208282 ⎘
Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor; Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group , e.g. alloys in different semiconductor regions, e.g. heterojunctions
Method of forming a self-aligned charge balanced power DMOS
#3002Semiconductor device and manufacturing method thereof
#3003MOS transistor, fabrication method thereof, and SRAM memory cell circuit
#3004Deep depleted channel MOSFET with minimized dopant fluctuation and diffusion levels
#3005Structure and method for a field effect transistor
#3006EPITAXIAL GROWTH OF SMOOTH AND HIGHLY STRAINED GERMANIUM
#3007SiGe SRAM butted contact resistance improvement
#3008Epitaxial formation of source and drain regions
#3009Thin film hybrid junction field effect transistor
#3010Strained MOS device and methods for forming the same
#3011Middle in-situ doped SiGe junctions for PMOS devices on 28 nm low power/high performance technologies using a silicon oxide encapsulation, early halo and extension implantations
#3012Semiconductor device having embedded strain-inducing pattern and method of forming the same
#3013PROCESSES AND STRUCTURES FOR DOPANT PROFILE CONTROL IN EPITAXIAL TRENCH FILL
#3014Source and drain architecture in an active region of a P-channel transistor by tilted implantation
#3015Methods of forming semiconductor devices with metal silicide using pre-amorphization implants
#3016Semiconductor device manufacturing method
#3017Semiconductor device with voltage compensation structure
#3018Heterojunction bipolar transistors with thin epitaxial contacts
#3019Heterojunction bipolar transistors with intrinsic interlayers
#3020Method of forming a semiconductor device
#3021BIPOLAR TRANSISTOR WITH EMBEDDED EPITAXIAL EXTERNAL BASE REGION AND METHOD OF FORMING THE SAME
#3022Semiconductor structure containing an aluminum-containing replacement gate electrode
#3023Semiconductor device including first and second semiconductor materials
#3024Method for improving transistor performance through reducing the salicide interface resistance
#3025Methods and apparatus for bipolar junction transistors and resistors
#3026Method of manufacturing semiconductor device
#3027Self-powered integrated circuit with multi-junction photovoltaic cell
#3028Structure for FinFETs
#3029Strained silicon structure
#3030Vertical polysilicon-germanium heterojunction bipolar transistor
#3031Aqueous cleaning techniques and compositions for use in semiconductor device manufacturing
#3032Strained structure of semiconductor device and method of making the strained structure
#3033Multi-gate devices with replaced-channels and methods for forming the same
#3034Transistor with improved sigma-shaped embedded stressor and method of formation
#3035Self-aligned contact metallization for reduced contact resistance
#3036Integrated circuits having protruding source and drain regions and methods for forming integrated circuits
#3037Semiconductor structure with metal gate and method of fabricating the same
#3038Method for forming semiconductor device
#3039STRUCTURE AND METHOD FOR NFET WITH HIGH K METAL GATE
#3040STRAINED SOI FINFET ON EPITAXIALLY GROWN BOX
#3041Replacement channels
#3042Non-planar FET
#3043Replacement gates to enhance transistor strain
#3044Column IV transistors for PMOS integration
#3045Strained structure of semiconductor device
#3046Method of epitaxial doped germanium tin alloy formation
#3047MOSFETs with channels on nothing and methods for forming the same
#3048MOS device for making the source/drain region closer to the channel region and method of manufacturing the same
#3049Surface tension modification using silane with hydrophobic functional group for thin film deposition
#3050Performing enhanced cleaning in the formation of MOS devices
#3051Semiconductor device and fabrication method thereof
#3052Contact structure of semiconductor device
#3053Selective germanium P-contact metalization through trench
#3054Semiconductor device having tipless epitaxial source/drain regions
#3055FinFET having superlattice stressor
#3056Semiconductor structure and fabrication method thereof
#3057MOS devices having non-uniform stressor doping
#3058Method for fabricating semiconductor device and PMOS device fabricated by the method
#3059Quantum well MOSFET channels having lattice mismatch with metal source/drains, and conformal regrowth source/drains
#3060MOS devices with modulated performance and methods for forming the same
#3061Short-Resistant Metal-Gate MOS Transistor and Method of Forming the Transistor
#3062Transistors with uniaxial stress channels
#3063Method for fabricating FinFETs and semiconductor structure fabricated using the method
#3064Laser using locally strained germanium on silicon for opto-electronic applications
#3065Modifying work function in PMOS devices by counter-doping
#3066Structure and method for transistor with line end extension
#3067Semiconductor devices having encapsulated stressor regions and related fabrication methods
#3068Epitaxial replacement of a raised source/drain
#3069Performing treatment on stressors
#3070Semiconductor devices
#3071Semiconductor substrate and semiconductor substrate manufacturing method
#3072Method of forming a semiconductor device
#3073STRESS ENHANCED MOS TRANSISTOR AND METHODS FOR FABRICATION
#3074TRANSISTOR WITH STRESS ENHANCED CHANNEL AND METHODS FOR FABRICATION
#3075Methods of Forming Faceted Stress-Inducing Stressors Proximate the Gate Structure of a Transistor
#3076FinFETs and the methods for forming the same
#3077Semiconductor device with strain-inducing regions and method thereof
#3078METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#3079Complementary junction field effect transistor device and its gate-last fabrication method
#3080Replacement gate having work function at valence band edge
#3081Semiconductor device including transistors having embedded source/drain regions each including upper and lower main layers comprising germanium
#3082Structure and method for increasing strain in a device
#3083MOSFETs with reduced contact resistance
#3084Embedded stressors for multigate transistor devices
#3085FinFETs with multiple threshold voltages
#3086Embedded stressors for multigate transistor devices
#3087Method and structure for forming high-K/metal gate extremely thin semiconductor on insulator device
#3088Method for manufacturing vertical-channel tunneling transistor
#3089METHODS OF FORMING FIELD EFFECT TRANSISTORS HAVING SILICON-GERMANIUM SOURCE/DRAIN REGIONS THEREIN
#3090METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#3091Stressed channel FET with source/drain buffers
#3092Silicon layer for stopping dislocation propagation
#3093Junction field-effect transistor with raised source and drain regions formed by selective epitaxy
#3094Method for forming a semiconductor transistor device with optimized dopant profile
#3095Semiconductor devices and methods of fabricating the same
#3096Strained-induced mobility enhancement nano-device structure and integrated process architecture for CMOS technologies
#3097Semiconductor device and method of manufacture
#3098Semiconductor device having epitaxial layer
#3099Semiconductor structure
#3100SiGe HBT and Manufacturing Method Thereof
#3101Post-gate shallow trench isolation structure formation
#3102Methods of Forming Source/Drain Regions on Transistor Devices
#3103SIGE HBT HAVING A POSITION CONTROLLED EMITTER-BASE JUNCTION
#3104SEMICONDUCTOR PROCESS
#3105Tucked active region without dummy poly for performance boost and variation reduction
#3106Selective epitaxial growth of semiconductor materials with reduced defects
#3107Method for growing conformal epi layers and structure thereof
#3108Semiconductor device and manufacturing method thereof
#3109Semiconductor device with strained channels induced by high-k capping metal layers
#3110SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#3111Semiconductor device fabrication method
#3112Field effect transistor device with raised active regions
#3113SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#3114Trench isolation structure
#3115Field effect transistor device with raised active regions
#3116CMOS SEMICONDUCTOR DEVICES HAVING STRESSOR REGIONS AND RELATED FABRICATION METHODS
#3117Strained semiconductor devices having asymmetrical heterojunction structures and methods for the fabrication thereof
#3118SILICON CARBIDE MOSFET WITH HIGH MOBILITY CHANNEL
#3119Device with engineered epitaxial region and methods of making same
#3120Method of manufacturing IC comprising a bipolar transistor and IC
#3121Techniques providing metal gate devices with multiple barrier layers
#3122Transistors having stressed channel regions and methods of forming transistors having stressed channel regions
#3123CIRCUIT SIMULATION METHOD AND SEMICONDUCTOR INTEGRATED CIRCUIT
#3124PRE-CLEAN METHOD FOR EPITAXIAL DEPOSITION AND APPLICATIONS THEREOF
#3125Semiconductor device with work function adjusting layer having varied thickness in a gate width direction and methods of making same
#3126MOSFET INTEGRATED CIRCUIT WITH IMPROVED SILICIDE THICKNESS UNIFORMITY AND METHODS FOR ITS MANUFACTURE
#3127Semiconductor devices utilizing partially doped stressor film portions and methods for forming the same
#3128FinFET device having a channel defined in a diamond-like shape semiconductor structure
#3129Graphene switching device having tunable barrier
#3130Semiconductor devices and methods of manufacturing the same
#3131Semiconductor device
#3132Semiconductor device with a buried stressor
#3133Semiconductor device having strained fin structure and method of making the same
#3134Semiconductor device and manufacturing method thereof
#3135Semiconductor device
#3136Fabrication of field-effect transistors with atomic layer doping
#3137N-CHANNEL TRANSISTOR COMPRISING A HIGH-K METAL GATE ELECTRODE STRUCTURE AND A REDUCED SERIES RESISTANCE BY EPITAXIALLY FORMED SEMICONDUCTOR MATERIAL IN THE DRAIN AND SOURCE AREAS
#3138FinFET field-effect transistors with atomic layer doping
#3139Transistor with boot shaped source/drain regions
#3140Semiconductor devices with non-implanted barrier regions and methods of fabricating same
#3141Non-planar germanium quantum well devices
#3142Methods and apparatus for forming silicon germanium-carbon semiconductor structures
#3143Replacement source/drain finFET fabrication
#3144Semiconductor device having epitaxial structures
#3145Replacement gate electrode with planar work function material layers
#3146Semiconductor device and manufacturing method thereof
#3147Semiconductor device and manufacturing method thereof
#3148Re-growing source/drain regions from un-relaxed silicon layer
#3149Method for fabricating a semiconductor device
#3150Method of fabricating semiconductor devices including PMOS devices having embedded SiGe
#3151Replacement metal gate structure and methods of manufacture
#3152Method of forming polysilicon resistor during replacement metal gate process and semiconductor device having same
#3153Semiconductor device having metal gate and manufacturing method thereof
#3154SEMICONDUCTOR DEVICE
#3155SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#3156MOS device with low injection diode
#3157Charge balance semiconductor devices with increased mobility structures
#3158Metal oxide semiconductor having epitaxial source drain regions and method of manufacturing same using dummy gate process
#3159Semiconductor device and method of fabricating the same
#3160Method to modify the shape of a cavity using angled implantation
#3161Semiconductor device with voltage compensation structure
#3162Method of forming a planar field effect transistor structure with recesses for epitaxially deposited source/drain regions
#3163Semiconductor device and method of manufacturing the same
#3164METAL SEMICONDUCTOR ALLOY STRUCTURE FOR LOW CONTACT RESISTANCE
#3165Semiconductor device with lower metal layer thickness in PMOS region
#3166Devices and methods to optimize materials and properties for replacement metal gate structures
#3167Process for forming repair layer and MOS transistor having repair layer
#3168Strained channel field effect transistor
#3169SEMICONDUCTOR DEVICE WITH THRESHOLD VOLTAGE CONTROL AND METHOD OF FABRICATING THE SAME
#3170Semiconductor device and method of manufacturing the same
#3171Semiconductor device and manufacturing method thereof
#3172Devices comprising coated semiconductor nanocrystal heterostructures
#3173METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
#3174Method of removing gate cap materials while protecting active area
#3175System and method of plating conductive gate contacts on metal gates for self-aligned contact interconnections
#3176Recessed gate field effect transistor
#3177Method of forming metal gate structure
#3178Method of manufacturing a semiconductor device
#3179METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
#3180Method for fabricating semiconductor device
#3181Method of fabricating semiconductor devices
#3182Method of fabricating semiconductor devices
#3183Method of fabricating semiconductor devices
#3184Transistors with embedded strain-inducing material formed in cavities provided by an oxidizing etch process
#3185Accumulation type FinFET, circuits and fabrication method thereof
#3186Performance enhancement in transistors by providing an embedded strain-inducing semiconductor material on the basis of a seed layer
#3187Semiconductor device with strained channel and method of fabricating the same
#3188PMOS threshold voltage control by germanium implantation
#3189Fabrication of MOS device with varying trench depth
#3190Method for fabricating semiconductor device having field effect transistor
#3191Method for fabricating semiconductor device
#3192Control of tunneling junction in a hetero tunnel field effect transistor
#3193High throughput cyclical epitaxial deposition and etch process
#3194SELECTIVE EPITAXIAL GROWTH BY INCUBATION TIME ENGINEERING
#3195Self-aligned contacts in carbon devices
#3196Fabrication methods of integrated semiconductor structure
#3197SOI SiGe-base lateral bipolar junction transistor
#3198SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#3199Planar MOSFET with textured channel and gate
#3200Field effect transistor device with shaped conduction channel
#3201Heterojunction device comprising a semiconductor oxide and a resistivity-switching oxide or nitride
#3202Embedded source/drain MOS transistor
#3203Method of fabricating an epitaxial layer
#3204Method of fabricating a semiconductor structure
#3205Early embedded silicon germanium with insitu boron doping and oxide/nitride proximity spacer
#3206Starting structure and protection component comprising such a starting structure
#3207Complementary tunneling field effect transistor and method for forming the same
#3208MANUFACTURING METHOD FOR METAL GATE STRUCTURE
#3209METHOD FOR FABRICATING MOS TRANSISTOR
#3210MICROELECTRONIC DEVICE STRUCTURE AND MANUFACTURING METHOD THEREOF
#3211Stabilized metal silicides in silicon-germanium regions of transistor elements
#3212Monolayer dopant embedded stressor for advanced CMOS
#3213SiC field effect transistor
#3214Semiconductor device
#3215Semiconductor device and fabrication method
#3216Method for increasing penetration depth of drain and source implantation species for a given gate height
#3217Semiconductor device and fabrication method therefor
#3218Selective epitaxial formation of semiconductive films
#3219Methods for fabricating semiconductor devices
#3220Methods of fabricating semiconductor devices
#3221FIELD-EFFECT TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
#3222Semiconductor device
#3223Metal-gate CMOS device
#3224TRANSISTOR STRUCTURE AND MANUFACTURING METHOD WHICH HAS CHANNEL EPITAXIAL EQUIPPED WITH LATERAL EPITAXIAL STRUCTURE
#3225Two-dimensional condensation for uniaxially strained semiconductor fins
#3226SEMICONDUCTOR DEVICE
#3227Semiconductor devices and methods of fabricating the same
#3228Semiconductor devices having tensile and/or compressive strain and methods of manufacturing and design structure
#3229Integrated circuit including a bipolar transistor and methods of making the same
#3230Vertical polysilicon-germanium heterojunction bipolar transistor
#3231Method of forming quantum well mosfet channels having uni-axial strains caused by metal source/drains
#3232Twin-drain spatial wavefunction switched field-effect transistors
#3233Semiconductor integrated circuit devices having different thickness silicon-germanium layers
#3234Strained Ge-on-insulator structure and method for forming the same
#3235SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#32363D polysilicon diode with low contact resistance and method for forming same
#3237Metal gate structure and manufacturing method thereof
#3238Transistors and methods of manufacturing the same
#3239Test structure for monitoring process characteristics for forming embedded semiconductor alloys in drain/source regions
#3240Methods related to power semiconductor devices with thick bottom oxide layers
#3241SEMICONDUCTOR DEVICE AND METHOD FOR FORMING THE SAME
#3242Semiconductor device comprising self-aligned contact elements and a replacement gate electrode structure
#3243Transistor with embedded Si/Ge material having enhanced across-substrate uniformity
#3244Fin-transistor formed on a patterned STI region by late fin etch
#3245Forming a non-planar transistor having a quantum well channel
#3246Graphene-containing semiconductor structures and devices on a silicon carbide substrate having a defined miscut angle
#3247Epitaxially Grown Extension Regions for Scaled CMOS Devices
#3248Method of manufacturing strained source/drain structures
#3249METHOD FOR FABRICATING MOS TRANSISTOR
#3250Bipolar transistor and method with recessed base electrode
#3251Drain extended field effect transistors and methods of formation thereof
#3252Defect reduction using aspect ratio trapping
#3253Power MOSFET Having a Strained Channel in a Semiconductor Heterostructure on Metal Substrate
#3254Devices and methods to optimize materials and properties for replacement metal gate structures
#3255STRUCTURE WITH ISOTROPIC SILICON RECESS PROFILE IN NANOSCALE DIMENSIONS
#3256Semiconductor devices having encapsulated stressor regions and related fabrication methods
#3257STRUCTURE WITH ISOTROPIC SILICON RECESS PROFILE IN NANOSCALE DIMENSIONS
#3258Heterojunction tunneling field effect transistors, and methods for fabricating the same
#3259Fabrication of a vertical heterojunction tunnel-FET
#3260Germanium-based quantum well devices
#3261N-type carrier enhancement in semiconductors
#3262N-type carrier enhancement in semiconductors
#3263Asymmetric channel MOSFET
#3264Semiconductor device including embedded isolation regions and method for forming the same
#3265FET structures with trench implantation to improve back channel leakage and body resistance
#3266Semiconductor device including an epitaxy region
#3267Method of introducing strain into channel and device manufactured by using the method
#3268Semiconductor devices with strained source/drain structures
#3269Stressed channel FET with source/drain buffers
#3270SUBSTRATE PROCESSING APPARATUS
#3271METHODS FOR FABRICATING A METAL SILICIDE LAYER AND SEMICONDUCTOR DEVICES USING THE SAME
#3272Method for forming accumulation-mode field effect transistor with improved current capability
#3273Semiconductor structures and methods of manufacturing the same
#3274Semiconductor device
#3275Semiconductor device and method of manufacturing same
#3276Method of manufacturing semiconductor device having silicon carbide layers containing phosphorus
#3277Semiconductor device and manufacturing method thereof
#3278Semiconductor device
#3279STRAINED-INDUCED MOBILITY ENHANCEMENT NANO-DEVICE STRUCTURE AND INTEGRATED PROCESS ARCHITECTURE FOR CMOS TECHNOLOGIES
#3280Reduction of Defect Rates in PFET Transistors Comprising a Silicon/Germanium Semiconductor Material by Providing a Graded Germanium Concentration
#3281High-K metal gate electrode structures formed by cap layer removal without sacrificial spacer
#3282Transistor comprising an embedded sigma shaped sequentially formed semiconductor alloy
#3283Strain Enhancement in Transistors Comprising an Embedded Strain-Inducing Semiconductor Material by Alloy Species Condensation
#3284SUBSTRATE, MANUFACTURING METHOD OF SUBSTRATE, SEMICONDUCTOR ELEMENT, AND MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT
#3285Phase change memory device and method of manufacturing the same
#3286Method for manufacturing a strained channel MOS transistor
#3287Transistors with high concentration of boron doped germanium
#3288PERFORMANCE ENHANCEMENT IN TRANSISTORS COMPRISING HIGH-K METAL GATE STACKS AND AN EMBEDDED STRESSOR BY PERFORMING A SECOND EPITAXY STEP
#3289Buried oxidation for enhanced mobility
#3290TEST MASK SET AND MASK SET
#3291Structure and method for mobility enhanced MOSFETS with unalloyed silicide
#3292Technique for enhancing dopant profile and channel conductivity by millisecond anneal processes
#3293Semiconductor device and method for manufacturing the same
#3294Structure and method for mobility enhanced MOSFETs with unalloyed silicide
#3295Method of fabricating spacers in a strained semiconductor device
#3296MOSFET with source side only stress
#3297Replacement gate devices with barrier metal for simultaneous processing
#3298Source/drain extension control for advanced transistors
#3299SOI SiGe-base lateral bipolar junction transistor
#3300Silicon and silicon germanium nanowire structures