208282 ⎘
Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor; Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group , e.g. alloys in different semiconductor regions, e.g. heterojunctions
N-type carrier enhancement in semiconductors
#3302Methods of forming integrated circuits
#3303Semiconductor device and method of manufacturing the same
#3304Strained silicon structure
#3305High performance strained source-drain structure and method of fabricating the same
#3306Semiconductor devices employing high-K dielectric layers as a gate insulating layer and methods of fabricating the same
#3307Method of NiSiGe epitaxial growth by introducing Al interlayer
#3308Method of manufacturing a transistor device having asymmetric embedded strain elements
#3309Performance enhancement in PMOS and NMOS transistors on the basis of silicon/carbon material
#3310Integrated circuits and fabrication methods thereof
#3311Borderless contact for replacement gate employing selective deposition
#3312Self-powered integrated circuit with multi-junction photovoltaic cell
#3313Methods of manufacturing a semiconductor device
#3314Replacement gate having work function at valence band edge
#3315Method of fabricating gate and method of manufacturing semiconductor device using the same
#3316Structure and method for replacement metal gate field effect transistors
#3317Asymmetric hetero-structure FET and method of manufacture
#3318Method of manufacturing a semiconductor device
#3319Method for fabricating a substrate provided with two active areas with different semiconductor materials
#3320Fin-like field effect transistor (FinFET) device and method of manufacturing same
#3321METHOD OF FABRICATING SEMICONDUCTOR DEVICE
#3322Method of manufacturing source/drain structures
#3323Reacted conductive gate electrodes and methods of making the same
#3324Epitaxial growth of crystalline material
#3325Semiconductor devices including compressive stress patterns and methods of fabricating the same
#3326Strained structure of a p-type field effect transistor
#3327Facet-free semiconductor device
#3328FinFET and method of fabricating the same
#3329Fin-like field effect transistor (FinFET) device and method of manufacturing same
#3330Semiconductor device with epitaxial crystal layer embedded within susbstrate of dummy pattern region
#3331Semiconductor Devices Having Shallow Junctions
#3332FET structures with trench implantation to improve back channel leakage and body resistance
#3333Tunnel field effect transistor
#3334SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING THE SAME
#3335MOS device with varying contact trench lengths
#3336Vertical transistor having first and second tensile layers
#3337SEMICONDUCTOR STRUCTURE AND METHOD FOR MAKING THE SAME
#3338Method of forming a semiconductor device and semiconductor device
#3339Semiconductor structure with gate structure, source/drain region and recess filling with epitaxial layer
#3340Non-planar quantum well device having interfacial layer and method of forming same
#3341Stressed barrier plug slot contact structure for transistor performance enhancement
#3342Transistors having stressed channel regions and methods of forming transistors having stressed channel regions
#3343Structure and method for increasing strain in a device
#3344METHODS OF FORMING LOW INTERFACE RESISTANCE CONTACTS AND STRUCTURES FORMED THEREBY
#3345Methods of making random access memory devices, transistors, and memory cells
#3346Metal gate transistor and method for fabricating the same
#3347Lateral power MOSFET device having a liner layer formed along the current path to reduce electric resistance and method for manufacturing the same
#3348Memory devices and memory cells
#3349Transistor devices and methods of making
#3350Multiple-gate transistors with reverse T-shaped fins
#3351Methods of manufacturing semiconductor devices
#3352Strained asymmetric source/drain
#3353Integrated electronic device with edge-termination structure and manufacturing method thereof
#3354Method for fabricating MOS transistor
#3355Vertical-conduction integrated electronic device and method for manufacturing thereof
#3356Integrated electronic device and method for manufacturing thereof
#3357Semiconductor Integrated Circuit Device Including an Epitaxial Layer
#3358Semiconductor structure and method for fabricating the same
#3359FIELD-EFFECT TRANSISTOR
#3360ULTRA-THIN BODY TRANSISTOR AND METHOD FOR MANUFCTURING THE SAME
#3361Method and structure for forming high-K/metal gate extremely thin semiconductor on insulator device
#3362Methods of forming memory cells, memory cells, and semiconductor devices
#3363Field effect transistor device with shaped conduction channel
#3364Transistor component with reduced short-circuit current
#3365Metal semiconductor alloy structure for low contact resistance
#3366Transistor with Embedded Strain-Inducing Material and Dummy Gate Electrodes Positioned Adjacent to the Active Region
#3367Semiconductor device and method for manufacturing the same
#3368Semiconductor device and manufacturing method thereof
#3369Integrated circuit and method of fabrication thereof
#3370Fin-like field effect transistor (FinFET) device and method of manufacturing same
#3371Si-Ge-Si SEMICONDUCTOR STRUCTURE HAVING DOUBLE GRADED JUNCTIONS AND METHOD FOR FORMING THE SAME
#3372Metal-oxide semiconductor transistor
#3373Deposited semiconductor structure to minimize N-type dopant diffusion and method of making
#3374Method for manufacturing semiconductor device with semiconductor materials with different lattice constants
#3375Semiconductor device and method of manufacturing the same
#3376Semiconductor device with side-junction and method for fabricating the same
#3377Asymmetric channel MOSFET
#3378Self-aligned contacts in carbon devices
#3379Process for forming a surrounding gate for a nanowire using a sacrificial patternable dielectric
#3380Methods of manufacturing semiconductor devices with Si and SiGe epitaxial layers
#3381REPLACEMENT GATES TO ENHANCE TRANSISTOR STRAIN
#3382Method to control source/drain stressor profiles for stress engineering
#3383Semiconductor device with gate-undercutting recessed region
#3384Methods for forming semiconductor device structures
#3385Semiconductor device with gate-undercutting recessed region
#3386Delta monolayer dopants epitaxy for embedded source/drain silicide
#3387Methods of manufacturing power semiconductor devices with shield and gate contacts
#3388NOVEL METHOD TO ENHANCE CHANNEL STRESS IN CMOS PROCESSES
#3389Methods of manufacturing power semiconductor devices with trenched shielded split gate transistor
#3390Semiconductor devices fabricated by doped material layer as dopant source
#3391System and method for the manufacture of semiconductor devices by the implantation of carbon clusters
#3392Semiconductor devices having stressor regions and related fabrication methods
#3393Semiconductor device and method of fabricating the same
#3394Fabrication of a vertical heterojunction tunnel-FET
#3395Method to enhance channel stress in CMOS processes
#3396CMOS device with raised source and drain regions
#3397Method of forming metal gate structure and method of forming metal gate transistor
#3398Transistor with embedded strain-inducing material formed in diamond-shaped cavities based on a pre-amorphization
#3399Multi-strained source/drain structures
#3400Modifying work function in PMOS devices by counter-doping
#3401Semiconductor devices including gate structure and method of fabricating the same
#3402Method for fabricating a semiconductor device having an epitaxial channel and transistor having same
#3403Strained channel integrated circuit devices
#3404High-mobility trench MOSFETs
#3405NMOS transistor devices and methods for fabricating same
#3406Semiconductor device having a SiGe feature and a metal gate stack
#3407STRAIN-DIRECT-ON-INSULATOR (SDOI) SUBSTRATE AND METHOD OF FORMING
#3408Semiconductor device having e-fuse structure and method of fabricating the same
#3409Method for fabricating a strained structure
#3410Maintaining Integrity of a High-K Gate Stack After Embedding a Stressor Material by Using a Liner
#3411METHOD FOR FORMING POWER DEVICES WITH CARBON-CONTAINING REGION
#3412CMOS devices having dual high-mobility channels
#3413Semiconductor device and method for manufacturing the same
#3414Monolayer dopant embedded stressor for advanced CMOS
#3415Semiconductor structure for reducing band-to-band tunneling (BTBT) leakage
#3416MOS devices with improved source/drain regions with SiGe
#3417Method for improving device performance using epitaxially grown silicon carbon (SiC) or silicon-germanium (SiGe)
#3418Wide band-gap MOSFETs having a heterojunction under gate trenches thereof and related methods of forming such devices
#3419Method of manufacturing a complementary nanowire tunnel field effect transistor semiconductor device
#3420Method of manufacturing semiconductor device
#3421Method of fabricating gate electrode using a treated hard mask
#3422SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#3423Semiconductor device with buried gates and method for fabricating the same
#3424Method of manufacturing a tunnel transistor and IC comprising the same
#3425Semiconductor device with a buried stressor
#3426Strain preserving ion implantation methods
#3427Methods of forming semiconductor devices having faceted semiconductor patterns
#3428Source/drain strained layers
#3429Method of making a finFET, and finFET formed by the method
#3430Implant damage control by in-situ C doping during sige epitaxy for device applications
#3431CMOS devices with Schottky source and drain regions
#3432MOSFETs with reduced contact resistance
#3433Semiconductor device having field effect transistor and method for fabricating the same
#3434Semiconductor device and method of manufacture thereof
#3435Structure and method for forming planar gate field effect transistor with low resistance channel region
#3436Semiconductor devices with heterojunction barrier regions and methods of fabricating same
#3437Method of fabricating transistor with epitaxial layers having different germanium concentrations
#3438Phosphorus Activated NMOS Using SiC Process
#3439Transistors comprising high-k metal gate electrode structures and adapted channel semiconductor materials
#3440Dual epitaxial process for a finFET device
#3441MOS device with varying trench depth
#3442Semiconductor device and method of manufacturing the same
#3443Methods of manufacturing semiconductor devices including forming (111) facets in silicon capping layers on source/drain regions
#3444Method of manufacturing semiconductor device
#3445Method of fabricating gate electrode using a treated hard mask
#3446Semiconductor device and method of manufacturing semiconductor device
#3447Semiconductor structures and methods of manufacturing the same
#3448Semiconductor device and method of manufacture thereof
#3449Transistor having V-shaped embedded stressor
#3450Planar field effect transistor structure having an angled crystallographic etch-defined source/drain recess and a method of forming the transistor structure
#3451Semiconductor device with group III-V channel and group IV source-drain and method for manufacturing the same
#3452Asymmetric source/drain junctions for low power silicon on insulator devices
#3453Methods for forming NMOS EPI layers
#3454Multilayer hard mask
#3455Method of fabricating multi-fingered semiconductor devices on a common substrate
#3456Transistor device having asymmetric embedded strain elements and related manufacturing method
#3457Transistor having gate dielectric protection and structure
#3458Structure and method of forming buried-channel graphene field effect device
#3459Enhanced integrity of a high-K metal gate electrode structure by using a sacrificial spacer for cap removal
#3460Stress enhanced transistor devices and methods of making
#3461Enhanced confinement of high-K metal gate electrode structures by reducing material erosion of a dielectric cap layer upon forming a strain-inducing semiconductor alloy
#3462High-K metal gate electrode structures formed at different process stages of a semiconductor device
#3463High voltage device with partial silicon germanium epi source/drain
#3464METHOD OF FABRICATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE FABRICATED THEREBY
#3465Forming a non-planar transistor having a quantum well channel
#3466Germanium-based quantum well devices
#3467Metal gate fill and method of making
#3468Tunnel field effect transistors
#3469Method of forming a self-aligned charge balanced power DMOS
#3470Semiconductor device having doped epitaxial region and its methods of fabrication
#3471Two-dimensional condensation for uniaxially strained semiconductor fins
#3472Method of fabricating strained structure in semiconductor device
#3473Non-planar germanium quantum well devices
#3474SEMICONDUCTOR DEVICE HAVING A LOCALLY BURIED INSULATION LAYER AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE
#3475Stressed barrier plug slot contact structure for transistor performance enhancement
#3476Vertical PMOS field effect transistor and manufacturing method thereof
#3477NMOS architecture involving epitaxially-grown in-situ N-type-doped embedded eSiGe:C source/drain targeting
#3478Performance enhancement in transistors comprising high-K metal gate stack by reducing a width of offset spacers
#3479Performance enhancement in PFET transistors comprising high-k metal gate stack by increasing dopant confinement
#3480Performance enhancement in transistors comprising high-k metal gate stack by an early extension implantation
#3481REDUCING THE SERIES RESISTANCE IN SOPHISTICATED TRANSISTORS BY EMBEDDING METAL SILICIDE CONTACT REGIONS RELIABLY INTO HIGHLY DOPED SEMICONDUCTOR MATERIAL
#3482Manufacturing method for semiconductor device and semiconductor device
#3483SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#3484Technique for enhancing dopant profile and channel conductivity by millisecond anneal processes
#3485Semiconductor device and manufacturing method thereof
#3486Quantum well MOSFET channels having uni-axial strain caused by metal source/drains, and conformal regrowth source/drains
#3487Inducement of strain in a semiconductor layer
#3488Heterojunction device comprising a semiconductor and a resistivity-switching oxide or nitride
#3489Method of forming asymmetric spacers and methods of fabricating semiconductor device using asymmetric spacers
#3490Method of forming strained structures with compound profiles in semiconductor devices
#3491SUBSTANTIALLY LATTICE MATCHED SEMICONDUCTOR MATERIALS AND ASSOCIATED METHODS
#3492Semiconductor device comprising NMOS and PMOS transistors with embedded Si/Ge material for creating tensile and compressive strain
#3493Selective silicon etch process
#3494METHOD OF FABRICATING SEMICONDUCTOR DEVICE
#3495Method of forming epi film in substrate trench
#3496Method for improving transistor performance through reducing the salicide interface resistance
#3497Semiconductor devices having tensile and/or compressive strain and methods of manufacturing and design structure
#3498MOS devices with partial stressor channel
#3499Bi-layer nFET embedded stressor element and integration to enhance drive current
#3500Strained structure of semiconductor device
#3501Controlling the shape of source/drain regions in FinFETs
#3502III-V semiconductor device structures
#3503Integrated circuit structures containing a strain-compensated compound semiconductor layer and methods and systems related thereto
#3504Substrate symmetrical silicide source/drain surrounding gate transistor
#3505High-performance FETs with embedded stressors
#35063D polysilicon diode with low contact resistance and method for forming same
#3507Method for fabricating transistor with thinned channel
#3508Embedded silicon germanium source drain structure with reduced silicide encroachment and contact resistance and enhanced channel mobility
#3509Semiconductor device structure with strain layer
#3510Structure with isotropic silicon recess profile in nanoscale dimensions
#3511Silicon carbide semiconductor device
#3512Device having self-aligned double gate formed by backside engineering, and device having super-steep retrograded island
#3513Semiconductor device
#3514Application of millisecond heating source for surface treatment
#3515SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#3516Buried etch stop layer in trench isolation structures for superior surface planarity in densely packed semiconductor devices
#3517Method for fabricating a MOS transistor with source/well heterojunction and related structure
#3518Accumulation type FinFET, circuits and fabrication method thereof
#3519Germanium silicide layer including vanadium, platinum, and nickel
#3520Bottle-neck recess in a semiconductor device
#3521Semiconductor device and production method thereof
#3522Semiconductor device with field effect transistor and manufacturing method thereof
#3523Extremely thin silicon on insulator (ETSOI) complementary metal oxide semiconductor (CMOS) with in-situ doped source and drain regions formed by a single mask
#3524SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#3525Metal oxide semiconductor transistor
#3526Semiconductor device and manufacturing method thereof
#3527Source/drain carbon implant and RTA anneal, pre-SiGe deposition
#3528SOI transistors having an embedded extension region to improve extension resistance and channel strain characteristics
#3529Method for forming high germanium concentration SiGe stressor
#3530Transistors having a composite strain structure, integrated circuits, and fabrication methods thereof
#3531Semiconductor device and manufacturing method of the same
#3532Semiconductor device manufacturing method
#3533Structure and method for forming field effect transistor with low resistance channel region
#3534Semiconductor nanocrystal heterostructures
#3535Silicon germanium and germanium multigate and nanowire structures for logic and multilevel memory applications
#3536FIELD EFFECT TRANSISTOR HAVING CHANNEL SILICON GERMANIUM
#3537Method for improving transistor performance through reducing the salicide interface resistance
#3538Semiconductor wafer, method of manufacturing a semiconductor wafer, and electronic device
#3539METHOD FOR MANUFACTURING SEMICONDUTOR DEVICE WITH STRAINED CHANNEL
#3540Power semiconductor devices having termination structures
#3541SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#3542SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#3543Method of making a hetero tunnel field effect transistor
#3544Insulated Gate Bipolar Transistor (IGBT) Collector Formed with Ge/A1 and Production Method
#3545Phase change memory device and method of manufacturing the same
#3546Semiconductor device having a plurality of phosphorus-doped silicon carbide layers
#3547Semiconductor device having a stress-inducing layer between channel region and source and drain regions
#3548Semiconductor device, method of manufacturing the same, and method of evaluating semiconductor device
#3549Methods for forming a transistor with a strained channel
#3550Strained channel transistor structure and method
#3551Semiconductor device including field effect transistor and method of forming the same
#3552Power amplifier
#3553Semiconductor device and fabrication method thereof
#3554Semiconductor device and manufacturing method thereof
#3555High voltage insulated gate bipolar transistors with minority carrier diverter
#3556Method of manufacturing semiconductor device
#3557SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#3558Semiconductor structure having blocks connected by nanowires
#3559Selective epitaxial growth of semiconductor materials with reduced defects
#3560Source/drain strained layers
#3561Modifying work function in PMOS devices by counter-doping
#3562Devices with graphene layers
#3563Formation Of Raised Source/Drain On A Strained Thin Film Implanted With Cold And/Or Molecular Carbon
#3564Inorganic Nanocrystal Bulk Heterojunctions
#3565NMOS transistor devices and methods for fabricating same
#3566MOSFET including epitaxial halo region
#3567N-type carrier enhancement in semiconductors
#3568Integrated circuit system with a floating dielectric region and method of manufacture thereof
#3569Semiconductor device and method of fabricating the same
#3570Source/drain engineering of devices with high-mobility channels
#3571CMOS SiGe channel pFET and Si channel nFET devices with minimal STI recess
#3572Semiconductor device including MISFET
#3573Method of fabricating spacers in a strained semiconductor device
#3574BANDGAP ENGINEERED MOS-GATED POWER TRANSISTORS
#3575Dual-SiGe epitaxy for MOS devices
#3576SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#3577Method of fabricating metal oxide semiconductor transistor
#3578CMOS transistors with silicon germanium channel and dual embedded stressors
#3579Chromium doped diamond-like carbon
#3580Silicon carbide semiconductor device and method for manufacturing the same
#3581Twin-drain spatial wavefunction switched field-effect transistors
#3582Adjusting of a non-silicon fraction in a semiconductor alloy during transistor fabrication by an intermediate oxidation process
#3583Asymmetric source/drain junctions for low power silicon on insulator devices
#3584Processing Method and Recording Medium
#3585Method for removing hard masks on gates in semiconductor manufacturing process
#3586Non-volatile semiconductor storage device and method for manufacturing the same
#3587Lattice-mismatched semiconductor structures and related methods for device fabrication
#3588Semiconductor device and manufacturing method of the same
#3589Semiconductor device and method of fabricating the same
#3590Methods of fabricating integrated circuit devices including strained channel regions and related devices
#3591Semiconductor devices
#3592EMBEDDED STRESS ELEMENTS ON SURFACE THIN DIRECT SILICON BOND SUBSTRATES
#3593Semiconductor Devices and Methods of Manufacturing Thereof
#3594Stress optimization in dual embedded epitaxially grown semiconductor processing
#3595Method of manufacturing semiconductor device having stress creating layer
#3596In situ formed drain and source regions including a strain-inducing alloy and a graded dopant profile
#3597Quantum well MOSFET channels having uni-axial strain caused by metal source/drains, and conformal regrowth source/drains
#3598Semiconductor device comprising NMOS and PMOS transistors with embedded Si/Ge material for creating tensile and compressive strain
#3599Transistor devices and methods of making
#3600Semiconductor device and manufacturing method thereof