Encapsulated electronic device

Semiconductor package substrate and semiconductor package having the same

Leadframe IC packages having top and bottom integrated heat spreaders

Light-emitting device manufacturing method and light-emitting device

Semiconductor device and method of manufacturing thereof

Interconnect structure and formation for package stacking of molded plastic area array package

Semiconductor component with connecting elements and method for producing the same

Dividable semiconductor device having ceramic substrate and surface mount components collectively sealed on principle surface of ceramic substrate

Semiconductor package, chip carrier structure thereof, and method for fabricating the chip carrier

Highly efficient both-side-cooled discrete power package, especially basic element for innovative power modules

SENSOR SEMICONDUCTOR DEVICE

Image sensor package having mount holder attached to image sensor die

Semiconductor device and method of manufacturing the same

No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement

Micro-package, multi-stack micro-package, and manufacturing method therefor

Semiconductor device having a chip stack on a rewiring plate

Manufacturing method of resin-molding type semiconductor device, and wiring board therefor

THREE-DIMENSIONAL PACKAGING SCHEME FOR PACKAGE TYPES UTILIZING A SACRIFICIAL METAL BASE

INTERCONNECTED IC PACKAGES WITH VERTICAL SMT PADS

Integrated circuit encapsulation system with vent

Semiconductor light emitting device and a method for producing the same

Package structure to reduce warpage

Systems and methods for high density multi-component modules

Stackable integrated circuit structures and systems devices and methods related thereto

PANEL AND SEMICONDUCTOR DEVICE HAVING A STRUCTURE WITH A LOW-K DIELECTRIC

Method for fabricating semiconductor package free of substrate

Carrierless chip package for integrated circuit devices, and methods of making same

Method for fabricating multi-chip semiconductor package

Surface mounting electronic component and manufacturing method thereof

Utra-thin substrate package technology

Package for optical device and method of manufacturing the same

Embedded integrated circuit package system

POP Semiconductor Device Manufacturing Method

Semiconductor package, array arranged substrate structure for the semiconductor package and fabrication method of the semiconductor package

High-Power LED Chip Packaging Structure And Fabrication Method Thereof

Overmolded semiconductor package with a wirebond cage for EMI shielding

Stacked semiconductor device

Low inductance bond-wireless co-package for high power density devices, especially for IGBTs and diodes

Lead frame based, over-molded semiconductor package with integrated through hole technology (THT) heat spreader pin(s) and associated method of manufacturing

Integrated circuit package system with net spacer

Chip scale surface mount package for semiconductor device and process of fabricating the same

Multiple flip-chip integrated circuit package system

Semiconductor device having adhesion increasing film to prevent peeling

Singulating surface-mountable semiconductor devices and fitting external contacts to said devices

Semiconductor device fabricating method

Semiconductor device manufacturing method

Controlling flip-chip techniques for concurrent ball bonds in semiconductor devices

Method for fabricating chip package structure

HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Separation method for cutting semiconductor package assemblage for separation into semiconductor packages

Manufacturing method of a package structure

Semiconductor device

Method for precision assembly of integrated circuit chip packages

Crystalline semiconductor film, semiconductor device, and method for manufacturing thereof

Electronic component and its manufacturing method

Method for producing semiconductor package

Wafer level packaging structure with inductors and manufacture method thereof

Method for producing semiconductor components

Carrierless chip package for integrated circuit devices, and methods of making same

Semiconductor device and method of manufacturing thereof

Semiconductor package with heat spreader

Multichip package system

Semiconductor device

Semiconductor device and manufacture method thereof

Method for manufacturing semiconductor device

Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE

Methods of promoting adhesion between transfer molded IC packages and injection molded plastics for creating over-molded memory cards

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

SiP module with a single sided lid

Optical device and method for manufacturing the same

Chip-size package structure and method of the same

Semiconductor package structure and method for manufacturing the same

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Semiconductor packaging method

Capacitor attachment method

Semiconductor device and method of manufacturing semiconductor device

Electronic assembly and method for forming the same

Method and apparatus for manufacturing electronic component-mounted component, and electronic component-mounted component

Board strip and method of manufacturing semiconductor package using the same

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in integrated circuit (IC) packages

No lead package with heat spreader

Wafer-leveled chip packaging structure and method thereof

Flip chip in package using flexible and removable leadframe

Method of resin sealing electronic part

Method for packaging organic light emitting display with frit seal and reinforcing structure

Semiconductor device and method of manufacturing semiconductor device

Integrated circuit package system with L-shaped leadfingers

Redistributed solder pads using etched lead frame

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Stacked integrated circuit package-in-package system with recessed spacer

Integrated circuit package system with exposed interconnects

Economical miniaturized assembly and connection technology for LEDs and other optoelectronic modules

LED mounting module, LED module, manufacturing method of LED mounting module, and manufacturing method of LED module

Semiconductor component with semiconductor chip and adhesive film, and method for its production

Semiconductor device

LED Illumination Apparatus and Card-Type LED Illumination Source

Method for producing a surface-mountable semiconductor component

Multilayer interconnection board, semiconductor device having the same, and method of forming the same as well as method of mounting the semicondutor chip on the interconnection board

Method for fabricating semiconductor package

Light-emitting device

SEMICONDUCTOR COMPONENT AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS

Plurality of devices attached by solder bumps

Module part

Semiconductor device package and methods for producing same

Microelectronic devices and methods for manufacturing microelectronic devices

Stacked semiconductor structure and fabrication method thereof

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices

Bare chip embedded PCB

Semiconductor device having an antenna with anisotropic conductive adhesive

Method of reeling a series of RFID tags and RFID tag roll

Interconnect substrate, semiconductor device, and method of manufacturing the same

Wafer level chip scale package system

Method for manufacturing a surface mount device

Sealed structure and method of fabricating sealed structure and semiconductor device and method of fabricating semiconductor device

Semiconductor device and method of manufacturing thereof

Low temperature co-fired ceramic module and method of manufacturing the same

Thin integrated circuit device packages for improved radio frequency performance

Semiconductor package

Multi-chips module package and manufacturing method thereof

Aluminum leadframes for semiconductor QFN/SON devices

Semiconductor light-emitting device, lighting module, lighting device and method for manufacturing semiconductor light-emitting device

Electrical component on a substrate and method for production thereof

Method of producing light emitting apparatus

Manufacturing method of semiconductor device

PACKAGE FOR MOUNTING AN OPTICAL ELEMENT AND A METHOD OF MANUFACTURING THE SAME

Circuit board and package structure thereof

Glass material for radio-frequency applications

Thermally enhanced semiconductor package and method of producing the same

Semiconductor package structure and fabrication method thereof

Low cost method to produce high volume lead frames

Semiconductor package structure and fabrication method thereof

Semiconductor device and fabrication method thereof

Method and device for contacting semiconductor chips

Strip for integrated circuit packages having a maximized usable area

Method of manufacturing light emitting apparatus

Stacked module and manufacturing method thereof

Semiconductor device package and method for manufacturing same

Manufacturing method for electronic device

Method for fabricating a flip chip system in package

Printed circuit board and method of manufacturing semiconductor package using the same

Semiconductor device having a plurality of semiconductor constructs

Circuit module

Integrated circuit package-in-package system

BGA-scale stacks comprised of layers containing integrated circuit die and a method for making the same

Methods for packaging and encapsulating semiconductor device assemblies that include tape substrates

Interconnected IC packages with vertical SMT pads

Semiconductor light-emitting device and method for manufacturing the device

Semiconductor light-emitting device and method for manufacturing the device

Semiconductor device

Electronic component mounting method

Methods for packaging microelectronic devices and microelectronic devices formed using such methods

ARRAY CIRCUIT SUBSTRATE AND WIRE BONDING PROCESS USING THE SAME

Semiconductor device, package structure thereof, and method for manufacturing the semiconductor device

Camera module fabrication method including the step of removing a lens mount and window from the mold

Package method for flash memory card and structure thereof

Electronic micromodule and method for manufacturing the same

Structure with semiconductor chips embeded therein

Semiconductor device

Stack-type semiconductor package and manufacturing method thereof

STACK TYPE SURFACE ACOUSTIC WAVE PACKAGE, AND METHOD FOR MANUFACTURING THE SAME

Electronic package with integral electromagnetic radiation shield and methods related thereto

Semiconductor device and manufacturing method of semiconductor device

Electrical device and method of manufacturing electrical devices using film embossing techniques to embed integrated circuits into film

Stackable molded packages and methods of making the same

Method of manufacturing semiconductor device

Package for high power density devices

Semiconductor device and manufacturing method of the same

Stackable electronic device assembly and high G-force test fixture

Semiconductor package structure and method of manufacture

Multi-strand substrate for ball-grid array assemblies and method

Method for fabricating semiconductor component with adjustment circuit for adjusting physical or electrical characteristics of substrate conductors

Package using array capacitor core

Manufacturing method of optical electronic components and optical electronic components manufactured using the same

Semiconductor component having plate, stacked dice and conductive vias

Thermal enhanced upper and dual heat sink exposed molded leadless package

Microelectronic devices having a curved surface and methods for manufacturing the same

Structure and method for thin single or multichip semiconductor QFN packages

DEVICE AND METHOD FOR ASSEMBLING A TOP AND BOTTOM EXPOSED PACKAGED SEMICONDUCTOR

Substrate panel with plating bar structured to allow minimum kerf width

Wafer street buffer layer

Method of making exposed pad ball grid array package

Method for packaging microelectronic devices

Semiconductor device and method of manufacturing the same

Semiconductor device and method of manufacturing the same

Leadless semiconductor package and method of manufacture

Method for packaging semiconductor device and package structure thereof

High-power LED chip packaging structure and fabrication method thereof

Semiconductor devices with conductive clips

Method of making semiconductor package having exposed heat spreader

Method for packaging a semiconductor device

Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices

Method for the interconnection of active and passive components and resulting thin heterogeneous component

Apparatus incorporating small-feature-size and large-feature-size components and method for making same

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Semiconductor device and method of manufacturing the same

Packaged device and method of forming same

Stackable semiconductor package and method for its fabrication

Ultra-thin quad flat no-lead (QFN) package

Semiconductor die package using leadframe and clip and method of manufacturing

Integrated circuit package system with heat sink

Method of forming a leaded molded array package

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

Reversible leadless package and methods of making and using same

FLIP-CHIP INTEGRATED CIRCUIT PACKAGING METHOD

Integrated circuit package system using heat slug

Method for fabricating semiconductor package

Semiconductor package including a semiconductor die having redistributed pads

Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same

Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor

Integrated circuit leadless package system

Image sensor with a compound structure

Leadless type semiconductor package, and production process for manufacturing such leadless type semiconductor package

Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device

Method for making stacked integrated circuits (ICs) using prepackaged parts

Electrode package for semiconductor device

Semiconductor device and method of manufacturing the same

Semiconductor package with redistributed pads

Method of making stacked die package

Method of manufacturing flash memory cards

Fabrication method for a chip packaging structure

Device for making an in-mold circuit

Board on chip package and method of manufacturing the same

Semiconductor device and manufacturing method thereof

Multilayered circuit substrate with semiconductor device incorporated therein

Method and apparatus for attaching a workpiece to a workpiece support

METHOD OF MAKING SEMICONDUCTOR PACKAGE WITH REDUCED MOISTURE SENSITIVITY

Method for manufacturing a semiconductor device

Methods and apparatuses for fluidic self assembly

Semiconductor mount substrate, semiconductor device and method of manufacturing semiconductor package

Plastic packaged device with die interface layer

Semiconductor component of semiconductor chip size with flip-chip-like external contacts

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Leadframes for improved moisture reliability of semiconductor devices

CHIP PACKAGE METHOD

Method for manufacturing semiconductor module using interconnection structure

Method and apparatus for providing double-sided cooling of leadframe-based wire-bonded electronic packages

Integrated circuit package system

Semiconductor packaging process and carrier for semiconductor package

Power package and fabrication method thereof

Wiring board, semiconductor device, and method of manufacturing the same

Microelectronic package having multiple conductive paths through an opening in a support substrate

Semiconductor device and a manufacturing method of the same

Manufacturing method of semiconductor device

Electronic device and manufacturing method of the same

Semiconductor package

Method of forming a molded array package device having an exposed tab and structure

Method of assembly for multi-flip chip on lead frame on overmolded IC package

Semiconductor device and method for manufacturing the same

PROCESS FOR FABRICATING CHIP PACKAGE STRUCTURE

Method for separating package of WLP

Semiconductor device with improved design freedom of external terminal

CLOCK DISTRIBUTION NETWORKS AND CONDUCTIVE LINES IN SEMICONDUCTOR INTEGRATED CIRCUITS

Component with chip through-contacts

Packaged die on PCB with heat sink encapsulant and methods

Optoelectronics processing module and method for manufacturing thereof

THERMAL ENHANCED PACKAGE FOR BLOCK MOLD ASSEMBLY

Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices

Integrated circuit package system with planar interconnects

Integrated circuit protruding pad package system

Surface mounting LED substrate and LED

Method for manufacturing electronic modules

Fan out type wafer level package structure and method of the same

Semiconductor package with a support structure and fabrication method thereof

Multiple chip semiconductor package

Apparatuses and methods for high speed bonding

METHOD FOR FABRICATING SEMICONDUCTOR PACKAGES

MATRIX PACKAGE SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND MOLDING PROCESS THEREOF

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Die pad for semiconductor packages and methods of making and using same

Light emitting diode and method for manufacturing the same

Module, method of manufacturing module, and electronic apparatus using module

Radiant energy heating for die attach

Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methods

Semiconductor memory card and method for manufacturing semiconductor memory card

Stacked microelectronic devices and methods for manufacturing microelectronic devices

Semiconductor packages for surface mounting and method of producing same

Land grid array semiconductor device packages

Microelectronic devices and methods for manufacturing microelectronic devices

Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices

Semiconductor device and manufacturing method thereof

Blue LED with phosphor layer for producing white light and different phosphor in outer lens for reducing color temperature

Semiconductor device and method of manufacturing the same

Integrated circuit device

Encapsulated chip scale package having flip-chip on lead frame structure and method

Semiconductor die package

Semiconductor device

MOSFET package

MOSFET package

Integrated circuit device

LED package and fabrication method thereof

3D IC method and device

Multichip packages with exposed dice

Semiconductor component and method of manufacture

Semiconductor module

Method for fabricating wafer level semiconductor package with build-up layer

Microelectronic imaging units

Packaged integrated circuit having a heat spreader and method therefor

Apparatuses and methods facilitating functional block deposition

Solder composition for electronic devices