Leadframe Array with Riveted Heat Sinks

Molded beam for optoelectronic sensor chip substrate

Semiconductor module with multiple semiconductor chips

Device having a bonding structure for two elements

MULTI-CHIPS PACKAGE AND METHOD OF FORMING THE SAME

Apparatus for packaging semiconductor devices, packaged semiconductor components, methods of manufacturing apparatus for packaging semiconductor devices, and methods of manufacturing semiconductor components

Apparatus comprising a device and method for producing it

Article and panel comprising semiconductor chips, casting mold and methods of producing the same

Method and apparatus for fabricating a plurality of semiconductor devices

Low cost lead-free preplated leadframe having improved adhesion and solderability

OPTOELECTRONIC DEVICE ALIGNMENT IN AN OPTOELECTRONIC PACKAGE

Semiconductor light emitting device and multiple lead frame for semiconductor light emitting device

Substrate process for an embedded component

Extended COB-USB with dual-personality contacts

Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns

Semiconductor component and method of manufacture

Chip carrier structure having semiconductor chip embedded therein and metal layer formed thereon

Structure of semiconductor device package and method of the same

Substrate for mounting semiconductor element and method of manufacturing the same

MEMS PACKAGE HAVING AT LEAST ONE PORT AND MANUFACTURING METHOD THEREOF

Substrate based unmolded package

Semiconductor package having insulating substrate

Electronic package and manufacturing method thereof

Encapsulated optical package

Method for manufacturing circuit modules and circuit module

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Packaged integrated circuit

BACKSIDE METALLIZATION FOR INTEGRATED CIRCUIT DEVICES

Stacked Package and Method of Fabricating the Same

High current semiconductor power device SOIC package

Sensor-type semiconductor package and method for fabricating the same

Collective substrate, semiconductor element mount, semiconductor device, imaging device, light emitting diode component and light emitting diode

LED devices having lenses and methods of making same

PRODUCTION METHOD OF ELECTRONIC APPARATUS, PRODUCTION METHOD OF ELECTRONIC EQUIPMENT IN WHICH ELECTRONIC APPARATUS IS PACKAGED, AND PRODUCTION METHOD OF ARTICLE IN WHICH ELECTRONIC APPARATUS IS MOUNTED

Method of assembling semiconductor devices with LEDS

Integrated circuit including conductive bumps

Method of manufacturing electronic component package, and wafer and substructure used for manufacturing electronic component package

Semiconductor device package with multi-chips and method of the same

SEMICONDUCTOR DEVICE PACKAGE WITH DIE RECEIVING THROUGH-HOLE AND CONNECTING THROUGH-HOLE AND METHOD OF THE SAME

Integrated package circuit with stiffener

Semiconductor device package with multi-chips and method of the same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Encapsulated chip scale package having flip-chip on lead frame structure

Printed circuit board having embedded components and method for manufacturing thereof

Fabrication of Electronic Components In Plastic

Method for mounting electronic components

Transfer mask in micro ball mounter

Block-molded semiconductor device singulation methods and systems

Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device

Semiconductor device and method of manufacturing the same

Solid-state imaging device and method for manufacturing the same

Electronic component module and method for manufacturing the same

APPARATUS FOR STACKING SEMICONDUCTOR CHIPS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME AND SEMICONDUCTOR PACKAGE MANUFACTURED THEREBY

Panel, semiconductor device and method for the production thereof

CMOS IMAGE SENSOR CHIP SCALE PACKAGE WITH DIE RECEIVING OPENING AND METHOD OF THE SAME

Image sensor package with die receiving opening and method of the same

Semiconductor device and manufacturing method thereof

SEMICONDUCTOR PACKAGE STRUCTURE AND CARRIER STRUCTURE

Semiconductor die package including leadframe with die attach pad with folded edge

RESIN-SEALED SEMICONDUCTOR LIGHT RECEIVING ELEMENT, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE USING THE SAME

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

Method for producing semiconductor device

Method for precision assembly of integrated circuit chip packages

Fabrication method of semiconductor package

SUBSTRATE AND SEMICONDUCTOR DEVICE USING THE SAME

LED chip package structure with a plurality of thick guiding pins and a method for manufacturing the same

Optical device and a method of manufacturing an optical device having a photoelectric conversion element and an optical adjustment element

Manufacturing method of electronic device

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor device manufacturing method, semiconductor device, and wiring board

Semiconductor device and method of manufacturing the same

Package, electronic device, substrate having a separation region and a wiring layers, and method for manufacturing

Integrated circuit package system with leads having multiple sides exposed

Method of manufacturing a component-embedded PCB

Stack type semiconductor chip package having different type of chips and fabrication method thereof

Semiconductor device and method of fabricating the same

MOSFET package

Optoelectronic device package and packaging method thereof

Semiconductor device and electronic device having the same

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Semiconductor package including connected upper and lower interconnections, and manufacturing method thereof

Semiconductor package with flow controller

Semiconductor module with a dielectric layer including a fluorocarbon compound on a chip

Semiconductor package, manufacturing method thereof and IC chip

Method of packaging semiconductor devices

Molding compound flow controller

CERAMIC PACKAGE FOR LED

Infrared Sensor

Method for fabricating semiconductor package

Assembly of thin die coreless package

PHYSICAL ALIGNMENT FEATURES ON INTEGRATED CIRCUIT DEVICES FOR ACCURATE DIE-IN-SUBSTRATE EMBEDDING

IC card and semiconductor integrated circuit device package

Dual molded multi-chip package system

Wafer level package with die receiving through-hole and method of the same

Heat dissipation semiconductor pakage

Manufacturing method of chip package

Semiconductor device with chip mounted on a substrate

Method of making a multi-layered semiconductor device

Stackable integrated circuit package system with recess

Multi-chips package and method of forming the same

Semiconductor image device package with die receiving through-hole and method of the same

Lead frame and method of manufacturing the same, and semiconductor device

Structure of super thin chip scale package and method of the same

Package having shield case

Lens compression molded over LED die

Alignment and cutting of microelectronic substrates

Method for integrating pre-fabricated chip structures into functional electronic systems

Thinned die integrated circuit package

Semiconductor Package Block Mold and Method

SEMICONDUCTOR DEVICE AND A METHOD FOR MANUFACTURING THE SAME

Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board

Carrier structure embedded with semiconductor chips and method for manufacturing the same

METHOD FOR FABRICATING A CIRCUIT

Method of Manufacturing a Semiconductor Packages and Packages Made

FLIP CHIP IN PACKAGE USING FLEXIBLE AND REMOVABLE LEADFRAME

Inverted lead frame in substrate

Method of manufacturing multi-layer printed circuit board

Systems and methods to laminate passives onto substrate

Singulation metal mold and method for producing semiconductor device

Semiconductor device and electronic device

Semiconductor package, manufacturing method thereof and IC chip

Manufacturing method for micro-SD flash memory card

LED Light Source Having Flexible Reflectors

Circuit device with at least partial packaging and method for forming

WAFER LEVEL PACKAGE WITH GOOD CTE PERFORMANCE

Integrated circuit package system with thermo-mechanical interlocking substrates

3D ELECTRONIC PACKAGING STRUCTURE WITH ENHANCED GROUNDING PERFORMANCE AND EMBEDDED ANTENNA

Integrated circuit package with elevated edge leadframe

Die positioning for packaged integrated circuits

Chip scale package structure with metal pads exposed from an encapsulant

Semiconductor device with hollow structure

MULTI-CHIP PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

Carrierless chip package for integrated circuit devices, and methods of making same

Semiconductor device having plurality of leads

Amplifier chip mounted on a lead frame

Packaged microelectronic devices and methods for packaging microelectronic devices

Electroplating method for a semiconductor device

Semiconductor device including microstrip line and coplanar line

System-in-package (SiP) and method of manufacturing the same

Stacked die package

Carrier structure embedded with semiconductor chip

Side-emitting LED package and manufacturing method of the same

Method and apparatus for linear die transfer

Electrical Insulating Layer for Metallic Thermal Interface Material

MULTI-COMPONENT ELECTRONIC PACKAGE WITH PLANARIZED EMBEDDED-COMPONENTS SUBSTRATE

Compact LED with a self-formed encapsulating dome

Semiconductor device with no base member and method of manufacturing the same

HEAT SPREADER FOR AN ELECTRICAL DEVICE

SEMICONDUCTOR CHIP EMBEDDED IN AN INSULATOR AND HAVING TWO-WAY HEAT EXTRACTION

Method of packaging a semiconductor device and a prefabricated connector

Method of packaging a device using a dielectric layer

Mold array process for chip encapsulation and substrate strip utilized

METHOD OF PACKAGING A DEVICE HAVING A KEYPAD SWITCH POINT

Semiconductor package and fabrication method thereof

Wafer level package with die receiving cavity and method of the same

Manufacturing process of the combining of optical lens and sensor chips

Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

Electronic device and method of fabricating the same

WIRING FILM HAVING WIRE, SEMICONDUCTOR PACKAGE INCLUDING THE WIRING FILM, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE

Component-embedded circuit board fabrication method

Method for fabricating semiconductor package free of substrate

STACKABLE MOLDED PACKAGES AND METHODS OF MAKING THE SAME

Structure of image sensor module and method for manufacturing of wafer level package

Semiconductor Laser Apparatus, Method for Manufacturing the Same, and Optical Pickup Apparatus Using the Same

Circuit device and method of manufacturing the same

Method of using a camera module

Electronic Device, a Chip Contacting Method and a Contacting Device

Fan out type wafer level package structure and method of the same

Stackable electronic device assembly

Integrated Circuit Package and Method for Manufacturing an Integrated Circuit Package

Sensor-type semiconductor package and fabrication method thereof

Sensor-type semiconductor package and fabrication

Non-pull back pad package with an additional solder standoff

LIGHT EMITTER, IMAGE DISPLAY, AND FABRICATION METHOD THEREOF

Packaged microelectronic devices and methods for packaging microelectronic devices

Flip-Chip Semiconductor Package with Encapsulant Retaining Structure and Strip

Semiconductor device and method of manufacturing the same

Ball grid array package structure

Array quad flat no-lead package and method of forming same

Light emitting diode, optical semiconductor device, epoxy resin composition and phosphor suited for optical semiconductor device, and method for manufacturing the same

Method for fabricating a leadframe

Method for forming conductive layer and substrate having the same, and method for manufacturing semiconductor device

Sawn power package and method of fabricating same

Methods for Depositing, Releasing and Packaging Micro-Electromechanical Devices on Wafer Substrates

Single chip USB packages with swivel cover

Luminous device with heat pipe and method of manufacturing heat pipe lead for luminous device

Semiconductor package and fabrication process thereof

Single chip USB packages with contact-pins cover

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Light emitting chip package and manufacturing method thereof

Method for fabricating heat dissipating package structure

Substrate and manufacturing method of package structure

Camera module having lower connection portions defining a chip region and engaging upper connection portions of a lens structure and method of fabricating the same

Light emitting device package and manufacture method of light emitting device package

Stacked structures and methods of fabricating stacked structures

Package structure of MEMS microphone

Processes and packaging for high voltage integrated circuits, electronic devices, and circuits

Method of making a light emitting device having a molded encapsulant

Semiconductor module, method for manufacturing the semiconductor module and portable device carrying the same

Dual-chip integrated heat spreader assembly, packages containing same, and systems containing same

Pin Array No Lead Package and Assembly Method Thereof

Sensor-type package and fabrication method thereof

Manufacturing method of a semiconductor device having a package dicing

METHOD FOR PRODUCING FLEXIBLE INTEGRATED CIRCUITS WHICH MAY BE PROVIDED CONTIGUOUSLY

Method of making a light emitting device

Semiconductor device and manufacturing method thereof

CHIP PACKAGE AND CHIP PACKAGE ARRAY

LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING METHOD, AND MANUFACTURING METHOD FOR MODULE USING THE LAMINATED CIRCUIT BOARD AND ITS MANUFACTURING APPARATUS

Structure of high performance combo chip and processing method

Structure of high performance combo chip and processing method

Optical semiconductor device and method of manufacturing thereof

Semiconductor apparatus and method of producing the same

Semiconductor device and method for fabricating the same

Semiconductor device package and manufacturing method

Method of manufacturing a combined multilayer circuit board having embedded chips

Method of manufacturing a semiconductor device

Map type semiconductor package

Component embedded printed circuit board

Flip-Chip Ball Grid Array Strip and Package

Distributed semiconductor device methods, apparatus, and systems

Dual heat spreader panel assembly method for bumpless die-attach packages, packages containing same, and systems containing same

Chip package and method for fabricating the same

Interposer bonding device

Method for producing semiconductor device

PRINTED CIRCUIT BOARD HAVING SUPPORTING PATTERNS

Peripheral card with sloped edges

Semiconductor device, substrate for producing semiconductor device and method of producing them

Stackable packages for three-dimensional packaging of semiconductor dice

LED with phosphor tile and overmolded phosphor in lens

Manufacturing method for resin sealed semiconductor device

Semiconductor die package using leadframe and clip and method of manufacturing

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Methods of forming semiconductor light emitting device packages by liquid injection molding

Packaging substrate and method of manufacturing the same

Plastic overmolded packages with molded lid attachments

Semiconductor device package and manufacturing method

White Light Emitting Device and Method for Manufacturing the Same

Chip package and method for fabricating the same

Light-Emitting Device, Light-Emitting Module, Display Unit, Lighting Unit and Method for Manufacturing Light-Emitting Device

Method for producing a component and device having a component

Web process interconnect in electronic assemblies

Production equipment of resin molding semiconductor device, method of manufacturing resin molding semiconductor device, and resin molding semiconductor device

Electronic device and method for producing a device

Light emitting device package and method for manufacturing the same

Method for fabricating chip-stacked semiconductor package

Method of fabricating microelectronic devices

Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same

METHOD FOR SEPARATING PACKAGE OF WLP

Integrated circuit package system with molding vents

Semiconductor package device

Electronic Device and Method For Producing the Same

Stress-free lead frame

Array-Processed Stacked Semiconductor Packages

Semiconductor device encapsulated by silicone resin composition, and silicone resin tablet for encapsulating semiconductor device

Single chip USB packages by various assembly methods

Method of fabricating semiconductor device having conducting portion of upper and lower conductive layers on a peripheral surface of the semiconductor device

Structure of image sensor module and a method for manufacturing of wafer level package

Electronic component module and radio comunications equipment

Electronic component of VQFN design and method for producing the same

Chip package structure and manufacturing method thereof

Structure of image sensor module and a method for manufacturing of wafer level package

Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices

Method of fabricating a semiconductor device including forming an insulating layer with a hard sheet buried therein

System and method of attenuating electromagnetic interference with a grounded top film

Heat treatment jig and heat treatment jig set

Method for forming a molded circuit board

Semiconductor package and fabrication method thereof

Semiconductor Package Having Improved Adhesion and Solderability

Quad flat no-lead (QFN) chip package assembly apparatus and method

Method for encapsulating sensor chips

Structure of high performance combo chip and processing method

Integrated circuit package, panel and methods of manufacturing the same

LED decorative lighting structure

Semiconductor device including semiconductor element surrounded by an insulating member wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Flip chip package including a non-planar heat spreader and method of making the same

Manufacturing process for single-chip MMC/SD flash memory device with molded asymmetric circuit board

Semiconductor device

Singulation Process for Block-Molded Packages

Illumination Device and Display Device Using Illumination Device

Die configurations and methods of manufacture

Manufacturing method for a leadless multi-chip electronic module

Micro universal serial bus (USB) memory package

Molding methods to manufacture single-chip chip-on-board USB device

Micro power converter and method of manufacturing same

Bond wireless power module with double-sided single device cooling and immersion bath cooling

IC chip package, and image display apparatus using same

Substrate treating method and method of manufacturing semiconductor apparatus

Fabrication method of semiconductor integrated circuit device

Stacked Chips with Underpinning

Methods of manufacturing microelectronic imaging units on a microfeature workpiece

Piezoelectric oscillator and method of manufacturing the same

Method of making thermally enhanced substrate-base package

Stacked die package system

Electronic Part And Method Of Producing The Same

Semiconductor device

Method of forming semiconductor packaged device

METHOD OF FORMING A TRACE EMBEDDED PACKAGE

Chip stack package and manufacturing method thereof

Semiconductor device encapsulated with resin composition

Semiconductor package and method for fabricating the same