ClassID:

208282

H01L29/165 - page 13 - CPC Classification

Classification description:

Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor; Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group , e.g. alloys in different semiconductor regions, e.g. heterojunctions

Recent Application in this class:
#3601
20100181619
2010-07-22

Method of forming a field effect transistor

#3602
20100181599
2010-07-22

Semiconductor device and method for fabricating the same

#3603
20100181598
2010-07-22

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCER DEVICE

#3604
20100167446
2010-07-01

Method for manufacturing a junction

#3605
20100164016
2010-07-01

Adjusting of strain caused in a transistor channel by semiconductor material provided for threshold adjustment

#3606
20100164005
2010-07-01

Selective wet etch process for CMOS ICs having embedded strain inducing regions and integrated circuits therefrom

#3607
20100163939
2010-07-01

Transistor device comprising an embedded semiconductor alloy having an asymmetric configuration

#3608
20100163847
2010-07-01

Quantum well MOSFET channels having uni-axial strain caused by metal source/drains, and conformal regrowth source/drains

#3609
20100163842
2010-07-01

Multiple-gate transistors with reverse T-shaped fins

#3610
20100163831
2010-07-01

Deposited semiconductor structure to minimize N-type dopant diffusion and method of making

#3611
20100163821
2010-07-01

Vertical diode and method for manufacturing same and semiconductor memory device

#3612
20100163179
2010-07-01

Substrate Processing Apparatus

#3613
20100159678
2010-06-24

Germanium substrate-type materials and approach therefor

#3614
20100159658
2010-06-24

High speed lateral heterojunction MISFETs realized by 2-dimensional bandgap engineering and methods thereof

#3615
20100155850
2010-06-24

Technique for providing stress sources in transistors in close proximity to a channel region by recessing drain and source regions

#3616
20100155727
2010-06-24

Test structure for monitoring process characteristics for forming embedded semiconductor alloys in drain/source regions

#3617
20100151692
2010-06-17

Epitaxial wafer and method of manufacturing the same

#3618
20100148273
2010-06-17

CMOS transistors with differential oxygen content high-K dielectrics

#3619
20100140744
2010-06-10

Structure comprises an As-deposited doped single crystalline Si-containing film

#3620
20100136761
2010-06-03

Semiconductor devices and methods of manufacturing thereof

#3621
20100133595
2010-06-03

Field effect transistor structure with abrupt source/drain junctions

#3622
20100129971
2010-05-27

Semiconductor device and production method thereof

#3623
20100127310
2010-05-27

Semiconductor device and method for producing the same

#3624
20100123198
2010-05-20

Semiconductor devices having Si and SiGe epitaxial layers

#3625
20100117120
2010-05-13

Semiconductor device

#3626
20100117048
2010-05-13

Memory cell access device having a pn-junction with polycrystalline and single crystal semiconductor regions

#3627
20100112798
2010-05-06

Method for gap filling in a gate last process

#3628
20100112766
2010-05-06

Semiconductor structure and method of forming the structure

#3629
20100112762
2010-05-06

Fabricating semiconductor structures

#3630
20100109091
2010-05-06

Recessed drain and source areas in combination with advanced silicide formation in transistors

#3631
20100109088
2010-05-06

Method for making a semiconductor device having metal gate stacks

#3632
20100109046
2010-05-06

Methods of forming low interface resistance contacts and structures formed thereby

#3633
20100109045
2010-05-06

INTEGRATED CIRCUIT SYSTEM EMPLOYING STRESS-ENGINEERED LAYERS

#3634
20100105184
2010-04-29

Method of manufacturing a semiconductor device

#3635
20100102401
2010-04-29

Semiconductor transistor having a stressed channel

#3636
20100102400
2010-04-29

Low-k isolation spacers for conductive regions

#3637
20100102356
2010-04-29

Semiconductor transistor having a stressed channel

#3638
20100097135
2010-04-22

Tunnel field effect transistor

#3639
20100096680
2010-04-22

Memory devices, transistor devices and related methods

#3640
20100093148
2010-04-15

Silicon germanium heterostructure barrier varactor

#3641
20100093147
2010-04-15

Method for forming a semiconductor device

#3642
20100093141
2010-04-15

Method of manufacturing a transistor and method of manufacturing a semiconductor device

#3643
20100090288
2010-04-15

Method of forming source and drain of a field-effect-transistor and structure thereof

#3644
20100084706
2010-04-08

Power semiconductor devices and methods of manufacture

#3645
20100078735
2010-04-01

CMOS DEVICE COMPRISING NMOS TRANSISTORS AND PMOS TRANSISTORS HAVING INCREASED STRAIN-INDUCING SOURCES AND CLOSELY SPACED METAL SILICIDE REGIONS

#3646
20100078728
2010-04-01

RAISE S/D FOR GATE-LAST ILD0 GAP FILLING

#3647
20100078691
2010-04-01

Transistor with embedded SI/GE material having enhanced across-substrate uniformity

#3648
20100078682
2010-04-01

Power MOSFET having a strained channel in a semiconductor heterostructure on metal substrate

#3649
20100078681
2010-04-01

Integrated circuit including a hetero-interface and self adjusted diffusion method for manufacturing the same

#3650
20100078654
2010-04-01

Method of fabricating semiconductor device using epitaxial growth inhibiting layers

#3651
20100078653
2010-04-01

Transistor having a high-k metal gate stack and a compressively stressed channel

#3652
20100072523
2010-03-25

Semiconductor device

#3653
20100072515
2010-03-25

FABRICATION AND STRUCTURES OF CRYSTALLINE MATERIAL

#3654
20100068861
2010-03-18

Method of defining gate structure height for semiconductor devices

#3655
20100065924
2010-03-18

Ultra-shallow junctions using atomic-layer doping

#3656
20100065922
2010-03-18

Semiconductor devices and methods of manufacture thereof

#3657
20100059833
2010-03-11

Metal gate transistor and method for fabricating the same

#3658
20100059764
2010-03-11

Structure and method to form multilayer embedded stressors

#3659
20100052065
2010-03-04

Method for mechanical stress enhancement in semiconductor devices

#3660
20100047977
2010-02-25

Strained silicon with elastic edge relaxation

#3661
20100044796
2010-02-25

Depletion mode trench MOSFET for improved efficiency of DC/DC converter applications

#3662
20100044720
2010-02-25

Semiconductor device with a reduced band gap and process

#3663
20100041199
2010-02-18

Field effect transistor with suppressed corner leakage through channel material band-edge modulation, design structure and method

#3664
20100038727
2010-02-18

Carbon-Doped Epitaxial SiGe

#3665
20100038685
2010-02-18

Enhanced dislocation stress transistor

#3666
20100035401
2010-02-11

Method for fabricating MOS transistors

#3667
20100032813
2010-02-11

IC FORMED WITH DENSIFIED CHEMICAL OXIDE LAYER

#3668
20100032733
2010-02-11

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

#3669
20100029053
2010-02-04

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

#3670
20100025771
2010-02-04

Performance enhancement in PMOS and NMOS transistors on the basis of silicon/carbon material

#3671
20100025743
2010-02-04

TRANSISTOR WITH EMBEDDED SI/GE MATERIAL HAVING ENHANCED BORON CONFINEMENT

#3672
20100019276
2010-01-28

All around gate type semiconductor device and method of manufacturing the same

#3673
20100015814
2010-01-21

MOSFET device with localized stressor

#3674
20100015774
2010-01-21

Semiconductor device and method of manufacturing the same

#3675
20100015768
2010-01-21

Method of fabricating semiconductor device having a junction extended by a selective epitaxial growth (SEG) layer

#3676
20100013029
2010-01-21

Implanted metal silicide for semiconductor device

#3677
20100012988
2010-01-21

METAL OXIDE SEMICONDUCTOR DEVICES HAVING IMPLANTED CARBON DIFFUSION RETARDATION LAYERS AND METHODS FOR FABRICATING THE SAME

#3678
20100012975
2010-01-21

Transistor device having asymmetric embedded strain elements and related manufacturing method

#3679
20100009502
2010-01-14

Semiconductor fabrication process including an SiGe rework method

#3680
20100001323
2010-01-07

Metal oxide semiconductor having epitaxial source drain regions and a method of manufacturing same using dummy gate process

#3681
20100001317
2010-01-07

CMOS TRANSISTOR AND THE METHOD FOR MANUFACTURING THE SAME

#3682
20090321882
2009-12-31

Epitaxial growth of crystalline material

#3683
20090321836
2009-12-31

Method for forming double gate and tri-gate transistors on a bulk substrate

#3684
20090321716
2009-12-31

Semiconductor nanowire transistor

#3685
20090315116
2009-12-24

Semiconductor device with hetero junction

#3686
20090309140
2009-12-17

In-situ carbon doped e-SiGeCB stack for MOS transistor

#3687
20090309133
2009-12-17

Manufacturing method for semiconductor device and semiconductor device

#3688
20090302388
2009-12-10

Method for fabricating super-steep retrograde well MOSFET on SOI or bulk silicon substrate, and device fabricated in accordance with the method

#3689
20090302381
2009-12-10

Structure and method for forming power devices with carbon-containing region

#3690
20090302375
2009-12-10

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND DEVICE MANUFACTURED BY THE METHOD

#3691
20090302350
2009-12-10

Tensile strained NMOS transistor using group III-N source/drain regions

#3692
20090302348
2009-12-10

STRESS ENHANCED TRANSISTOR DEVICES AND METHODS OF MAKING

#3693
20090301564
2009-12-10

Devices comprising coated semiconductor nanocrystals heterostructures

#3694
20090294894
2009-12-03

Integrated circuit having localized embedded SiGe and method of manufacturing

#3695
20090294757
2009-12-03

Semiconductor nanowire vertical device architecture

#3696
20090291537
2009-11-26

Method of manufacturing a semiconductor device

#3697
20090289379
2009-11-26

Methods of manufacturing semiconductor devices and structures thereof

#3698
20090289280
2009-11-26

Method for Making Transistors and the Device Thereof

#3699
20090286372
2009-11-19

Superjunction trench device formation methods

#3700
20090286367
2009-11-19

System and method for the manufacture of semiconductor devices by the implantation of carbon clusters

#3701
20090283828
2009-11-19

Reduced floating body effect without impact on performance-enhancing stress

#3702
20090280627
2009-11-12

Method of forming stepped recesses for embedded strain elements in a semiconductor device

#3703
20090280612
2009-11-12

Semiconductor device and production method thereof

#3704
20090278201
2009-11-12

Enhanced stress-retention silicon-on-insulator devices and methods of fabricating enhanced stress retention silicon-on-insulator devices

#3705
20090273034
2009-11-05

Source/drain carbon implant and RTA anneal, pre-SiGe deposition

#3706
20090272976
2009-11-05

Method for producing nMOS and pMOS devices in CMOS processing

#3707
20090267118
2009-10-29

METHOD FOR FORMING CARBON SILICON ALLOY (CSA) AND STRUCTURES THEREOF

#3708
20090267117
2009-10-29

Enhanced stress for transistors

#3709
20090261349
2009-10-22

Semiconductor device with strained channel and method of fabricating the same

#3710
20090258500
2009-10-15

Method of forming a pattern for a semiconductor device and method of forming the related MOS transistor

#3711
20090258464
2009-10-15

METHODS FOR MANUFACTURING A HIGH VOLTAGE JUNCTION FIELD EFFECT TRANSISTOR USING A HYBRID ORIENTATION TECHNOLOGY WAFER

#3712
20090258463
2009-10-15

Methods of fabricating different thickness silicon-germanium layers on semiconductor integrated circuit devices and semiconductor integrated circuit devices fabricated thereby

#3713
20090256173
2009-10-15

Complementary field effect transistors having embedded silicon source and drain regions

#3714
20090253237
2009-10-08

Scalable power field effect transistor with improved heavy body structure and method of manufacture

#3715
20090250771
2009-10-08

MOSFET and production method of semiconductor device

#3716
20090246921
2009-10-01

Semiconductor devices having tensile and/or compressive strain and methods of manufacturing and design structure

#3717
20090242995
2009-10-01

Semiconductor device and method for fabricating the same

#3718
20090242989
2009-10-01

COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR DEVICE WITH EMBEDDED STRESSOR

#3719
20090233410
2009-09-17

Self-aligned halo/pocket implantation for reducing leakage and source/drain resistance in MOS devices

#3720
20090233408
2009-09-17

Semiconductor device manufacturing method

#3721
20090230480
2009-09-17

Epitaxial silicon germanium for reduced contact resistance in field-effect transistors

#3722
20090230475
2009-09-17

Field effect structure including carbon alloyed channel region and source/drain region not carbon alloyed

#3723
20090228132
2009-09-10

METHOD AND APPARATUS FOR CONTROLLING STRESSED LAYER GATE PROXIMITY

#3724
20090227084
2009-09-10

Method to enhance channel stress in CMOS processes

#3725
20090227078
2009-09-10

CMOS devices having dual high-mobility channels

#3726
20090224339
2009-09-10

Silicon-germanium-carbon semiconductor structure

#3727
20090224337
2009-09-10

MOS devices with partial stressor channel

#3728
20090224328
2009-09-10

SEMICONDUCTOR DEVICE

#3729
20090224287
2009-09-10

SEMICONDUCTOR DEVICE HAVING A LOCALLY BURIED INSULATION LAYER

#3730
20090224286
2009-09-10

MOBILITY ENHANCEMENT IN SiGe HETEROJUNCTION BIPOLAR TRANSISTORS

#3731
20090224263
2009-09-10

Generating Stress in a Field Effect Transistor

#3732
20090221123
2009-09-03

Method for increasing penetration depth of drain and source implantation species for a given gate height

#3733
20090221119
2009-09-03

Fabrication of a semiconductor device with stressor

#3734
20090218633
2009-09-03

CMOS DEVICE COMPRISING AN NMOS TRANSISTOR WITH RECESSED DRAIN AND SOURCE AREAS AND A PMOS TRANSISTOR HAVING A SILICON/GERMANIUM MATERIAL IN THE DRAIN AND SOURCE AREAS

#3735
20090218597
2009-09-03

Method for fabricating a semiconductor device having an epitaxial channel and transistor having same

#3736
20090215249
2009-08-27

Method of forming an embedded silicon carbon epitaxial layer

#3737
20090215240
2009-08-27

Semiconductor device with strained transistors and its manufacture

#3738
20090194816
2009-08-06

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

#3739
20090194811
2009-08-06

Structure and method for forming field effect transistor with low resistance channel region

#3740
20090194788
2009-08-06

Strained channel transistor structure and method

#3741
20090189203
2009-07-30

Semiconductor device and method of manufacturing the same

#3742
20090184346
2009-07-23

Nonvolatile memory and three-state FETs using cladded quantum dot gate structure

#3743
20090181508
2009-07-16

Method and Structure For NFET With Embedded Silicon Carbon

#3744
20090181477
2009-07-16

Methods of designing an integrated circuit on corrugated substrate

#3745
20090179236
2009-07-16

Recess Etch for Epitaxial SiGe

#3746
20090179226
2009-07-16

Strain-direct-on-insulator (SDOI) substrate and method of forming

#3747
20090176356
2009-07-09

METHODS FOR FABRICATING SEMICONDUCTOR DEVICES USING THERMAL GRADIENT-INDUCING FILMS

#3748
20090176343
2009-07-09

P-channel MOS transistor and fabrication process thereof

#3749
20090174005
2009-07-09

Semiconductor device with gate-undercutting recessed region

#3750
20090174002
2009-07-09

MOSFET HAVING A HIGH STRESS IN THE CHANNEL REGION

#3751
20090173967
2009-07-09

STRAINED-CHANNEL FET COMPRISING TWIST-BONDED SEMICONDUCTOR LAYER

#3752
20090173941
2009-07-09

Method for fabricating a semiconductor structures and structures thereof

#3753
20090173939
2009-07-09

Hybrid Wafers

#3754
20090170270
2009-07-02

INTEGRATION SCHEMES TO AVOID FACETED SIGE

#3755
20090170256
2009-07-02

ANNEALING METHOD FOR SIGE PROCESS

#3756
20090170254
2009-07-02

Method of manufacturing a semiconductor device

#3757
20090169919
2009-07-02

Devices with graphene layers

#3758
20090166761
2009-07-02

Field effect transistor structure with an insulating layer at the junction

#3759
20090166725
2009-07-02

Method for forming a vertical transistor having tensile layers

#3760
20090166676
2009-07-02

SiGe device with SiGe-embedded dummy pattern for alleviating micro-loading effect

#3761
20090166618
2009-07-02

Test structure for monitoring process characteristics for forming embedded semiconductor alloys in drain/source regions

#3762
20090159937
2009-06-25

Simple scatterometry structure for Si recess etch control

#3763
20090155969
2009-06-18

Protection of SiGe during etch and clean operations

#3764
20090152634
2009-06-18

Method of forming a semiconductor device and semiconductor device

#3765
20090152622
2009-06-18

Semiconductor device having SiGe semiconductor regions

#3766
20090152590
2009-06-18

METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICES WITH SILICON-GERMANIUM DEPOSITS

#3767
20090148988
2009-06-11

Method of reducing embedded SiGe loss in semiconductor device manufacturing

#3768
20090146183
2009-06-11

Method of forming a germanium silicide layer, semiconductor device including the germanium silicide layer, and method of manufacturing the semiconductor device

#3769
20090146181
2009-06-11

INTEGRATED CIRCUIT SYSTEM EMPLOYING DIFFUSED SOURCE/DRAIN EXTENSIONS

#3770
20090146180
2009-06-11

LDMOS with channel stress

#3771
20090142890
2009-06-04

Phosphorus Activated NMOS Using SiC Process

#3772
20090140351
2009-06-04

MOS Devices Having Elevated Source/Drain Regions

#3773
20090140338
2009-06-04

Method of fabricating patterned SOI devices and the resulting device structures

#3774
20090140302
2009-06-04

Semiconductor device and method of fabricating the same

#3775
20090140292
2009-06-04

Integrated circuit and method of fabrication thereof

#3776
20090140290
2009-06-04

Semiconductor component including a short-circuit structure

#3777
20090137089
2009-05-28

Semiconductor MOS transistor device and method for making the same

#3778
20090134381
2009-05-28

Semiconductor device and fabrication method thereof

#3779
20090130806
2009-05-21

Power semiconductor component with charge compensation structure and method for the fabrication thereof

#3780
20090127620
2009-05-21

Semiconductor doping with reduced gate edge diode leakage

#3781
20090127593
2009-05-21

MOS device with varying trench depth

#3782
20090124056
2009-05-14

Method of fabricating semiconductor device

#3783
20090121258
2009-05-14

Field effect transistor containing a wide band gap semiconductor material in a drain

#3784
20090121257
2009-05-14

Semiconductor superjunction structure

#3785
20090117715
2009-05-07

Selective epitaxial growth method using halogen containing gate sidewall mask

#3786
20090114956
2009-05-07

Semiconductor device and manufacturing method thereof

#3787
20090114949
2009-05-07

High-mobility trench MOSFETs

#3788
20090108350
2009-04-30

Method for fabricating super-steep retrograde well MOSFET on SOI or bulk silicon substrate, and device fabricated in accordance with the method

#3789
20090108308
2009-04-30

Transistor with a plurality of layers with different Ge concentrations

#3790
20090108291
2009-04-30

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

#3791
20090108290
2009-04-30

Source/drain strained layers

#3792
20090104739
2009-04-23

Method of forming conformal silicon layer for recessed source-drain

#3793
20090101942
2009-04-23

Planar field effect transistor structure having an angled crystallographic etch-defined source/drain recess and a method of forming the transistor structure

#3794
20090101887
2009-04-23

Silicon germanium heterostructure barrier varactor

#3795
20090098665
2009-04-16

Methodology of implementing ultra high temperature (UHT) anneal in fabricating devices that contain sige

#3796
20090095992
2009-04-16

SEMICONDUCTOR DEVICE INCLUDING MOS FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE

#3797
20090095982
2009-04-16

Semiconductor device and method of manufacturing the same

#3798
20090090982
2009-04-09

Ultra-abrupt semiconductor junction profile

#3799
20090090941
2009-04-09

Semiconductor device and method of manufacturing the same

#3800
20090090919
2009-04-09

Semiconductor device and method of producing the same

#3801
20090087955
2009-04-02

Method for removing hard masks on gates in semiconductor manufacturing process

#3802
20090085129
2009-04-02

Defect-free source/drain extensions for MOSFETS having germanium based channel regions

#3803
20090085125
2009-04-02

MOS transistor and CMOS transistor having strained channel epi layer and methods of fabricating the transistors

#3804
20090085123
2009-04-02

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

#3805
20090085075
2009-04-02

METHOD OF FABRICATING MOS TRANSISTOR AND MOS TRANSISTOR FABRICATED THEREBY

#3806
20090085064
2009-04-02

Heterojunction semiconductor device and method

#3807
20090079007
2009-03-26

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

#3808
20090075445
2009-03-19

Complementary metal oxide semiconductor integrated circuit using uniaxial compressive stress and biaxial compressive stress

#3809
20090075029
2009-03-19

Stressor for engineered strain on channel

#3810
20090068824
2009-03-12

FABRICATING METHOD OF SEMICONDUCTOR DEVICE

#3811
20090065861
2009-03-12

MOS device with low injection diode

#3812
20090065855
2009-03-12

MOS device with integrated schottky diode in active region contact trench

#3813
20090065814
2009-03-12

MOS device with Schottky barrier controlling layer

#3814
20090065809
2009-03-12

Semiconductor device and method of manufacturing semiconductor device

#3815
20090065808
2009-03-12

SEMICONDUCTOR TRANSISTOR HAVING A STRESSED CHANNEL

#3816
20090065805
2009-03-12

Method and structure using a pure silicon dioxide hardmask for gate patterning for strained silicon MOS transistors

#3817
20090061604
2009-03-05

Germanium substrate-type materials and approach therefor

#3818
20090057772
2009-03-05

Replacement gates to enhance transistor strain

#3819
20090050965
2009-02-26

Semiconductor device and method of fabricating the same

#3820
20090050942
2009-02-26

Self-aligned super stressed PFET

#3821
20090045471
2009-02-19

Semiconductor device fabricated by selective epitaxial growth method

#3822
20090045470
2009-02-19

Semiconductor device and manufacturing method of the same

#3823
20090045456
2009-02-19

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

#3824
20090045411
2009-02-19

Forming embedded dielectric layers adjacent to sidewalls of shallow trench isolation regions

#3825
20090039442
2009-02-12

Semiconductor devices and methods of manufacture thereof

#3826
20090039399
2009-02-12

Semiconductor device with semiconductor epitaxial layers buried in source/drain regions, and fabrication method of the same

#3827
20090039389
2009-02-12

Metal oxide semiconductor transistor

#3828
20090035911
2009-02-05

METHOD FOR FORMING A SEMICONDUCTOR DEVICE HAVING ABRUPT ULTRA SHALLOW EPI-TIP REGIONS

#3829
20090032845
2009-02-05

SOI field effect transistor having asymmetric junction leakage

#3830
20090032844
2009-02-05

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

#3831
20090032840
2009-02-05

Semiconductor device and method of manufacture

#3832
20090026582
2009-01-29

Deposited semiconductor structure to minimize n-type dopant diffusion and method of making

#3833
20090026554
2009-01-29

Source/drain stressors formed using in-situ epitaxial growth

#3834
20090026552
2009-01-29

Method for forming a transistor having gate dielectric protection and structure

#3835
20090026496
2009-01-29

Methods of making substitutionally carbon-doped crystalline Si-containing materials by chemical vapor deposition

#3836
20090023258
2009-01-22

Method of manufacturing complementary metal oxide semiconductor transistors

#3837
20090020820
2009-01-22

Methods of fabrication of channel-stressed semiconductor devices

#3838
20090020783
2009-01-22

Transistor with differently doped strained current electrode region

#3839
20090020748
2009-01-22

Si/SiGe interband tunneling diodes with tensile strain

#3840
20090016666
2009-01-15

Silicon-based Ge/SiGe optical interconnects

#3841
20090011565
2009-01-08

Field effect transistor structure with abrupt source/drain junctions

#3842
20090008709
2009-01-08

Power semiconductor devices with trenched shielded split gate transistor and methods of manufacture

#3843
20090008706
2009-01-08

Power semiconductor devices with shield and gate contacts and methods of manufacture

#3844
20090001468
2009-01-01

Method of fabricating transistor including buried insulating layer and transistor fabricated using the same

#3845
20090001420
2009-01-01

Epitaxial source/drain transistor

#3846
20090001418
2009-01-01

Semiconductor device and method for fabricating the same

#3847
20090001417
2009-01-01

Structures and methods of forming SiGe and SiGeC buried layer for SOI/SiGe technology

#3848
20080315254
2008-12-25

Semiconductor device fabrication method, semiconductor device, and semiconductor layer formation method

#3849
20080308904
2008-12-18

P-DOPED REGION WITH IMPROVED ABRUPTNESS

#3850
20080308872
2008-12-18

CMOS transistors with differential oxygen content high-k dielectrics

#3851
20080308842
2008-12-18

Forming silicides with reduced tailing on silicon germanium and silicon

#3852
20080305621
2008-12-11

Channel strain engineering in field-effect-transistor

#3853
20080303062
2008-12-11

Semiconductor device with strain in channel region and its manufacture method

#3854
20080303060
2008-12-11

Semiconductor devices and methods of manufacturing thereof

#3855
20080303036
2008-12-11

Method of manufacturing semiconductor device and semiconductor device manufactured thereof

#3856
20080299735
2008-12-04

Methods for forming a transistor

#3857
20080299733
2008-12-04

METHOD OF FORMING A SEMICONDUCTOR STRUCTURE COMPRISING AN IMPLANTATION OF IONS IN A MATERIAL LAYER TO BE ETCHED

#3858
20080299724
2008-12-04

Method of making a semiconductor device with embedded stressor

#3859
20080296702
2008-12-04

Integrated circuit structures with multiple FinFETs

#3860
20080293217
2008-11-27

Semiconductor substrates having useful and transfer layers

#3861
20080293185
2008-11-27

Semiconductor substrates having useful and transfer layers

#3862
20080290470
2008-11-27

Integrated circuit on corrugated substrate

#3863
20080290370
2008-11-27

Semiconductor devices having recesses filled with semiconductor materials

#3864
20080283941
2008-11-20

FABRICATION OF TRANSISTORS WITH A FULLY SILICIDED GATE ELECTRODE AND CHANNEL STRAIN

#3865
20080283906
2008-11-20

Semiconductor device having tipless epitaxial source/drain regions

#3866
20080280413
2008-11-13

Methods for forming a transistor

#3867
20080277735
2008-11-13

MOS devices having elevated source/drain regions

#3868
20080277699
2008-11-13

Recess etch for epitaxial SiGe

#3869
20080272395
2008-11-06

ENHANCED HOLE MOBILITY P-TYPE JFET AND FABRICATION METHOD THEREFOR

#3870
20080272394
2008-11-06

JUNCTION FIELD EFFECT TRANSISTORS IN GERMANIUM AND SILICON-GERMANIUM ALLOYS AND METHOD FOR MAKING AND USING

#3871
20080265279
2008-10-30

Semiconductor device and a method for manufacturing a semiconductor device

#3872
20080265256
2008-10-30

MOS devices with improved source/drain regions with SiGe

#3873
20080265241
2008-10-30

Semiconductor device and a method for manufacturing a semiconductor device

#3874
20080258220
2008-10-23

Ion implantation combined with in situ or ex situ heat treatment for improved field effect transistors

#3875
20080258180
2008-10-23

Method of forming a cross-section hourglass shaped channel region for charge carrier mobility modification

#3876
20080258175
2008-10-23

Stressed MOS device

#3877
20080248635
2008-10-09

Polycrystalline SiGe Junctions for advanced devices

#3878
20080248251
2008-10-09

Semiconductor substrates having useful and transfer layers

#3879
20080246112
2008-10-09

Semiconductor structure including laminated isolation region

#3880
20080246092
2008-10-09

Semiconductor device structure with strain layer and method of fabricating the semiconductor device structure

#3881
20080246057
2008-10-09

Silicon layer for stopping dislocation propagation

#3882
20080246056
2008-10-09

SILICIDE FORMATION FOR eSiGe USING SPACER OVERLAPPING eSiGe AND SILICON CHANNEL INTERFACE AND RELATED PFET

#3883
20080246041
2008-10-09

METHOD OF FABRICATING SOI nMOSFET AND THE STRUCTURE THEREOF

#3884
20080242037
2008-10-02

Semiconductor device having self-aligned epitaxial source and drain extensions

#3885
20080242032
2008-10-02

Carbon-Doped Epitaxial SiGe

#3886
20080242020
2008-10-02

METHOD OF MANUFACTURING A MOS TRANSISTOR DEVICE

#3887
20080237742
2008-10-02

Methods of forming improved EPI fill on narrow isolation bounded source/drain regions and structures formed thereby

#3888
20080237741
2008-10-02

METHODS OF FORMING IMPROVED EPI FILL ON NARROW ISOLATION BOUNDED SOURCE/DRAIN REGIONS AND STRUCTURES FORMED THEREBY

#3889
20080237661
2008-10-02

Ultra-abrupt semiconductor junction profile

#3890
20080237637
2008-10-02

Ultra scalable high speed heterojunction vertical n-channel MISFETs and methods thereof

#3891
20080237634
2008-10-02

CRYSTALLOGRAPHIC RECESS ETCH FOR EMBEDDED SEMICONDUCTOR REGION

#3892
20080237577
2008-10-02

Forming a non-planar transistor having a quantum well channel

#3893
20080237575
2008-10-02

Silicon germanium and germanium multigate and nanowire structures for logic and multilevel memory applications

#3894
20080237572
2008-10-02

Forming a type I heterostructure in a group IV semiconductor

#3895
20080233722
2008-09-25

METHOD OF FORMING SELECTIVE AREA COMPOUND SEMICONDUCTOR EPITAXIAL LAYER

#3896
20080233691
2008-09-25

Method of forming asymmetric spacers and methods of fabricating semiconductor device using asymmetric spacers

#3897
20080232735
2008-09-25

Surface parallel modulator

#3898
20080230808
2008-09-25

Heterojunction bipolar transistor

#3899
20080230805
2008-09-25

Semiconductor device and method of manufacturing semiconductor device

#3900
20080224226
2008-09-18

Semiconductor device including complementary MOS transistor having a strained Si channel