207827 ⎘
Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Wire connectors; Manufacturing methods related thereto; Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
Radio frequency transistor amplifiers and other multi-cell transistors having isolation structures
#602Semiconductor device
#603Semiconductor package including a package substrate including staggered bond fingers
#604Packaged stackable electronic power device for surface mounting and circuit arrangement
#605MCM package isolation through leadframe design and package saw process
#606Package for power electronics
#607Group III nitride-based radio frequency amplifiers having back side source, gate and/or drain terminals
#608Semiconductor device and inspection device
#609High voltage semiconductor device lead frame and method of fabrication
#610Multi-die, vertical-wire package-in-package apparatus, and methods of making same
#611Semiconductor device
#612Wiring formation method, method for manufacturing semiconductor device, and semiconductor device
#613Method of attaching an insulation sheet to encapsulated semiconductor device
#614RADIO FREQUENCY SHIELDING WITHIN A SEMICONDUCTOR PACKAGE
#615Semiconductor package structure with heat sink and method preparing the same
#616Semiconductor packages having photon integrated circuit (PIC) chips
#617Semiconductor device
#618Methods and apparatus for an improved integrated circuit package
#619Power amplifier with decreased RF return current losses
#620IC package having a metal die for ESP protection
#621Semiconductor package
#622Semiconductor package including semiconductor chip having point symmetric chip pads
#623LED package with multiple element light source and encapsulant having curved and/or planar surfaces
#624Semiconductor die singulation
#625Semiconductor arrangement and method for producing the same
#626Semiconductor device with frame having arms
#627Semiconductor device
#628Package with different types of semiconductor dies attached to a flange
#629OPTOELECTRONIC SYSTEM
#630RF amplifiers with series-coupled output bondwire arrays and shunt capacitor bondwire array
#631Semiconductor device
#632Semiconductor device and manufacturing method of the same
#633Chip on Package Structure and Method
#634Power module and method of manufacturing the same, and power conversion apparatus
#635Semiconductor device
#636Packaging mechanisms for dies with different sizes of connectors
#637Power semiconductor module
#638Electronic element mounting substrate, electronic device, and electronic module
#639Power amplifier packages containing multi-path integrated passive devices
#640Face-to-face semiconductor device with fan-out porch
#641HIGH POWER MODULE
#642Transistor die with output bondpad at the input side of the die, and power amplifiers including such dies
#643Packaging structure and packaging method of digital circuit
#644Wideband RF power splitters and amplifiers including wideband RF power splitters
#645Multi-chip package structure having high density chip interconnect bridge with embedded power distribution network
#646Integrated multiple-path power amplifier
#647Semiconductor devices with package-level configurability
#648Semiconductor power module
#649Semiconductor memory device
#650SYSTEMS AND METHODS FOR HIERARCHICAL EXPOSURE OF AN INTEGRATED CIRCUIT HAVING MULTIPLE INTERCONNECTED DIE
#651Light emitting device
#652Method for forming hermetic package for a power semiconductor
#653Flat no-leads package, packaged electronic component, printed circuit board and measurement device
#654Thermal Management in Integrated Circuit Using Phononic Bandgap Structure
#655Amplifier
#656Semiconductor device having conductive wire with increased attachment angle and method
#657Semiconductor device including a semiconductor chip connected with a plurality of main terminals
#658Multi-chip package and method of providing die-to-die interconnects in same
#659Power module semiconductor device and inverter equipment, and fabrication method of the power module semiconductor device, and metallic mold
#660Semiconductor die, semiconductor device and IGBT module
#661Semiconductor package and manufacturing method thereof
#662Clips for semiconductor package and related methods
#663MULTI-ACCESS MEMORY SYSTEM AND A METHOD TO MANUFACTURE THE SYSTEM
#664Semiconductor device using wires and stacked semiconductor package
#6653D chip with shared clock distribution network
#666Semiconductor light emitting device
#667Semiconductor assemblies using edge stacking and methods of manufacturing the same
#668Packaging of a semiconductor device with a plurality of leads
#669Electronic package for integrated circuits and related methods
#670Semiconductor device
#671Microelectronic device with floating pads
#672Electronic device packages and methods for maximizing electrical current to dies and minimizing bond finger size
#673Semiconductor device
#674Semiconductor device with sealed semiconductor chip
#675Polygon integrated circuit (IC) packaging
#676Semiconductor apparatus
#677Semiconductor devices and methods of manufacturing semiconductor devices
#678Open-drain transistor monitoring circuit in a multi-chip package to control power
#679LED assembly with omnidirectional light field
#680Power amplifier systems with control interface and bias circuit
#681Package-on-package assembly with wire bonds to encapsulation surface
#682Noble metal-coated silver wire for ball bonding and method for producing the same, and semiconductor device using noble metal-coated silver wire for ball bonding and method for producing the same
#683Memory device comprising programmable command-and-address and/or data interfaces
#684Semiconductor device and power converter
#685THERMAL MANAGEMENT IN INTEGRATED CIRCUIT PACKAGES
#686Memory device including circuitry under bond pads
#687Semiconductor die singulation
#688Package-on-package assembly with wire bond vias
#689Bond wire array for packaged semiconductor device
#690Semiconductor device package and method for manufacturing the same
#691Switching device and electronic circuit
#692Through electrode substrate and semiconductor device
#693Contact with bronze material to mitigate undercut
#694Semiconductor device and method of manufacturing the same
#695Semiconductor package structure and method for manufacturing the same
#696Leadframe leads having fully plated end faces
#697Leads for semiconductor package
#698Leadless packaged device with metal die attach
#699MAGNETICALLY COUPLED GALVANICALLY ISOLATED COMMUNICATION USING LEAD FRAME
#700Package structure
#701Semiconductor device having an electrical connection between semiconductor chips established by wire bonding, and method for manufacturing the same
#702Integrated circuit (IC) device including a force mitigation system for reducing under-pad damage caused by wire bond
#703Power die package
#704Three-dimensional functional integration
#705Semiconductor package with a cavity in a die pad for reducing voids in the solder
#706Method for testing a high voltage transistor with a field plate
#707DISPLAY DEVICE
#708Stair-stacked dice device in a system in package, and methods of making same
#709Semiconductor device assemblies including multiple stacks of different semiconductor dies
#710Packaged transistor devices with input-output isolation and methods of forming packaged transistor devices with input-output isolation
#711Chip package structure, electronic device and method for preparing a chip package structure
#712Semiconductor device
#713Wire bonding structure
#714Package for power electronics
#715Method for manufacturing a semiconductor device having a semiconductor element mounted on a lead frame
#716Radiofrequency transmission/reception device
#717Shield structure for backside through substrate vias (TSVs)
#718Image sensor package
#719Electromagnetic shields with bonding wires for sub-modules
#720Reduced-length bond pads for broadband power amplifiers
#721Semiconductor device and method of manufacturing semiconductor device
#722Semiconductor module
#723Bonded semiconductor devices and methods of forming the same
#724LEADLESS SEMICONDUCTOR PACKAGES, LEADFRAMES THEREFOR, AND METHODS OF MAKING
#725Amplifier module
#726SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#727Bond pad structure for bonding improvement
#728Multi-chip package and method of providing die-to-die interconnects in same
#729Packaged multichip device with stacked die having a metal die attach
#730Leadless packaged device with metal die attach
#731Semiconductor apparatus including leads and bonding wires
#732Semiconductor device and methods of manufacturing
#733High power transistor with interior-fed fingers
#734Semiconductor packages and methods of forming same
#735Switch module
#736Semiconductor device with bond pad extensions formed on molded appendage
#737Package structure and method of manufacturing the same
#738Semiconductor device
#739Power amplifier packages and systems incorporating design-flexible package platforms
#740Receiver optical module and process of assembling the same
#741Semiconductor device and method for manufacturing semiconductor device
#742Protective elements for bonded structures
#743MAGNETIC SENSOR MODULE
#744Bonded assembly containing side bonding structures and methods of manufacturing the same
#745Memory devices with controllers under memory packages and associated systems and methods
#746Semiconductor device and method for manufacturing semiconductor device
#747Dual-sided radio-frequency package with overmold structure
#748Semiconductor device
#749Manufacturing method of semiconductor package including thermal conductive block
#750Semiconductor Device and Method of Manufacturing Semiconductor Device
#751Multi-chip package with high thermal conductivity die attach
#752Three-dimensional device with bonded structures including a support die and methods of making the same
#753Electronic device having inverted lead pins
#7543D chip with shared clock distribution network
#755Light emitting device
#756Hetero-epitaxial output device array with serial connections
#757Semiconductor arrangement having a circuit board with a patterned metallization layer
#758Illumination device
#759Stacked semiconductor die assemblies with die support members and associated systems and methods
#760High-frequency amplifier
#761Universal surface-mount semiconductor package
#762Replaceable end effector contact pads, end effectors, and maintenance methods
#763Die stack assembly using an edge separation structure for connectivity through a die of the stack
#764Hermetic package for power semiconductor
#765Semiconductor device and manufacturing method of semiconductor device
#766Methods related to shielded module having compression overmold
#767Microelectronic device with floating pads
#768Floated singulation
#769OFFSET INTERPOSERS FOR LARGE-BOTTOM PACKAGES AND LARGE-DIE PACKAGE-ON-PACKAGE STRUCTURES
#770Semiconductor packages having stacked chip structure
#771Methods for generating wire loop profiles for wire loops, and methods for checking for adequate clearance between adjacent wire loops
#772Integrated circuit packaging
#773Semiconductor device and method for manufacturing the same
#774Power module and motor drive circuit
#775Semiconductor device with semiconductor element and electrodes on different surfaces
#776Semiconductor device
#777Package structure
#778Semiconductor device assembly with through-package interconnect and associated systems, devices, and methods
#779Packaged multichip module with conductive connectors
#780Bonding process with rotating bonding stage
#781Semiconductor package having multi-tier bonding wires and components directly mounted on the multi-tier bonding wires
#782Semiconductor device
#783Semiconductor device having an oscillator and an associated integrated circuit
#784Temporary interconnect for use in testing a semiconductor package
#785Apparatus related to conformal coating implemented with surface mount devices
#786Semiconductor device package and method of manufacturing the same
#787Method for forming an electrical connection between an electronic chip and a carrier substrate and electronic device
#788Current flow between a plurality of semiconductor chips
#789Semiconductor package structure and a method of manufacturing the same
#790Radio frequency transistor amplifiers and other multi-cell transistors having isolation structures
#791Conformal shielding for solder ball array
#792Millimeter wave LTCC filter
#793Semiconductor Package
#794Radio-frequency module and communication device
#795Package device and method of manufacturing the same
#796High-performance integrated circuit packaging platform compatible with surface mount assembly
#797High voltage semiconductor device lead frame and method of fabrication
#798LEADFRAME FOR MULTICHIP DEVICES WITH THINNED DIE PAD PORTIONS
#799Leadframe die pad with partially-etched groove between through-hole slots
#800Removal of wirebonds in quantum hardware
#801Removal of wirebonds in quantum hardware
#802High power radio frequency amplifiers and methods of manufacture thereof
#803High power radio frequency amplifiers and methods of manufacture thereof
#804Abstracted NAND logic in stacks
#805SEMICONDUCTOR MODULE
#806Systems and methods for hierarchical exposure of an integrated circuit having multiple interconnected die
#807Semiconductor with external electrode
#808INTEGRATED CIRCUIT PACKAGE
#809Multi-die module with substrate cavity assembly
#810UNIVERSAL LEADED/LEADLESS CHIP SCALE PACKAGE FOR MICROELECRONIC DEVICES
#811LOW COST RELIABLE FAN-OUT FAN-IN CHIP SCALE PACKAGE
#812High voltage semiconductor devices having improved electric field suppression
#813Package with dies mounted on opposing surfaces of a leadframe
#814Compact leadframe package
#815Angled die pad of a leadframe for a molded integrated circuit package
#816Integrally-formed multiple-path power amplifier with on-die combining node structure
#817Power amplifier with integrated bias circuit having multi-point input
#818Light emitting device
#819Integrated circuits and methods of manufacturing and designing the same
#820Semiconductor power module
#821Packaged semiconductor system having unidirectional connections to discrete components
#822Semiconductor device with electroplated die attach
#823MCM package isolation through leadframe design and package saw process
#824Semiconductor arrangement
#825Packaged transistor devices with input-output isolation and methods of forming packaged transistor devices with input-output isolation
#826Package-on-package assembly with wire bonds to encapsulation surface
#827RF power amplifier pallet
#828Semiconductor package with in-package compartmental shielding and fabrication method thereof
#829Integrated circuit package including inward bent leads
#830Semiconductor package with top circuit and an IC with a gap over the IC
#831INTEGRATED CIRCUIT CHIP PACKAGING
#832INTEGRATED CIRCUIT CHIP PACKAGING
#833SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#834Lead frame, semiconductor device, and method for manufacturing semiconductor device
#835Parallel electrode combination, power module and power module group
#836Semiconductor devices with package-level configurability
#837Semiconductor device and manufacturing method of the same
#838METHOD OF FABRICATING ELECTRONIC PACKAGE STRUCTURE WITH MULTIPLE ELECTRONIC COMPONENTS
#839High aspect ratio connection for EMI shielding
#840Multiple-path RF amplifiers with angularly offset signal path directions, and methods of manufacture thereof
#841Semiconductor device
#842Power semiconductor module with dimples in metallization layer below foot of terminal
#843Conductive bonding layer with spacers between a package substrate and chip
#844Semiconductor device packages with electrical routing improvements and related methods
#845Circuit board and packaged chip
#846Semiconductor packages having photon integrated circuit (PIC) chips
#847Pad structure for enhanced bondability
#848Semiconductor packages including a supporting block supporting an upper chip stack
#849Semiconductor package
#850PRE-PATTERNED FINE-PITCH BOND PAD INTERPOSER
#851Semiconductor package
#852Manufacturing method of semiconductor package
#853Amplifier
#854DIE WITH BUMPER FOR SOLDER JOINT RELIABILITY
#855Wire bond wires for interference shielding
#856Semiconductor device
#857Stacked semiconductor die assemblies with support members and associated systems and methods
#858Semiconductor device and method for manufacturing semiconductor device
#859Bonding wire, semiconductor package including the same, and wire bonding method
#860Flange mount millimeter-wave package
#861Semiconductor package having mark with identification information
#862Semiconductor packages
#863Bonded semiconductor devices and methods of forming the same
#864Stack packages including stacked semiconductor dies
#865Semiconductor device
#866Package structure of a folding magnetic coupling isolator, leadframe component, and leadframe structure
#867Semiconductor device
#868Method and apparatus for bond wire testing in an integrated circuit
#869Method of Manufacturing a Multi-Chip Semiconductor Power Device
#870Semiconductor device
#871Impedance controlled electrical interconnection employing meta-materials
#872Electronic device comprising heat pipe contacting a cover structure for heat dissipation
#873Device with out-plane inductors
#874High frequency amplifier
#875Semiconductor device with tunable antenna using wire bonds
#876Semiconductor package assembly and method for forming the same
#877Multi-chip package and method of providing die-to-die interconnects in same
#878Semiconductor package having an isolation wall to reduce electromagnetic coupling
#879STACKED CHIP PACKAGE HAVING SUBSTRATE INTERPOSER AND WIREBONDS
#880Half-bridge module with coaxial arrangement of the DC terminals
#881Semiconductor package
#882Semiconductor device and method for manufacturing semiconductor device
#883Plurality of lead frames electrically connected to inductor chip
#884Semiconductor integrated circuit device
#885AMPLIFIERS WITH BROADBAND IMPEDANCE MATCHING AND METHODS OF MANUFACTURE THEREOF
#886Semiconductor package including thermal relaxation block and manufacturing method thereof
#887Light source device
#888Semiconductor device
#889Light source device
#890Apparatus for communication across a capacitively coupled channel
#891Semiconductor device including sense insulated-gate bipolar transistor
#892Semiconductor device and method for manufacturing the same
#893Thermally-optimized tunable stack in cavity package-on-package
#894MODULE
#895Semiconductor device and method of manufacturing the same
#896Thermal and stress isolation for precision circuit
#897Semiconductor package and manufacturing method thereof
#898Power module including multiple signal wiring patterns disposed on an insulating substrate
#899Semiconductor module, method for manufacturing semiconductor module, and power conversion apparatus
#900Semiconductor device