208282 ⎘
Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof; Multistep manufacturing processes therefor; Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic System including two or more of the elements provided for in group , e.g. alloys in different semiconductor regions, e.g. heterojunctions
Semiconductor structure and manufacturing method thereof
#1202Finfet semiconductor device structure with capped source drain structures
#1203VERTICAL FINFET WITH IMPROVED TOP SOURCE/DRAIN CONTACT
#1204Semiconductor device with high-quality epitaxial layer and method of manufacturing the same
#1205Semiconductor device and manufacturing method thereof
#1206FinFET device and method of forming same
#1207Semiconductor structure with protection layer and fabrication method thereof
#1208Self-aligned epitaxy layer
#1209Silicide implants
#1210NANOWIRE DEVICE WITH REDUCED PARASITICS
#1211Semiconductor structure and fabrication method thereof
#1212Memory devices including memory cells and related methods
#1213Hybrid scheme for improved performance for P-type and N-type FinFETs
#1214Structure and formation method of semiconductor device structure with isolation feature
#1215Method for forming semiconductor device structure
#1216Methods for depositing a doped germanium tin semiconductor and related semiconductor device structures
#1217High dose implantation for ultrathin semiconductor-on-insulator substrates
#1218Semiconductor device and method of manufacturing the same
#1219Semiconductor devices
#1220Gate-all-around field-effect-transistor devices and fabrication methods thereof
#1221SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#1222Quantum dot devices with multiple dielectrics around fins
#1223Gate walls for quantum dot devices
#1224Superlattice materials and applications
#1225Quantum dot devices with strain control
#1226Quantum dot devices with passive barrier elements in a quantum well stack between metal gates
#1227Semiconductor device including metal-2 dimensional material-semiconductor contact
#1228Lateral bipolar junction transistor with abrupt junction and compound buried oxide
#1229Ambipolar synaptic devices
#1230Semiconductor structure and fabrication method thereof
#1231Source and drain stressors with recessed top surfaces
#1232Cascode heterojunction bipolar transistors
#1233Semiconductor Device and Method for Manufacturing the Semiconductor Device
#1234Method of fabricating a semiconductor device with strained SiGe fins and a Si cladding layer
#1235Fabrication of fin field effect transistor complementary metal-oxide-semiconductor devices with uniform hybrid channels
#1236Semiconductor device including a Fin-FET and method of manufacturing the same
#1237Liner-less contact metallization
#1238Method for selectively depositing a Group IV semiconductor and related semiconductor device structures
#1239Method for depositing a group IV semiconductor and related semiconductor device structures
#1240Methods of manufacturing inner spacers in a gate-all-around (GAA) FET through multi-layer spacer replacement
#1241Structure and formation method of semiconductor device structure with etch stop layer
#1242Semiconductor device and manufacturing method thereof
#1243High voltage transistor using buried insulating layer as gate dielectric
#1244Anti-fuse with reduced programming voltage
#1245Electrostatic discharge protection structure and fabrication method thereof
#1246MOS devices having epitaxy regions with reduced facets
#1247Bipolar semiconductor device with silicon alloy region in silicon well and method for making
#1248ALIGNED PITCH-QUARTERED PATTERNING FOR LITHOGRAPHY EDGE PLACEMENT ERROR ADVANCED RECTIFICATION
#1249High-quality, single-crystalline silicon-germanium films
#1250Strained semiconductor using elastic edge relaxation of a stressor combined with buried insulating layer
#1251Silicon germanium fin immune to epitaxy defect
#1252Semiconductor device with multi-layered source/drain regions having different dopant concentrations and manufacturing method thereof
#1253Gate stack structure and method for forming the same
#1254Semiconductor device having interfacial layer and high κ dielectric layer
#1255Sidewall image transfer nanosheet
#1256Enhanced channel strain to reduce contact resistance in NMOS FET devices
#1257FinFET CMOS device including single diffusion break in each of NMOS and PMOS regions
#1258Semiconductor structure with doped layers on fins and fabrication method thereof
#1259Semiconductor devices, FinFET devices, and manufacturing methods thereof
#1260Metal gate stack having TaAlCN layer
#1261Crystallized silicon carbon replacement material for NMOS source/drain regions
#1262Methods of forming a bulk field effect transistor (FET) with sub-source/drain isolation layers and the resulting structures
#1263Semiconductor devices including a dummy gate structure on a fin
#1264Substrate isolation for low-loss radio frequency (RF) circuits
#1265SiGe source/drain structure
#1266Semiconductor device and method of fabricating the same
#1267Semiconductor device including a first fin active region and a second fin active region
#1268Semiconductor device having a shaped epitaxial region
#1269Semiconductor structure and fabrication method thereof
#1270Trench-gated heterostructure and double-heterostructure active devices
#1271Lateral fin static induction transistor
#1272Vertical transistor gated diode
#1273FINFET DEVICE WITH STACKED GERMANIUM AND SILICON CHANNEL
#1274Source and drain epitaxy re-shaping
#1275Semiconductor devices and methods of manufacturing the same
#1276FinFET with sigma recessed source/drain and un-doped buffer layer epitaxy for uniform junction formation
#1277Silicon germanium fin immune to epitaxy defect
#1278Forming strained channel with germanium condensation
#1279Semiconductor devices
#1280Digital alloy vertical lamellae FinFET with current flow in alloy layer direction
#1281Semiconductor device and method for fabricating the same
#1282Free-standing substrate comprising polycrystalline group 13 element nitride and light-emitting element using same
#1283Semiconductor device and manufacturing method thereof
#1284FinFET device with high-k metal gate stack
#1285Method and structure of stacked FinFET
#1286High pressure low thermal budge high-k post annealing process
#1287Metal oxide semiconductor having epitaxial source drain regions and a method of manufacturing same using dummy gate process
#1288Semiconductor devices with core-shell structures
#1289Method of manufacturing a semiconductor device with multilayered channel structure
#1290Gate structure of field effect transistor with footing
#1291Method of forming improved vertical FET process with controlled gate length and self-aligned junctions
#1292Metal gate and contact plug design and method forming same
#1293Free-standing substrate comprising polycrystalline group 13 element nitride and light-emitting element using same
#1294Method for semiconductor device fabrication with improved source drain proximity
#1295Decoupling capacitor on strain relaxation buffer layer
#1296Fabrication of fin field effect transistors for complementary metal oxide semiconductor devices including separate n-type and p-type source/drains using a single spacer deposition
#1297Semiconductor epitaxy bordering isolation structure
#1298Lattice-mismatched semiconductor substrates with defect reduction
#1299Lattice-mismatched semiconductor substrates with defect reduction
#1300Semiconductor device and manufacturing method thereof
#1301Unipolar spacer formation for finFETs
#1302Spacers for nanowire-based integrated circuit device and method of fabricating same
#1303Transistor devices having source/drain structure configured with high germanium content portion
#1304Two dimension material fin sidewall
#1305Two dimension material fin sidewall
#1306Method and device having low contact resistance
#1307Device and fabrication of MOS device with island region
#1308Systems and methods for a semiconductor structure having multiple semiconductor-device layers
#1309Semiconductor devices with shaped portions of elevated source/drain regions
#1310Self aligned top extension formation for vertical transistors
#1311Threshold adjustment for quantum dot array devices with metal source and drain
#1312Nanosheet transistors on bulk material
#1313Method to induce strain in finFET channels from an adjacent region
#1314Fabrication of fin field effect transistor complementary metal-oxide-semiconductor devices with uniform hybrid channels
#1315Methods of fabricating semiconductor devices using MOS transistors with nonuniform gate electrode structures
#1316Self-aligned contact process enabled by low temperature
#1317Semiconductor device with chlorine-containing N-work function conductor and method of forming the same
#1318Method of making a CMOS semiconductor device using a stressed silicon-on-insulator (SOI) wafer
#1319Method for manufacturing a bipolar junction transistor
#1320FinFET with epitaxial source and drain regions and dielectric isolated channel region
#1321Semiconductor structures and fabrication methods thereof
#1322Integration of strained silicon germanium PFET device and silicon NFET device for finFET structures
#1323STI-diode structure
#1324Dual threshold voltage (VT) channel devices and their methods of fabrication
#1325Semiconductor device and method of fabricating the same
#1326Field-effect semiconductor device having a heterojunction contact
#1327Substrate isolation for low-loss radio frequency (RF) circuits
#1328Structure and formation method of fin-like field effect transistor
#1329Semiconductor devices and fabrication methods thereof
#1330Source/drain recess in a semiconductor device
#1331Vertical tunneling FinFET
#1332Co-integration of tensile silicon and compressive silicon germanium
#1333Dual channel silicon/silicon germanium complementary metal oxide semiconductor performance with interface engineering
#1334A METHOD OF MANUFACTURING AN ARRAY SUBSTRATE AND A DISPLAY SUBSTRATE, AND A DISPLAY PANEL
#1335EMBEDDED SIGE PROCESS FOR MULTI-THRESHOLD PMOS TRANSISTORS
#1336Semiconductor device and method of manufacturing the same
#1337Structure of semiconductor device structure having fins
#1338Method of forming semiconductor device
#1339Flexible merge scheme for source/drain epitaxy regions
#1340Semiconductor structure and manufacturing method thereof
#1341Semiconductor device and manufacturing method thereof
#1342Gate fill utilizing replacement spacer
#1343Active matrix OLED display with normally-on thin-film transistors
#1344Active matrix OLED display with normally-on thin-film transistors
#1345Electrical devices making use of counterdoped junctions
#1346Semiconductor devices
#1347Deep gate-all-around semiconductor device having germanium or group III-V active layer
#1348Multi-gate device
#1349Semiconductor device and method of forming the same
#1350Tunneling field effect transistor (TFET) having a semiconductor fin structure
#1351FinFET having improved Ge channel interfacial layer
#1352Semiconductor structure and fabrication method thereof
#1353Field effect transistor having a Fermi filter between a source and source contact thereof
#1354Nanosheet transistor with uniform effective gate length
#1355Semiconductor devices and methods of manufacturing the same
#1356Two dimension material fin sidewall
#1357Two dimension material fin sidewall
#1358Two dimension material fin sidewall
#1359Formation method and structure semiconductor device with source/drain structures
#1360Methods of forming epi semiconductor material on a recessed fin in the source/drain regions of a FinFET device
#1361Semiconductor structure and fabrication method thereof
#1362Self-aligned bipolar junction transistors with a base grown in a dielectric cavity
#1363PRESERVING THE SEED LAYER ON STI EDGE AND IMPROVING THE EPITAXIAL GROWTH
#1364LDD-free semiconductor structure and manufacturing method of the same
#1365Semiconductor device and method of forming the semiconductor device
#1366Method of fabricating semiconductor device
#1367Semiconductor device and method
#1368Nanowire semiconductor device having high-quality epitaxial layer and method of manufacturing the same
#1369Single-electron transistor with self-aligned coulomb blockade
#1370Transistor device
#1371Semiconductor device structure with gate spacer having protruding bottom portion and method for forming the same
#1372Multi-gate devices with replaced-channels and methods for forming the same
#1373Transmitting multi-destination packets in overlay networks
#1374Methods of forming doped source/drain contacts and structures formed thereby
#1375Semiconductor structure and fabrication method thereof
#1376METHOD OF MAKING A SEMICONDUCTOR DEVICE USING A DUMMY GATE
#1377Forming bottom isolation layer for nanosheet technology
#1378Strain compensation in transistors
#1379Forming horizontal bipolar junction transistor compatible with nanosheets
#1380Fin field effect transistor and fabrication method thereof
#1381Stacked gate-all-around FinFET and method forming the same
#1382Semiconductor device including fin structure with two channel layers and manufacturing method thereof
#1383Semiconductor device including fin structures and manufacturing method thereof
#1384Vertical transistor with reduced gate-induced-drain-leakage current
#1385Nanosheet MOSFET with partial release and source/drain epitaxy
#1386Methods of forming backside self-aligned vias and structures formed thereby
#1387Germanium dual-fin field effect transistor
#1388Heterojunction bipolar transistor with a thickened extrinsic base
#1389Forming non-line-of-sight source drain extension in an NMOS FINFET using n-doped selective epitaxial growth
#1390Low resistance source drain contact formation
#1391Nanosheet transistors with sharp junctions
#1392Embedded SiGe epitaxy test pad
#1393Methods for producing low oxygen silicon ingots
#1394Semiconductor arrangement with substrate isolation
#1395Co-fabricated gate-all-around field effect transistor and fin field effect transistor
#1396Integrated circuit device and method of manufacturing the same
#1397Semiconductor device and method for manufacturing the same
#1398Nanosheet transistors on bulk material
#1399Self-aligned sacrificial epitaxial capping for trench silicide
#1400Methods of manufacturing semiconductor devices
#1401Graphene contacts on source/drain regions of FinFET devices
#1402Semiconductor device with low band-to-band tunneling
#1403Metal gate scheme for device and methods of forming
#1404Semiconductor device and method of fabricating the same
#1405Wrap-around contact on FinFET
#1406Methods for forming wrap around contact
#1407Method for manufacturing a semiconductor device including a pair of channel semiconductor patterns
#1408Low temperature polysilicon array substrate and method for manufacturing the same
#1409Semiconductor device having fin-shaped structure and bump
#1410Semiconductor device
#1411Semiconductor device including quantum wires
#1412Lateral PiN diodes and schottky diodes
#1413Semiconductor structure and fabrication method thereof
#1414Field effect transistor with channel layer, and semiconductor device including the same
#1415Co-integration of elastic and plastic relaxation on the same wafer
#1416SEMICONDUCTOR DEVICES INCLUDING VARIED DEPTH RECESSES FOR CONTACTS
#1417Self-aligned doping in source/drain regions for low contact resistance
#1418Self-aligned doping in source/drain regions for low contact resistance
#1419Semiconductor devices having FIN active regions
#1420Method of forming a fin structure of semiconductor device
#1421Fin spacer protected source and drain regions in FinFETs
#1422Semiconductor device having curved gate electrode aligned with curved side-wall insulating film and stress-introducing layer between channel region and source and drain regions
#1423Method of forming a contact structure for a FinFET semiconductor device
#1424Method of manufacturing SOI lateral Si-emitter SiGe base HBT
#1425Devices with strained source/drain structures and method of forming the same
#1426Method and structure for protecting gates during epitaxial growth
#1427Asymmetric band gap junctions in narrow band gap MOSFET
#1428Semiconductor device and manufacturing method thereof
#1429Semiconductor structure having insulator pillars and semiconductor material on substrate
#1430Process for fabricating a field effect transistor having a coating gate
#1431Precise junction placement in vertical semiconductor devices using etch stop layers
#1432Semiconductor device and method of manufacturing semiconductor device
#1433Fin field effect transistor complementary metal oxide semiconductor with dual strained channels with solid phase doping
#1434Semiconductor device and method of fabricating the same
#1435Device with diffusion blocking layer in source/drain region
#1436Soi FinFET fins with recessed fins and epitaxy in source drain region
#1437High pressure low thermal budge high-k post annealing process
#1438Bipolar junction transistors with a combined vertical-lateral architecture
#1439Conformal transfer doping method for fin-like field effect transistor
#1440FinFET structures and methods of forming the same
#1441Source and drain formation technique for fin-like field effect transistor
#1442Semiconductor devices with multi-gate structure and method of manufacturing the same
#1443Fin-like field effect transistor (FinFET) device and method of manufacturing same
#1444Preparation method for heterogeneous SiGe based plasma P-I-N diode string for sleeve antenna
#1445Structure and formation method of semiconductor device structure
#1446FinFET devices and methods of forming
#1447FinFET structures and methods of forming the same
#1448Nanowire field effect transistor having a metal gate surrounding semiconductor nanowire
#1449Semiconductor device and method of forming doped channel thereof
#1450Method for reducing contact resistance in semiconductor structures
#1451N-type fin field-effect transistor
#1452Method for manufacturing semiconductor structure
#1453Method for forming recess within epitaxial layer
#1454Semiconductor structure and fabricating method thereof
#1455Lateral bipolar junction transistor with controlled junction
#1456Silicon Carbide Vertical MOSFET with Polycrystalline Silicon Channel Layer
#1457Method of forming fin shape structure having different buffer layers
#1458Methods for titanium silicide formation using TiClprecursor and silicon-containing precursor
#1459Method of forming semiconductor device using titanium-containing layer and device formed
#1460Method and structure for incorporating strain in nanosheet devices
#1461SiGe source/drain structure and preparation method thereof
#1462Field-effect transistor
#1463Confined epitaxial regions for semiconductor devices and methods of fabricating semiconductor devices having confined epitaxial regions
#1464Semiconductor device and method for fabricating the same
#1465Mechanisms for growing epitaxy structure of finFET device
#1466Methods of fabricating semiconductor devices
#1467Method of removing an etch mask
#1468Semiconductor device and manufacturing method thereof
#1469CARBON-BASED INTERFACE FOR EPITAXIALLY GROWN SOURCE/DRAIN TRANSISTOR REGIONS
#1470RESISTANCE REDUCTION IN TRANSISTORS HAVING EPITAXIALLY GROWN SOURCE/DRAIN REGIONS
#1471Elongated source/drain region structure in finFET device
#1472Dopant concentration boost in epitaxially formed material
#1473Method of manufacturing a semiconductor device with multilayered channel structure
#1474FinFET device and methods of forming
#1475Semiconductor device manufacturing method with reduced gate electrode height loss and related devices
#1476Semiconductor device having two spacers
#1477Superlattice materials and applications
#1478Semiconductor device having asymmetrical source/drain
#1479Semiconductor device and forming method thereof
#1480Semiconductor structure, static random access memory, and fabrication method thereof
#1481Semiconductor structure, static random access memory and fabrication method thereof
#1482Method of manufacturing a semiconductor device and a semiconductor device
#1483Conductive structure and method for manufacturing conductive structure
#1484FinFET device having oxide layer among interlayer dielectric layer
#1485FinFET device and method of forming
#1486Multi-gate device and method of fabrication thereof
#1487Source/drain structure having multi-facet surfaces
#1488Techniques for integration of Ge-rich p-MOS source/drain
#1489Metal gate scheme for device and methods of forming
#1490Fin field effect transistors having conformal oxide layers and methods of forming same
#1491Silicon on insulator device with partially recessed gate
#1492Fully substrate-isolated FinFET transistor
#1493Deposition apparatus and method for manufacturing semiconductor device using the same
#1494Semiconductor device and forming method thereof
#1495Semiconductor device and method for fabricating the same
#1496FIELD EFFECT TRANSISTOR INCLUDING GRAPHENE LAYER
#1497Semiconductor structures having increased channel strain using fin release in gate regions
#1498Nanostructure field-effect transistors with enhanced mobility source/drain regions
#1499Integrated RF front end system
#1500Vertical Thyristor Cell and Memory Array with Silicon Germanium Base Regions