207942 ⎘
Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being a semiconductor body including a plurality of individual components in a non-repetitive configuration integrated circuits having a two-dimensional layout of components without a common active region without components of the field effect type comprising combinations of diodes, or capacitors or resistors
RESISTOR GEOMETRY
#2SELF-CLAMPING RESISTOR AND CIRCUIT FOR TRANSISTOR LINEAR REGION CURRENT MATCHING
#3STACKED SEMICONDUCTOR DEVICE AND METHOD
#4Fabrication method for JFET with implant isolation
#5TRANSIENT VOLTAGE ABSORPTION ELEMENT
#6POWER SEMICONDUCTOR DEVICE
#7SEMICONDUCTOR DEVICE WITH PROTECTIVE PROTRUSION
#8SEMICONDUCTOR DEVICE
#9Resistor structure
#10Stacked semiconductor device and method
#11Terahertz element and semiconductor device
#12Diode and Power Circuit
#13Monolithic multi-I region diode limiters
#14ELECTRONIC COMPONENT, ELECTRONIC CIRCUIT, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT
#15Fabrication method for JFET with implant isolation
#16MANUFACTURABLE GALLIUM CONTAINING ELECTRONIC DEVICES
#17MONOLITHIC MULTI-I REGION DIODE SWITCHES
#18Chip parts
#19Resistor structure
#20Terahertz oscillator and producing method thereof
#21RESISTANCE ELEMENT AND ELECTRONIC DEVICE
#22MANUFACTURABLE GALLIUM AND NITROGEN CONTAINING SINGLE FREQUENCY LASER DIODE
#23ELECTRONIC CIRCUITS AND CIRCUIT ELEMENTS
#24Resistor geometry
#25Stacked semiconductor device and method
#26Vertical etch heterolithic integrated circuit devices
#27Protection against electrostatic discharges and filtering
#28INTERCONNECT STRUCTURES WITH AREA SELECTIVE ADHESION OR BARRIER MATERIALS FOR LOW RESISTANCE VIAS IN INTEGRATED CIRCUITS
#29Terahertz element and semiconductor device
#30Embedded substrate voltage converter module
#31Semiconductor device having a resistor and structure therefor
#32RC-IGBT with lifetime control layer
#33Device isolator with reduced parasitic capacitance
#34Monolithic multi-I region diode limiters
#35Semiconductor device and method for manufacturing same
#36JFET with implant isolation
#37Embedded substrate voltage regulators
#38Semiconductor device
#39Resistive element
#40Semiconductor device and manufacturing method thereof
#41Monolithic multi-I region diode switches
#42Variable capacitance element
#43Method of forming a semiconductor device having a resistor and structure therefor
#44Method of forming a semiconductor device and structure therefor
#45Monolithic multi-I region diode limiters
#46Semiconductor device comprising first and second standard cells arranged adjacent to each other
#47Electrostatic protection circuit and a semiconductor structure
#48Terahertz element and semiconductor device
#49RC-snubber element with high dielectric strength
#50Electronic circuit comprising diodes
#51Electrical stimulation and monitoring device
#52Semiconductor package with passive electrical component and method for the production thereof
#53Integrated rectifier
#54Vertical etch heterolithic integrated circuit devices
#55Semiconductor device with protective protrusion
#56On-chip power supply noise suppression through hyperabrupt junction varactors
#57Protection against electrostatic discharges and filtering
#58Electrical stimulation and monitoring device
#59ASYMMETRIC TRANSIENT VOLTAGE SUPPRESSOR DEVICE AND METHODS FOR FORMATION
#60Device isolator with reduced parasitic capacitance
#61Chip resistor and electronic equipment having resistance circuit network
#62Semiconductor device comprising a standard cell including a non-active fin area
#63Thin-film ESD protection device
#64Electrostatic discharge protection structure
#65ESD protection device and signal transmission line
#66Transferring logging data from an offset well location to a target well location
#67Chip capacitor, circuit assembly, and electronic device
#68Method for making semiconductor device with stacked analog components in back end of line (BEOL) regions
#69Sinusoidal shaped capacitor architecture in oxide
#70Semiconductor device including a switching element and a sense diode
#71Rectifier device
#72SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#73Tuning LC tank circuits
#74Semiconductor device comprising a standard cell and a non-active transistor
#75Miniature inductors and related circuit components and methods of making same
#76Device isolator with reduced parasitic capacitance
#77Semiconductor device
#78Chip resistor and electronic equipment having resistance circuit network
#79Electrostatic discharge protection device having an adjustable triggering threshold
#80Single-Chip High Speed and High Voltage Level Shifter
#81Chip capacitor, circuit assembly, and electronic device
#82Semiconductor device and manufacturing method thereof
#83Frequency-variable terahertz oscillator and method for manufacturing the same
#84Electrostatic discharge (ESD) protection of capacitors using lateral surface Schottky diodes
#85MOS varactors and semiconductor integrated devices including the same
#86Manufacture of a tunnel diode memory
#87Semiconductor device and semiconductor circuit including the device
#88Optocoupler having a semiconductor diode for each voltage source and a tunnel diode formed between each two successive voltage sources
#89Method for manufacturing a semiconductor component having a common mode filter monolithically integrated with a protection device
#90Semiconductor device including capacitor and method for manufacturing the same
#91Device isolator with reduced parasitic capacitance
#92High voltage resistor with pin diode isolation
#93Semiconductor device having a trench MOS barrier Schottky diode
#94Method for making semiconductor device with stacked analog components in back end of line (BEOL) regions
#95Interposer having stacked devices
#96Chip capacitor, circuit assembly, and electronic device
#97Integrated circuit with shared electrode energy storage devices
#98Semiconductor device comprising a standard cell
#99Semiconductor device and fabrication method thereof
#100Chip resistor and electronic equipment having resistance circuit network
#101Stack MOM capacitor structure for CIS
#102Semiconductor device
#103Embedded tungsten resistor
#104Embedded tungsten resistor
#105Systems and methods for integrating bootstrap circuit elements in power transistors and other devices
#106Apparatus and method to monitor die edge defects
#107Wedge bond foot jumper connections
#108Deep trench isolation structure layout and method of forming
#109Semiconductor device structure and method of forming
#110Semiconductor diode
#111Power semiconductor device including a cooling material
#112Semiconductor component that includes a common mode filter and method of manufacturing the semiconductor component
#113Semiconductor component and method of manufacture
#114Integrated circuit device
#115Semiconductor device
#116Semiconductor device and a method for manufacturing a semiconductor device having a semi-insulating region
#117Integrated EMI filter circuit with ESD protection and incorporating capacitors
#118Compact electrostatic discharge (ESD) protection structure
#119Filter and capacitor using redistribution layer and micro bump layer
#120Planar qubits having increased coherence times
#121High voltage resistor with PIN diode isolation
#122Chip resistor and electronic equipment having resistance circuit network
#123Semiconductor integrated circuit device
#124Resonant clocking for three-dimensional stacked devices
#125Apparatus for ESD protection
#126Systems and methods for integrating bootstrap circuit elements in power transistors and other devices
#127Semiconductor device
#128Semiconductor device having nitride layers
#129Semiconductor device and method of manufacturing the same
#130Semiconductor device and method for making the same
#131Semiconductor device element formed on SOI substrate comprising a hollow region, and having capacitors in an electric field alleviation region
#132Semiconductor device
#133Semiconductor device having nitride layers
#134Semiconductor device
#135SEMICONDUCTOR DEVICE, SEMICONDUCTOR SYSTEM, AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE
#136Semiconductor device with protective diode
#137Semiconductor device and method of forming RF FEM with LC filter and IPD filter over substrate
#138High voltage resistor with pin diode isolation
#139SUPER-HIGH-VOLTAGE RESISTOR ON SILICON
#140HIGH VOLTAGE RESISTANCE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A HIGH VOLTAGE RESISTANCE SEMICONDUCTOR DEVICE
#141Semiconductor device and a method for manufacturing a semiconductor device
#142Semiconductor device and method of forming RF FEM with IC filter and IPD filter over substrate
#143Bias circuit and method of manufacturing the same
#144Semiconductor component with dielectric layer stack and voltage divider
#145Methods of achieving linear capacitance in symmetrcial and asymmetrical EMI filters with TVS
#146Diffused integrated resistor
#147Electrostatic discharge protection element and electrostatic discharge protection circuit including the same
#148SEMICONDUCTOR DIODE
#149Top layers of metal for high performance IC's
#150Integrated circuit with a rectifier element
#151Capacitor based transformer
#152Top layers of metal for high performance IC's
#153VOLTAGE REGULATION SYSTEM USING ABRUPT METAL-INSULATOR TRANSITION
#154High performance system-on-chip inductor using post passivation process
#155Top layers of metal for high performance IC's
#156Semiconductor device having diode and IGBT
#157Top layers of metal for high performance IC's
#158Methods of achieving linear capacitance in symmetrical and asymmetrical EMI filters with TVS
#159Methods of achieving linear capacitance in symmetrical and asymmetrical EMI filters with TVS
#160TOP LAYERS OF METAL FOR INTEGRATED CIRCUITS
#161Top layers of metal for high performance IC's
#162Electronic circuit component
#163Top layers of metal for high performance IC's
#164Top layers of metal for high performance IC's
#165Top layers of metal for high performance IC's
#166Chip structure and process for forming the same
#167Chip structure and process for forming the same
#168Top layers of metal for integrated circuits
#169High performance system-on-chip using post passivation process
#170Semiconductor for macro and micro frequency tuning, and antenna and frequency tuning circuit having the semiconductor
#171High performance system-on-chip using post passivation process
#172Top layers of metal for high performance IC's
#173Top layers of metal for high performance IC's
#174Top layers of metal for high performance IC's
#175Chip structure and process for forming the same
#176Top layers of metal for high performance IC's
#177Top layers of metal for high performance IC's
#178Top layers of metal for integrated circuits
#179High performance system-on-chip using post passivation process
#180High performance system-on-chip using post passivation process
#181High performance system-on-chip using post passivation process
#182High performance system-on-chip using post passivation process
#183High performance system-on-chip using post passivation process
#184High performance system-on-chip using post passivation process
#185High performance system-on-chip using post passivation process
#186High performance system-on-chip using post passivation process
#187High performance system-on-chip using post passivation process
#188Top layers of metal for high performance IC's
#189Top layers of metal for high performance IC's
#190Top layers of metal for high performance IC's
#191Top layers of metal for high performance IC's
#192Top layers of metal for high performance IC's
#193Top layers of metal for high performance IC's
#194Top layers of metal for high performance IC's
#195Top layers of metal for high performance IC's
#196Top layers of metal for high performance IC's
#197Top layers of metal for high performance IC's
#198Top layers of metal for high performance IC's
#199Top layers of metal for high performance IC's
#200Top layers of metal for high performance IC's
#201Top layers of metal for high performance IC's
#202Top layers of metal for high performance IC's
#203Top layers of metal for high performance IC's
#204Top layers of metal for high performance IC's
#205Top layers of metal for high performance IC's
#206Top layers of metal for high performance IC's
#207Top layers of metal for high performance IC's
#208Top layers of metal for high performance IC's
#209Top layers of metal for high performance IC's
#210Top layers of metal for high performance IC's
#211Top layers of metal for high performance IC's
#212Top layers of metal for high performance IC's
#213Top layers of metal for high performance IC's
#214Top layers of metal for high performance IC's
#215Top layers of metal for high performance IC's
#216Top layers of metal for high performance IC's
#217Top layers of metal for high performance IC's
#218Top layers of metal for high performance IC's
#219Top layers of metal for high performance IC's
#220Top layers of metal for high performance IC's
#221Integrated snubber device on a semiconductor basis for switching load reduction, voltage limitation and/or oscillation attenuation
#222Top layers of metal for high performance IC's
#223Top layers of metal for high performance IC's
#224Top layers of metal for high performance IC's
#225Top layers of metal for high performance IC's
#226Top layers of metal for high performance IC's
#227Top layers of metal for high performance IC's
#228Top layers of metal for high performance IC's
#229Top layers of metal for high performance IC's
#230Top layers of metal for high performance IC's
#231Top layers of metal for high performance IC's
#232Top layers of metal for high performance IC's
#233Top layers of metal for high performance IC's
#234Top layers of metal for high performance IC's
#235Top layers of metal for high performance IC's
#236Top layers of metal for high performance IC's
#237Top layers of metal for high performance IC's
#238Top layers of metal for high performance IC's
#239Poly emitter bipolar device configuration and fabrication method with an inter-level dielectric deposited by plasma enhanced chemical vapor deposition
#240Semiconductor device
#241Ignition circuit
#242Method of forming a semiconductor device and structure therefor
#243Top layers of metal for integrated circuits
#244Top layers of metal for integrated circuits
#245Top layers of metal for high performance IC's
#246Top layers of metal for high performance IC's
#247Top layers of metal for high performance IC's
#248Top layers of metal for high performance IC's
#249Chip structure and process for forming the same
#250Top layers of metal for high performance IC's
#251Top layers of metal for high performance IC's
#252High performance system-on-chip discrete components using post passivation process
#253Top layers of metal for high performance IC's
#254Top layers of metal for high performance IC's
#255High performance system-on-chip using post passivation process
#256High performance system-on-chip discrete components using post passivation process
#257Chip structure and process for forming the same
#258High performance voltage control diffusion resistor
#259Diode circuit and method of producing a diode circuit
#260Chip structure and process for forming the same
#261Manufacturable thin film gallium and nitrogen containing devices
#262Manufacturable thin film gallium and nitrogen containing devices
#263Manufacturable display based on thin film gallium and nitrogen containing light emitting diodes
#264Manufacturable thin film gallium and nitrogen containing semiconductor devices
#265Manufacturable thin film gallium and nitrogen containing devices integrated with silicon electronic devices
#266Manufacturable thin film gallium and nitrogen containing devices
#267Manufacturable RGB display based on thin film gallium and nitrogen containing light emitting diodes
#268On-chip resistors with a tunable temperature coefficient of resistance
#269Method for making semiconductor device with stacked analog components in back end of line (BEOL) regions
#270Manufacturable thin film gallium and nitrogen containing devices
#271Integrated circuits with test structures including bi-directional protection diodes