208282 ⎘
Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor; Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group , e.g. alloys in different semiconductor regions, e.g. heterojunctions
Method of forming a field effect transistor
#3602Semiconductor device and method for fabricating the same
#3603SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCER DEVICE
#3604Method for manufacturing a junction
#3605Adjusting of strain caused in a transistor channel by semiconductor material provided for threshold adjustment
#3606Selective wet etch process for CMOS ICs having embedded strain inducing regions and integrated circuits therefrom
#3607Transistor device comprising an embedded semiconductor alloy having an asymmetric configuration
#3608Quantum well MOSFET channels having uni-axial strain caused by metal source/drains, and conformal regrowth source/drains
#3609Multiple-gate transistors with reverse T-shaped fins
#3610Deposited semiconductor structure to minimize N-type dopant diffusion and method of making
#3611Vertical diode and method for manufacturing same and semiconductor memory device
#3612Substrate Processing Apparatus
#3613Germanium substrate-type materials and approach therefor
#3614High speed lateral heterojunction MISFETs realized by 2-dimensional bandgap engineering and methods thereof
#3615Technique for providing stress sources in transistors in close proximity to a channel region by recessing drain and source regions
#3616Test structure for monitoring process characteristics for forming embedded semiconductor alloys in drain/source regions
#3617Epitaxial wafer and method of manufacturing the same
#3618CMOS transistors with differential oxygen content high-K dielectrics
#3619Structure comprises an As-deposited doped single crystalline Si-containing film
#3620Semiconductor devices and methods of manufacturing thereof
#3621Field effect transistor structure with abrupt source/drain junctions
#3622Semiconductor device and production method thereof
#3623Semiconductor device and method for producing the same
#3624Semiconductor devices having Si and SiGe epitaxial layers
#3625Semiconductor device
#3626Memory cell access device having a pn-junction with polycrystalline and single crystal semiconductor regions
#3627Method for gap filling in a gate last process
#3628Semiconductor structure and method of forming the structure
#3629Fabricating semiconductor structures
#3630Recessed drain and source areas in combination with advanced silicide formation in transistors
#3631Method for making a semiconductor device having metal gate stacks
#3632Methods of forming low interface resistance contacts and structures formed thereby
#3633INTEGRATED CIRCUIT SYSTEM EMPLOYING STRESS-ENGINEERED LAYERS
#3634Method of manufacturing a semiconductor device
#3635Semiconductor transistor having a stressed channel
#3636Low-k isolation spacers for conductive regions
#3637Semiconductor transistor having a stressed channel
#3638Tunnel field effect transistor
#3639Memory devices, transistor devices and related methods
#3640Silicon germanium heterostructure barrier varactor
#3641Method for forming a semiconductor device
#3642Method of manufacturing a transistor and method of manufacturing a semiconductor device
#3643Method of forming source and drain of a field-effect-transistor and structure thereof
#3644Power semiconductor devices and methods of manufacture
#3645CMOS DEVICE COMPRISING NMOS TRANSISTORS AND PMOS TRANSISTORS HAVING INCREASED STRAIN-INDUCING SOURCES AND CLOSELY SPACED METAL SILICIDE REGIONS
#3646RAISE S/D FOR GATE-LAST ILD0 GAP FILLING
#3647Transistor with embedded SI/GE material having enhanced across-substrate uniformity
#3648Power MOSFET having a strained channel in a semiconductor heterostructure on metal substrate
#3649Integrated circuit including a hetero-interface and self adjusted diffusion method for manufacturing the same
#3650Method of fabricating semiconductor device using epitaxial growth inhibiting layers
#3651Transistor having a high-k metal gate stack and a compressively stressed channel
#3652Semiconductor device
#3653FABRICATION AND STRUCTURES OF CRYSTALLINE MATERIAL
#3654Method of defining gate structure height for semiconductor devices
#3655Ultra-shallow junctions using atomic-layer doping
#3656Semiconductor devices and methods of manufacture thereof
#3657Metal gate transistor and method for fabricating the same
#3658Structure and method to form multilayer embedded stressors
#3659Method for mechanical stress enhancement in semiconductor devices
#3660Strained silicon with elastic edge relaxation
#3661Depletion mode trench MOSFET for improved efficiency of DC/DC converter applications
#3662Semiconductor device with a reduced band gap and process
#3663Field effect transistor with suppressed corner leakage through channel material band-edge modulation, design structure and method
#3664Carbon-Doped Epitaxial SiGe
#3665Enhanced dislocation stress transistor
#3666Method for fabricating MOS transistors
#3667IC FORMED WITH DENSIFIED CHEMICAL OXIDE LAYER
#3668SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#3669METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#3670Performance enhancement in PMOS and NMOS transistors on the basis of silicon/carbon material
#3671TRANSISTOR WITH EMBEDDED SI/GE MATERIAL HAVING ENHANCED BORON CONFINEMENT
#3672All around gate type semiconductor device and method of manufacturing the same
#3673MOSFET device with localized stressor
#3674Semiconductor device and method of manufacturing the same
#3675Method of fabricating semiconductor device having a junction extended by a selective epitaxial growth (SEG) layer
#3676Implanted metal silicide for semiconductor device
#3677METAL OXIDE SEMICONDUCTOR DEVICES HAVING IMPLANTED CARBON DIFFUSION RETARDATION LAYERS AND METHODS FOR FABRICATING THE SAME
#3678Transistor device having asymmetric embedded strain elements and related manufacturing method
#3679Semiconductor fabrication process including an SiGe rework method
#3680Metal oxide semiconductor having epitaxial source drain regions and a method of manufacturing same using dummy gate process
#3681CMOS TRANSISTOR AND THE METHOD FOR MANUFACTURING THE SAME
#3682Epitaxial growth of crystalline material
#3683Method for forming double gate and tri-gate transistors on a bulk substrate
#3684Semiconductor nanowire transistor
#3685Semiconductor device with hetero junction
#3686In-situ carbon doped e-SiGeCB stack for MOS transistor
#3687Manufacturing method for semiconductor device and semiconductor device
#3688Method for fabricating super-steep retrograde well MOSFET on SOI or bulk silicon substrate, and device fabricated in accordance with the method
#3689Structure and method for forming power devices with carbon-containing region
#3690METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND DEVICE MANUFACTURED BY THE METHOD
#3691Tensile strained NMOS transistor using group III-N source/drain regions
#3692STRESS ENHANCED TRANSISTOR DEVICES AND METHODS OF MAKING
#3693Devices comprising coated semiconductor nanocrystals heterostructures
#3694Integrated circuit having localized embedded SiGe and method of manufacturing
#3695Semiconductor nanowire vertical device architecture
#3696Method of manufacturing a semiconductor device
#3697Methods of manufacturing semiconductor devices and structures thereof
#3698Method for Making Transistors and the Device Thereof
#3699Superjunction trench device formation methods
#3700System and method for the manufacture of semiconductor devices by the implantation of carbon clusters
#3701Reduced floating body effect without impact on performance-enhancing stress
#3702Method of forming stepped recesses for embedded strain elements in a semiconductor device
#3703Semiconductor device and production method thereof
#3704Enhanced stress-retention silicon-on-insulator devices and methods of fabricating enhanced stress retention silicon-on-insulator devices
#3705Source/drain carbon implant and RTA anneal, pre-SiGe deposition
#3706Method for producing nMOS and pMOS devices in CMOS processing
#3707METHOD FOR FORMING CARBON SILICON ALLOY (CSA) AND STRUCTURES THEREOF
#3708Enhanced stress for transistors
#3709Semiconductor device with strained channel and method of fabricating the same
#3710Method of forming a pattern for a semiconductor device and method of forming the related MOS transistor
#3711METHODS FOR MANUFACTURING A HIGH VOLTAGE JUNCTION FIELD EFFECT TRANSISTOR USING A HYBRID ORIENTATION TECHNOLOGY WAFER
#3712Methods of fabricating different thickness silicon-germanium layers on semiconductor integrated circuit devices and semiconductor integrated circuit devices fabricated thereby
#3713Complementary field effect transistors having embedded silicon source and drain regions
#3714Scalable power field effect transistor with improved heavy body structure and method of manufacture
#3715MOSFET and production method of semiconductor device
#3716Semiconductor devices having tensile and/or compressive strain and methods of manufacturing and design structure
#3717Semiconductor device and method for fabricating the same
#3718COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR DEVICE WITH EMBEDDED STRESSOR
#3719Self-aligned halo/pocket implantation for reducing leakage and source/drain resistance in MOS devices
#3720Semiconductor device manufacturing method
#3721Epitaxial silicon germanium for reduced contact resistance in field-effect transistors
#3722Field effect structure including carbon alloyed channel region and source/drain region not carbon alloyed
#3723METHOD AND APPARATUS FOR CONTROLLING STRESSED LAYER GATE PROXIMITY
#3724Method to enhance channel stress in CMOS processes
#3725CMOS devices having dual high-mobility channels
#3726Silicon-germanium-carbon semiconductor structure
#3727MOS devices with partial stressor channel
#3728SEMICONDUCTOR DEVICE
#3729SEMICONDUCTOR DEVICE HAVING A LOCALLY BURIED INSULATION LAYER
#3730MOBILITY ENHANCEMENT IN SiGe HETEROJUNCTION BIPOLAR TRANSISTORS
#3731Generating Stress in a Field Effect Transistor
#3732Method for increasing penetration depth of drain and source implantation species for a given gate height
#3733Fabrication of a semiconductor device with stressor
#3734CMOS DEVICE COMPRISING AN NMOS TRANSISTOR WITH RECESSED DRAIN AND SOURCE AREAS AND A PMOS TRANSISTOR HAVING A SILICON/GERMANIUM MATERIAL IN THE DRAIN AND SOURCE AREAS
#3735Method for fabricating a semiconductor device having an epitaxial channel and transistor having same
#3736Method of forming an embedded silicon carbon epitaxial layer
#3737Semiconductor device with strained transistors and its manufacture
#3738SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#3739Structure and method for forming field effect transistor with low resistance channel region
#3740Strained channel transistor structure and method
#3741Semiconductor device and method of manufacturing the same
#3742Nonvolatile memory and three-state FETs using cladded quantum dot gate structure
#3743Method and Structure For NFET With Embedded Silicon Carbon
#3744Methods of designing an integrated circuit on corrugated substrate
#3745Recess Etch for Epitaxial SiGe
#3746Strain-direct-on-insulator (SDOI) substrate and method of forming
#3747METHODS FOR FABRICATING SEMICONDUCTOR DEVICES USING THERMAL GRADIENT-INDUCING FILMS
#3748P-channel MOS transistor and fabrication process thereof
#3749Semiconductor device with gate-undercutting recessed region
#3750MOSFET HAVING A HIGH STRESS IN THE CHANNEL REGION
#3751STRAINED-CHANNEL FET COMPRISING TWIST-BONDED SEMICONDUCTOR LAYER
#3752Method for fabricating a semiconductor structures and structures thereof
#3753Hybrid Wafers
#3754INTEGRATION SCHEMES TO AVOID FACETED SIGE
#3755ANNEALING METHOD FOR SIGE PROCESS
#3756Method of manufacturing a semiconductor device
#3757Devices with graphene layers
#3758Field effect transistor structure with an insulating layer at the junction
#3759Method for forming a vertical transistor having tensile layers
#3760SiGe device with SiGe-embedded dummy pattern for alleviating micro-loading effect
#3761Test structure for monitoring process characteristics for forming embedded semiconductor alloys in drain/source regions
#3762Simple scatterometry structure for Si recess etch control
#3763Protection of SiGe during etch and clean operations
#3764Method of forming a semiconductor device and semiconductor device
#3765Semiconductor device having SiGe semiconductor regions
#3766METHOD AND STRUCTURE FOR SEMICONDUCTOR DEVICES WITH SILICON-GERMANIUM DEPOSITS
#3767Method of reducing embedded SiGe loss in semiconductor device manufacturing
#3768Method of forming a germanium silicide layer, semiconductor device including the germanium silicide layer, and method of manufacturing the semiconductor device
#3769INTEGRATED CIRCUIT SYSTEM EMPLOYING DIFFUSED SOURCE/DRAIN EXTENSIONS
#3770LDMOS with channel stress
#3771Phosphorus Activated NMOS Using SiC Process
#3772MOS Devices Having Elevated Source/Drain Regions
#3773Method of fabricating patterned SOI devices and the resulting device structures
#3774Semiconductor device and method of fabricating the same
#3775Integrated circuit and method of fabrication thereof
#3776Semiconductor component including a short-circuit structure
#3777Semiconductor MOS transistor device and method for making the same
#3778Semiconductor device and fabrication method thereof
#3779Power semiconductor component with charge compensation structure and method for the fabrication thereof
#3780Semiconductor doping with reduced gate edge diode leakage
#3781MOS device with varying trench depth
#3782Method of fabricating semiconductor device
#3783Field effect transistor containing a wide band gap semiconductor material in a drain
#3784Semiconductor superjunction structure
#3785Selective epitaxial growth method using halogen containing gate sidewall mask
#3786Semiconductor device and manufacturing method thereof
#3787High-mobility trench MOSFETs
#3788Method for fabricating super-steep retrograde well MOSFET on SOI or bulk silicon substrate, and device fabricated in accordance with the method
#3789Transistor with a plurality of layers with different Ge concentrations
#3790SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#3791Source/drain strained layers
#3792Method of forming conformal silicon layer for recessed source-drain
#3793Planar field effect transistor structure having an angled crystallographic etch-defined source/drain recess and a method of forming the transistor structure
#3794Silicon germanium heterostructure barrier varactor
#3795Methodology of implementing ultra high temperature (UHT) anneal in fabricating devices that contain sige
#3796SEMICONDUCTOR DEVICE INCLUDING MOS FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR DEVICE
#3797Semiconductor device and method of manufacturing the same
#3798Ultra-abrupt semiconductor junction profile
#3799Semiconductor device and method of manufacturing the same
#3800Semiconductor device and method of producing the same
#3801Method for removing hard masks on gates in semiconductor manufacturing process
#3802Defect-free source/drain extensions for MOSFETS having germanium based channel regions
#3803MOS transistor and CMOS transistor having strained channel epi layer and methods of fabricating the transistors
#3804SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
#3805METHOD OF FABRICATING MOS TRANSISTOR AND MOS TRANSISTOR FABRICATED THEREBY
#3806Heterojunction semiconductor device and method
#3807SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#3808Complementary metal oxide semiconductor integrated circuit using uniaxial compressive stress and biaxial compressive stress
#3809Stressor for engineered strain on channel
#3810FABRICATING METHOD OF SEMICONDUCTOR DEVICE
#3811MOS device with low injection diode
#3812MOS device with integrated schottky diode in active region contact trench
#3813MOS device with Schottky barrier controlling layer
#3814Semiconductor device and method of manufacturing semiconductor device
#3815SEMICONDUCTOR TRANSISTOR HAVING A STRESSED CHANNEL
#3816Method and structure using a pure silicon dioxide hardmask for gate patterning for strained silicon MOS transistors
#3817Germanium substrate-type materials and approach therefor
#3818Replacement gates to enhance transistor strain
#3819Semiconductor device and method of fabricating the same
#3820Self-aligned super stressed PFET
#3821Semiconductor device fabricated by selective epitaxial growth method
#3822Semiconductor device and manufacturing method of the same
#3823SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
#3824Forming embedded dielectric layers adjacent to sidewalls of shallow trench isolation regions
#3825Semiconductor devices and methods of manufacture thereof
#3826Semiconductor device with semiconductor epitaxial layers buried in source/drain regions, and fabrication method of the same
#3827Metal oxide semiconductor transistor
#3828METHOD FOR FORMING A SEMICONDUCTOR DEVICE HAVING ABRUPT ULTRA SHALLOW EPI-TIP REGIONS
#3829SOI field effect transistor having asymmetric junction leakage
#3830SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#3831Semiconductor device and method of manufacture
#3832Deposited semiconductor structure to minimize n-type dopant diffusion and method of making
#3833Source/drain stressors formed using in-situ epitaxial growth
#3834Method for forming a transistor having gate dielectric protection and structure
#3835Methods of making substitutionally carbon-doped crystalline Si-containing materials by chemical vapor deposition
#3836Method of manufacturing complementary metal oxide semiconductor transistors
#3837Methods of fabrication of channel-stressed semiconductor devices
#3838Transistor with differently doped strained current electrode region
#3839Si/SiGe interband tunneling diodes with tensile strain
#3840Silicon-based Ge/SiGe optical interconnects
#3841Field effect transistor structure with abrupt source/drain junctions
#3842Power semiconductor devices with trenched shielded split gate transistor and methods of manufacture
#3843Power semiconductor devices with shield and gate contacts and methods of manufacture
#3844Method of fabricating transistor including buried insulating layer and transistor fabricated using the same
#3845Epitaxial source/drain transistor
#3846Semiconductor device and method for fabricating the same
#3847Structures and methods of forming SiGe and SiGeC buried layer for SOI/SiGe technology
#3848Semiconductor device fabrication method, semiconductor device, and semiconductor layer formation method
#3849P-DOPED REGION WITH IMPROVED ABRUPTNESS
#3850CMOS transistors with differential oxygen content high-k dielectrics
#3851Forming silicides with reduced tailing on silicon germanium and silicon
#3852Channel strain engineering in field-effect-transistor
#3853Semiconductor device with strain in channel region and its manufacture method
#3854Semiconductor devices and methods of manufacturing thereof
#3855Method of manufacturing semiconductor device and semiconductor device manufactured thereof
#3856Methods for forming a transistor
#3857METHOD OF FORMING A SEMICONDUCTOR STRUCTURE COMPRISING AN IMPLANTATION OF IONS IN A MATERIAL LAYER TO BE ETCHED
#3858Method of making a semiconductor device with embedded stressor
#3859Integrated circuit structures with multiple FinFETs
#3860Semiconductor substrates having useful and transfer layers
#3861Semiconductor substrates having useful and transfer layers
#3862Integrated circuit on corrugated substrate
#3863Semiconductor devices having recesses filled with semiconductor materials
#3864FABRICATION OF TRANSISTORS WITH A FULLY SILICIDED GATE ELECTRODE AND CHANNEL STRAIN
#3865Semiconductor device having tipless epitaxial source/drain regions
#3866Methods for forming a transistor
#3867MOS devices having elevated source/drain regions
#3868Recess etch for epitaxial SiGe
#3869ENHANCED HOLE MOBILITY P-TYPE JFET AND FABRICATION METHOD THEREFOR
#3870JUNCTION FIELD EFFECT TRANSISTORS IN GERMANIUM AND SILICON-GERMANIUM ALLOYS AND METHOD FOR MAKING AND USING
#3871Semiconductor device and a method for manufacturing a semiconductor device
#3872MOS devices with improved source/drain regions with SiGe
#3873Semiconductor device and a method for manufacturing a semiconductor device
#3874Ion implantation combined with in situ or ex situ heat treatment for improved field effect transistors
#3875Method of forming a cross-section hourglass shaped channel region for charge carrier mobility modification
#3876Stressed MOS device
#3877Polycrystalline SiGe Junctions for advanced devices
#3878Semiconductor substrates having useful and transfer layers
#3879Semiconductor structure including laminated isolation region
#3880Semiconductor device structure with strain layer and method of fabricating the semiconductor device structure
#3881Silicon layer for stopping dislocation propagation
#3882SILICIDE FORMATION FOR eSiGe USING SPACER OVERLAPPING eSiGe AND SILICON CHANNEL INTERFACE AND RELATED PFET
#3883METHOD OF FABRICATING SOI nMOSFET AND THE STRUCTURE THEREOF
#3884Semiconductor device having self-aligned epitaxial source and drain extensions
#3885Carbon-Doped Epitaxial SiGe
#3886METHOD OF MANUFACTURING A MOS TRANSISTOR DEVICE
#3887Methods of forming improved EPI fill on narrow isolation bounded source/drain regions and structures formed thereby
#3888METHODS OF FORMING IMPROVED EPI FILL ON NARROW ISOLATION BOUNDED SOURCE/DRAIN REGIONS AND STRUCTURES FORMED THEREBY
#3889Ultra-abrupt semiconductor junction profile
#3890Ultra scalable high speed heterojunction vertical n-channel MISFETs and methods thereof
#3891CRYSTALLOGRAPHIC RECESS ETCH FOR EMBEDDED SEMICONDUCTOR REGION
#3892Forming a non-planar transistor having a quantum well channel
#3893Silicon germanium and germanium multigate and nanowire structures for logic and multilevel memory applications
#3894Forming a type I heterostructure in a group IV semiconductor
#3895METHOD OF FORMING SELECTIVE AREA COMPOUND SEMICONDUCTOR EPITAXIAL LAYER
#3896Method of forming asymmetric spacers and methods of fabricating semiconductor device using asymmetric spacers
#3897Surface parallel modulator
#3898Heterojunction bipolar transistor
#3899Semiconductor device and method of manufacturing semiconductor device
#3900Semiconductor device including complementary MOS transistor having a strained Si channel