISTOR WITH A FIELD PLATE
#512Package structure
#513SEMICONDUCTOR PACKAGE INCLUDING PROCESSOR CHIP AND MEMORY CHIP
#514Semiconductor module
#515Semiconductor package and manufacturing method thereof
#516Light emitting device package
#517Package for power semiconductor devices
#518Stacked semiconductor package
#519Semiconductor package
#520Semiconductor package
#521Semiconductor device and method of forming leadframe with clip bond for electrical interconnect
#522Heat conduction pattern for cooling a power module
#523Semiconductor package with top circuit and an IC with a gap over the IC
#524Semiconductor package including stacked semiconductor chips
#525Semiconductor package including stacked semiconductor chips
#526Power amplifier with a power transistor and an electrostatic discharge protection circuit on separate substrates
#527Semiconductor device with metal film on surface between passivation film and copper film
#528Stem for semiconductor package
#529Light emitting apparatus
#530CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS
#531Lead frame with a support portion having a through hole over a heat dissipation plate, semiconductor device, and manufacturing method of lead frame
#532Semiconductor module and method for manufacturing semiconductor module
#533Memory device comprising programmable command-and-address and/or data interfaces
#534Package-on-package assembly with wire bond vias
#535Bond pad connection layout
#536Offset interposers for large-bottom packages and large-die package-on-package structures
#537Package with electrically insulated carrier and at least one step on encapsulant
#538Integrated circuit packages with cavities and methods of manufacturing the same
#539Semiconductor packages
#540Semiconductor Device with Tunable Antenna Using Wire Bonds
#541SEMICONDUCTOR APPARATUS
#542Pad structure for enhanced bondability
#543Semiconductor package structure including an encapsulant having a cavity exposing an interposer
#544Semiconductor device
#545Multi wire bonding with current sensing method
#546Circuit structure
#547Power module and process for manufacturing the same
#548Semiconductor package including semiconductor chips
#549Package for power electronics
#550Devices and methods related to dual-sided radio-frequency package with overmold structure
#551Loop height measurement of overlapping bond wires
#552Semiconductor device having inner lead exposed from sealing resin, semiconductor device manufacturing method thereof, and power converter including the semiconductor device
#553Light-emitting device
#554Semiconductor package
#555Semiconductor device
#556Semiconductor device with electrode pad having different bonding surface heights
#557Semiconductor device including a bidirectional switch
#558Straight wirebonding of silicon dies
#559Compact leadframe package
#560Semiconductor device
#561Semiconductor package
#562Package with an electrode-attached frame supported by a heat sink, and method for manufacturing power semiconductor module provided therewith
#563SEMICONDUCTOR DEVICE
#564Electronic device having inverted lead pins
#565Semiconductor device
#566Method of forming package structure
#567Shielded electronic component package
#568Semiconductor device
#569Semiconductor package including plurality of recesses and molding member with plurality of protrusions that fill the recesses
#570SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
#571Hermetic package for high CTE mismatch
#572Hermetic package for high CTE mismatch
#573MULTI-CHIP PACKAGE
#574Package comprising wire bonds configured as a heat spreader
#575Isolation device and method of transmitting a signal across an isolation material using wire bonds
#576Multichip package manufacturing process
#577SEMICONDUCTOR DEVICE, POWER CONVERTER, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING POWER CONVERTER
#578Integrated circuit package and die
#579Semiconductor device
#580Semiconductor packages and methods of packaging semiconductor devices
#581Package substrate and semiconductor package with elevated bonding pad, and comprising the same
#582Semiconductor package and method of fabricating the same
#583Plurality of overlapping power terminals in a semiconductor module
#584Packaging of a semiconductor device with a plurality of leads
#585Electronic element mounting substrate, and electronic device
#586Sensor package structure
#587Semiconductor device including sense insulated-gate bipolar transistor
#588Semiconductor device and method for manufacturing the same
#589Stacked semiconductor die assemblies with support members and associated systems and methods
#590Stacked semiconductor die assemblies with die support members and associated systems and methods
#591Interconnected substrate arrays containing electrostatic discharge protection grids and associated microelectronic packages
#592Semiconductor module
#593Semiconductor device
#594Package with dies mounted on opposing surfaces of a leadframe
#595Reliable semiconductor packages
#596Backside metalization with through-wafer-via processing to allow use of high Q bond wire inductances
#597DC and AC magnetic field protection for MRAM device using magnetic-field-shielding structure
#598Method for bonding insulated coating wire, connection structure, method for stripping insulated coating wire and bonding apparatus
#599Bonding wire, semiconductor package including the same, and wire bonding method
#600Capacitor die for stacked integrated circuits