Method for fabricating semiconductor package with circuit side polymer layer

Snap lid camera module

Manufacture of RFID tags and intermediate products therefor

Microelectronic imaging units and methods of manufacturing microelectronic imaging units

Chip-under-tape package structure and manufacture thereof

Semiconductor light-emitting device and method of manufacturing the same

Wafer-leveled chip packaging structure and method thereof

Method for manufacturing semiconductor device having shielding case, electronic equipment using the semiconductor device, and shielding case attaching method

Semiconductor package and method for its manufacture

Semiconductor device and its manufacturing method

Optical package for a semiconductor sensor

Manufacturing method of a semiconductor device, and paste applicator

Methods of manufacturing microelectronic imaging units with discrete standoffs

Chip handling methods and apparatus

Method for manufacturing surface acoustic wave device

Semiconductor chip resin encapsulation method

Methods of bonding two semiconductor devices

Circuit device with at least partial packaging and method for forming

Wafer-level assembly method for semiconductor devices

Radiofrequency power semiconductor module with cavity housing, and method for producing it

Method for producing a component comprising a conductor structure that is suitable for use at high frequencies

Electronic package having a folded flexible substrate and method of manufacturing the same

Method for manufacturing surface acoustic wave device

Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration

Substrate based unmolded package

Microelectronic devices

Semiconductor device assemblies and packages with edge contacts and sacrificial substrates and other intermediate structures used or formed in fabricating the assemblies or packages

Semiconductor component having stacked, encapsulated dice and method of fabrication

Interposers and other carriers including a slot with laterally recessed area at an end thereof and semiconductor device assemblies and packages including such carriers

Image sensor package and method of manufacturing the same

Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods

Substrate based unmolded package

Optoelectronic packaging with embedded window

Technique for protecting photonic devices in optoelectronic packages with clear overmolding

Wafer level mounting frame with passive components integration for ball grid array packaging

Taped lead frames and methods of making and using the same in semiconductor packaging

Method for encapsulating lead frame packages

Method for fabricating semiconductor packages

Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe

Methods for designing carrier substrates with raised terminals

Integrated transistor module and method of fabricating same

Method for manufacturing a semiconductor device

Method for manufacturing semiconductor substrate and semiconductor substrate

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Memory card with a cap having indented portions

Semiconductor light emitting device and semiconductor light emitting unit

PCB-based surface mount LED device with silicone-based encapsulation structure

Semiconductor acceleration sensor device and method for manufacturing the same

Image pickup device and production method thereof

High density multilayer circuit module

Embedded chip semiconductor having dual electronic connection faces

Methods of making microelectronic packages

Semiconductor package, mold used in manufacturing the same, and method for manufacturing the same

Semiconductor device having adhesion increasing film to prevent peeling

Method for balancing molding flow during the assembly of semiconductor packages with defective carrying units

Method of manufacturing semiconductor device and method of manufacturing electronic device

Method of fabricating a built-in chip type substrate

Circuit device and manufacturing method thereof

Method for manufacturing circuit device

Circuit device and manufacturing method thereof

Cold weld hermetic MEMS package and method of manufacture

Interposer substrate, semiconductor package and semiconductor device, and their producing methods

Semiconductor device, method for manufacturing the same, circuit board, and electronic equipment

Partially patterned lead frames and methods of making and using the same in semiconductor packaging

Selective packaging of tested semiconductor devices

Method of manufacturing circuit device

Electronic and optoelectronic component packaging technique

Circuit device, manufacturing method thereof, and sheet-like board member

Method for fabricating leadless packages with mold locking characteristics

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Semiconductor molding method and structure

Chip heat sink device and method

Leadless leadframe with an improved die pad for mold locking

Packaging of a microchip device

Method and system for deflashing mold compound

Method of manufacturing semiconductor device

Method and resulting structure for manufacturing semiconductor substrates

Chemical-enhanced package singulation process

Microelectronic devices and methods for packaging microelectronic devices

Web fabrication of devices

Semiconductor package and method for fabricating the same

Method for integrating pre-fabricated chip structures into functional electronic systems

Mold gates and tape substrates including the mold gates

Systems for degating packaged semiconductor devices with tape substrates

Method of forming an array of semiconductor packages

Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape

Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device

Embedded chip semiconductor without wire bondings

Circuit device

Method for manufacturing optical electronic component

Image sensor with a protection layer

Structure of image sensor module and a method for manufacturing of wafer level package

Card-type LED illumination source

Camera module having a threaded lens barrel and a ball grid array connecting device

Method for producing a BGA chip module and BGA chip module

Device mounting board

Card-type LED illumination source

Multiple chip semiconductor package

Fan out type wafer level package structure and method of the same

Semiconductor light emitting device and fabrication method thereof

Side-emission type semiconductor light-emitting device and manufacturing method thereof

Packaging method for integrated circuits

Method for manufacturing semiconductor device

Wafer level mounting frame for ball grid array packaging, and method of making and using the same

Lead frame, method of manufacturing the same, semiconductor device using lead frame and method of manufacturing semiconductor device

Light emitting diode, optical semiconductor device, epoxy resin composition suited for optical semiconductor device, and method for manufacturing the same

Encapsulating epoxy resin composition, and electronic parts device using the same

Circuitry module

Semiconductor device assemblies and packages including multiple semiconductor device components

Method for manufacturing leadless semiconductor packages

Semiconductor device, a method of manufacturing the same and an electronic device

Land grid array packaged device and method of forming same

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Semiconductor package with build-up structure and method for fabricating the same

Semiconductor device and method of manufacturing the same

HYBRID INTEGRATED CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME

Surface-mountable semiconductor component and method for producing it

Semiconductor device and manufacturing method of the same

Method for fabricating window ball grid array semiconductor package

Semiconductor chip packaging method with individually placed film adhesive pieces

Clock distribution networks and conductive lines in semiconductor integrated circuits

LED illumination apparatus and card-type LED illumination source

Semiconductor device and method of manufacturing the same

Multi-flip chip on lead frame on over molded IC package and method of assembly

Method for manufacturing wiring board and semiconductor device

Semiconductor device with recessed post electrode

Thin semiconductor package including stacked dies

Board-on-chip packages

Process for producing optical semiconductor device

Flip chip packaging process

Wafer level semiconductor package with build-up layer and method for fabricating the same

Semiconductor package without bonding wires and fabrication method thereof

Semiconductor device and electronic device

High power LED package

System and method for forming mold caps over integrated circuit devices

Apparatuses and methods for forming assemblies

Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same

Semiconductor package free of substrate and fabrication method thereof

Semiconductor package free of substrate and fabrication method thereof

Semiconductor package free of substrate and fabrication method thereof

Semiconductor light emitting device and method for manufacturing same

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods of fabrication of package assemblies for optically interactive electronic devices

Semiconductor package free of substrate and fabrication method thereof

Packaged die on PCB with heat sink encapsulant and methods

Apparatus for encapsulating a multi-chip substrate array

Method of surface mounting a semiconductor device

Semiconductor light emitting device and method for manufacturing same

Chip package sealing method

Photosensitive semiconductor package with support member and method for fabricating the same

Electrode package for semiconductor device

Electronic component and method for producing the same

Semiconductor package free of substrate and fabrication method thereof

Lead frame for semiconductor package and method of fabricating semiconductor package

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Semiconductor component having stiffener, stacked dice and circuit decals

Method for fabricating semiconductor component with stiffener and circuit decal

Method for preparing integrated circuit modules for attachment to printed circuit substrates

Method for manufacturing semiconductor device

Method of manufacturing hybrid integrated circuit device

Manufacturing method of a semiconductor device utilizing a flexible adhesive tape

PACKAGE STRUCTURE OF OPTICAL DEVICE AND METHOD FOR MANUFACTURING THE SAME

Electronic component and fabricating method

Optically interactive device package array

Electronic component and fabricating method

Electronic component and fabricating method

Quad flat non-leaded package comprising a semiconductor device

Method for assembling a ball grid array package with two substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Fabrication method of semiconductor package with photosensitive chip

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Method for making a micromechanical device by using a sacrificial substrate

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Resin-encapsulation semiconductor device and method for fabricating the same

Encapsulated electronics device with improved heat dissipation

Method of making microelectronic packages including electrically and/or thermally conductive element

Die-wafer package and method of fabricating same

Semiconductor device and method of manufacturing same

Integrated circuit package with transparent encapsulant and method for making thereof

Semiconductor device

Area array packages with overmolded pin-fin heat sinks

Method of fabricating a semiconductor package utilizing a thermosetting resin base member

Semiconductor device having conducting portion of upper and lower conductive layers

HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

Strip-fabricated flip chip in package and flip chip in system heat spreader assemblies and fabrication methods therefor

Method of making wireless semiconductor device, and leadframe used therefor

Optical sensor module with semiconductor device for drive

Method and resulting structure for manufacturing semiconductor substrates

Manufacturing method for resin sealed semiconductor device

Structure and method for temporarily holding integrated circuit chips in accurate alignment

Method for manufacturing optical module, optical communication device, and electronic device

Method of packaging an optical sensor

Flipchip QFN package

Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrate

Wafer level chip stack method

Carrier, method of manufacturing a carrier and an electronic device

Method for manufacturing semiconductor device with plural semiconductor chips

Mounting substrate and electronic component using the same

Semiconductor device and manufacturing method for the same

LED substrate

Micro lead frame package having transparent encapsulant

Semiconductor chip with external connecting terminal

Semiconductor chip with external connecting terminal

Semiconductor device and semiconductor module

Semiconductor device and method of manufacturing the same

Semiconductor chip with external connecting terminal

Method of packaging an optical sensor

Method of manufacturing a semiconductor device by using a matrix frame

Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof

Semiconductor device including a hard sheet to reduce warping of a base plate and method of fabricating the same

Methods of making microelectronic assemblies including compliant interfaces

Method of manufacturing a semiconductor device

Methods for depositing, releasing and packaging microelectromechanical devices on wafer substrates

Package structure for semiconductor

Die exhibiting an effective coefficient of thermal expansion equivalent to a substrate mounted thereon, and processes of making same

Process for producing optical semiconductor device

Warpage control of array packaging

Semiconductor module with a semiconductor stack, and methods for its production

Manufacturing method of a semiconductor device

Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions

Opto-electronic assembly having an encapsulant with at least two different functional zones

Package for mounting an optical element and a method of manufacturing the same

Method of manufacturing a semiconductor device and a semiconductor device

Method of making semiconductor device

Carrier layer for a semiconductor layer sequence and method for producing semiconductor chips

Semiconductor packaging

Method of forming land grid array packaged device

Fan out type wafer level package structure and method of the same

Semiconductor device and a method of manufacturing the same

Semiconductor device manufacturing method and semiconductor device manufactured thereby

Method for the hermetic encapsulation of a component

Thinned die integrated circuit package

Semiconductor device with stacked chips

Method for fabricating chip package

Multi-chips bumpless assembly package and manufacturing method thereof

Stackable integrated circuit packaging

Semiconductor device and method for fabricating the same

Integrated circuit package overlay

Method for making dual gauge leadframe

Electroplating method for a semiconductor device

Method of manufacturing semiconductor device and system of manufacturing semiconductor device

Techniques for joining an opto-electronic module to a semiconductor package

Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus

Stacked semiconductor device

Semiconductor device and method for assembling the same

Enhanced solder joint strength and ease of inspection of leadless leadframe package (LLP)

Method of manufacturing a solid state image sensing device

Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device

Method of manufacturing a semiconductor device

Frame for semiconductor package

Intermediate chip module, semiconductor device, circuit board, and electronic device

Method of fabricating semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface

Circuit device and manufacturing method thereof

Stress-free lead frame

Molded leadless package having a partially exposed lead frame pad

Semiconductor element, semiconductor device, and method for manufacturing semiconductor element

Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same

Techniques for joining an opto-electronic module to a semiconductor package

Surface acoustic wave device, package for the device, and method of fabricating the device

Semiconductor device and method of manufacturing the same

FBGA arrangement

Semiconductor device having a semiconductor chip mounted on external terminals and fabrication method thereof

Fabrication method of semiconductor package with heat sink

Method for manufacturing ball grid array package

Integrated interconnect package

Semiconductor package for memory chips

Semiconductor device

Plastic package and method of fabricating the same

Chip package with die and substrate

IC package with stacked sheet metal substrate

Chip package with die and substrate

Solid-state imaging device

Semiconductor chip package and method for making the same

Chip package structure and process for fabricating the same

Electronic module having plug contacts and method for producing it

Chip scale package and method of fabricating the same

Method of manufacturing a semiconductor device

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Integrated circuit packaging system

Optical device and production method thereof

Integrated circuit package

Package carrier having multiple individual ceramic substrates

Leadframe for use in a semiconductor package

Process for producing resin-sealed type electronic device

Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates

Method for manufacturing solid-state imaging devices

Semiconductor component and system having stiffener and circuit decal

Lead frame, semiconductor device, and method for manufacturing semiconductor device

Method of manufacturing a semiconductor device

Method of manufacturing electronic device and method of manufacturing electro-optical device

Method of producing an electronic component and a panel with a plurality of electronic components

Semiconductor device containing stacked semiconductor chips and manufacturing method thereof

Castellated chip-scale packages and methods for fabricating the same

Method of forming a semiconductor package and structure thereof